JP2012135815A - ポリアミンフラックス組成物およびはんだ付け方法 - Google Patents
ポリアミンフラックス組成物およびはんだ付け方法 Download PDFInfo
- Publication number
- JP2012135815A JP2012135815A JP2011260170A JP2011260170A JP2012135815A JP 2012135815 A JP2012135815 A JP 2012135815A JP 2011260170 A JP2011260170 A JP 2011260170A JP 2011260170 A JP2011260170 A JP 2011260170A JP 2012135815 A JP2012135815 A JP 2012135815A
- Authority
- JP
- Japan
- Prior art keywords
- group
- polyamine
- flux composition
- substituted
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/958,480 | 2010-12-02 | ||
| US12/958,480 US8070044B1 (en) | 2010-12-02 | 2010-12-02 | Polyamine flux composition and method of soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012135815A true JP2012135815A (ja) | 2012-07-19 |
| JP2012135815A5 JP2012135815A5 (enExample) | 2015-01-22 |
Family
ID=45034314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011260170A Withdrawn JP2012135815A (ja) | 2010-12-02 | 2011-11-29 | ポリアミンフラックス組成物およびはんだ付け方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8070044B1 (enExample) |
| JP (1) | JP2012135815A (enExample) |
| CN (1) | CN102554513B (enExample) |
| DE (1) | DE102011120049A1 (enExample) |
| FR (1) | FR2968228B1 (enExample) |
| TW (1) | TWI438178B (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012135813A (ja) * | 2010-12-02 | 2012-07-19 | Rohm & Haas Electronic Materials Llc | フラックス組成物およびはんだ付け方法 |
| JP2012135814A (ja) * | 2010-12-02 | 2012-07-19 | Rohm & Haas Electronic Materials Llc | 硬化性アミンフラックス組成物およびはんだ付け方法 |
| JP2012148337A (ja) * | 2010-12-02 | 2012-08-09 | Rohm & Haas Electronic Materials Llc | アミンフラックス組成物およびはんだ付け方法 |
| JP2013078799A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | フラックス組成物およびはんだ付け方法 |
| JP2013078798A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | アミン、カルボン酸フラックス組成物およびはんだ付け方法 |
| JP2013079376A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | 硬化性アミン、カルボン酸フラックス組成物およびはんだ付け方法 |
| JP2013091093A (ja) * | 2011-10-27 | 2013-05-16 | Internatl Business Mach Corp <Ibm> | アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス |
| JP2013091100A (ja) * | 2011-09-30 | 2013-05-16 | Rohm & Haas Electronic Materials Llc | ポリアミン、カルボン酸フラックス組成物およびはんだ付け方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2723493C (en) * | 2009-12-22 | 2013-08-06 | Dow Global Technologies, Inc. | Novel diamino-alcohol compounds, their manufacture and use in high solids mineral slurries |
| CA2723359C (en) * | 2009-12-22 | 2015-03-17 | Dow Global Technologies, Inc. | Diamino-alcohol compounds, their manufacture and use in epoxy resins |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE860795C (de) * | 1939-03-23 | 1952-12-22 | Hoechst Ag | Verfahren zur Herstellung von aliphatischen Dinitroalkoholen |
| US2632022A (en) | 1950-07-07 | 1953-03-17 | Rohm & Haas | Method of preparing 1, 8-diamino-p-menthane |
| US2897179A (en) | 1956-07-18 | 1959-07-28 | Union Carbide Corp | Hardener for epoxy resin composition |
| US3488831A (en) * | 1967-04-14 | 1970-01-13 | Continental Can Co | Fluxing materials for soldering metal surfaces |
| BE786932A (fr) * | 1971-07-28 | 1973-01-29 | Int Nickel Ltd | Fondants de soudage |
| US3814638A (en) * | 1972-05-05 | 1974-06-04 | Int Nickel Co | Soldering fluxes |
| US4028143A (en) * | 1974-12-30 | 1977-06-07 | Chevron Research Company | Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering |
| US4165244A (en) * | 1977-10-21 | 1979-08-21 | Jacobs Norman L | Soldering flux and method of using same |
| US4196024A (en) * | 1978-11-02 | 1980-04-01 | E. I. Du Pont De Nemours And Company | Alkyl phosphate soldering fluxes |
| US4360144A (en) * | 1981-01-21 | 1982-11-23 | Basf Wyandotte Corporation | Printed circuit board soldering |
| USRE32309E (en) * | 1983-10-31 | 1986-12-16 | Scm Corporation | Fusible powdered metal paste |
| GB8900381D0 (en) * | 1989-01-09 | 1989-03-08 | Cookson Group Plc | Flux composition |
| US5145722A (en) * | 1989-04-11 | 1992-09-08 | Hughes Aircraft Company | Method and composition for protecting and enhancing the solderability of metallic surfaces |
| US5011546A (en) * | 1990-04-12 | 1991-04-30 | International Business Machines Corporation | Water soluble solder flux and paste |
| CA2121914C (en) * | 1990-09-11 | 1998-09-29 | Chou-Hong Tann | Process for preparing albuterol, acetal, hemi-acetal, and hydrates of arylglyoxal intermediates thereof |
| CN1223250A (zh) * | 1990-09-11 | 1999-07-21 | 先灵公司 | 乙缩醛和半乙缩醛及乙二醛水合物的制备方法 |
| US5615827A (en) | 1994-05-31 | 1997-04-01 | International Business Machines Corporation | Flux composition and corresponding soldering method |
| US5571340A (en) | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
| JP3498427B2 (ja) * | 1995-06-19 | 2004-02-16 | ソニー株式会社 | 成形はんだ用フラックス |
| US5851311A (en) | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| US5958151A (en) | 1996-07-22 | 1999-09-28 | Ford Global Technologies, Inc. | Fluxing media for non-VOC, no-clean soldering |
