JP2012154712A - Flow sensor and resist application device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flow sensor or the like which is capable of suppressing elution of impurities such as a metal into a measured fluid and of measuring flow rate of a fluid more accurately in comparison with conventional ones and has robustness.SOLUTION: A flow sensor is equipped with: a resin pipe in which a measured fluid is made to flow; a heating mechanism which is provided outside the resin pipe for heating the measured fluid; and a temperature detecting mechanism which is provided outside the resin pipe for detecting a change in temperature of the measured fluid due to its flow. On each of the sides towards both ends of the resin pipe from the positions where the heating mechanism and the temperature detecting mechanism are arranged, at least one fixing member projecting outward from the resin pipe is fixed, and the two fixing members are fixed to a holding member which holds the fixed members while restricting rotation of the fixing members around the axis of the pipe.

Description

  The present invention relates to a flow sensor and a resist coating apparatus using the same.

  Conventionally, as a flow rate sensor for measuring the flow rate of a fluid such as liquid or gas flowing in a pipe, a heating mechanism is provided outside the pipe for heating the fluid inside the pipe, and the heated fluid is inside the pipe. There is known a flow sensor that has a temperature measuring mechanism for measuring a temperature change caused by flowing through the pipe and obtains a flow rate (mass flow rate) of the fluid flowing through the pipe from the measured temperature information (for example, a patent) Reference 1).

  On the other hand, in the manufacturing process of a semiconductor device, a resist coating apparatus that applies a photoresist to a substrate to be processed such as a semiconductor wafer in a photolithography process for forming a fine circuit pattern has been conventionally used. Such a resist coating apparatus includes a spin chuck for holding and rotating a semiconductor wafer, a photoresist supply mechanism for supplying a photoresist to the surface of the semiconductor wafer on the spin chuck, and a semiconductor wafer on the spin chuck. There is known one provided with a cup or the like arranged so as to surround the periphery (see, for example, Patent Document 2).

JP-A-5-107093 JP 7-320999 A

  In the above resist coating apparatus, a certain amount of photoresist is supplied to the surface of the semiconductor wafer by a bellows pump or the like provided in the photoresist supply mechanism, and then the semiconductor wafer is rotated by a spin chuck, thereby removing the photoresist from the semiconductor. The entire surface of the wafer is diffused, and excess photoresist is scattered in the cup and removed from the surface of the semiconductor wafer.

  As described above, in a conventional resist coating apparatus, an amount of photoresist with a certain allowance is supplied to the surface of the semiconductor wafer, and excess photoresist is shaken off by the rotation of the spin chuck and removed. However, in recent years, the circuit pattern of a semiconductor device tends to be miniaturized, and an expensive photoresist capable of forming a fine circuit pattern is increasingly used.

  For this reason, it is required to reduce the amount of photoresist used. In this case, it is conceivable that the supply amount of the photoresist is controlled with high accuracy and the minimum necessary photoresist is supplied to the semiconductor wafer. However, the supply amount of the photoresist is about 0.5 ml, and it is difficult to accurately measure the flow rate of such a small amount of fluid. In addition, in order to prevent contaminants such as metals from entering the photoresist supply piping system, resin piping such as PFA (perfluoroalkoxy fluororesin) is used. Metal piping and glass piping are used. There is a problem that the used flow rate sensor cannot be used. Furthermore, the flow rate sensor is required to have a certain degree of robustness so as not to be damaged when the pipe is attached.

  The present invention has been made in response to the above-described conventional circumstances, and can suppress the elution of impurities such as metals into the fluid to be measured, and can measure the flow rate of the fluid with higher accuracy than in the past. Therefore, an object of the present invention is to provide a flow rate sensor that is capable of providing robustness and a resist coating apparatus using the flow rate sensor.

