JP5216111B2 - LED substrate holding member and LED lamp using the same - Google Patents

Description

  The present invention relates to an LED substrate pressing member that covers an LED substrate on which an LED (light emitting diode) is mounted, and an LED lamp using the LED substrate pressing member.

  Light-emitting diodes (hereinafter referred to as “LEDs”), which have lower power consumption and longer life than conventional incandescent bulbs, are used as one of the energy-saving measures along with increasing ecological awareness of consumers. In recent years, the production volume of LED lamps using such LEDs has increased rapidly.

  One of the advantages of LEDs over incandescent bulbs is low power consumption. However, unlike incandescent bulbs, only a few dozen percent of the power consumed in an LED is converted to visible light, and the others are directly heat, so in a small light source LED, heat concentrates on itself. There are characteristics that make it easier.

  In general, LEDs are said to have a long lifetime, but for a long lifetime, it is necessary to keep the chip junction temperature (referred to as the junction temperature) below a specified temperature. Shorter. Further, not only the junction temperature, but also the phosphor and the sealing material are accelerated at high temperatures, so that the deterioration of the light output is prevented and the maintenance of the light output is prevented. Therefore, the temperature of the LED needs to be as low as possible.

  On the other hand, LEDs for lighting use are required to have higher output in order to increase the amount of light emission, and high output type LEDs (called “power LEDs” etc.) are used, or many LEDs are used. Use in combination has become common. If the output is increased, the temperature of the LED naturally rises and cannot be made to have a long lifetime, so the “heat countermeasure” is a very important factor.

  An LED lamp described in Patent Document 1 can be given as an example of such an LED lamp that has been subjected to such “heat countermeasures”.

  This LED lamp includes an LED board on which the LED is mounted, and a heat radiating member that is in contact with the back surface and the outer periphery of the LED board and conducts heat from the LED board. The heat is conducted from the substrate to the heat radiating member, and then is radiated from the outer surface of the heat radiating member to the outside.

JP 2009-93926 A

  However, simply dissipating heat from the LED to the outside is insufficient as a “heat countermeasure” for the LED lamp.

  That is, a circuit pattern for supplying power to the LED is also mounted on the surface of the LED substrate on which the LED is mounted, and a power supply housed inside the LED lamp is provided at an electrical end of the circuit pattern. A terminal is provided for electrically connecting a power supply lead wire for supplying power from the circuit (usually a pair of terminals is provided with plus and minus), and the power supply lead wire is connected to the terminal. It is fixed with solder.

  Naturally, the heat from the LED during light emission is also transmitted to the connection part between the power supply lead wire and the terminal. Therefore, when the LED lamp is used for a long period of time, the heat softens the solder and causes the creep phenomenon (to the object). A phenomenon in which strain increases with the passage of time when sustained stress is applied, whereas plastic deformation does not depend on time, whereas creep increases in displacement (has time dependence) and temperature The higher the value, the faster the creep rate.) Or cracks in the solder, and the solder may peel from the terminal.

  By the way, in general, since the power supply lead wire is pushed into the LED lamp on the assumption that the power supply lead wire is fixed to the terminal by solder, the power supply lead wire is always oriented to be disconnected from the terminal. The stress is energized. For this reason, as described above, when the fixing force by the solder becomes weaker than the stress due to the occurrence of creep or crack in the solder, the power supply lead wire may be disconnected from the terminal, and the LED may not be lit. was there.

  The present invention has been developed in view of such problems of the prior art. Therefore, a main object of the present invention is to provide a technique for preventing the power supply lead from coming off from the terminal of the circuit pattern and preventing the LED from becoming unlit even after long-term use.

The invention described in claim 1
“LED 14 and the LED board pressing member 20 for fixing the LED board 16 attached to the front surface 16a side to the LED main body 12 with the power supply terminal 40 to the LED 14 to which the power supply lead wire 38 is solder-connected,
A surface mounting portion 50 that presses and fixes the LED substrate 16 to the lamp body 12 from the surface 16a side of the LED substrate 16 while avoiding the LED 14 and the terminal 40;
A solder connecting portion Z that extends from the surface mounting portion 50 and can be moved close to and away from the surface 16a with elasticity, and by which the power supply lead wire 38 is soldered to the terminal 40 due to the elasticity. The LED board pressing member 20 ”includes an elastic pressing portion 52 that presses toward the surface 16a.

