JP5679897B2 - LED module - Google Patents

LED module Download PDF

Info

Publication number
JP5679897B2
JP5679897B2 JP2011102810A JP2011102810A JP5679897B2 JP 5679897 B2 JP5679897 B2 JP 5679897B2 JP 2011102810 A JP2011102810 A JP 2011102810A JP 2011102810 A JP2011102810 A JP 2011102810A JP 5679897 B2 JP5679897 B2 JP 5679897B2
Authority
JP
Japan
Prior art keywords
led
pair
side electrode
transparent cover
led module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011102810A
Other languages
Japanese (ja)
Other versions
JP2012234979A (en
Inventor
渡辺 正志
正志 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP2011102810A priority Critical patent/JP5679897B2/en
Publication of JP2012234979A publication Critical patent/JP2012234979A/en
Application granted granted Critical
Publication of JP5679897B2 publication Critical patent/JP5679897B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本発明は、リペア性および組立性に優れ、薄型化も可能なLEDモジュールに関する。   The present invention relates to an LED module which is excellent in repairability and assemblability and can be thinned.

近年、高出力の白色LEDを使用した照明器具が広く一般に採用されつつある。例えば、特許文献1では、LEDチップを用いた複数のLED部材(発光装置)が搭載されたLEDモジュールと、LEDモジュールを固定ネジで取り付けるモジュール取付部を有する金属製の器具本体とを備えた照明器具が提案されている。この照明器具では、LEDチップの実装基板の各外部接続用電極部が、端子板を介して回路基板の回路パターンと電気的に接続されている。上記端子板は、細長の金属板の一端部が回路基板の回路パターンに半田を用いて接合されていると共に、他端部が外部接続用電極部に半田を用いて接合されている。   In recent years, lighting fixtures using high-power white LEDs have been widely adopted. For example, in patent document 1, the illumination provided with the LED module in which the some LED member (light-emitting device) using an LED chip was mounted, and the metal instrument main body which has a module attaching part which attaches an LED module with a fixing screw. Instruments have been proposed. In this lighting fixture, each external connection electrode part of the mounting substrate of the LED chip is electrically connected to the circuit pattern of the circuit board via the terminal board. The terminal plate has one end of an elongated metal plate joined to the circuit pattern of the circuit board using solder, and the other end joined to the external connection electrode using solder.

また、特許文献2では、熱伝導シート、熱伝導プレート、LEDが実装された回路基板および配光制御レンズが配置されたLED光学モジュールを、ハウジング上に実装したLED照明灯具が提案されている。このLED照明器具では、ハウジングに取り付けられて、外部の電力供給源からの電力をユニット内に導入する外部接続コネクタからユニット内に配線されたコードに取り付けられた配線コネクタとLED光学モジュールの基板コネクタとを接続している。   Patent Document 2 proposes an LED illumination lamp in which an LED optical module on which a heat conductive sheet, a heat conductive plate, a LED-mounted circuit board, and a light distribution control lens are mounted is mounted on a housing. In this LED lighting apparatus, a wiring connector attached to a cord and wired to a cord wired in the unit from an external connection connector that is attached to the housing and introduces power from an external power supply source into the unit, and a board connector of the LED optical module And connected.

特開2009−76326号公報JP 2009-76326 A 特開2010−67415号公報JP 2010-67415 A

しかしながら、上記従来の技術には、以下の課題が残されている。
すなわち、従来、LED部材と電源回路とを接続する際に、特許文献1に記載の技術のように端子板を半田付けする場合やリード線を半田付けする場合、劣化したLED部材の交換などのリペア性に難があると共に、半田付け時にヒューマンエラー等のイレギュラーによる不良が発生しやすく、さらに工数が増えて製造コストが高いという問題があった。また、LED部材にコネクタを設けて接続を図る場合、コネクタが凸部となってレンズとの干渉を配慮しなければならず設計上の自由度が制限されると共に全体の薄型化が困難になるという不都合があった。さらに、コネクタと配線とが必要になり、部材コストの増加を招いてしまう問題もあった。
However, the following problems remain in the conventional technology.
That is, conventionally, when connecting an LED member and a power supply circuit, when soldering a terminal plate or soldering a lead wire as in the technique described in Patent Document 1, replacement of a deteriorated LED member, etc. In addition to difficulty in repairability, irregularities such as human errors are likely to occur during soldering, and the number of man-hours is increased and the manufacturing cost is high. Further, when a connection is provided by providing a connector on the LED member, the connector becomes a convex portion, and it is necessary to consider interference with the lens, so that the degree of freedom in design is limited and it is difficult to reduce the overall thickness. There was an inconvenience. Furthermore, there is a problem that a connector and wiring are required, resulting in an increase in member cost.