  One aspect of the flow sensor of the present invention includes a resin pipe through which a fluid to be measured flows, a heating mechanism provided outside the resin pipe and for heating the fluid to be measured, and the resin A flow rate sensor provided outside the pipe and configured to detect a temperature change caused by the flow of the fluid to be measured, the flow rate sensor comprising: a resin made of an arrangement portion of the heating mechanism and the temperature detection mechanism; At least one fixing member protruding to the outside of the resin pipe is fixed to each end of the pipe, and the two holding members are held while restricting rotation of the fixing member around the tube axis. It is fixed to the member.

  One aspect of the resist coating apparatus of the present invention includes a rotation holding mechanism that holds and rotates a substrate to be processed, and a photoresist supply pipe through which the photoresist is circulated, and is held by the rotation holding mechanism. A photoresist coating apparatus that includes a photoresist supply mechanism that supplies a photoresist to the surface of a substrate to be processed, and is provided outside the resin pipe and a resin pipe through which the photoresist is distributed. A heating mechanism for heating the photoresist; and a temperature detection mechanism for detecting a temperature change caused by the flow of the photoresist provided outside the resin pipe. The heating mechanism and the temperature detection mechanism At least one fixing member that protrudes outward from the resin pipe is fixed to both ends of the resin pipe from the arrangement site of The fixing member, the flow rate sensor fixed to the holding member for holding while limiting the rotation about the tube axis of the fixing member, characterized in that it is interposed in the photoresist supply piping.

  According to the present invention, the elution of impurities such as metals into the fluid to be measured can be suppressed, the flow rate of the fluid can be measured with higher accuracy than before, and the flow rate has robustness. A sensor and a resist coating apparatus using the sensor can be provided.

The figure which shows typically the manufacturing process of the flow sensor of one Embodiment of this invention. The figure which shows typically the structure of the measurement system of the flow sensor of one Embodiment. The figure which shows typically the principal part structure of the flow sensor of one Embodiment. The figure which shows typically the principal part structure of the flow sensor of one Embodiment. The figure which shows typically the whole structure of the flow sensor of one Embodiment. The figure which shows typically the principal part structure of the flow sensor of one Embodiment. The figure which shows typically the principal part structure of the flow sensor which does not comprise a thin part. The graph which shows the temperature simulation result in the flow sensor of FIG. The graph which shows the temperature simulation result in the flow sensor of FIG. The figure which shows typically the manufacturing process of the flow sensor which concerns on other embodiment. The figure which shows typically the structure of the resist coating apparatus of one Embodiment of this invention.

  Hereinafter, details of the present invention will be described with reference to the drawings.

  FIG. 1 is a view for explaining a manufacturing process of a flow rate sensor suitable as a flow rate sensor for measuring a photoresist flow rate of a resist coating apparatus as a flow rate sensor according to an embodiment of the present invention. As shown in FIG. 1A, the flow sensor according to the present embodiment uses a resin pipe 10 in which a fluid to be measured (for example, a photoresist or the like) is circulated. In this embodiment, the resin pipe 10 is made of PFA (perfluoroalkoxy fluororesin), and has an inner diameter (diameter) of, for example, 3 mm, an outer diameter (diameter) of, for example, 4 mm, and a tube wall thickness of, for example, 500 μm. Has been.

  When manufacturing the flow sensor according to the present embodiment, first, as shown in FIG. 1 (b), a thin wall portion 10a that is thinned by cutting the tube wall from the outside is provided in the middle portion of the resin pipe 10 in the longitudinal direction. . The thickness of the tube wall in the thin portion 10a is preferably about 100 μm, for example. That is, it is preferable that a tube wall having a thickness of 500 μm is cut by about 400 μm so that the remaining tube wall thickness is about 100 μm.

  Next, at least one (two in total) fixing members 13 are inserted from both sides of the resin pipe 10, and the pipe wall thickness in the vicinity of both ends of the resin pipe 10 is a portion having a normal thickness (thin wall portion). It adheres to a part other than 10a. As the fixing member 13, one having a shape protruding to the outside of the pipe wall of the resin pipe 10 can be used. For example, one having a shape protruding like a bowl over the entire circumference of the pipe wall of the resin pipe 10. It can be preferably used. In the present embodiment, a member having a substantially hexagonal nut shape (no thread groove is provided on the inner side) is used.