| US6367150B1 (en) | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
| US5963355A (en) * | 1997-11-17 | 1999-10-05 | Asahi Kogaku Kogyo Kabushiki Kaisha | Optical scanning system with single element refractive/reflective Fθlθ lens |
| US6234381B1 (en) * | 1998-04-14 | 2001-05-22 | Denso Corporation | Water-base binder for aluminum material brazing, brazing composition, and method of brazing with the composition |
| JP4343354B2 (ja) * | 1999-11-02 | 2009-10-14 | Agcセイミケミカル株式会社 | 半田用フラックス這い上がり防止剤組成物とその用途 |
| US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
| US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
| JP2001300766A (ja) * | 2000-04-27 | 2001-10-30 | Tamura Kaken Co Ltd | 回路基板はんだ付用フラックス及び回路基板 |
| US6926849B2 (en) * | 2000-11-29 | 2005-08-09 | Senju Metal Industry Co., Ltd. | Solder paste |
| US6794761B2 (en) * | 2001-04-26 | 2004-09-21 | Intel Corporation | No-flow underfill material |
| US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
| TWI228132B (en) | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
| US20060043157A1 (en) * | 2004-08-25 | 2006-03-02 | Harima Chemicals, Inc. | Flux for soldering, soldering method, and printed circuit board |
| JP4142312B2 (ja) * | 2002-02-28 | 2008-09-03 | ハリマ化成株式会社 | 析出型はんだ組成物及びはんだ析出方法 |
| US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| EP1533070B1 (en) * | 2002-06-17 | 2013-05-01 | Sumitomo Light Metal Industries, Ltd. | Water-base aluminum-brazing composition and process of brazing |
| US7022410B2 (en) * | 2003-12-16 | 2006-04-04 | General Electric Company | Combinations of resin compositions and methods of use thereof |
| US20050170188A1 (en) * | 2003-09-03 | 2005-08-04 | General Electric Company | Resin compositions and methods of use thereof |
| US7276673B2 (en) | 2003-09-26 | 2007-10-02 | Tdk Corporation | Solder bonding method and solder bonding device |
| TWI262041B (en) | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| US7671114B2 (en) * | 2004-01-26 | 2010-03-02 | Henkel Corporation | Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder |
| MY148568A (en) * | 2004-12-09 | 2013-04-30 | Lonza Ag | Quaternary ammonium salts as a conversion coating or coating enhancement |
| US20060147683A1 (en) * | 2004-12-30 | 2006-07-06 | Harima Chemicals, Inc. | Flux for soldering and circuit board |
| US20060272747A1 (en) | 2005-06-03 | 2006-12-07 | Renyi Wang | Fluxing compositions |
| US20060275608A1 (en) | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
| US7780801B2 (en) | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
| US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
| KR20100132480A (ko) | 2007-07-23 | 2010-12-17 | 헨켈 리미티드 | 땜납 플럭스 |
| CN101596656B (zh) * | 2009-07-02 | 2011-11-02 | 东莞市中实焊锡有限公司 | 一种无铅焊接用水清洗助焊剂及其制备方法 |
| CA2791226C (en) * | 2009-12-22 | 2014-04-15 | Dow Global Technologies, Inc. | Novel diamino-alcohol compounds and processes for their manufacture |
-
2010
- 2010-12-02 US US12/958,480 patent/US8070044B1/en not_active Expired - Fee Related
-
2011
- 2011-11-29 JP JP2011260170A patent/JP2012135815A/ja not_active Withdrawn
- 2011-12-01 TW TW100144125A patent/TWI438178B/zh not_active IP Right Cessation
- 2011-12-02 CN CN201110463044.4A patent/CN102554513B/zh not_active Expired - Fee Related
- 2011-12-02 FR FR1161086A patent/FR2968228B1/fr not_active Expired - Fee Related
- 2011-12-02 DE DE102011120049A patent/DE102011120049A1/de not_active Ceased
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012135813A (ja) * | 2010-12-02 | 2012-07-19 | Rohm & Haas Electronic Materials Llc | フラックス組成物およびはんだ付け方法 |
| JP2012135814A (ja) * | 2010-12-02 | 2012-07-19 | Rohm & Haas Electronic Materials Llc | 硬化性アミンフラックス組成物およびはんだ付け方法 |
| JP2012148337A (ja) * | 2010-12-02 | 2012-08-09 | Rohm & Haas Electronic Materials Llc | アミンフラックス組成物およびはんだ付け方法 |
| JP2013078799A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | フラックス組成物およびはんだ付け方法 |
| JP2013078798A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | アミン、カルボン酸フラックス組成物およびはんだ付け方法 |
| JP2013079376A (ja) * | 2011-09-30 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | 硬化性アミン、カルボン酸フラックス組成物およびはんだ付け方法 |
| JP2013091100A (ja) * | 2011-09-30 | 2013-05-16 | Rohm & Haas Electronic Materials Llc | ポリアミン、カルボン酸フラックス組成物およびはんだ付け方法 |
| JP2013091093A (ja) * | 2011-10-27 | 2013-05-16 | Internatl Business Mach Corp <Ibm> | アンダーフィルとの間で化学的に硬化物を形成する無洗浄フラックス |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102011120049A1 (de) | 2012-06-06 |
| CN102554513A (zh) | 2012-07-11 |
| US8070044B1 (en) | 2011-12-06 |
| FR2968228A1 (fr) | 2012-06-08 |
| TW201231440A (en) | 2012-08-01 |
| CN102554513B (zh) | 2015-05-06 |
| FR2968228B1 (fr) | 2014-07-18 |
| TWI438178B (zh) | 2014-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141127 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141127 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A132 Effective date: 20150820 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20151113 |