本発明は、前述の課題に鑑みてなされたもので、リペア性および組立性に優れ、薄型化および低コスト化が可能なLEDモジュールを提供することを目的とする。   The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an LED module that is excellent in repairability and assemblability and can be reduced in thickness and cost.

本発明は、前記課題を解決するために以下の構成を採用した。すなわち、第1の発明のLEDモジュールは、基板上にLED部が設けられ該LED部に電気的に接続された一対のLED側電極部が前記基板上に設けられたLED部材と、上面に該LED部材が載置されているヒートシンク部材と、該ヒートシンク部材上に載置されていると共に前記LED部材に隣接した一対のベース側電極部が上面に設けられたベース板と、前記LED部材を覆って前記ベース板上に設置された透明カバー部材とを備え、該透明カバー部材が、前記ベース板に設置された状態で互いに対応する前記LED側電極部と前記ベース側電極部とに両端部が付勢状態で接触する一対の導電性のバネ部材を内面に備えていることを特徴とする。   The present invention employs the following configuration in order to solve the above problems. That is, the LED module of the first invention includes an LED member provided with an LED portion on a substrate and a pair of LED side electrode portions electrically connected to the LED portion provided on the substrate; A heat sink member on which the LED member is mounted, a base plate that is mounted on the heat sink member and has a pair of base-side electrode portions adjacent to the LED member on the upper surface, and the LED member are covered. A transparent cover member installed on the base plate, and the transparent cover member has both ends on the LED side electrode portion and the base side electrode portion corresponding to each other in a state of being installed on the base plate. A pair of conductive spring members that are in contact in an urging state are provided on the inner surface.

このLEDモジュールでは、透明カバー部材が、ベース板に設置された状態で互いに対応するLED側電極部とベース側電極部とに両端部が付勢状態で接触する一対の導電性のバネ部材を内面に備えているので、透明カバー部材をベース板上に設置するだけでLED側電極部とベース側電極部とをバネ部材を介して電気的に導通させることができる。したがって、半田付けやリード線によって接合または接続させる必要が無く、リペア性および組立性に優れている。また、LED部材にコネクタを設ける必要が無く、部材コストの増大を抑制することができると共に、付勢により変形可能なバネ部材で導通を図るので、設計上の自由度も比較的高く、透明カバー部材との干渉も抑制することができる。   In this LED module, the transparent cover member is provided with a pair of conductive spring members whose both ends are in contact with the LED side electrode portion and the base side electrode portion corresponding to each other in a state of being installed on the base plate. Therefore, the LED side electrode part and the base side electrode part can be electrically connected via the spring member only by installing the transparent cover member on the base plate. Therefore, there is no need to join or connect by soldering or lead wires, and the repairability and assemblability are excellent. Further, there is no need to provide a connector on the LED member, and an increase in member cost can be suppressed, and conduction is achieved by a spring member that can be deformed by biasing, so the degree of freedom in design is relatively high, and the transparent cover Interference with the member can also be suppressed.

第2の発明のLEDモジュールは、第1の発明において、前記透明カバー部材が、前記LED部からの出射される光を集光して外部に出射するレンズ部を前記LED部の上方に備えていることを特徴とする。
すなわち、このLEDモジュールでは、透明カバー部材が、LED部からの出射される光を集光して外部に出射するレンズ部をLED部の上方に備えているので、レンズ部により透明カバー部材がカバーだけでなくレンズも兼ねて高い集光効果を得ることができる。
In the LED module of the second invention according to the first invention, the transparent cover member includes a lens unit that condenses the light emitted from the LED unit and emits the light to the outside above the LED unit. It is characterized by being.
That is, in this LED module, since the transparent cover member has a lens portion that condenses the light emitted from the LED portion and emits it to the outside, the transparent cover member is covered by the lens portion. Not only a lens but also a high light collecting effect can be obtained.