  As a material of the fixing member 13, for example, metal, resin, ceramics, or the like can be used. When the fixing member 13 is made of resin, for example, PFA (perfluoroalkoxy fluororesin), the fixing member 13 can be fixed to the resin pipe 10 by, for example, heat fusion.

  Then, as shown in FIG. 2A, a heater 11 as a heating mechanism, an upstream temperature sensor 12a and a downstream temperature sensor 12b as temperature detection mechanisms are arranged in the thin portion 10a of the resin pipe 10. To do. The upstream temperature sensor 12 a is disposed upstream of the heater 11 with respect to the flow direction of the fluid to be measured flowing through the resin pipe 10, and the downstream temperature sensor 12 b is downstream of the heater 11. Arranged on the side.

  In the present embodiment, the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are disposed on a flexible flexible substrate 14 as shown in FIG. The heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b can be disposed in a state of being in line contact with the outside of the thin portion 10a, for example, by winding about 10 a around the periphery of 10a. ing. As shown in FIG. 3, the flexible substrate 14 is provided with two electrodes 14a electrically connected to the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b, respectively, for a total of six. Yes.

  In this embodiment, as shown in FIGS. 2 and 5, the flexible substrate 14 on which the heater 11, the upstream temperature sensor 12 a, and the downstream temperature sensor 12 b are disposed so as to be sandwiched by the holder 15 is attached to the thin portion 10 a. It is designed to be fixed around. That is, as shown in FIGS. 4 and 5, the holder 15 includes a first holder part 15 a and a second holder part 15 b which are divided into two parts. The first holder part 15 a and the second holder part 15 b By arranging the flexible substrate 14 and the resin pipe 10 so as to be sandwiched between the holder portion 15b, the flexible substrate 14 is fixed around the thin portion 10a.

  In addition, as shown in FIG. 4, FIG. 5, the 1st holder part 15a is made into the substantially rectangular parallelepiped shape. On the other hand, the second holder portion 15b is substantially H-shaped when viewed from the upper surface side, and has a shape in which recessed portions 15c are provided on both side surface portions. The electrode 14a provided on the flexible substrate 14 shown in FIG. 3 is exposed at the recessed portion 15c, and can be electrically connected to the outside. As shown in FIG. 4, the first holder portion 15a and the second holder portion 15b have a groove portion 18 for accommodating the thin portion 10a therein, and are formed on both sides of the groove portion 18 and adjacent to the thin portion 10a. A groove portion 17 is formed to accommodate a portion having a normal tube wall thickness.

  Then, as shown in FIG. 5, the fixing member 13 of the resin pipe 10 assembled with the flexible substrate 14 and the holder 15 is fixed to the holding member 19 whose outer shape is a substantially rectangular parallelepiped shape, and the flow sensor is configured. Is done. The holding member 19 has a rectangular container-like lower holding member 19a and a rectangular container-like upper holding member 19b that are brought into contact with the edge surfaces of the opening side so that the overall shape becomes a substantially rectangular parallelepiped shape. It is configured. Further, on both side surfaces in the longitudinal direction of the holding member 19, a holding hole 19c having a hexagonal shape in a state where the lower holding member 19a and the upper holding member 19b are combined is provided so as to penetrate the side surface.

  Then, the resin pipe 10 is disposed between the lower holding member 19a and the upper holding member 19b, and is fixed so as to hold the fixing member 13 fixed to the resin pipe 10 at the holding hole 19c. Thus, the resin pipe 10 is held while restricting the rotation of the fixing member 13 around the pipe axis. A groove (not shown) for fitting the fixing member 13 is formed in the inner peripheral edge of the holding hole 19c. By fitting the fixing member 13 into this groove, the fixing member 13 and The resin pipe 10 is configured not to move in the pipe axis direction with respect to the holding member 19.

