JP4679922B2 - EL light source - Google Patents

Description

The present invention, EL (electroluminescence) light emitting device, about the EL light source, in particular using an organic EL (organic EL device).

  In recent years, the development of EL light-emitting elements, particularly organic EL light-emitting elements, has been attracting attention as a planar light source. An organic EL light-emitting element has an organic thin film containing a fluorescent organic compound sandwiched between a positive electrode and a negative electrode as a light-emitting layer, and injects electrons and holes (holes) from each electrode into the organic thin film, thereby providing a fluorescent property. Excitons of the compound are generated, and light emitted when the excitons return to the ground state is extracted to the outside.

  In such an EL light emitting element, it is necessary to form a planar electrode, to extract light from the light emitting layer to the outside, to form an organic thin film, to improve moisture resistance, etc. A glass substrate is generally used as the substrate and the sealing substrate.

  Moreover, since it is necessary to take out the light from a light emitting layer outside, a transparent electrode is used as an electrode (element electrode). As the transparent electrode (element electrode), ITO (indium tin oxide) is generally used because of its good transparency and easy manufacture.

  However, the glass substrate used as the element substrate and the sealing substrate is formed as thin as possible in order to improve the productivity of the EL light emitting element, and is usually as thin as several millimeters. Therefore, the conventional EL light emitting device has problems such as being easily affected by an external force due to its low mechanical strength, being easily damaged, and having a large area.

  In addition, ITO used as an element electrode is a conductor, but has high resistivity, and a voltage drop due to ITO resistance is large when power is supplied from a local connection with an external terminal, so that power is supplied to the light emitting layer. As the distance from the connection point decreases, there are problems such as luminance spots and the fact that a large area cannot be constructed.

  In order to improve the mechanical strength of an EL light-emitting element, an EL light-emitting element using a protective transparent substrate in addition to an element substrate and a glass substrate as a sealing substrate is known (for example, see Patent Document 1 below). , Referred to as Conventional Example 1). In Conventional Example 1, the device electrode is represented by an anode layer, the EL light emitting device is represented by an organic EL panel, and the protective transparent substrate is represented by a panel mounting substrate.

  In the conventional example 1, the mechanical strength can be improved, but the connection (connection portion) to the element electrode is merely configured locally as a pad shape or a pin shape. It is difficult to prevent the luminance unevenness from being eliminated, and it is difficult to form a large-area EL light-emitting element by itself. In addition, although a plurality of EL light emitting elements are mounted on a panel substrate to form a large area light emitting panel, since the connection portions are pin-shaped, handling is not easy and replacement of EL light emitting elements is not easy. There is a problem.

  In order to improve the mechanical strength of the EL light emitting element, an EL light emitting element as an airtight container has been proposed (see, for example, Patent Document 2, hereinafter referred to as Conventional Example 2).

In the conventional example 2, the mechanical strength can be improved, but the element substrate of the single EL light emitting element is used as a part of the hermetic container as it is, so that the productivity in forming the light emitting layer and the element electrode is low. However, since the productivity of the airtight container is low, there is a problem that the productivity is lacking as a whole. In addition, since no consideration is given to the element electrode, it is difficult to prevent a voltage drop due to the resistance of the element electrode, the luminance unevenness cannot be eliminated, and a large-area EL light-emitting element is configured. There is a problem that it is difficult. In addition, since connection with the outside is not taken into consideration, there is a problem that connection to an EL light emitting element is not easy and handling is not easy.
JP 2004-69774 A JP 2002-208476 A

  The present invention has been made in view of such a situation. By placing the element substrate of the EL light emitting element on the translucent protective substrate and protecting the EL light emitting element from the external force, the influence (damage etc.) due to the external force is achieved. It is an object of the present invention to provide an EL light source body with high mechanical strength capable of preventing

  In addition, the present invention connects the connection pattern of the element wiring board to the element electrode of the EL light emitting element to prevent a voltage drop caused by the resistance of the element electrode, thereby supplying power uniformly to the light emitting layer. Another object is to provide an EL light source that can emit light with less spots.

  In addition, the present invention makes the connection pattern of the element wiring board conductive to the element electrode formed on the element substrate at the outer periphery (outside of the peripheral edge) of the sealing substrate, thereby reducing the influence on the light emitting layer and reducing the reliability. Another object is to provide an EL light source body capable of high and stable light emission.

  Further, the present invention makes it easy to reliably align the element electrode and the connection pattern with the element wiring board as a frame shape, and the element electrode and the connection pattern are continuously (uniformly) along the side of the sealing substrate. It is another object of the present invention to provide an EL light source body that can reliably emit light with less brightness unevenness and can protect the periphery of the EL light emitting element and increase the mechanical strength.

  In addition, the present invention provides a highly reliable EL light source body that suppresses a voltage drop at the element electrode by reliably conducting the element electrode and the connection pattern with a conductive adhesive, and has less luminance unevenness. For other purposes.

  Another object of the present invention is to provide an EL light source body having a cassette type exterior structure by providing a frame portion on a translucent protective substrate.

  In addition, the present invention simplifies the manufacturing process by connecting the element electrode and the connection pattern with the pressing member, and the element electrode and the connection pattern based on the difference in coefficient of thermal expansion between the element electrode and the connection pattern. Another object of the present invention is to provide a highly reliable EL light source body that does not cause a connection failure problem.

  In addition, the present invention improves the adhesion and conductivity between the element electrode and the connection pattern by conducting the element electrode and the connection pattern through the elastic conductor, thereby reducing the voltage drop due to the resistance of the element electrode. Another object is to provide a highly reliable EL light source body that can be suppressed.

  Another object of the present invention is to provide a highly reliable EL light source body in which the element electrode and the connection pattern are more reliably conducted by having a spring portion in the pressing member.

  Further, the present invention provides a pressing member as a clamping member and a clamping section of the clamping member in a U shape so that the translucent protective substrate, the element substrate, and the element wiring board are sandwiched between the element electrode and the element electrode. Another object of the present invention is to provide a highly reliable EL light source body which can ensure conduction with a connection pattern and which has improved mechanical strength by protecting the periphery of the EL light emitting element.