第3の発明のLEDモジュールは、第1または第2の発明において、前記基板が、4つの角部を有した略四角形状であり、前記4つの角部のうち対向する一対の角部に前記一対のLED側電極部が形成されていると共に、他の対向する一対の角部が一対のLED用ネジにより前記ヒートシンク部材に押し付けられて固定されていることを特徴とする。
すなわち、このLEDモジュールでは、基板の4つの角部のうち対向する一対の角部に一対のLED側電極部が形成されていると共に、他の対向する一対の角部が一対のLED用ネジによりヒートシンク部材に押し付けられて固定されているので、四隅(4つの角部)がバネ部材およびLED側電極部によりヒートシンク部材に押し付けられてLED部材を安定して固定することができ、位置ズレなどを防ぐことができる。
The LED module according to a third aspect of the present invention is the LED module according to the first or second aspect, wherein the substrate has a substantially quadrangular shape having four corners, and the pair of corners opposed to each other among the four corners. A pair of LED side electrode portions are formed, and another pair of opposite corner portions are pressed against and fixed to the heat sink member by a pair of LED screws.
That is, in this LED module, a pair of LED side electrode portions are formed at a pair of opposite corner portions of the four corner portions of the substrate, and another pair of opposite corner portions are formed by a pair of LED screws. Since it is pressed and fixed to the heat sink member, the four corners (four corners) are pressed against the heat sink member by the spring member and the LED side electrode portion, so that the LED member can be stably fixed, and misalignment, etc. Can be prevented.

第4の発明のLEDモジュールは、第1から第3の発明のいずれかにおいて、前記透明カバー部材の内面に複数のリベット部が形成されていると共に前記バネ部材に前記リベット部が挿通可能なかしめ用孔部が形成され、前記バネ部材が、前記かしめ用孔部に挿通された前記リベット部をかしめることで前記透明カバー部材に固定されていることを特徴とする。
すなわち、このLEDモジュールでは、バネ部材が、かしめ用孔部に挿通されたリベット部をかしめることで透明カバー部材に固定されているので、バネ部材の固定が容易であると共にネジ等の固定部材が不要で部材コストを低減することができる。
According to a fourth aspect of the present invention, there is provided the LED module according to any one of the first to third aspects, wherein a plurality of rivet portions are formed on the inner surface of the transparent cover member and the rivet portion can be inserted into the spring member. A hole is formed, and the spring member is fixed to the transparent cover member by caulking the rivet portion inserted through the caulking hole.
That is, in this LED module, since the spring member is fixed to the transparent cover member by caulking the rivet portion inserted through the caulking hole, the spring member can be easily fixed and a fixing member such as a screw can be used. Is unnecessary, and the member cost can be reduced.

本発明によれば、以下の効果を奏する。
すなわち、本発明に係るLEDモジュールによれば、透明カバー部材が、ベース板に設置された状態で互いに対応するLED側電極部とベース側電極部とに両端部が付勢状態で接触する一対の導電性のバネ部材を内面に備えているので、リペア性および組立性に優れていると共に、設計上の自由度も比較的高く、部材コストの増大を抑制することもできる。
The present invention has the following effects.
That is, according to the LED module according to the present invention, the transparent cover member is installed on the base plate, and the pair of the electrode side electrode part and the base side electrode part corresponding to each other are in contact with each other in the biased state. Since the conductive spring member is provided on the inner surface, it is excellent in repairability and assemblability, has a relatively high degree of freedom in design, and can suppress an increase in member cost.

本発明に係るLEDモジュールの一実施形態を示す斜視図である。It is a perspective view which shows one Embodiment of the LED module which concerns on this invention. 本実施形態において、内部を透視して示すLEDモジュールの斜視図である。In this embodiment, it is a perspective view of the LED module shown through the inside. 本実施形態において、LEDモジュールを示す平面図である。In this embodiment, it is a top view which shows an LED module. 図3のA−A線断面図である。FIG. 4 is a sectional view taken along line AA in FIG. 3. 本実施形態において、透明カバー部材を示す下面(裏面)側から見た斜視図である。In this embodiment, it is the perspective view seen from the lower surface (back surface) side which shows a transparent cover member. 本実施形態において、LED部材を示す斜視図である。In this embodiment, it is a perspective view which shows an LED member. 本実施形態において、LEDモジュールを示す上面(平面)側から見た分解斜視図である。In this embodiment, it is the disassembled perspective view seen from the upper surface (plane) side which shows an LED module. 本実施形態において、LEDモジュールを示す下面(裏面)側から見た分解斜視図である。In this embodiment, it is the disassembled perspective view seen from the lower surface (back surface) side which shows an LED module.

以下、本発明に係るLEDモジュールの一実施形態を、図1から図8に基づいて説明する。   Hereinafter, an LED module according to an embodiment of the present invention will be described with reference to FIGS.