  As described above, in the flow rate sensor according to the present embodiment, the fixing members 13 are fixed to the portions near the ends of the resin pipe 10, and these fixing members 13 are in a state where the rotation around the tube axis is restricted. , Fixed to the holding member 19. For this reason, in the process of attaching the resin pipe 10 to the pipe through which the fluid to be measured is circulated, when the connecting member for connecting the pipes is fastened to the resin pipe 10, the rotational torque is a thin portion of the resin pipe 10. It can prevent joining to 10a. The thin wall portion 10a is in a state where the physical strength is low because the wall of the thin wall portion 10a is thinner than the other portions of the resin pipe 10. For this reason, when rotational torque is applied when attaching or detaching the flow sensor to / from the pipe, it is damaged or deformed, and the contact state with the heater 11, the upstream sensor 12a, and the downstream sensor 12b becomes defective. Is likely to occur. In this embodiment, since it is possible to prevent rotational torque from being applied to the thin-walled portion 10a, the possibility of the occurrence of the above problems can be reduced, and sufficient robustness can be ensured. .

  As shown in FIG. 2, the heater 11 is electrically connected to the power supply circuit 8, and power is supplied from the power supply circuit 8 to the heater 11. Further, the measurement signal from the upstream temperature sensor 12a and the measurement signal from the downstream temperature sensor 12b are separately input to the flow rate calculation module 7 and the two heat capacity measurement circuits 9, respectively. The flow rate calculation module 7 is connected to the power supply circuit 8 and the two heat capacity measurement circuits 9 by signal lines, and the power supply circuit 8 and the two heat capacity measurement circuits 9 are also connected by signal lines.

  The flow rate calculation module 7 includes a temperature difference detection circuit 4, a flow rate calculation circuit 5, and a physical property data change circuit 6. The temperature difference detection circuit 4 detects these temperature differences ΔT from the measurement signals of the upstream temperature sensor 12a and the downstream temperature sensor 12b. The flow rate calculation circuit 5 includes a temperature difference ΔT detected by the temperature difference detection circuit 4, a coefficient ks (or ka) as physical property data from the physical property data changing circuit 6, and electric power supplied from the power supply circuit 8 to the heater 11. The flow rate (mass flow rate) of the fluid to be measured is calculated from the heating amount W of the fluid to be measured based on the amount.

That is, the flow rate calculation circuit 5 uses the following equation (1) for the coefficient ks as the physical property data of the fluid S determined by the specific heat Cp of the fluid S for calibration, the heat capacity Cs of the fluid S, and the like, and the temperature difference ΔT from the temperature difference detection circuit 4. ) To calculate the mass flow rate F.
W = ks · Cp · F · ΔT (1)

For any fluid to be measured A, the physical capacity data conversion circuit 6 uses the heat capacity Ca of the fluid A to be measured measured by the heat capacity measuring circuit 9 to measure the flow required for calculating the flow rate based on the following equation (2). The coefficient ka of the fluid A is obtained.
ka = Ca / Cs (2)

  The heat capacity measuring circuit 9 is configured to measure the fluid A to be measured based on the measurement amount of the fluid to be measured W based on the measurement signals from the upstream temperature sensor 12a and the downstream temperature sensor 12b and the amount of power supplied from the power supply circuit 8 to the heater 11. , And the calculated heat capacity Ca of the fluid A to be measured is output to the physical property data changing circuit 6 of the flow rate calculation module 7. Here, in the case of measuring the flow rate of only the fluid to be measured whose heat capacity is known, the heat capacity measuring circuit 9 is omitted, and the above-mentioned coefficient as the physical property data such as the heat capacity of each measured fluid is given to the physical property data changing circuit 6. The flow rate of the fluid to be measured may be calculated by using the coefficient as the physical property data stored in the physical property data changing circuit 6 by storing the fluid and specifying the fluid to be measured.