  Another object of the present invention is to provide an EL light source body that can be easily connected to the outside by providing a connection member on the element wiring board.

  Another object of the present invention is to provide an EL light source body with good luminous efficiency that can be driven with low voltage, low current, and low power consumption by using an organic EL light emitting element as the EL light emitting element.

EL light source according to the present invention, the EL light source body having an EL light emitting device having a device substrate及beauty sealing substrate which is formed between the light emitting layer are arranged opposite to each other, the element substrate is mounted A translucent protective substrate, two element electrodes of different polarities that are respectively led out along the side of the sealing substrate and are arranged outside the sealing substrate in a peripheral region of the element substrate , and the sealing An element wiring board having a connection pattern arranged to face the element electrode on the outside of the substrate and conducted to the element electrode, the element wiring board being arranged along an inner periphery of the sealing substrate. characterized in that there as a frame-shaped having an outer circumference along the circumferential and peripheral edge of the device substrate.

With this configuration, the translucent protective substrate protects the EL light emitting element from external force, and an EL light source body with high mechanical strength can be obtained. In addition, since the connection pattern of the device wiring board can be composed of a low-resistance metal film, it is possible to prevent a voltage drop due to the resistance of the device electrode composed of ITO having a high resistance, and to uniformly power the light emitting layer. Therefore, it is possible to prevent the occurrence of luminance unevenness in the light emitting portion, and it is possible to configure a large area light emitting portion. Since the connection pattern is connected to the element electrode outside the sealing substrate, the light emitting layer is not damaged, and reliable and stable light emission is possible. In addition, since the element wiring board is configured to reinforce and protect the element substrate and the sealing substrate formed of glass, the mechanical strength of the EL light source body can be further improved. In addition, the connection pattern can be extended in the four directions around the sealing substrate, and the conduction region between the device electrode and the connection pattern can be configured to be large and continuous, so that the voltage drop due to the resistance of the device electrode is reduced. Further suppression is possible. Further, the alignment between the element electrode and the element wiring board is facilitated, and the element electrode and the connection pattern can be reliably conducted. The periphery of the EL light emitting element can be protected, and an EL light source body with high mechanical strength can be obtained.

In the EL light source body according to the present invention, the element electrode is led out in four directions of the sealing substrate, and the connection pattern extends in four directions of the sealing substrate .

With this configuration, the connection pattern extends in the four directions of the sealing substrate, so that the connection region with the device electrode can be made large and even, and the voltage drop due to the resistance of the device electrode can be reliably suppressed. It becomes possible .

  In the EL light source body according to the present invention, the connection pattern is connected to the element electrode by a conductive adhesive.

  With this configuration, the connection pattern and the element electrode can be reliably conducted, voltage drop due to the resistance of the element electrode can be suppressed, and a highly reliable EL light source body with less luminance unevenness can be obtained. it can.

  In the EL light source body according to the present invention, the translucent protective substrate has a frame portion surrounding the EL light emitting element and the element wiring board.

  With this configuration, the EL light source body can be a cassette-type exterior structure, the mechanical strength can be further improved, and the EL light source body is easy to handle and highly reliable. Further, the outer shape of the EL light source body can be made compact.

  In the EL light source body according to the present invention, the connection pattern is pressed against the element electrode by a pressing member that presses the element wiring board.

  With this configuration, the connection pattern and the element electrode can be brought into pressure contact with each other, so that a conductive adhesive or the like is not necessary, so that the manufacturing process can be simplified. In addition, connection failure problems such as peeling of the conductive adhesive due to the difference in coefficient of thermal expansion between the element wiring board and the element substrate (glass) can be prevented.

  In the EL light source body according to the present invention, the connection pattern is in pressure contact with the element electrode through an elastic conductor.

  With this configuration, since the adhesion and conductivity between the connection pattern and the device electrode are improved as compared with the case where the connection pattern and the device electrode are directly pressed, a highly reliable EL with improved uniformity of the applied voltage. It can be a light source.

  In the EL light source body according to the present invention, the pressing member has a spring portion.

  With this configuration, the connection pattern can be pressed more strongly against the element electrode, and can be reliably conducted.

  In the EL light source body according to the present invention, the pressing member is a clamping member that clamps the translucent protective substrate, the element substrate, and the element wiring substrate.

  With this configuration, the connection pattern and the device electrode can be reliably conducted with a simple pressing structure, and a highly reliable EL light source body with improved mechanical strength can be obtained. In addition, the outer shape of the EL light source body can be simplified and the size can be reduced.

  In the EL light source body according to the present invention, the clamping member has a U-shaped clamping section.

  With this configuration, it is possible to perform strong pressing with a sandwiching member having a simple structure, and to reliably protect the translucent protective substrate, the element substrate, and the element wiring substrate from external forces, and to obtain an EL light source body with high mechanical strength. Can do. In addition, the holding member can be easily manufactured, and an EL light source body with high reliability can be obtained.

  In the EL light source body according to the present invention, the element wiring board includes a connection member.

  With this configuration, connection to the outside (power supply member) can be performed collectively at one place, and an EL light source body that can be easily connected to the outside is obtained.

  In the EL light source body according to the present invention, the EL light emitting element is an organic EL light emitting element.

  With this configuration, an EL light source body with high luminous efficiency that can be driven with low voltage, low current, and low power consumption is obtained.

  According to the EL light source body according to the present invention, the element electrode and the low resistance connection pattern are connected continuously (equally) using the element wiring board, so that the voltage drop of the applied voltage due to the resistance of the element electrode is reduced. Since it can be suppressed, uniform power supply to the light emitting layer can be performed, and there is an effect that a light emitting portion having a large area with few luminance spots can be obtained.

  According to the EL light source body according to the present invention, since the EL light emitting element is mounted on the translucent protective substrate, it is possible to prevent the influence of external force on the EL light emitting element, so that the mechanical strength is large and the handling is performed. Is easy and high reliability is obtained.