The invention described in claim 2
“The LED 14 and the power supply terminal 40 to which the power supply lead wire 38 is soldered are attached to the front surface 16a side, and the LED substrate pressing member 20 attached to the LED substrate 16 fixed to the lamp body 12 is used. There,
A surface mounting portion 50 that is mounted on the surface 16a of the LED board 16 while avoiding the LED 14 and the terminal 40;
A solder connecting portion Z that extends from the surface mounting portion 50 and can be moved close to and away from the surface 16a with elasticity, and by which the power supply lead wire 38 is soldered to the terminal 40 due to the elasticity. The LED board pressing member 20 ”includes an elastic pressing portion 52 that presses toward the surface 16a.

  According to these LED board pressing members 20, the surface 16a of the LED board 16 is pressed and fixed to the lamp body 12 (corresponding to claim 1, FIG. 1 to FIG. 4), or the LED board 16 fixed to the lamp body 12. The elastic pressing portion 52 is soldered to the power supply terminal 40 and the power supply lead wire 38 toward the surface 16a. Since it can be pressed, heat from the LED 14 at the time of light emission is transmitted continuously or intermittently over a long period to the solder connection portion Z that fixes the power supply lead wire 38 to the terminal 40. Even if creep, cracks, or peeling of solder occurs in the solder connection portion Z, the power supply lead wire 38 or the solder connection portion Z is disconnected from the terminal 40 and the LED 14 is lit. It is possible to avoid to become ability.

The invention described in claim 3 relates to the improvement of the LED substrate pressing member 20 according to claim 1 or 2,
“The surface is extended from the surface mounting portion 50 and is elastically movable toward and away from the surface 16a, and receives the pressing force from the lower end 24a of the reflector 24 that reflects the light from the LED 14, whereby the surface The mounting portion 50 is further provided with a pressing force biasing portion 54 that biases the pressing force to the surface 16a.

  According to the present invention, the pressing force biasing portion 54 is elastic with respect to the surface mounting portion 50 by pressing the lower end 24 a of the reflector 24 against the pressing force biasing portion 54 provided on the LED substrate pressing member 20. The surface mounting portion 50 is pressed against the LED board 16 by deformation and approaching the surface 16a of the LED board 16 and the reaction force due to the deformation. Accordingly, it is not necessary to use an adhesive or to form an engagement portion or the like to the LED substrate 16 on the LED substrate pressing member 20, and the LED substrate pressing member 20 can be easily fixed to the LED substrate 16. can do.

The invention described in claim 4
“LED 14 and LED board 16 having a terminal 40 for supplying power to LED 14 attached to surface 16a;
A reflector 24 disposed on the surface 16a side of the LED substrate 16 and reflecting light from the LED 14,
It is LED lamp 10 "provided with the LED board pressing member 20 in any one of Claim 1 thru | or 3.

  By providing the LED lamp 10 using the LED substrate pressing member 20 according to any one of claims 1 to 3, the LED lamp 10 is provided in which the LED 14 is difficult to be turned on even when used for a long period of time. Can do.

  According to the present invention, the heat from the light-emitting LED is continuously or intermittently transmitted over a long period of time to the solder connection portion that fixes the power supply lead to the terminal. Even if a creep or crack occurs in the part, it can be avoided that the power supply lead wire or the solder connection part itself is disconnected from the terminal and the LED cannot be turned on.

It is the cross-sectional perspective view which shows the LED lamp to which this invention was applied, and its one part enlarged view. It is a disassembled perspective view of the LED lamp to which this invention was applied. It is a perspective view which shows the relationship between a LED board and a LED board attachment member. It is a perspective view which shows a LED board pressing member. It is a figure which shows typically the state which the elastic press part is pressing the electric power feeding lead wire. It is a perspective view which shows the other Example regarding an LED board and an LED board mounting member.