  In the flow sensor of the present embodiment having the above-described configuration, a resin pipe 10 made of PFA (perfluoroalkoxy fluororesin) is used. The resin piping 10 made of PFA is the same in material, inner diameter, and outer diameter as the resin piping used for the resist supply piping constituting the resist supply mechanism of the resist coating apparatus described later. By using such a resin pipe 10, it is possible to suppress the elution of impurities such as metals in the photoresist.

  In addition, since the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are disposed in the thin portion 10a of the resin pipe 10, a fluid to be measured that flows through the resin pipe 10, such as a photoresist, for example. Can be efficiently heated in a short time, and a temperature change due to the flow of the photoresist can be detected with high sensitivity. Thereby, the flow rate of the fluid to be measured can be measured with high accuracy. Further, for example, when bubbles are mixed in the photoresist, the detected temperature change is different from that in the case where there are no bubbles, so that the mixing of bubbles can also be detected.

  FIG. 6 schematically shows a positional relationship among the thin portion 10a, the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b in a longitudinal section. In addition, the arrow shown in FIG. 6 has shown the flow direction of the to-be-measured fluid which distribute | circulates the inside of the resin piping 10. As shown in FIG.

  FIG. 7 shows a heater 11, which is made of PFA (perfluoroalkoxy fluororesin), has an inner diameter of 3 mm, an outer diameter of 4 mm, a pipe wall thickness of 500 μm, and does not have a thin portion. A configuration in the case where the upstream temperature sensor 12a and the downstream temperature sensor 12b are provided is shown.

  In the case of the configuration of FIG. 7, the temperature detection signal measured by the upstream temperature sensor 12a and the downstream temperature sensor 12b, and as shown in FIG. 6, the resin pipe 10 has a thickness 10a of 100 μm. 8 and FIG. 8 show the results of simulation and comparison of temperature detection signals measured by the upstream temperature sensor 12a and the downstream temperature sensor 12b when the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are provided. This is shown in the graph of FIG.

  8 and 9, the vertical axis represents temperature and the horizontal axis represents time. The simulation is performed using an upstream temperature sensor 12a at a position of 0.3 mm upstream of the heater 11 and a downstream temperature sensor 12b at a position of 0.3 mm downstream, and using physical properties of cyclohexanone as a fluid to be measured. It was. In addition, when the flow rate of the fluid to be measured is zero and the heater 11 is heated for 0 to 18 seconds, and then the fluid to be measured is flowed at a flow rate of 0.25 ml / s for 18 to 20 seconds. A simulation was performed. The graph of FIG. 8 is the case of the configuration shown in FIG. 6, and the graph of FIG. 9 is the case of the configuration shown in FIG.

  As shown in the graphs of FIG. 8 and FIG. 9, the temperature increase width is larger in the configuration of FIG. 7 that does not have the thin portion 10 a during the time 0 to 18 seconds. This is because the thermal conductivity of PFA is 0.25 W / m · K, whereas the thermal conductivity of cyclohexanone is as low as 0.12 W / m · K, and the tube wall is thicker, the heater 11 This is because there is much heat that reaches the upstream temperature sensor 12a and the downstream temperature sensor 12b through the pipe wall.

  An important characteristic of the thermal flow sensor is that the temperature difference detected by the upstream temperature sensor 12a and the downstream temperature sensor 12b is large in the time 18 to 20 seconds when the fluid to be measured flows. About this temperature difference, the direction in the case of the structure which has the thin part 10a shown in the graph of FIG. 8 becomes large clearly. Accordingly, the flow rate of the fluid to be measured can be measured with higher accuracy in the configuration in which the thin portion 10a shown in FIG. 6 is provided than in the configuration in which the thin portion 10a is not provided as shown in FIG. Can do. In addition, when the fluid continues to flow, the time until the measured temperature at the upstream temperature sensor 12a and the downstream temperature sensor 12b reaches a constant temperature is shorter in the configuration in which the thin portion 10a is provided.