  According to the EL light source body according to the present invention, since the element wiring substrate is used, the adhesion and conductivity between the element electrode and the connection pattern can be improved, and the voltage drop due to the resistance of the element electrode is suppressed, thereby increasing the luminance. There are effects that there are few spots and the reliability can be increased.

  According to the EL light source body according to the present invention, a cassette-type exterior structure can be provided by providing a frame portion on the translucent protective substrate and providing a connection member, so that it is easy to handle, compact, and mounted. The efficiency (mounting efficiency) is good and the reliability is high.

  According to the EL light source body according to the present invention, since the element electrode is pressed against the element wiring board (connection pattern) using the pressing member, a cassette-type exterior structure can be obtained, which is easy to handle and compact. The mounting efficiency (mounting efficiency) is good and the reliability is high. In addition, it is possible to increase the adhesion and conductivity between the device electrode and the connection pattern, to reduce luminance unevenness, and to improve the reliability.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
FIG. 1 is an exploded perspective view of an EL light source body according to Embodiment 1 of the present invention.

  The EL light source body 20 according to the present embodiment includes an EL light emitting element 1, an element wiring board 2, a translucent protective substrate 10, and the like that are stacked and overlapped.

  The EL light-emitting element 1 is composed of an element substrate 1a and a sealing substrate 1b arranged to face each other, and a light-emitting layer (not shown) is formed therebetween. A positive hole transport layer (not shown) is formed on the plus side and an electron transport layer (not shown) is formed on the minus side with the light emitting layer interposed therebetween. An organic EL light-emitting element is formed by forming a light-emitting layer with organic molecules.

  When the EL light emitting element 1 is an organic EL light emitting element, it can be driven with a low voltage and a low current, and can be an EL light source body having high emission luminance with respect to the supplied power and good light emission efficiency. Various structures have been proposed for the light-emitting layer of the EL light-emitting element 1 and the structure of the hole transport layer and the electron transport layer stacked on the light-emitting layer, and the structure is not limited to the above-described structure.

  The element substrate 1a is required to be transparent in order to extract light from the light emitting portion 1d (see FIG. 2) to the outside, and the element electrode 1e (see the plus element electrode 1ep and the minus element electrode 1em shown in FIG. 2). Since it is necessary to form the element electrode 1e when it is not necessary to distinguish between the electrode 1ep and the minus element electrode 1em, the electrode 1ep and the minus element electrode 1em are formed of, for example, a glass substrate.

  The element electrode 1e is led out along the periphery (side) of the sealing substrate 1b on the surface of the element substrate 1a facing the element wiring substrate 2 (see FIGS. 3 and 4). Since the element electrode 1e is required to be transparent, it is made of, for example, ITO (indium tin oxide), and the element electrode 1e has at least two electrodes having different polarities (plus and minus) (the above-described plus element electrode 1ep and minus). Element electrodes 1em) are respectively formed.

  In the element wiring board 2, a connection pattern 2c (refer to the plus connection pattern 2cp and the minus connection pattern 2cm shown in FIG. 3) disposed on the surface facing the element electrode 1e along the element electrode 1e. When it is not necessary to distinguish the negative connection pattern 2 cm, the connection pattern 2 c is formed. The connection pattern 2c is configured to be continuously (equally) connected to the element electrodes 1e by using a conductive adhesive or the like so as to be electrically connected to each other. Since the connection pattern 2c is arranged along the element electrode 1e, it has a shape along the periphery (side) of the sealing substrate 1b.

  The EL light emitting element 1 and the element wiring board 2 are superimposed (laminated), and the element electrode 1e on the element substrate 1a and the connection pattern 2c are connected, whereby the EL light emitting element 1 and the element wiring board 2 are integrated. Is done. The element substrate 1a having the light emitting portion 1d is disposed so as to face the translucent protective substrate 10, and the integrated EL light emitting element 1 and element wiring substrate 2 are placed and fixed on the translucent protective substrate 10. The That is, the element substrate 1a is bonded and fixed to the translucent protective substrate 10 with an appropriate adhesive or the like.

  On the sealing substrate 1b, a heat sink 14 as a heat radiating means is superimposed and laminated via a heat conductive elastic body 13. In addition, it is preferable from a design viewpoint to provide the mask part 11 between the element substrate 1a and the translucent protective substrate 10, and to mask the non-light-emitting part of the EL light-emitting element 1.

  A part of the element wiring board 2 is extended to form a terminal forming portion 2b, and the terminal forming portion 2b is provided with a connector 12 as a connecting member for connecting to the outside. Depending on the shape of the connector 12, connector alignment portions 10b, 13b, and 14b are formed in a cutout shape on the translucent protective substrate 10, the heat conductive elastic body 13, and the heat sink 14 so that the connector 12 can be connected to the outside. It is.

  The translucent protective substrate 10 includes a frame portion 10f having a shape for housing (embedding) the mask portion 11, the EL light emitting element 1, the element wiring substrate 2, the heat conductive elastic body 13, and the heat sink 14. Since the EL light-emitting element 1 and the element wiring board 2 are surrounded by the translucent protective substrate 10 and the frame portion 10f, the EL light source body 20 has a so-called cassette-type exterior structure. The translucent protective substrate 10 is made of a translucent substrate having high strength such as acrylic resin or tempered glass, and the required strength can be ensured by setting the thickness to 5 to 10 mm, for example.

  Therefore, the EL light source body 20 can increase the mechanical strength, is not affected by external force (damage or the like), can be handled easily, and can have high reliability. Moreover, since the EL light source body 20 includes the connector 12, it can be easily connected to the outside. Mounting efficiency (mounting efficiency) is improved, and maintenance such as replacement with an EL light source device is facilitated.

  2A and 2B are explanatory diagrams of an EL light-emitting element applied to the EL light source body according to Embodiment 1 of the present invention. FIG. 2A is a plan view seen from the side from which the element electrode is derived, and FIG. It is a side view in the arrow A direction of (A).