本実施形態におけるLEDモジュール1は、図1から図4に示すように、全体が薄型の略円盤状であり、基板2上にLED部3が実装され該LED部3に電気的に接続された一対のLED側電極部2aが基板2上に設けられたLED部材4と、上面に該LED部材4が載置されているヒートシンク部材5と、該ヒートシンク部材5上に載置されていると共にLED部材4に隣接した一対のベース側電極部6aが上面に設けられたベース板6と、該ベース板6が載置されるヒートシンク部材5と、LED部材4を覆ってベース板6上に設置された透明カバー部材7とを備えている。   As shown in FIGS. 1 to 4, the LED module 1 according to the present embodiment has a thin and generally disk shape, and the LED unit 3 is mounted on the substrate 2 and electrically connected to the LED unit 3. A LED member 4 having a pair of LED side electrode portions 2a provided on the substrate 2, a heat sink member 5 on which the LED member 4 is mounted on the upper surface, and an LED mounted on the heat sink member 5 and an LED A base plate 6 having a pair of base-side electrode portions 6 a adjacent to the member 4 provided on the upper surface, a heat sink member 5 on which the base plate 6 is placed, and the LED member 4 are installed on the base plate 6. The transparent cover member 7 is provided.

上記LED部3は、白色LEDであり、図6に示すように、略四角形状の基板2上に実装された青色LEDなどのLEDチップ(図示略)を、シリコーン樹脂を主剤としてYAG蛍光体等が添加された樹脂材で円板状に封止したものである。なお、白色LEDとしては、上記以外でも種々のものが採用可能である。
上記LED側電極部2aは、基板2上にパターン形成された金属膜であり、略長方形状の基板2における互いに対向した角部近傍に形成されている。これらのLED側電極部2aは、基板2に形成された配線パターン(図示略)によりLED部3のLEDチップに電気的に接続されている。
The LED unit 3 is a white LED, and as shown in FIG. 6, an LED chip (not shown) such as a blue LED mounted on a substantially square substrate 2, a YAG phosphor or the like with a silicone resin as a main component, and the like. It is sealed in a disk shape with a resin material to which is added. Various white LEDs other than those described above can be used.
The LED side electrode portion 2a is a metal film patterned on the substrate 2, and is formed in the vicinity of the corner portions of the substantially rectangular substrate 2 facing each other. These LED side electrode portions 2 a are electrically connected to the LED chip of the LED portion 3 by a wiring pattern (not shown) formed on the substrate 2.

上記ヒートシンク部材5は、例えば放熱性の高いアルミ板で形成されている。このヒートシンク部材5は、中央にLED部材4が載置可能な円盤状に形成されている。すなわち、LED部材4は、ヒートシンク部材5上の中央設置領域に熱伝導ペースト(図示略)を介して載置される。   The heat sink member 5 is formed of, for example, an aluminum plate with high heat dissipation. The heat sink member 5 is formed in a disk shape in which the LED member 4 can be placed at the center. That is, the LED member 4 is placed on a central installation region on the heat sink member 5 via a heat conductive paste (not shown).

上記ベース板6は、図7および図8に示すように、中央にLED部材4を配置するための中央孔6bが形成された略円板状に形成されている。ベース板6の上面には、一対のベース側電極部6aが略半円状にそれぞれ対向状態にパターン形成されている。また、ベース板6の外縁には、半径方向外方に突出した突出部6cが形成され、該突出部6cの上面に一対のベース側電極部6aに接続された一対の外部接続用電極部6dがパターン形成されている。
なお、上記ベース側電極部6aは、交流電圧を整流して直流に変換するAC−DC変換回路である外部のLED駆動回路等に、一対の外部接続用電極部6dを介して電気的に接続される。
As shown in FIGS. 7 and 8, the base plate 6 is formed in a substantially disk shape having a central hole 6b for arranging the LED member 4 at the center. On the upper surface of the base plate 6, a pair of base-side electrode portions 6 a are formed in patterns in a substantially semicircular shape so as to face each other. Further, a protruding portion 6c protruding radially outward is formed on the outer edge of the base plate 6, and a pair of external connection electrode portions 6d connected to the pair of base side electrode portions 6a on the upper surface of the protruding portion 6c. Is patterned.
The base-side electrode portion 6a is electrically connected to an external LED drive circuit or the like, which is an AC-DC conversion circuit that rectifies and converts an alternating voltage into a direct current via a pair of external connection electrode portions 6d. Is done.