  In the present embodiment, the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are disposed on the flexible substrate 14, and the flexible substrate 14 is wound around the thin portion 10a. Thereby, the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b can be made to contact the thin part 10a in a line contact state. In such a configuration, for example, the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are disposed on a hard substrate, and the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are in a point contact state. Therefore, the heat of the heater 11 can be efficiently transmitted to the fluid to be measured in the resin pipe 10 as compared with the case where the thin portion 10a is brought into contact with the fluid. Further, the upstream temperature sensor 12a and the downstream temperature sensor 12b can efficiently detect the temperature, and as a result, the flow rate can be measured with high accuracy.

  In addition, the flow sensor which concerns on said embodiment demonstrated the case where it was set as the structure which provided the thin part 10a in resin-made piping 10. As shown in FIG. However, for example, as shown in FIG. 10, the flow rate sensor similar to the above-described embodiment may be configured by disposing the fixing member 13 in the resin pipe 40 not provided with the thin portion 10 a. Even in such a configuration, it is possible to prevent rotational torque from being applied to the locations where the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b are disposed. It is possible to prevent the occurrence of breakage, poor contact state of the heater 11, the upstream temperature sensor 12a, and the downstream temperature sensor 12b with the resin pipe 40. In this case, for example, by using a thin pipe wall as the resin pipe 40, the accuracy of flow rate measurement can be increased.

  FIG. 11 shows the configuration of a resist coating apparatus using the flow rate sensor of the above embodiment. As shown in the figure, the resist coating apparatus includes a spin chuck 101 as a rotation holding mechanism for holding and rotating a semiconductor wafer W as a substrate to be processed. A cup 102 is provided around the spin chuck 101 so as to surround the circumference of the spin chuck 101 and the semiconductor wafer W. Above the spin chuck 101, a resist supply nozzle 103 and a solvent supply nozzle 104 are provided. It is arranged. The resist supply nozzle 103 and the solvent supply nozzle 104 are connected to a nozzle drive mechanism 105 and are movable in the vertical and horizontal directions as indicated by arrows in the figure.

  The resist supply nozzle 103 is connected to a photoresist supply source 107 via a resist supply pipe 106. The resist supply pipe 106 is made of a resin pipe made of PFA. The resist supply pipe 106 includes, in order from the upstream side (photoresist supply source 107 side), a pump 108, a filter 109, a bubble removing mechanism 110, a flow sensor 111, An on-off valve 112 and a suck back valve 113 are inserted. The flow sensor 111 has the configuration shown in FIG. 5 and the like, and includes a PFA resin pipe 10 (not shown in FIG. 11) that is the same as the resist supply pipe 106.

  On the other hand, the solvent supply nozzle 104 is connected to a solvent supply source 115 via a solvent supply pipe 114. An opening / closing valve 116 is inserted in the solvent supply pipe 114.

  In the resist coating apparatus having the above configuration, the semiconductor wafer W is placed on the spin chuck 101 and is held by suction on the spin chuck 101. Then, a predetermined amount of photoresist is supplied to the semiconductor wafer W from the resist nozzle 103, and the semiconductor wafer W is rotated by the spin chuck 101, whereby the photoresist is diffused over the entire surface of the semiconductor wafer W to thereby form a predetermined film. A thick photoresist is applied. At this time, the photoresist can be supplied to the semiconductor wafer W while the flow rate is accurately measured by the flow sensor 111, so that the minimum amount of photoresist can be supplied accurately.

  Therefore, it is not necessary to supply a large amount of photoresist more than the necessary minimum amount in anticipation of a margin, and the consumption of the photoresist can be reduced. Since the photoresist is expensive, the manufacturing cost can be reduced.

