JP2012134314A5

JP2012134314A5 -

Info

Publication number: JP2012134314A5
Application number: JP2010284837A
Authority: JP
Filing date: 2010-12-21
Publication date: 2013-09-19
Anticipated expiration: 2030-12-21

Description

本発明の一観点によれば、配線基板と、前記配線基板面に搭載される電子部品が電気的に接続されるパッドと、位置ずれ検出用の検出パターンとを含む配線層と、前記配線層を覆うように形成されるソルダーレジスト膜とを備えた配線基板であって、前記ソルダーレジスト膜は、該ソルダーレジスト膜の位置ずれを検出する位置ずれ検出用開口部と、前記パッドを露出するパッド用開口部とを有し、前記検出パターン及び前記位置ずれ検出用開口部をそれぞれ複数設け、前記各検出パターンを、前記位置ずれ検出用開口部の外周側に枠状に形成するとともに、前記各検出パターンと前記位置ずれ検出用開口部の開口縁との間隔をそれぞれ異なる間隔とし、前記位置ずれ検出用開口部から前記検出パターンを確認することで、前記ソルダーレジスト膜の位置ずれを検出する。 According to one aspect of the present invention, a wiring layer including a wiring board, a pad to which an electronic component mounted on the wiring board surface is electrically connected, a detection pattern for detecting misalignment, and the wiring layer A solder resist film formed so as to cover the solder resist film, wherein the solder resist film includes a misalignment detection opening for detecting misalignment of the solder resist film, and a pad exposing the pad. A plurality of detection patterns and a plurality of position detection openings, and each detection pattern is formed in a frame shape on the outer periphery of the position detection opening. the distance between the detection pattern and the opening edge of the positional deviation detecting opening and different intervals, by checking the detection pattern from the positional deviation detecting opening, said Sorudareji Detecting the positional deviation of bets film.

Claims

A wiring board;
A wiring layer including a pad for electrically connecting electronic components mounted on the wiring board, and a detection pattern for detecting misalignment;
A wiring board provided with a solder resist film formed so as to cover the wiring layer,
The solder resist film has a misregistration detection opening for detecting misregistration of the solder resist film, and a pad opening for exposing the pad,
A plurality said detection pattern and the positional deviation detecting openings respectively, the respective detection patterns, and forming a frame shape on the outer peripheral side of the position displacement detection aperture, the for the positional deviation detection and the detection pattern A wiring board characterized in that a positional shift of the solder resist film is detected by setting different intervals between the opening and the opening edge and confirming the detection pattern from the positional shift detection opening.

The wiring board according to claim 1, wherein an alignment mark is exposed from the misalignment detection opening.

Wherein the wiring layer includes a plating power feeding layer for forming the surface plated layer on the pad, the detection pattern according to claim 1 or 2, characterized in that it is electrically connected to the plating power-supply layer Wiring board.

The wiring board according to claim 3, wherein the alignment mark is electrically connected across the detection pattern and the plating power feeding layer.

The wiring board according to claim 1, wherein the detection pattern is formed in a blank portion around a sheet on which a large number of the wiring boards are formed.