上記透明カバー部材7は、図5に示すように、ガラスまたはプラスチックで略円盤状に形成され、例えばアクリル樹脂などの光透過性材料で一体成形されたものである。この透明カバー部材7は、ベース板6に設置された状態で互いに対応するLED側電極部2aとベース側電極部6aとに両端部が付勢状態で接触する一対の導電性のバネ部材8を内面に備えている。   As shown in FIG. 5, the transparent cover member 7 is made of glass or plastic in a substantially disk shape, and is integrally formed of a light transmissive material such as acrylic resin. The transparent cover member 7 includes a pair of conductive spring members 8 whose both end portions are in contact with the LED side electrode portion 2a and the base side electrode portion 6a corresponding to each other in a state of being installed on the base plate 6. It is provided on the inner surface.

この透明カバー部材7の内面には、複数のリベット部7aが突出状態に一体成形されていると共に、バネ部材8にはリベット部7aが挿通可能なかしめ用孔部が一対ずつ形成されている。すなわち、バネ部材8は、かしめ用孔部に挿通されたリベット部7aをかしめることで透明カバー部材7に固定されている。   On the inner surface of the transparent cover member 7, a plurality of rivet portions 7a are integrally formed in a protruding state, and the spring member 8 is formed with a pair of caulking holes through which the rivet portions 7a can be inserted. That is, the spring member 8 is fixed to the transparent cover member 7 by caulking the rivet portion 7a inserted through the caulking hole.

また、透明カバー部材7は、LED部3からの出射される光を集光して外部に出射するレンズ部7bをLED部3の上方に備えている。
このレンズ部7bは、例えば透明カバー部材7の内面中央に形成されたフレネルレンズであり、LED部3の光軸を中心とした同心円上の複数のプリズム部で構成されている。なお、レンズ部7bは、フレネルレンズの他に、TIR(Total Internal Reflection)レンズや通常の凸レンズ等の他のレンズ形状を採用しても構わない。
Further, the transparent cover member 7 includes a lens portion 7 b that condenses the light emitted from the LED unit 3 and emits the light to the outside above the LED unit 3.
The lens portion 7 b is, for example, a Fresnel lens formed at the center of the inner surface of the transparent cover member 7, and includes a plurality of concentric prism portions centered on the optical axis of the LED portion 3. In addition to the Fresnel lens, the lens unit 7b may adopt another lens shape such as a TIR (Total Internal Reflection) lens or a normal convex lens.

上記バネ部材8は、金属製のものが採用されるが、導電性を有していれば他の材質または構成としても構わない。例えば、バネ部材8として、プラスチックの表面に金属めっきを施したものや、プラスチックに金属箔をラミネートしたものでも構わない。
このバネ部材8は、レンズ部7bの外周部に取り付けられ、一対のかしめ用孔部が形成された中央部から互いに反対方向に突出して延在した一対の端子部8aを有している。これら端子部8aは、くの字状に屈曲して先端が下方に向けて傾斜している。また、バネ部材8は、一対の端子部8aの先端が対応するLED側電極部2aとベース側電極部6aとに対向して取り付けられている。したがって、透明カバー部材7がベース板6上に設置された際に、一対のバネ部材8の端子部8aがそれぞれLED側電極部2aとベース側電極部6aとに押圧状態に接触して付勢された状態となり、LED側電極部2aとベース側電極部6aとの電気的導通を図るようになっている。
The spring member 8 is made of metal, but other materials or configurations may be used as long as they have conductivity. For example, the spring member 8 may be a plastic surface with metal plating or a plastic with a metal foil laminated.
The spring member 8 is attached to the outer peripheral portion of the lens portion 7b, and has a pair of terminal portions 8a extending in a direction opposite to each other from a central portion where a pair of caulking holes are formed. These terminal portions 8a are bent in a dogleg shape and the tips are inclined downward. Further, the spring member 8 is attached to face the LED side electrode portion 2a and the base side electrode portion 6a corresponding to the tip ends of the pair of terminal portions 8a. Therefore, when the transparent cover member 7 is installed on the base plate 6, the terminal portions 8a of the pair of spring members 8 come into contact with the LED side electrode portion 2a and the base side electrode portion 6a in a pressed state, respectively, and are biased. Thus, the LED-side electrode portion 2a and the base-side electrode portion 6a are electrically connected.