  Further, the flow rate sensor 111 can ensure the required robustness because the thin-walled portion 10a is provided with the tubular reinforcing member by the heat-shrinkable tube 14, and can be secured to the resist supply pipe 106. It is possible to reduce the possibility of breakage.

  Furthermore, since the flow rate sensor 111 uses the resin piping 10 made of PFA and all the contact portions with the photoresist are made of PFA, it is possible to prevent impurities such as metals from being eluted into the photoresist. be able to. Furthermore, when bubbles are mixed in the photoresist, the flow rate sensor 111 can detect the mixing of the bubbles, so that the bubbles are supplied to the semiconductor wafer W and the formation state of the photoresist film is poor. Can be prevented from occurring.

  Prior to the application of the photoresist, if necessary, a solvent is supplied to the surface of the semiconductor wafer W from the solvent supply nozzle 104 so that the surface of the semiconductor wafer W is wetted with the solvent, and then the photoresist supply nozzle 103 applies the photo resist. Supply resist.

  As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications are possible.

  DESCRIPTION OF SYMBOLS 10 ... Resin (PFA) piping, 10a ... Thin part, 11 ... Heater, 12a ... Upstream temperature sensor, 12b ... Downstream temperature sensor, 13 ... Fixing member, 14 ... Flexible substrate, 15 ... Holder, 19 ... Holding member.

Claims (8)

A resin pipe through which the fluid to be measured flows;
A heating mechanism provided outside the resin pipe, for heating the fluid to be measured;
A temperature detection mechanism that is provided outside the resin pipe and detects a temperature change caused by the flow of the fluid to be measured;
A flow sensor comprising:
At least one each from the arrangement part of the heating mechanism and the temperature detection mechanism to the both ends of the resin pipe, respectively, fixing a fixing member that protrudes outside the resin pipe,
A flow sensor characterized in that the two fixing members are fixed to a holding member that holds the fixing members while restricting rotation around the tube axis. The flow sensor according to claim 1,
The flow rate sensor characterized in that the resin pipe is made of PFA (perfluoroalkoxy fluororesin). The flow sensor according to claim 1 or 2,
In a part of the resin pipe, a thin portion with a thin tube wall is provided, and the heating mechanism and the temperature detection mechanism are arranged in the thin portion,
The flow sensor characterized in that the fixing member is fixed to a portion other than the thin-walled portion outside the resin pipe and at a position sandwiching the thin-walled portion. The flow sensor according to claim 3,
The thin wall portion is formed by cutting the outside of the resin pipe. The flow sensor according to any one of claims 1 to 4,
The flow sensor according to claim 1, wherein the fixing member is configured to protrude outwardly from the resin pipe in a bowl shape. The flow sensor according to any one of claims 1 to 4,
The flow rate sensor, wherein the holding member is formed in a rectangular parallelepiped box shape, and the fixing member is fixed to opposite side surfaces. The flow sensor according to any one of claims 1 to 6,
The temperature detection mechanism includes an upstream temperature detection mechanism disposed upstream from the heating mechanism with respect to the flow of the fluid to be measured, and a downstream temperature detection mechanism disposed downstream. A flow sensor characterized by A rotation holding mechanism for holding and rotating the substrate to be processed;
A photoresist coating apparatus having a photoresist supply pipe through which photoresist is distributed, and a photoresist supply mechanism that supplies photoresist to the surface of the substrate to be processed held by the rotation holding mechanism. And
Resin piping through which the photoresist is circulated, a heating mechanism provided outside the resin piping for heating the photoresist, and a flow of the photoresist provided outside the resin piping A temperature detection mechanism for detecting a temperature change,
At least one each from the arrangement part of the heating mechanism and the temperature detection mechanism to the both ends of the resin pipe, respectively, fixing a fixing member that protrudes outside the resin pipe,
A flow rate sensor fixed to a holding member that holds the two fixing members while restricting rotation of the fixing members around the tube axis;
A resist coating apparatus, wherein the resist coating apparatus is interposed in the photoresist supply pipe.

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