  In the EL light emitting device 1, a light emitting layer or the like is laminated and enclosed between the element substrate 1a and the sealing substrate 1b as described above. The element substrate 1a and the sealing substrate 1b are, for example, 10 to 20 cm square glass substrates, and the thickness is, for example, about 1 to 2 mm. Since the element electrode 1e is led out and formed on the peripheral edge (peripheral region, peripheral edge portion) of the element substrate 1a along the side of the sealing substrate 1b, the peripheral edge of the element substrate 1a is from the outer periphery of the sealing substrate 1b. It is configured outside.

  For example, a positive element electrode 1ep for applying a positive voltage is disposed on the left and right peripheral edges of the element substrate 1a, and a negative element electrode 1em for applying a negative voltage is disposed on the upper and lower peripheral edges of the element substrate 1a. The state is illustrated. The light emitting portion 1d is defined by the plus element electrode 1ep and the minus element electrode 1em.

  In order to facilitate understanding, the layout configuration of the element electrode 1e is illustrated as a simple configuration. However, the layout is not limited to this, and the element electrode 1e can be divided as appropriate on each side. Needless to say.

  FIG. 3 is an explanatory view for explaining the outline of the element wiring board of the EL light source body according to the first embodiment of the present invention, and (A) is an element viewed from the side opposite to the surface on which the connection pattern is formed. The top view of the wiring board for an object, (B) is sectional drawing in the arrow AA of (A).

  In order to facilitate understanding, after the connection pattern 2c is formed, the wiring pattern 2w (see the plus wiring pattern 2wp and the minus wiring pattern 2wm shown in FIG. 4 is necessary. It is necessary to distinguish between the plus wiring pattern 2wp and the minus wiring pattern 2wm. In this case, the element wiring board 2 before forming the wiring pattern 2w is shown.

  A connection pattern 2 c is formed and arranged on the element wiring board 2 so as to correspond to the arrangement of the element electrodes 1 e (see FIG. 2) of the EL light emitting element 1. The positive connection pattern 2cp is patterned and divided so as to correspond to the positive element electrode 1ep, and the negative connection pattern 2cm is corresponding to the negative element electrode 1em.

  The connection pattern 2c is formed by, for example, laminating (adhering) a copper foil (metal conductor) on an insulating substrate and then patterning the copper foil, and is much lower than the element electrode 1e (ITO). Since it has a resistivity, it can be made low resistance. The positive connection pattern 2cp is made to correspond to the positive element electrode 1ep, and the negative connection pattern 2cm is made to correspond to the negative element electrode 1em so as to be connected to each other with a conductive adhesive to be conducted. By using a conductive adhesive, a reliable connection is possible. It is also possible to connect using low-temperature solder or the like instead of the conductive adhesive.

  Since the low resistance connection pattern 2c is continuously (equally) connected to the element electrode 1e along the side direction of the sealing substrate 1b, it is possible to prevent a voltage drop of the applied voltage due to the element electrode 1e having a large resistance. This makes it possible to supply the device electrode 1e (that is, the light emitting layer) with uniform power. Therefore, it is possible to prevent luminance unevenness of the light emitted from the light emitting portion 1d, and it is possible to configure a large area light emitting portion 1d, that is, a large area EL light source body 20.

  Further, since the connection pattern 2c is connected to the element electrode 1e on the outer periphery (outside of the periphery) of the sealing substrate 1b, the light emitting layer is not damaged, and an external force may be exerted on the light emitting portion 1d. Therefore, a stable and reliable EL light source body 20 can be obtained.

  In order to reduce the influence of the resistance of the element electrode 1e as much as possible, the element electrode 1e is led out in the four directions around the sealing substrate 1b, so that the connection pattern 2c extends in the four directions of the sealing substrate 1b. The connection region with the element electrode 1e can be made large and uniform, and the voltage drop due to the resistance of the element electrode 1e can be reliably suppressed. Therefore, in order to extend and hold the connection pattern 2c connected to the element electrode 1e in the four directions of the sealing substrate 1b, it is preferable that the element wiring board 2 has a frame shape.

  By making the element wiring board 2 into a frame shape, the alignment between the element electrode 1e and the connection pattern 2c is facilitated, and the element electrode 1e and the connection pattern 2c can be connected continuously (equally) and reliably. . Further, since the element wiring board 2 is superimposed on the element electrode 1e led out to the outer periphery of the sealing substrate 1b, the element wiring board 2 is disposed along the entire circumference of the element substrate 1a and the sealing substrate 1b. Since the sealing substrate 1b is reliably protected from external force, the mechanical strength of the EL light source body 20 can be improved.

  A through conductor 2h is connected to the connection pattern 2c in correspondence with the wiring pattern 2w to be connected, and the connection pattern 2c and the wiring pattern 2w are connected through the through conductor 2h. The through conductor 7h can be formed by appropriately forming a through hole in the element wiring substrate 2 and plating or filling the through hole with a conductor.

  A part of the element wiring board 2 is extended to form a terminal forming portion 2b. The terminal forming portion 2b is formed with a plus pad terminal 2tp corresponding to the plus connection pattern 2cp and a minus pad terminal 2tm corresponding to the minus connection pattern 2cm (the distinction between the plus pad terminal 2tp and the minus pad terminal 2tm). If it is not necessary to do this, the pad terminal is 2t). The pad terminal 2t formed corresponding to the connection pattern 2c can be used for connection to the outside as required.

  By converging the pad terminals 2t to one side of the element wiring board 2, it becomes possible to collectively connect to the outside, and it becomes easy to mount a connecting member such as the connector 12, so The EL light source body 20 can be easily connected.

  In the present embodiment, since the connector 12 is mounted on the pad terminal 2t (see the plus pad terminal 2tp and the minus pad terminal 2tm shown in FIG. 4) formed by extending the wiring pattern 2w, it corresponds to the connection pattern 2c. The pad terminal 2t (the pad terminal 2t on the surface where the connection pattern 2c is formed) is not necessarily required.

  Since the terminal forming portion 2b is formed to extend outward from the peripheral edge of the EL light emitting element 1, when the connector 12 is connected to the pad terminal 2t, the EL light emitting element 1 is stable without causing any external force. A connection state can be secured.