  Embodiments to which the present invention is applied will be described below with reference to the drawings. As shown in FIGS. 1 to 4, an LED lamp 10 to which the present invention is applied is roughly a lamp body 12, an LED 14, an LED substrate 16, an LED substrate pressing member 20, a power feeding circuit 22, and a reflector 24. And a front cover 26.

  The lamp body 12 is a housing of the LED lamp 10 formed of a material having high thermal conductivity such as an aluminum alloy, for example. A socket part 30 formed adjacent to the LED storage part 28 and in which the power feeding circuit 22 is stored, and a base 32 formed adjacent to the socket part 30 for receiving electric power from the outside are attached. It is comprised by the nozzle | cap | die part 34 and the LED board attachment member 18. As shown in FIG.

  Further, the internal space 28a of the LED housing portion 28 and the internal space 30a of the socket portion 30 are in communication with each other, and the LED board mounting member 18 is disposed at the boundary between the internal spaces 28a and 30a, as will be described later. Yes. Furthermore, the internal space 30a of the socket part 30 and the internal space 34a of the base part 34 are also in communication with each other, and lead wires for supplying power from the base 32 to the power supply circuit 22 through both the internal spaces 30a and 34a. (Not shown) is accommodated.

  In this embodiment, the LED housing portion 28, the socket portion 30, and the base portion 34 are integrally formed. Of course, each portion 28, 30, 34 is formed separately and bonded or screwed. The lamp main body 12 may be configured by combining with known means such as the above.

  As shown in FIG. 3, the LED board mounting member 18 is a member for fixing the LED board 16 to the lamp body 12, and in this embodiment, the LED housing part 28 side of the internal space 30 a in the socket part 30. It is fitted and fixed to the end.

  In addition, the LED substrate mounting member 18 is formed on the surface on the LED housing portion 28 side at the time of fixing, slightly larger than the outer shape of the LED substrate 16, and the LED substrate insertion recess 42 into which the LED substrate 16 is fitted, A pair of power supply lead wire insertion holes 44 for inserting the pair of power supply lead wires 38 (in this embodiment, the peripheral edge of the insertion hole 44 reaches the side peripheral surface 18a of the LED board mounting member 18; And a protrusion receiving hole 48 for receiving the positioning protrusion 46 protruding from the LED board pressing member 20 is provided. In addition, it is suitable to form the LED board attachment member 18 with a material with high heat conductivity in that heat generated when the LED 14 is caused to emit light can be quickly conducted to the lamp body 12 to increase heat dissipation efficiency.

  The LED 14 is a semiconductor element that emits light when a predetermined voltage is applied, and is mounted and held on the upper surface of the LED substrate 16. The light emitting surface 14a of the LED 14 in the present embodiment is formed in an elliptical shape, but of course, it may be rectangular or circular, and there is no restriction on the shape selection. Further, the number of LEDs 14 is not limited to one, and a plurality of LEDs 14 may be mounted on the upper surface of the LED substrate 16. The light distribution pattern of the LED 14 is a so-called Lambertian type, and is characterized in that most of the light is collected in the optical axis L (= 0 °) and in the vicinity thereof, and the angle formed with the optical axis L is ± 50% of the total light emitted from the LED 14 is included within the range of 30 °, 70% of the total light is included within the range of ± 45 °, and further within the range of ± 60 °. 90% of the total light is included.

  The LED board 16 is a rectangular insulating plate material on which an LED 14 and a circuit pattern 36 for supplying power to the LED 14 are mounted. An LED 14 from the power supply circuit 22 is turned on at the end of the circuit pattern 36. A pair of terminals 40 to which a pair of power supply lead wires 38 for supplying power are connected by solder are formed. This solder connection portion is referred to as a solder connection portion Z.

  The LED board pressing member 20 (FIG. 4) is provided with a window 51 at the center thereof, which avoids the terminal 40 of the circuit pattern 36 to which the LED 14 and the power feed lead 38 are soldered, and enters them inside. A portion around the window portion 51 is a surface attachment portion 50 that presses and fixes the surface 16 a of the LED substrate 16 from the periphery of the LED substrate 16. Of course, you may make it avoid LED14 etc. by providing a notch in the periphery of the surface attachment part 50 instead of the window part 51 enclosed by the surface attachment part 50. FIG.

  The two opposing sides of the window 51 are notched in an L-shape so as to coincide with the solder connection portion Z raised by soldering the power supply lead wire 38 to the terminal 40, and the remaining portion 52a is in an extended state. It is bent in an L shape on the surface 50a side so as to elastically contact the solder connection portion Z (of course, the notch is not limited to the L shape, and the two parallel to the outer periphery from the inner peripheral edge of the window 51) A cutout may be provided, and a portion cut out between the cutouts may be used as the elastic pressing portion 52. In short, it is sufficient that the portion is in the shape of a tongue having elasticity.

  In other words, when disposed on the surface 16a side of the LED substrate 16, the elastic pressing portion 52 can be moved toward and away from the surface 16a of the LED substrate 16 with elasticity. And is pressed toward the surface 16a (see FIG. 5).

  On the other hand, the outer peripheral edge of the surface mounting portion 50 is provided with three sets of two notches parallel to the inside (of course, three or more sets may be provided), and a tongue-like pressing force between the notches is provided. The urging portion 54 is integrally extended outward, and projects outward from the outer peripheral edge of the surface mounting portion 50. The surface of the projecting portion 54 a projecting outward is higher than the surface 50 a of the surface mounting portion 50, and the intermediate portion 54 b from the projecting portion 54 a to the extending base portion 54 c faces the surface 50 a of the surface mounting portion 50. Inclined downward, the back surface of the protruding portion 54a can be elastically approached and separated from the front surface 16a of the LED substrate 16 in an elastic state, and from the lower end of the reflector 24 mounted in the LED housing portion 28. When the overhanging portion 54a receives a pressing force, the intermediate portion 54b is bent, and the surface mounting portion 50 connected to the pressing force urging portion 54 is pressed against the surface 16a of the LED substrate 16 by the generated elastic force.

  In addition, it is preferable to provide a chamfered portion 52m at the surface side corner portion of the inner peripheral edge of the window portion 51 so that the emitted light from the mounted LED 14 is not blocked as much as possible. Further, a clearance groove 52p for the feed lead wire 38 is provided at one set of opposing angles of the window 51. In addition, a pair of positioning protrusions 46 are provided on the back surface of the front surface mounting portion 50 of the LED substrate pressing member 20 with the window 51 interposed therebetween.

  In the present embodiment, these are integrally molded with resin, but of course, the surface mounting portion 50, the elastic pressing portion 52, and the pressing force biasing portion 54 are formed as separate bodies, and then combined with each other to produce an LED. The substrate pressing member 20 may be formed. Moreover, as a material of the LED board pressing member 20, since the heat dissipation performance of the heat generated in the LED 14 is enhanced and the member 20 may touch the circuit pattern 36, an insulating material having a high thermal conductivity (for example, It is preferable to use ceramics or high thermal conductive resin). Of course, it is also possible to use a metal material whose surface is resin-coated.

  The pressing force urging portion 54 is not an essential component of the LED substrate pressing member 20, but when the pressing force urging portion 54 is not provided, the elastic pressing portion 52 can press the power supply lead 38. In addition, the surface mounting portion 50 must be fixed to the surface 16a of the LED board 16 by another means, and as another means, for example, bonding with an adhesive, screwing, or an engaging member is used. (In FIG. 6, a bolt 62 is projected from the surface 16a of the LED board 16, and the bolt 62 is inserted into a bolt insertion hole 64 provided at a corresponding position of the LED board pressing member 20. After that, the nut 66 is tightened to attach the LED board pressing member 20 to the surface 16a of the LED board 16).

  The power supply circuit 22 (FIG. 1) is an electric power (usually several volts) obtained by matching the power (usually commercial AC power) supplied from the outside via a base 32 and a lead wire (not shown) to the specifications of the LED 14. DC power), and then the power is supplied to the LED 14 via the power supply lead 38 and the circuit pattern 36, for example, a circuit configured by combining capacitors, diodes, etc. The lamp body 12 is accommodated in the internal space 30 a of the socket portion 30.

  The reflector 24 is a bowl-shaped member in which a reflection surface 56 that reflects light from the LED 14 is formed on the inner surface thereof, and is fitted into the internal space 28 a of the LED housing portion 28 in the lamp body 12. Although the reflective surface 56 of the present embodiment is formed by arranging a large number of minute segments 56a, the reflective surface 56 may be configured with a smooth curved surface without being divided into such segments 56a.

  Further, when the reflector 24 is fitted into the internal space 28a of the LED accommodating portion 28 as described above, the pressing force urging portion 54 of the LED substrate pressing member 20 attached to the surface 16a of the LED substrate 16 is replaced with the reflector 24. The shape of the reflector 24 is determined so that the lower end 24a of the first and second ends 24a abuts and presses. For this reason, when the pressing force urging portion 54 of the LED substrate pressing member 20 receives the pressing force from the lower end 24a of the reflector 24, the pressing force urging portion 54 is elastically deformed with respect to the surface mounting portion 50, and the LED is pressed. The surface mounting portion 50 is pressed against the LED substrate 16 by the reaction force due to the deformation in the vicinity of the surface 16a of the substrate 16. As described above, the LED board pressing member 20 can be fixed to the LED board 16 by fitting the reflector 24.

  The front cover 26 is made of polycarbonate that covers the opening 28b of the LED housing portion 28 (and the opening 24b of the reflector 24) in the lamp body 12 (of course, not limited to polycarbonate, but also glass, polypropylene, polyethylene terephthalate (PET), etc. And a transparent member having a role of preventing the user from touching the high-temperature LED 14 and the circuit pattern 36 on the LED substrate 16 by mistake. In this embodiment, three locking claws 58 are projected from the peripheral edge of the front cover 26 toward the reflector 24 at 120 ° intervals (of course, three or more may be used). Is fitted into a locking groove 60 provided at a corresponding position on the inner surface of the opening 28 b of the LED housing 28 in the lamp body 12, whereby the front cover 26 is fixed to the lamp body 12. By fixing the front cover 26 in this way, the opening 24b side end of the reflector 24 comes into contact with the front cover 26, and the lower end 24a is a reaction force from the pressing force urging portion 54 of the LED board pressing member 20. By receiving, the reflector 24 is also fixed between the front cover 26 and the LED board pressing member 20. Further, in the illustrated embodiment, the solid transparent lens body 27 protruding from the central portion of the front cover 26 toward the LED 14 is formed, but of course, the lens body 27 may not be provided.

  A procedure for assembling the LED lamp 10 of this embodiment will be briefly described. First, the feeding circuit 22 is accommodated in the internal space 30a of the socket portion 30 from the opening 28b of the LED accommodating portion 28 in the lamp body 12, and a base 32 to which a lead wire (not shown) is electrically connected is attached to the base portion 34. Thereafter, the LED board mounting member 18 is inserted from the opening 28b and is fitted into and fixed to the end of the internal space 30a in the socket 30 on the side of the LED accommodating portion 28 (in this case, the power supply lead wire 38 from the power supply circuit 22). Is inserted into the power supply lead wire insertion hole 44 formed in the LED board mounting member 18 and the tip thereof is exposed to the internal space 28a of the LED housing portion 28).

  Both ends of the power supply lead wire 38 protruding from the power supply lead wire insertion hole 44 toward the LED housing portion 28 are fixed to the terminals 40 on the surface 16a of the LED substrate 16 by soldering (this portion is the solder connection portion Z). Thereafter, the LED board 16 is fitted into the LED board insertion recess 42 of the LED board mounting member 18 (silicon grease or the like having high thermal conductivity is interposed between the LED board 16 and the LED board insertion recess 42. You may apply.)

  After the LED board 16 is fitted into the LED board insertion recess 42, the LED board pressing member 20 is placed on the surface of the LED board 16 (at this time, the positioning protrusion 46 protruding from the LED board pressing member 20 is placed). Then, the LED board pressing member 20 is easily positioned at a correct position where the surface mounting part 50 does not interfere with the circuit pattern 36 or the terminal 40 by being inserted into the protrusion receiving hole 48 provided in the LED board mounting member 18. After that, the reflector 24 is fitted into the internal space 28a of the LED housing portion 28, and finally the locking claw 58 of the front cover 26 is locked to the opening portion 28b of the LED housing portion 28. The front cover 26 is fixed to the opening 28b so as to be fitted into the groove 60.