上記LED部材4は、一対のLED用ネジ9によりヒートシンク部材5に固定されている。すなわち、基板2の角部のうちLED側電極部2aが形成されていない一対が円弧状に切り欠かれており、これらの角部にLED用ネジ9が配されてヒートシンク部材5に形成されたLED用ネジ孔5aに螺着されると共にLED用ネジ9の頭部により一対の上記角部がヒートシンク部材5に押し付けられてLED部材4が固定されている。したがって、4つの角部のうち対向する一対の角部に一対のLED側電極部2aが形成されてバネ部材8で押さえ付けられていると共に、他の対向する一対の角部が一対のLED用ネジ9によりヒートシンク部材5に押し付けられて固定されている。   The LED member 4 is fixed to the heat sink member 5 by a pair of LED screws 9. That is, a pair of corner portions of the substrate 2 where the LED side electrode portion 2a is not formed is cut out in an arc shape, and LED screws 9 are arranged at these corner portions to form the heat sink member 5. The LED member 4 is fixed by being screwed into the LED screw hole 5a and pressing the pair of corners against the heat sink member 5 by the head of the LED screw 9. Therefore, a pair of LED side electrode portions 2a is formed at a pair of opposite corners of the four corners and pressed by the spring member 8, and another pair of opposite corners is for a pair of LEDs. The screw 9 is pressed against the heat sink member 5 and fixed.

上記ベース板6および透明カバー部材7は、一対の組立用ネジ10によりヒートシンク部材5に固定されている。
ヒートシンク部材5には、一対の組立用ネジ10が螺着される一対の組立用ネジ孔5bが形成されていると共に、ベース板6および透明カバー部材7には、一対の組立用ネジ10が挿通可能な一対のベース側貫通孔6eおよびカバー側貫通孔7cが形成されている。
すなわち、一対の組立用ネジ10を、カバー側貫通孔7cとベース側貫通孔6eとに挿入すると共に組立用ネジ孔5bに螺着させることで、透明カバー部材7とヒートシンク部材5とでベース板6を挟んだ状態にしてこれらを互いに固定している。
The base plate 6 and the transparent cover member 7 are fixed to the heat sink member 5 by a pair of assembly screws 10.
The heat sink member 5 is formed with a pair of assembly screw holes 5b into which the pair of assembly screws 10 are screwed, and the pair of assembly screws 10 are inserted into the base plate 6 and the transparent cover member 7. A pair of possible base side through holes 6e and cover side through holes 7c are formed.
That is, by inserting the pair of assembly screws 10 into the cover side through hole 7c and the base side through hole 6e and screwing them into the assembly screw hole 5b, the transparent cover member 7 and the heat sink member 5 can be used as a base plate. These are fixed to each other with 6 interposed therebetween.

なお、透明カバー部材7は、カバー側貫通孔7cの上部にざぐり部が形成されて組立用ネジ10の頭部が収納可能になっており、透明カバー部材7の表面から突出しないようになっている。また、LED側電極部2aは、ベース側貫通孔6eの周囲を避けてパターン形成されており、組立用ネジ10に接触しないようになっている。   The transparent cover member 7 has a counterbore portion formed at the upper part of the cover side through-hole 7c so that the head of the assembly screw 10 can be stored, and does not protrude from the surface of the transparent cover member 7. Yes. The LED-side electrode portion 2a is patterned so as to avoid the periphery of the base-side through hole 6e, and does not come into contact with the assembly screw 10.

このように本実施形態のLEDモジュール1では、透明カバー部材7が、ベース板6に設置された状態で互いに対応するLED側電極部2aとベース側電極部6aとに両端部が付勢状態で接触する一対の導電性のバネ部材8を内面に備えているので、透明カバー部材7をベース板6上に設置するだけでLED側電極部2aとベース側電極部6aとをバネ部材8を介して電気的に導通させることができる。   As described above, in the LED module 1 according to the present embodiment, the transparent cover member 7 is placed on the base plate 6 and both ends thereof are biased to the LED side electrode portion 2a and the base side electrode portion 6a that correspond to each other. Since a pair of conductive spring members 8 in contact with each other are provided on the inner surface, the LED side electrode portion 2a and the base side electrode portion 6a can be connected via the spring member 8 simply by installing the transparent cover member 7 on the base plate 6. Can be made electrically conductive.