  The element wiring board 2 is formed of a so-called composite board, but is not limited thereto, and an appropriate wiring board such as a glass epoxy board or a flexible board (a flexible film board such as a polyimide film) can be used. .

  When the element wiring substrate 2 is formed of a flexible substrate, it absorbs distortion such as warpage due to a difference in thermal expansion coefficient between the element substrate 1a (glass substrate) and the element wiring substrate 2 (for example, a composite substrate). Therefore, it is possible to suppress peeling (connection failure) of the conductive adhesive used for connection between the element electrode 1e and the connection pattern 2c, and the EL light source body 20 with high reliability can be obtained.

  4A and 4B are explanatory views for explaining the outline of the element wiring board of the EL light source body according to Embodiment 1 of the present invention. FIG. 4A is a plan view of the element wiring board showing a wiring pattern, and FIG. FIG. 6 is a cross-sectional view taken along arrows AA in FIG.

  In order to facilitate understanding, in the element wiring substrate 2 shown in FIG. 2A, the wiring pattern 2w formed on the surface opposite to the surface on which the connection pattern 2c is formed, the wiring pattern 2w, and the connection pattern 2c. The through conductors 2h for connecting are mainly shown, and the connection pattern 2c is not shown. That is, the element wiring board 2 has a so-called double-sided wiring structure. Needless to say, the wiring pattern 2w can be formed in the same manner as the connection pattern 2c.

  The positive wiring pattern 2wp is connected to the positive connection pattern 2cp through the corresponding through conductor 2h, and the negative wiring pattern 2wm is connected to the negative connection pattern 2cm through the corresponding through conductor 2h. In the terminal forming portion 2b, a plus wiring pattern 2wp is extended to constitute a plus pad terminal 2tp, and a minus wiring pattern 2wm is extended to constitute a minus pad terminal 2tm.

  The pad terminals 2t are formed on both surfaces of the element wiring board 2 so as to correspond to the connection pattern 2c and the wiring pattern 2w, and are connected to each other by the through conductors 7h, thereby increasing the number of connection points and the reliability of connection to the outside. Can be improved.

  5A and 5B are explanatory diagrams for explaining a main part of the EL light source body according to Embodiment 1 of the present invention. FIG. 5A is a plan view seen from the sealing substrate side, and FIG. It is sectional drawing in arrow AA.

  The main part of the EL light source body 20 is configured by superimposing (stacking) the EL light emitting element 1 and the element wiring board 2 to connect (conduct) the element electrode 1e and the connection pattern 2c. That is, as described above, the element wiring board 2 has the element electrode 1e of the EL light emitting element 1 (the internal structure of the EL light emitting element 1 is omitted for easy understanding of the present invention). The connection pattern 2c is formed and arranged corresponding to the arrangement.

  In order to improve the mechanical strength of the EL light source body 20 with certainty, the planar shape of the element wiring board 2 is such that the inner periphery and the periphery of the element substrate 1a are aligned with the periphery (side) of the sealing substrate 1b. It is preferable to form in the shape of a frame having an outer periphery having a shape along the side. The inner periphery of the element wiring substrate 2 is formed slightly larger than the outer periphery of the sealing substrate 1b so as to enclose the sealing substrate 1b, and the outer periphery of the element wiring substrate 2 protects the element substrate 1a. The size is preferably equal to or larger than the outer circumference of 1a.

  By connecting (mounting) an external connector 12 to the plus pad terminal 2tp and minus pad terminal 2tm on the surface on which the wiring pattern 2w is formed, the connector 12, the wiring pattern 2w, the through conductor 2h, the connection pattern 2c, and the element electrode 1e It becomes possible to supply electric power to the EL light emitting element 1 (the light emitting layer thereof) via.

  The terminal forming portion 2b is formed to extend outward from the peripheral edge of the EL light emitting element 1, and the wiring pattern 2w is formed on the surface opposite to the connection pattern 2c. Therefore, the surface on which the wiring pattern 2w is formed. The connector 12 can be directly mounted on the pad terminal 2t. In particular, when the connector 12 is mounted, the connection from the outside may be performed by fitting a plug to the connector 12, so that the connection from the outside to the EL light source body 20 can be performed very easily. It becomes.

  FIG. 6 is a plan view illustrating a pattern of a protective film that covers and protects the wiring pattern of the element wiring board of the EL light source body according to the first embodiment of the present invention.

  In order to cover and protect the wiring pattern 2w of the element wiring board 2 shown in FIG. 4, a protective film 2s is formed on the surface of the element wiring board 2 (wiring pattern 2w) (here, the entire surface of the element wiring board 2). The terminal connecting part 5 (plus terminal connecting part 5p, minus terminal connecting part 5m. The plus terminal connecting part 5p and the minus terminal connecting part 5m are provided by removing the opening of the protective film 2s to connect the connector 12. When there is no need to distinguish, it is referred to as a terminal connection portion 5). The protective film 2s is made of, for example, a solder resist.

  The connector 12 is provided by connecting the corresponding terminals of the connector 12 to the plus terminal connecting portion 5p and the minus terminal connecting portion 5m, respectively. Connection reliability can be improved by providing a plurality of positive terminal connection portions 5p and a plurality of negative terminal connection portions 5m. In addition, what is necessary is just to set the pattern shape of the terminal connection part 5 suitably according to the terminal shape of the connector 12 to connect, and is not restricted to the pattern shown in figure.

  The connector 12 can be mounted on the opposite side of the connection pattern 2c when the element wiring board 2 has a double-sided wiring structure, and can be mounted on the surface of the connection pattern 2c when the single-sided wiring structure is used. Therefore, the mounting position (mounting surface) of the connector 12 can be changed according to the wiring structure of the element wiring board 2.

  FIG. 7 is a schematic cross-sectional view of the EL light source body according to Embodiment 1 of the present invention, (A) is an EL light source body using an element wiring board having a double-sided wiring structure, and (B) is a single side. This is an EL light source body using an element wiring board having a wiring structure.