  In the LED lamp 10 of the present embodiment, the LED board pressing member 20 is attached to the surface 16a of the LED board 16 so that the elastic pressing part 52 is connected to the power supply terminal 40 and the power supply lead 38 by soldering. Since Z can be pressed toward the surface 16a, heat from the LED 14 during light emission continuously or intermittently over a long period of time to the solder connection portion Z that fixes the power supply lead wire 38 to the terminal 40. Even if creep, cracks, or peeling of the solder occurs in the solder connection portion Z, the power supply lead wire 38 or the solder connection portion Z is disconnected from the terminal 40 and the LED 14 cannot be turned on. It can be avoided.

  Further, the pressing force urging portion 54 is pressed against the surface mounting portion 50 by pressing the lower end 24a of the reflector 24 against the pressing force urging portion 54 provided on the LED substrate pressing member 20 as described above. It is elastically deformed and approaches the surface 16a of the LED board 16, and the surface mounting portion 50 is pressed against the LED board 16 by a reaction force due to the deformation. Accordingly, it is not necessary to use an adhesive or to form an engagement portion or the like to the LED substrate 16 on the LED substrate pressing member 20, and the LED substrate pressing member 20 can be easily fixed to the LED substrate 16. can do.

10 ... LED lamp 12 ... Lamp body 14 ... LED
DESCRIPTION OF SYMBOLS 16 ... LED board 18 ... LED board attachment member 20 ... LED board pressing member 22 ... Power feeding circuit 24 ... Reflector 26 ... Front cover 27 ... Lens body 28 ... LED accommodating part 30 ... Socket part 32 ... Base 34 ... Base part 36 ... Circuit Pattern 38 ... Power supply lead wire 40 ... Terminal 42 ... LED substrate insertion recess 44 ... Power supply lead wire insertion hole 46 ... Positioning projection 48 ... Projection receiving hole 50 ... Surface mounting portion 52 ... Elastic pressing portion 54 ... With pressing force Force portion 56 ... Reflecting surface 58 ... Locking claw 60 ... Locking groove 62 ... Bolt 64 ... Bolt insertion hole 66 ... Nut Z ... Solder connection portion

Claims (4)

An LED substrate pressing member that fixes an LED substrate, to which a LED and a terminal for power supply to the LED, to which the power supply lead wire is soldered, attached to the surface side, to the lamp body,
A surface mounting portion that presses and fixes the LED substrate to the lamp body from the surface side of the LED substrate while avoiding the LED and the terminal;
Extending from the surface mounting portion and being able to approach and separate from the surface with elasticity, the elasticity allows the solder connection portion that solder-connects the power supply lead wire to the terminal toward the surface. An LED substrate pressing member comprising an elastic pressing portion for pressing. An LED substrate pressing member attached to an LED substrate, which is attached to the front surface side of the LED and a terminal for power supply to the LED, to which the power supply lead wire is solder-connected,
A surface mounting portion that is mounted on the surface of the LED substrate while avoiding the LED and the terminal;
Extending from the surface mounting portion and being able to approach and separate from the surface with elasticity, the elasticity allows the solder connection portion that solder-connects the power supply lead wire to the terminal toward the surface. An LED substrate pressing member comprising an elastic pressing portion for pressing.   The surface mounting portion extends from the surface mounting portion and is elastically movable toward and away from the surface. By receiving a pressing force from a lower end of a reflector that reflects light from the LED, the surface mounting portion receives the surface. The LED board pressing member according to claim 1, further comprising a pressing force urging portion that urges the pressing force to the LED board. An LED substrate on which a LED and a terminal for supplying power to the LED are attached to the surface;
A reflector disposed on the surface side of the LED substrate and reflecting light from the LED;
An LED lamp comprising the LED substrate pressing member according to any one of claims 1 to 3.

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