したがって、半田付けやリード線によって接合または接続させる必要が無く、リペア性および組立性に優れている。また、LED部材4にコネクタを設ける必要が無く、部材コストの増大を抑制することができると共に、付勢により変形可能なバネ部材8で導通を図るので、設計上の自由度も比較的高く、透明カバー部材7との干渉も抑制することができる。特に、レンズ部7bの外周部にバネ部材8を配するので、レンズ部7bによる集光の妨げにならないと共に、バネ部材8がLEDモジュール1の厚さ方向に柔軟に変形するので、レンズ部7bをLED部3に近接させることが可能になる。   Therefore, there is no need to join or connect by soldering or lead wires, and the repairability and assemblability are excellent. In addition, it is not necessary to provide a connector on the LED member 4, and it is possible to suppress an increase in member cost and to achieve conduction with the spring member 8 that can be deformed by biasing, so the degree of freedom in design is relatively high, Interference with the transparent cover member 7 can also be suppressed. In particular, since the spring member 8 is disposed on the outer peripheral portion of the lens portion 7b, the lens portion 7b does not hinder light collection by the lens portion 7b, and the spring member 8 is flexibly deformed in the thickness direction of the LED module 1. Can be brought close to the LED unit 3.

また、透明カバー部材7が、LED部3からの出射される光を集光して外部に出射するレンズ部7bをLED部3の上方に備えているので、レンズ部7bにより透明カバー部材7がカバーだけでなくレンズも兼ねて高い集光効果を得ることができる。   Further, since the transparent cover member 7 includes a lens portion 7b that condenses the light emitted from the LED portion 3 and emits the light to the outside, the transparent cover member 7 is formed by the lens portion 7b. High condensing effect can be obtained not only as a cover but also as a lens.

さらに、基板2の4つの角部のうち対向する一対の角部に一対のLED側電極部2aが形成されていると共に、他の対向する一対の角部が一対のLED用ネジ9によりヒートシンク部材5に押し付けられて固定されているので、四隅(4つの角部)がバネ部材8およびLED側電極部2aによりヒートシンク部材5に押し付けられてLED部材4を安定して固定することができ、位置ズレなどを防ぐことができる。
また、バネ部材8が、かしめ用孔部に挿通されたリベット部7aをかしめることで透明カバー部材7に固定されているので、バネ部材8の固定が容易であると共にネジ等の固定部材が不要で部材コストを低減することができる。
Further, a pair of LED side electrode portions 2a is formed at a pair of opposing corners among the four corners of the substrate 2, and the other pair of opposing corners are heat sink members by a pair of LED screws 9. Since the four corners (four corners) are pressed against the heat sink member 5 by the spring member 8 and the LED side electrode portion 2a, the LED member 4 can be stably fixed. Misalignment can be prevented.
Further, since the spring member 8 is fixed to the transparent cover member 7 by caulking the rivet portion 7a inserted through the caulking hole portion, the spring member 8 is easily fixed and a fixing member such as a screw is provided. It is unnecessary and the member cost can be reduced.

なお、本発明は上記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることができる。   In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.

1…LEDモジュール、2…基板、2a…LED側電極部、3…LED部、4…LED部材、5…ヒートシンク部材、6…ベース板、6a…ベース側電極部、7…透明カバー部材、7a…リベット部、7b…レンズ部、8…バネ部材、9…LED用ネジ   DESCRIPTION OF SYMBOLS 1 ... LED module, 2 ... Board | substrate, 2a ... LED side electrode part, 3 ... LED part, 4 ... LED member, 5 ... Heat sink member, 6 ... Base plate, 6a ... Base side electrode part, 7 ... Transparent cover member, 7a ... Rivet part, 7b ... Lens part, 8 ... Spring member, 9 ... LED screw

Claims (4)