  4A shows an example in which the element wiring board 2 shown in FIG. 4 is used. A mask part 11 and an EL light emitting element 1 (element substrate 1a, sealing member) are formed on the frame part 10f of the translucent protective substrate 10. FIG. A state in which the substrate 1b), the element wiring substrate 2, the heat conductive elastic body 13, and the heat sink 14 are stacked and stacked is shown.

  The mask part 11 is arranged corresponding to the non-light-emitting part generated at the periphery of the EL light-emitting element 1 (element substrate 1a). When the non-light-emitting part (periphery) is masked (shielded), the mask part 11 is used as an illumination device or the like. The beauty (design) will be improved. Further, since the mask portion 11 is disposed between the element substrate 1a and the translucent protective substrate 10, the element substrate 1a and the translucent protective substrate 10 are not in direct contact with each other, so that the element substrate 1a is stabilized. Therefore, the element substrate 1a can be prevented from being damaged. The mask part 11 can be comprised by the synthetic resin film which has a suitable color (for example, black) as needed.

  Further, an appropriate polarizing plate 15 (see FIG. 8) can be disposed between the element substrate 1a and the translucent protective substrate 10 so as to correspond to the light emitting portion 1d (element substrate 1a). In the case where the polarizing plate 15 is disposed, the mask portion 11 is not necessary. Further, the polarizing plate 15 also acts as a buffer material like the mask portion 11.

  By providing a heat sink 14 as a heat radiating member on the sealing substrate 1b of the EL light emitting element 1 via the thermal conductive elastic body 13, the heat radiating characteristic of the EL light emitting element 1 can be improved, and excellent thermal characteristics are obtained. Thus, the EL light source body 20 having stable light emission characteristics can be obtained. For example, aluminum is suitable as the heat sink 14.

  The heat conductive elastic body 13 functions as a cushioning material that protects the sealing substrate 1b from external force, and improves the adhesion between the sealing substrate 1b and the heat sink 14, so that the heat from the sealing substrate 1b is transferred to the heat sink 14. It functions as a heat transfer material that conducts heat efficiently. Silicone rubber or the like is suitable as the heat conductive elastic body 13.

  It should be noted that the mask portion 11, the EL light emitting element 1 (element substrate 1a, sealing substrate 1b), the element wiring substrate 2, the heat conductive elastic body 13, and the heat sink 14 are overlapped and laminated by appropriate means such as adhesion. What is necessary is just to fix suitably. Moreover, it is also possible to fix each other by providing an appropriate locking member, pressing member, etc., regardless of adhesion.

  FIG. 5B shows an example in which an element wiring board 2 having a single-sided wiring structure is used instead of the element wiring board 2 having a double-sided wiring structure shown in FIG. In the case of the single-sided wiring structure, the surface on which the connector 12 is mounted is the opposite side (the surface on which the connection pattern 2c is formed) as shown in FIGS. 1 and 4, but is the same in other respects and will be described in detail. Is omitted.

<Embodiment 2>
FIG. 8 is a main partial cross-sectional view of an EL light source body according to Embodiment 2 of the present invention.

  The EL light source body 30 according to the present embodiment uses a clamping member 16 as a pressing member instead of the frame portion 10f provided on the translucent protective substrate 10 in the first embodiment. By pressing 2 in the direction of the device electrode 1e (1ep), the connection pattern 2c (2cp) is pressed into contact with the device electrode 1e (1ep) so that they are electrically connected to each other. The description of the same configuration as that in Embodiment 1 is omitted as appropriate. In the figure, only the main part of the EL light source 30 is shown.

  In the present embodiment, it is possible to establish electrical connection between the element electrode 1e and the connection pattern 2c without using a conductive adhesive, and the assembly process of the EL light source body 30 can be simplified. In addition, since a connection failure such as peeling of the conductive adhesive due to a difference in thermal expansion coefficient between the element wiring board 2 (for example, a composite board) and the element substrate 1a (glass substrate) does not occur, a highly reliable EL light source body 30. Of course, it is possible to use a conductive adhesive in combination.

  If an elastic conductor (not shown) is inserted between the element electrode 1e and the connection pattern 2c, and the connection pattern 2c is pressed against the element electrode 1e via the elastic conductor, the element electrode 1e is connected. Since the adhesiveness and conductivity with the pattern 2c are improved, more reliable conduction is possible, and the EL light source body 30 with higher reliability can be obtained.

  The clamping member 16 has an engaging portion 16a and a spring portion 16b at the end, and is configured to have a U-shaped sandwiching section, with U-shaped both ends (engaging portion 16a, spring portion 16b). The light-transmitting protective substrate 10, the element substrate 1a, and the element wiring substrate 2 are sandwiched. The engaging portion 16a engages with the cutout portion 10a formed on the translucent protective substrate 10, and the element wiring substrate 2 is pressed by the spring portion 16b, so that the pressing member 16 having a simple structure can be strongly pressed. Thus, the manufacture becomes easy. Since the clamping member 16 has the spring portion 16b, the connection pattern 2c can be strongly pressed by the element electrode 1e and can be reliably conducted. The sandwiching member 16 can be appropriately formed of metal or synthetic resin. As the metal, stainless steel or the like is preferable from the viewpoint of strength, workability, aesthetics, and the like.

  In the present embodiment, similarly to the first embodiment, the element wiring board 2 can be formed of a flexible substrate. When the element wiring board 2 is formed of a flexible substrate, the flexible substrate can freely (softly) contact the element electrode 1e, so that the connection pattern 2c is reliably conducted by the element electrode 1e. It is possible to improve the adhesion and conductivity between the element electrode 1e and the connection pattern 2c, and to reduce the voltage drop due to the resistance of the element electrode 1e. Further, when an elastic body (not shown) is inserted between the element wiring board 2 and the spring portion 16b, the adhesion can be further improved.

  In the present embodiment, since the clamping member 16 is used as the pressing means, the connection pattern 2c can be conducted to the element electrode 1e with a simple structure, and the translucent protective substrate 10, the element substrate 1a, and the element Since the wiring board 2 can be protected from external force, the mechanical strength can be further improved and the EL light source body 30 with high reliability can be obtained. Further, the outer shape of the EL light source body 30 can be simplified and the size can be reduced.

  In the present embodiment, since the heat conductive elastic body 13 provided on the sealing substrate 1b and the heat sink 14 are also sandwiched, the element wiring board 2 is reliably and stably pressed by the element electrode 1e. be able to. Needless to say, the translucent protective substrate 10, the element substrate 1a, and the element wiring board 2 may be directly sandwiched between the U-shaped ends (engagement portion 16a, spring portion 16b). Further, since the polarizing plate 15 formed of a circularly polarizing plate is configured to be inserted between the translucent protective substrate 10 and the element substrate 1a, the light emitting portion 1d is prevented from being visually recognized as, for example, silver when it is turned off. be able to.

  By making the holding member 16 into a frame shape surrounding the periphery of the translucent protective substrate 10, the EL light source body 30 can have a cassette type exterior structure as in the first embodiment, and the mechanical strength is further improved. Therefore, the EL light source 30 can be easily handled and highly reliable.

  Even when the polarizing plate 15 is not used, the engaging portion 16a of the holding member 16 can mask the non-light emitting portion, so that it is not necessary to provide the mask portion 11 and the structure can be simplified. . Of course, when the length of the engaging portion 16a cannot be increased, the mask portion 11 can be used together.

<Embodiment 3>
FIG. 9 is a main part sectional view of an EL light source body according to Embodiment 3 of the present invention. The same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  The EL light source body 40 according to the present embodiment uses a locking member 17 as a pressing member instead of the frame portion 10f provided on the light-transmissive protective substrate 10 in the first embodiment, and the locking member 17 is used for an element. The wiring board 2 is pressed in the direction of the element electrode 1e (1ep), whereby the connection pattern 2c (2cp) is pressed against the element electrode 1e (1ep) to conduct between them. The description of the same configurations as those in Embodiments 1 and 2 will be omitted as appropriate. In the figure, only the main part of the EL light source body 40 is shown.

  In the present embodiment, it is possible to establish electrical connection between the element electrode 1e and the connection pattern 2c without using a conductive adhesive, and the assembly process of the EL light source body 40 can be simplified. Further, since there is no connection failure such as peeling of the conductive adhesive due to the difference in thermal expansion coefficient between the element wiring substrate 2 and the element substrate 1a, the EL light source body 40 with high reliability can be obtained. Of course, it is possible to use a conductive adhesive in combination.

  If an elastic conductor (not shown) is inserted between the element electrode 1e and the connection pattern 2c, and the connection pattern 2c is pressed against the element electrode 1e via the elastic conductor, the element electrode 1e is connected. Since conductivity with the pattern 2c is improved, more reliable conduction is possible, and the EL light source body 40 with higher reliability can be obtained.

  The locking member 17 has a fixing portion 17a and a spring portion 17b at the end, and is configured so that the fixing portion 17a is fixed to the translucent protective substrate 10, and both ends of the locking member 17 (fixing portion 17a). The element substrate 1a and the element wiring board 2 are locked to the translucent protective substrate 10 by the spring portion 17b). That is, the fixing portion 17a is fixed to the translucent protective substrate 10 with an appropriate fixing member such as a bolt, and the element wiring substrate 2 is pressed by the spring portion 17b. Since the locking member 17 has the spring portion 17b, the connection pattern 2c can be reliably pressed against the element electrode 1e and can be reliably conducted. The locking member 17 can be appropriately formed of metal or synthetic resin. Further, an adjusting portion 17c for adjusting a pressing distance (pressing strength) is provided between the fixing portion 17a and the translucent protective substrate 10.

  In the present embodiment, similarly to the first and second embodiments, the element wiring board 2 can be formed of a flexible substrate. When the element wiring board 2 is formed of a flexible substrate, the flexible substrate can freely (softly) contact the element electrode 1e, so that the connection pattern 2c is reliably conducted by the element electrode 1e. In addition, since the adhesion and conductivity between the element electrode 1e and the connection pattern 2c are improved, a voltage drop due to the resistance of the element electrode 1e can be reduced. In addition, the adhesion can be further improved by inserting an elastic body (not shown) between the element wiring board 2 and the spring portion 17b.

  In the present embodiment, since the locking member 17 is used as the pressing means, the connection pattern 2c and the element electrode 1e can be conducted with a simple structure, and the element substrate 1a and the element wiring board 2 can be connected to each other. Since it can protect from external force, mechanical strength can further be improved and it can be set as the highly reliable EL light source body 40. FIG. Further, the outer shape of the EL light source body 40 can be simplified and the size can be reduced.

  In the present embodiment, since the heat conductive elastic body 13 and the heat sink 14 provided on the sealing substrate 1b are pressed together, the element wiring board 2 can be reliably pressed by the element electrode 1e. . Needless to say, the translucent protective substrate 10, the element substrate 1 a, and the element wiring substrate 2 may be directly engaged with both ends (fixing portion 17 a and spring portion 17 b) of the engagement member 17. Needless to say, the mask portion 11 or the polarizing plate 15 may be inserted between the translucent protective substrate 10 and the element substrate 1a.

  By making the locking member 17 into a frame shape surrounding the periphery of the translucent protective substrate 10, the EL light source body 40 can have a cassette-type exterior structure as in the first and second embodiments. It is possible to further improve the mechanical strength, and to make the EL light source body 40 easy to handle and highly reliable.

  In this embodiment, since the locking member 17 is configured to be attached to the translucent protective substrate 10, the area of the translucent protective substrate 10 is increased so that the plurality of EL light source bodies 40 are integrated with the translucent protection. It can be juxtaposed on the substrate 10. That is, an EL light source body (40..., Not shown) having a larger area can be obtained.

<Embodiment 4>
FIG. 10 is a schematic partial cross-sectional view of an EL light source device according to Embodiment 4 of the present invention.

  The EL light source device according to the present embodiment includes a translucent device substrate 18, an EL light source body 20 (30, 40) mounted on the translucent device substrate 18 by a mounting member 18a, and an EL light source body 20 (30, 40). ), A cord 19a as a power supply member derived from the power supply unit 19, and a plug 19b are provided. The translucent device substrate 18 can be made of acrylic resin, tempered glass, or the like.

  The cord 19a and the plug 19b are joined to the connector 12 (connection member) included in the EL light source body 20 (30, 40), and supply power from the power source unit 19 to the EL light source body 20 (30, 40). The body 20 (30, 40) is operated (EL light emission operation). The cord 19a and the plug 19b as the power supply members may be mounted on the translucent device substrate 18.

  Alternatively, the power supply unit 19 may be arranged separately from the translucent device substrate 18, and the power supply member (the cord 19 a and the plug 19 b) may be provided on the translucent device substrate 18. According to this configuration, an EL light source device having a simple structure (appearance) and a beautiful appearance can be obtained.

  The EL light source body 20 (30, 40) can be easily mounted on the EL light source device, and the EL light source body 20 (30, 40) and the EL light source device can be mounted with good mounting efficiency (mounting efficiency). Further, the EL light source device 20 (30, 40) can be easily replaced (maintenance) with an EL light source device.

  The plurality of EL light source bodies 20 (30, 40) can be juxtaposed to and connected to the translucent device substrate 18. In this case, the EL light source device can be thin and have a larger area. Needless to say, the connection form may be either parallel or serial.

It is a disassembled perspective view of the EL light source body concerning Embodiment 1 of this invention. It is explanatory drawing of EL light emitting element applied to the EL light source body which concerns on Embodiment 1 of this invention, (A) is the top view seen from the side where the element electrode was derived | led-out, (B) is (A). It is a side view in the arrow A direction. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing explaining the outline of the wiring board for elements of the EL light source body which concerns on Embodiment 1 of this invention, (A) is the wiring board for elements seen from the opposite side of the surface in which the connection pattern is formed. A plan view, (B) is a cross-sectional view taken along arrow AA in (A). It is explanatory drawing explaining the outline of the element wiring board of the EL light source body which concerns on Embodiment 1 of this invention, (A) is a top view of the element wiring board which shows a wiring pattern, (B) is (A). It is sectional drawing in the arrow AA. It is explanatory drawing explaining the principal part of the EL light source body which concerns on Embodiment 1 of this invention, (A) is the top view seen from the sealing substrate side, (B) is the arrow A- of (A). It is sectional drawing in A. It is a top view explaining the pattern of the protective film which coat | covers and protects the wiring pattern of the wiring board for elements of the EL light source body which concerns on Embodiment 1 of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing of the EL light source body which concerns on Embodiment 1 of this invention, (A) is an EL light source body using the wiring board for elements made into the double-sided wiring structure, (B) was made into the single-sided wiring structure. This is an EL light source body using an element wiring board. It is principal part sectional drawing of the EL light source body which concerns on Embodiment 2 of this invention. It is principal part sectional drawing of the EL light source body which concerns on Embodiment 3 of this invention. It is a general | schematic fragmentary sectional view of the EL light source device which concerns on Embodiment 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 EL light emitting element 1a Element board | substrate 1b Sealing board | substrate 1d Light emission part 1e Element electrode 1ep Positive element electrode 1em Negative element electrode 2 Element wiring board 2b Terminal formation part 2c Connection pattern 2cp Positive connection pattern 2cm Negative connection pattern 2h Through conductor 2s Protective film 2t Pad terminal 2tp Plus pad terminal 2tm Minus pad terminal 2w Wiring pattern 2wp Plus wiring pattern 2wm Minus wiring pattern 5 Terminal connection 5p Plus terminal connection 5m Minus terminal connection 10 Translucent protective substrate 10a Notch 10b Connector alignment Part 10f Frame part 11 Mask part 12 Connector (connection member)
13 thermal conductive elastic body 13b connector matching part 14 heat sink (heat radiating member)
14b Connector matching part 15 Polarizing plate 16 Holding member (pressing member)
16a engaging part 16b spring part 17 locking member (pressing member)
17a Fixing part 17b Spring part 17c Adjustment part 18 Translucent device substrate 18a Mounting member 19 Power supply part 19a Cord (power supply member)
19b plug (power supply member)
20, 30, 40 EL light source

Claims (11)

In EL light source body having an EL light emitting elements are arranged opposite to each other with an element substrate及beauty sealing substrate which is formed between the light emitting layer,
A translucent protective substrate on which the element substrate is placed;
Two element electrodes of different polarities respectively led out along the side of the sealing substrate and arranged in the peripheral region of the element substrate outside the sealing substrate ;
A device wiring board having a connection pattern arranged on the outside of the sealing substrate so as to face the device electrode and conducted to the device electrode ;
The EL light source body, wherein the element wiring board has a frame shape having an inner periphery along the periphery of the sealing substrate and an outer periphery along the periphery of the element substrate . 2. The EL light source body according to claim 1, wherein the element electrode is led out in four directions of the sealing substrate, and the connection pattern extends in four directions of the sealing substrate .   The EL light source body according to claim 1, wherein the connection pattern is connected to the element electrode by a conductive adhesive.   The EL light source body according to claim 1, wherein the translucent protective substrate has a frame portion surrounding the EL light emitting element and the element wiring substrate.   The EL light source body according to claim 1, wherein the connection pattern is pressed against the element electrode by a pressing member that presses the element wiring board.   6. The EL light source body according to claim 5, wherein the connection pattern is in pressure contact with the element electrode via an elastic conductor.   The EL light source body according to claim 5, wherein the pressing member has a spring portion.   8. The EL light source according to claim 5, wherein the pressing member is a holding member that holds the translucent protective substrate, the element substrate, and the element wiring substrate. 9. body.   9. The EL light source body according to claim 8, wherein the clamping member has a U-shaped sandwiching section.   The EL light source body according to claim 1, wherein the element wiring board includes a connection member.   The EL light source body according to any one of claims 1 to 10, wherein the EL light emitting element is an organic EL light emitting element.

Images