基板上にLED部が設けられ該LED部に電気的に接続された一対のLED側電極部が前記基板上に設けられたLED部材と、
上面に該LED部材が載置されているヒートシンク部材と、
該ヒートシンク部材上に載置されていると共に前記LED部材に隣接した一対のベース側電極部が上面に設けられたベース板と、
前記LED部材を覆って前記ベース板上に設置された透明カバー部材とを備え、
該透明カバー部材が、前記ベース板に設置された状態で互いに対応する前記LED側電極部と前記ベース側電極部とに両端部が付勢状態で接触する一対の導電性のバネ部材を内面に備えていることを特徴とするLEDモジュール。
An LED member provided with an LED part on a substrate and a pair of LED side electrode parts electrically connected to the LED part provided on the substrate;
A heat sink member on which the LED member is mounted;
A base plate mounted on the heat sink member and provided with a pair of base side electrode portions adjacent to the LED member on an upper surface;
A transparent cover member that covers the LED member and is installed on the base plate;
When the transparent cover member is installed on the base plate, a pair of conductive spring members whose opposite ends are in contact with the LED side electrode portion and the base side electrode portion that correspond to each other are provided on the inner surface. An LED module comprising:
請求項1に記載のLEDモジュールにおいて、
前記透明カバー部材が、前記LED部からの出射される光を集光して外部に出射するレンズ部を前記LED部の上方に備えていることを特徴とするLEDモジュール。
The LED module according to claim 1,
The LED module, wherein the transparent cover member includes a lens unit that collects light emitted from the LED unit and emits the light to the outside, above the LED unit.
請求項1または2に記載のLEDモジュールにおいて、
前記基板が、4つの角部を有した略四角形状であり、
前記4つの角部のうち対向する一対の角部に前記一対のLED側電極部が形成されていると共に、他の対向する一対の角部が一対のLED用ネジにより前記ヒートシンク部材に押し付けられて固定されていることを特徴とするLEDモジュール。
The LED module according to claim 1 or 2,
The substrate has a substantially quadrangular shape with four corners;
The pair of LED side electrode portions are formed at a pair of opposite corner portions of the four corner portions, and another pair of opposite corner portions are pressed against the heat sink member by a pair of LED screws. An LED module which is fixed.
請求項1から3のいずれか一項に記載のLEDモジュールにおいて、
前記透明カバー部材の内面に複数のリベット部が形成されていると共に前記バネ部材に前記リベット部が挿通可能なかしめ用孔部が形成され、
前記バネ部材が、前記かしめ用孔部に挿通された前記リベット部をかしめることで前記透明カバー部材に固定されていることを特徴とするLEDモジュール。
The LED module according to any one of claims 1 to 3,
A plurality of rivet portions are formed on the inner surface of the transparent cover member and a caulking hole portion through which the rivet portion can be inserted is formed in the spring member.
The LED module, wherein the spring member is fixed to the transparent cover member by caulking the rivet portion inserted through the caulking hole.
JP2011102810A 2011-05-02 2011-05-02 LED module Expired - Fee Related JP5679897B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011102810A JP5679897B2 (en) 2011-05-02 2011-05-02 LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011102810A JP5679897B2 (en) 2011-05-02 2011-05-02 LED module

Publications (2)

Publication Number Publication Date
JP2012234979A JP2012234979A (en) 2012-11-29
JP5679897B2 true JP5679897B2 (en) 2015-03-04

Family

ID=47435016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011102810A Expired - Fee Related JP5679897B2 (en) 2011-05-02 2011-05-02 LED module

Country Status (1)

Country Link
JP (1) JP5679897B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6029067B2 (en) * 2013-03-12 2016-11-24 パナソニックIpマネジメント株式会社 Illumination light source and illumination device
JP5882525B2 (en) * 2015-09-02 2016-03-09 京セラコネクタプロダクツ株式会社 Semiconductor light emitting device holder and semiconductor light emitting device module
JP6844993B2 (en) * 2016-11-25 2021-03-17 古河電気工業株式会社 Laser device and light source device
JP6844994B2 (en) * 2016-11-25 2021-03-17 古河電気工業株式会社 Laser device and light source device

Also Published As

Publication number Publication date
JP2012234979A (en) 2012-11-29

Similar Documents

Publication Publication Date Title
JP5570018B2 (en) LED module
US8764249B2 (en) Lamp device and luminaire
JP5665521B2 (en) LED connector assembly and connector
JP4854798B2 (en) Lighting device
US20120127741A1 (en) Lamp unit and lighting fixture
TW201319456A (en) Illiminant device and lamp thereof and manufacturing method of the of the lamp
JP2016528665A (en) Ultra-thin LED light engine
JP5679897B2 (en) LED module
JP5563407B2 (en) LED lighting unit
JP2013175350A (en) Light-emitting device and lighting fixture using the same
JP5752336B1 (en) LED lamp
JP5216111B2 (en) LED substrate holding member and LED lamp using the same
JP2011096416A (en) Led lighting fixture
JP6108223B2 (en) Lighting device
JP2009170642A (en) Electric device
US8653734B2 (en) Light emitting device
JP2012043571A (en) Lighting unit
JP6646881B2 (en) lighting equipment
JP5811960B2 (en) Light emitting module
JP6796752B2 (en) Light source device
WO2019207932A1 (en) Lighting device
JP2016066500A (en) Lamp device and lighting system
WO2018116698A1 (en) Structure for attaching light source substrate
JP5126638B2 (en) Light emitting device and lighting apparatus
KR20160016103A (en) Optical semiconductor illuminating apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140328

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141119

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150106

R150 Certificate of patent or registration of utility model

Ref document number: 5679897

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees