JP2012124376A - Method of forming functional membrane, laminate structure, multilayer wiring board, active matrix substrate, image display unit, drawing preparing apparatus, inkjet device, and laminate structure manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming a functional membrane capable of forming a functional membrane without causing a short in a fine pattern by an inkjet method.SOLUTION: On the surface of a printed surface which contains high surface energy regions 231 and 241, adjoining each other with a low surface energy region in between, a droplet tolerable range 231A (241A) which allows a functional liquid to contact only to the high surface energy region 231 (241) when the functional liquid is supplied to the high surface energy region 231 (241) is determined based on the shapes of the high surface energy regions 231 and 241 and a fitting range of the functional liquid. Then, an arbitrary position in the droplet tolerable range 231A (241A) is determined as a droplet position 231C (241C) of the functional liquid on the high surface energy region 231 (241). The functional liquid is selectively supplied using an inkjet method to the droplet position 231C (241C) of the high surface energy region 231 (241), so that a functional membrane of a predetermined pattern is formed.

Description

  The present invention relates to a functional film forming method for forming a functional film having a predetermined pattern, a laminated structure, a multilayer wiring board, an active matrix substrate, an image display apparatus, a drawing manufacturing apparatus, an inkjet apparatus, and a laminated structure manufacturing apparatus. Is.

  As a method for forming functional film patterns such as electrodes, insulators, and semiconductors used in electric circuits and the like, there is an ink jet method that supplies a necessary amount of a functional liquid containing these functional materials to a predetermined position on a substrate. The ink-jet method has advantages in that the number of steps is small and the material utilization efficiency is high, without requiring expensive equipment and equipment, compared to the photolithography method using an exposure apparatus. However, on the other hand, it is difficult to control droplets of 1 pL or less, and there is a lower limit on the size of the droplets. When a plurality of nozzles are used, the landing position of the functional liquid varies. In general, it has been difficult to form a fine pattern having a line width of 50 μm or less because of wet spreading.

  On the other hand, Patent Document 1 discloses a method for manufacturing a laminated structure using a wettability changing layer in which surface energy changes due to energy application. By applying energy to the wettability changing layer and forming a high surface energy part that is hydrophilic to the functional liquid and a low surface energy part that is hydrophobic to the functional liquid, the high surface energy part is selectively used. When a functional liquid containing a conductive material is dropped, a laminated structure including a fine conductive layer can be formed.

  Patent Document 2 discloses a method of preventing a functional liquid from spreading by forming a bank as a barrier against the functional liquid in advance on a substrate and supplying the functional liquid to a groove between the banks. Furthermore, as a pre-treatment, a high surface energy part is formed on the groove between the banks, and a low surface energy part is formed on the bank, so that the functional liquid efficiently flows into the groove between the banks, and the fine and uniform functionality. The material pattern can be formed.

  In the manufacturing methods disclosed in Patent Documents 1 and 2, regions having different surface energies composed of a low surface energy region and a high surface energy region are formed on a non-printing surface, and a functional liquid is selectively applied to the high surface energy region. Therefore, the functional film pattern can be miniaturized. However, in order to form a functional film pattern without a short in the high surface energy region and to precisely control the film thickness of the functional film pattern, it is necessary to supply the functional liquid accurately to the printing surface. was there.

  The present invention has been made in view of the above-described problems in the prior art, and a functional film forming method capable of forming a functional film without causing a short-circuit in a fine pattern by an inkjet method, the functional film Provided are a laminated structure manufactured by the forming method, a multilayer wiring board, an active matrix substrate, an image display device, a drawing manufacturing apparatus, an ink jet apparatus, and a laminated structure manufacturing apparatus that realize the functional film forming method. With the goal.

The present invention provided to solve the above problems is as follows. In addition, the site | part and code | symbol etc. which respond | correspond in the form for implementing this invention in a parenthesis are shown.
[1] A functional film forming method for forming a functional film having a predetermined pattern on a plurality of high surface energy regions that are not connected to each other across a low surface energy region. A first step of forming a surface energy region (low surface energy region 50) and a plurality of high surface energy regions (high surface energy regions 41, 42) adjacent to each other across the low surface energy region (FIGS. 2 and 2) 3) and a second step (FIG. 4) for selectively supplying a functional liquid (functional liquid 61) to the plurality of high surface energy regions formed on the printing surface using an inkjet method, And a third step (FIG. 5) for forming a functional film (conductive layer 71) having a predetermined pattern by drying and solidifying the functional liquid supplied to the plurality of high surface energy regions. The plurality of steps A first high surface energy region (first high surface energy region 43, 231 (or 241)) to be dropped with the functional liquid selected from the high surface energy region is separated from the low surface energy region. The shape of one or a plurality of second high surface energy regions (second high surface energy regions 44, 241 (or 231)) adjacent to the first high surface energy region and the landing range (virtual) of the functional liquid On the basis of the landing range 62E), when the functional liquid is supplied to the first high surface energy region, the functional liquid does not touch the one or more second high surface energy regions and does not touch the first high surface energy region. A first procedure (FIG. 6, FIG. 16 (a), (b)) for determining a drop allowable range (drop allowable range 61 F, 61 G, 231 A (or 241 A)) for touching only the surface energy region; In the second procedure (FIG. 7, FIG. 16 (c), an arbitrary position within the permissible drop range is determined as a drop position (drop position 61C, 231C (or 241C)) of the functional liquid with respect to the first high surface energy region. And a step of determining the dropping position of each functional liquid by executing the first procedure and the second procedure for each of the plurality of high surface energy regions. (FIGS. 2 to 7, FIG. 16, FIG. 22).
[2] The functionality according to [1], wherein a center position in a predetermined direction of the first high surface energy region is determined as a dripping position of the functional liquid within the dripping allowable range. Method for forming a film.
[3] The center position of the first high surface energy region in the direction adjacent to the second high surface energy region is determined as the dropping position of the functional liquid within the allowable drop range. The method for forming a functional film according to [2].
[4] The functional liquid dropping position is a center position in a direction perpendicular to a direction adjacent to the second high surface energy area in the first high surface energy area within the allowable dropping range. The method for forming a functional film according to the above [2] or [3], wherein the functional film is determined.
[5] In the second step, among the plurality of high surface energy regions, the dropping positions (dropping positions 61C and 61D) of the respective functional liquids in adjacent high surface energy regions (high surface energy regions 43 and 44). The functional liquid dropping position is determined so that the landing ranges (landing ranges 61E and 61E ′) calculated from (1) are not overlapped with each other, according to any one of [1] to [4], Method for forming functional film (FIG. 8).
[6] In the second step, the printing surface is divided into a plurality of sections, and the first procedure and the second procedure are executed for each of the plurality of high surface energy regions for each section, and each functional liquid is obtained. The method for forming a functional film according to any one of the above [1] to [5], wherein the dropping position is determined (FIGS. 9 and 10).
[7] The first step includes a first procedure (FIG. 2) for forming a wettability changing layer (wetability changing layer 30) including a material whose surface energy is changed by energy application on the printing surface. The high surface energy region is obtained by selectively applying energy to a part of the printed surface based on a drawing in which two different regions representing a low surface energy region and a high surface energy region are partitioned. The method for forming a functional film according to any one of [1] to [6], comprising: a second procedure (FIG. 3) for forming (high surface energy regions 41, 42).
[8] The method for forming a functional film according to [7] (FIG. 3), wherein the energy is applied using light (ultraviolet ray 92).
[9] A photomask (photomask 91) is produced based on a drawing in which two different regions representing a low surface energy region and a high surface energy region are partitioned, and light irradiation through the photomask is performed. The method for forming a functional film as described in [8] above, wherein a high surface energy region is formed by the method (FIG. 3).
[10] A region having a surface energy different from that of a low surface energy region (low surface energy region 50) and a high surface energy region (high surface energy regions 41, 42) is included. A laminated structure including a wettability changing layer (wetting change layer 30) and a conductive layer (conductive layer 71) formed on a high surface energy region of the wettability changing layer, wherein the conductive layer is A laminated structure (laminated structure 10, 10A, FIG. 1, FIG. 20) formed by using the method for forming a functional film according to any one of [1] to [9].
[11] In a multilayer wiring board having at least a substrate, an insulating layer, and an electrode layer,
The laminated structure according to [10], wherein the conductive layer formed on the high surface energy region of the laminated structure is used as at least a part of the electrode layer. Multilayer wiring board.
[12] Gate electrode (gate electrode 210), gate insulating layer (gate insulating layer 220), source electrode (source electrode 230), drain electrode (drain electrode 240), storage capacitor electrode (storage capacitor electrode 250), and semiconductor layer (Semiconductor layer 260) including transistors (transistors 270 and 270A), a wiring (wiring 140) connected to any of the gate electrode, source electrode, drain electrode, and storage capacitor electrode, and an electrode PAD (electrode) connected to the wiring An active matrix substrate having a PAD150) includes the stacked structure according to [10], wherein the conductive layer formed on the high surface energy region of the stacked structure includes the gate electrode and the source electrode. , At least one of the drain electrode, the storage capacitor electrode, the wiring, and the electrode PAD An active matrix substrate (active matrix substrates 120 and 120A, FIGS. 11, 12, and 21) characterized by being used as one.
[13] An image display device comprising: an image display element; and the active matrix substrate according to [12].
[14] A drawing manufacturing apparatus for manufacturing an ink jet printing drawing that describes a dropping position of a functional liquid in an ink jet device, and includes a low surface energy region (low surface energy region 50S) and a plurality of high surface energy regions (high surface). A mechanism (mechanism m1) for creating a drawing in which two different regions representing the energy regions 43S, 44S) are represented by vector data in which the regions are shown in sections, and the shapes of the plurality of high surface energy regions are extracted from the drawings. And 1 adjacent to the first high surface energy region across the first high surface energy region and the low surface energy region to be dropped from the plurality of high surface energy regions. Or based on the shape of the plurality of second high surface energy regions and the landing range of the functional liquid, the first high surface A mechanism (mechanism m2) for automatically calculating a dripping allowable range (dropping allowable range 43A, 44A) for allowing the functional liquid to selectively touch only the energy region and an arbitrary position within the dripping allowable range are shown in FIG. A mechanism (mechanism m3) which is determined and illustrated as the dropping position (dropping position 43P, 44P) of the functional liquid for one high surface energy region, and a mechanism (mechanism) which converts vector data describing the dropping position into raster data and outputs it m4), and a drawing manufacturing apparatus (FIG. 17).
[15] A stage (stage 102) for supporting the substrate (substrate 20), a droplet discharge head (droplet discharge head 103), a moving / rotating mechanism (Y-axis direction moving mechanism 105) connected to the stage, An inkjet apparatus including a movement / rotation mechanism (X-axis direction movement mechanism 104) connected to a droplet discharge head, and a control device (control device 106), the drawing manufacturing apparatus according to [14] above Based on the raster data describing the output position of the functional liquid that is output, the control apparatus supplies a functional liquid ejection control signal and a stage drive signal (inkjet apparatus 100, FIG. 18).
[16] Substrate transport mechanism and mechanism (wetability change layer) for forming a wettability changing layer (wetability changing layer 30) composed of regions having different surface energies consisting of a low surface energy region and a high surface energy region on the printing surface Layer manufacturing mechanism), an inkjet printing mechanism that selectively drops functional liquid (functional liquid 61) onto a predetermined position on the surface of the wettability changing layer, and the functional liquid. A laminated structure manufacturing apparatus (FIG. 19) comprising a mechanism for drying and solidifying (drying and solidifying mechanism).

According to the method for forming a functional film of the present invention, the second step includes the first high surface energy region and the low surface to be dropped with the functional liquid selected from the plurality of high surface energy regions. The first high surface energy region based on the shape of one or more second high surface energy regions adjacent to the first high surface energy region across the energy region and the landing range of the functional liquid A first procedure for determining a permissible dropping range for the functional liquid to touch only the first high surface energy area without touching the one or more second high surface energy areas when supplying the functional liquid to And a second procedure for determining an arbitrary position within the permissible dropping range as a dropping position of the functional liquid with respect to the first high surface energy area, and for each of the plurality of high surface energy areas. Since the dropping position of each functional liquid is determined by executing the first procedure and the second procedure, the functional liquid is not in contact with the adjacent high surface energy region with respect to the target high surface energy region by the inkjet method. It is possible to form a functional film without landing shortly with a fine pattern.
In addition, the laminated structure, multilayer wiring board, active matrix substrate, and image display device of the present invention can be obtained by the functional film (conductive layer, electrode layer or gate electrode, source electrode, drain electrode) by the functional film forming method of the present invention. , At least one of a storage capacitor electrode, a wiring, and an electrode PAD) is formed, so that a desired one can be manufactured with a high yield.
Moreover, according to the drawing manufacturing apparatus, ink jet apparatus, and laminated structure manufacturing apparatus of the present invention, the functional film forming method of the present invention can be realized.

It is sectional drawing which illustrates the laminated structure which concerns on this invention. FIG. 2 is a diagram (part 1) illustrating a method for forming a functional film according to the invention. It is FIG. (The 2) which illustrates the formation method of the functional film which concerns on this invention. It is FIG. (The 3) which illustrates the formation method of the functional film which concerns on this invention. It is FIG. (The 4) which illustrates the formation method of the functional film which concerns on this invention. It is explanatory drawing of the 1st procedure in the determination method of the dripping position of a functional liquid. It is explanatory drawing of the 2nd procedure in the determination method of the dripping position of a functional liquid. It is explanatory drawing of the determination method of the dripping position in the case of dripping a functional liquid to both the 1st high surface energy area | region and a 2nd high surface energy area | region. It is a top view which shows the example (1) of division of the to-be-printed surface in which a high surface energy area | region is formed. It is a top view which shows the example of a partition (2) of the to-be-printed surface in which a high surface energy area | region is formed. 1 is a plan view illustrating an active matrix substrate according to the present invention. It is a figure which shows the structural example of the pixel circuit in the active matrix substrate of FIG. FIG. 2 is a diagram (No. 1) illustrating a method for manufacturing an active matrix substrate according to the present invention; FIG. 6 is a second diagram illustrating the method for manufacturing the active matrix substrate according to the invention; It is explanatory drawing of the determination method of the dripping position of a functional liquid in the process shown in FIG. It is explanatory drawing of the determination method of the dripping position of a functional liquid with respect to the division of the pixel circuit in the process shown in FIG. It is the schematic which illustrates the mechanism of the drawing manufacturing apparatus which concerns on this invention. It is the schematic which illustrates the structure of the inkjet apparatus which concerns on this invention. It is the schematic which illustrates the structure of the laminated structure manufacturing apparatus which concerns on this invention. 3 is a diagram illustrating a method for manufacturing a laminated structure according to Example 1. FIG. 6 is a diagram illustrating a configuration of an active matrix substrate of Example 3. FIG. FIG. 10 is a diagram illustrating an example of a dropping position of a functional liquid when forming a source electrode, a drain electrode, and a source signal line on an active matrix substrate of Example 3.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and the overlapping description may be abbreviate | omitted.

[Structure of laminated structure]
First, the schematic structure of the laminated structure according to the present invention will be described.
FIG. 1 is a cross-sectional view illustrating a laminated structure according to the present invention.
Referring to FIG. 1, a laminated structure 10 according to the present invention has a structure in which a wettability changing layer 30 and a conductive layer 71 are laminated on a substrate 20.

  As the substrate 20, for example, a glass substrate, a silicon substrate, a stainless steel substrate, a film substrate, or the like can be used. Among these, as the film substrate, for example, a polyimide (PI) substrate, a polyethersulfone (PES) substrate, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or the like can be used.

  The wettability changing layer 30 includes a wettability changing material whose surface energy (critical surface tension) is changed by application of energy such as heat, electron beam, ultraviolet light, and plasma. As this wettability changing material, a polymer material having a hydrophobic group in the side chain can be used. As the polymer material, specifically, a material in which a side chain having a hydrophobic group is bonded to a main chain having a skeleton such as polyimide or (meth) acrylate directly or via a bonding group is used. it can. As the hydrophobic group, a fluoroalkyl group containing a fluorine atom or a hydrocarbon group containing no fluorine element can be used.

  Further, in the vicinity of the surface of the wettability changing layer 30, the low surface energy region 50, the first high surface energy region 41, and the first high surface energy region 41 are adjacent (adjacent) across the low surface energy region. And a second high surface energy region 42 is formed. In FIG. 1, second high surface energy regions 42 are formed on both the left and right sides of the first high surface energy region 41.

In addition, a conductive layer 71 is formed on the first high surface energy region 41 and the second high surface energy region 42 constituting the wettability changing layer 30.
As the conductive layer 71, for example, transparent conductive materials such as Au, Ag, Cu, Pt, Al, Ni, Pd, Pb, In, Sn, Zn, Ti and alloys thereof, indium oxide, zinc oxide, tin oxide, gallium oxide, and the like. A material containing a metal raw material composed of a body or the like, or a material containing a conductive polymer in which PSS (polyethylenesulfonic acid) is doped into doped PANI (polyaniline) or PEDOT (polyethylenedioxythiophene) can be used.

  The laminated structure according to the present invention is formed on, for example, a substrate, an insulator layer that is a wettability changing layer formed on the substrate, and a high surface energy portion of the insulator layer that is a wettability changing layer. The present invention can be applied to a multilayer wiring board having an electrode layer which is a conductive layer. Further, the present invention can be applied to an active matrix substrate having a transistor which is a stacked structure according to the present invention. By using the active matrix substrate according to the present invention, an inexpensive and high-performance image display device can be realized.

[Manufacturing method of laminated structure]
Next, the manufacturing method of the laminated structure which concerns on this invention is demonstrated. Specifically, a method for forming a functional film for forming a functional film having a predetermined pattern will be described.
2-5 is a figure which illustrates the formation method of the functional film which concerns on this invention. 2A to FIG. 5A are plan views, and FIG. 2B to FIG. 5B are along the line AA in FIG. 2A to FIG. 5A. It is sectional drawing.

In the method for forming a functional film according to the present invention, a wettability changing layer 30 is formed on a substrate (FIG. 2), and energy such as ultraviolet rays is applied to a part of the wettability changing layer 30 to thereby change the wettability changing layer 30. Forming a low surface energy region 50, a first high surface energy region 41, and a second high surface energy region 42 adjacent to the first high surface energy region 41 across the low surface energy region 50. Step 2 (FIG. 3) and a second step of selectively dropping the functional liquid 61 containing a conductive material onto the first high surface energy region 41 and the second high surface energy region 42 of the high surface energy part. And the third step (FIG. 5) for drying the functional liquid 61 to form the conductive layer 71.
Hereinafter, each process will be described in detail with reference to FIGS.

  In the first step shown in FIGS. 2 and 3, first, a solution containing the wettability changing material is applied onto the substrate 20 by spin coating or the like and dried to form the wettability changing layer 30. For example, when a polymer material having a structure having a hydrophobic group in the side chain is used as the wettability changing material, the wettability changing layer 30 having the low surface energy region 50 is formed on the substrate 20 (FIG. 2).

  Next, as shown in FIG. 3, using a photomask 91, ultraviolet rays 92 are exposed on a part of the wettability changing layer 30. The wettability changing layer 30 in the portion exposed to the ultraviolet rays is changed from a low surface energy (hydrophobic) to a high surface energy (hydrophilicity) by breaking a hydrophobic group bond. Therefore, the low surface energy region 50, the first high surface energy region 41, and the second high energy adjacent to the first high surface energy region 41 across the low surface energy region 50 on the wettability changing layer 30. A pattern comprising the surface energy region 42 can be formed.

  In the second step shown in FIG. 4, the functional liquid 61 containing a conductive material is transferred from the droplet discharge nozzle 93 onto the first high surface energy region 41 and the second high surface energy region 42 of the high surface energy portion. Selective placement.

  As the arrangement means for the functional liquid 61, an ink jet method having a feature that fine droplets can be accurately dropped one by one is suitable. The functional liquid 61 containing a conductive material includes Au, Ag, Cu, Pt, Al, Ni, Pd, Pb, In, Sn, Zn, Ti, and alloys thereof, indium oxide, zinc oxide, tin oxide, gallium oxide, and the like. Ink dispersed in or dissolved in an organic solvent or water in the form of fine particles, complexes, or the like, or doped PANI (polyaniline) or PEDOT (polyethylenedioxythiophene) and PSS (polyethylenesulfone). Examples thereof include an aqueous solution of a conductive polymer doped with (acid).

  In order to be used in the inkjet method, the surface tension of the functional liquid 61 is desirably 20 mN / m or more and 50 mN / m or less, and the viscosity is desirably 2 mPa · s or more and 50 mPa · s or less.

In the third step shown in FIG. 5, the functional liquid 61 is dried and solidified to form the conductive layer 71.
As a drying method, a convection heat transfer method using an oven or the like, a conductive heat transfer method using a hot plate or the like, or a radiant heat transfer method using far infrared rays or microwaves can be used. Moreover, it is not always necessary to carry out at atmospheric pressure, and a device such as depressurization may be added if necessary. Further, an additional heat treatment or the like may be applied to the dried and solidified conductive layer 71. In particular, when the above-described nanometal ink is used as the functional liquid 61, it is difficult to achieve sufficient conductivity simply by drying and solidifying, and thus heat treatment for fusing the nanoparticles together is required.
Thus, the laminated structure 10 shown in FIG. 1 is manufactured by the steps shown in FIGS.

Next, the determination of the dropping position of the functional liquid 61 in the second step shown in FIG. 4 will be described in more detail with reference to FIGS.
6 and 7 are explanatory diagrams of a method for determining the dropping position of the functional liquid when supplying the functional liquid to a linear high surface energy region extending in a certain direction. 6 and 7, reference numeral 43 denotes a rectangular first high surface energy region, and reference numeral 44 denotes a rectangular second high surface energy region disposed adjacent to both the left and right sides of the first high surface energy region 43 in the drawing. Regions are shown, and their surroundings are low surface energy regions. L is the width of the first high surface energy region 43, S is the interval between the first high surface energy region 43 and the second high surface energy region 44, and X is the first high surface energy region 43. Each distance in the line width direction (left and right direction in the figure) from the center is shown.

  The determination of the dropping position of the functional liquid in the second step includes a step (first procedure) for determining the allowable dropping range shown in FIG. 6 and a step (second procedure) for determining the dropping position shown in FIG. .

(First procedure)
In the first step (first procedure), the first high surface is separated from the first high surface energy region 43 and the low surface energy region to be dropped by the functional liquid selected from the plurality of high surface energy regions. Based on the shape of one or a plurality of second high surface energy regions 44 adjacent to the energy region 43 and the landing range of the functional fluid, the function liquid is supplied to the first high surface energy region 43. The permissible dripping range for the liquid to touch only the first high surface energy region 43 without touching the one or more second high surface energy regions 44 is determined. The shapes of the first high surface energy region 43 and the one or more second high surface energy regions 44 are, for example, the dimensions of the first high surface energy region 43, the first high surface energy region 43, The distance from one or more second high surface energy regions 44.

  That is, in the first procedure, as shown in FIG. 6, the case where the functional liquid 62 is dropped is virtually assumed, and the virtual dropping position 62C is determined. Here, if the droplet diameter D and landing position variation of the functional liquid 62 are α, the virtual landing range 62E is determined as a circle having a diameter D + 2α with the virtual dropping position 62C as the center. Here, the virtual landing range 62E means that the functional liquid lands within the virtual landing range 62E when the functional liquid is dropped onto the virtual dropping position 62C. The droplet diameter D and landing position variation α of the functional liquid can be adjusted. Specifically, the droplet diameter depends on the ejection conditions (driving waveform) of the inkjet head, and the landing position variation α depends on the type of head and nozzle used. It can be changed depending on the number of

  Now, in order to selectively form a conductive layer in the first high surface energy region 43, the functional liquid 61 is dropped so as not to touch the second high surface energy region 44 (first condition); It is necessary to drop the functional liquid 61 so as to touch the first high surface energy region 43 (second condition). In other words, the virtual drop position 62C is determined so that the virtual landing range 62E of the functional liquid 62 does not touch the second high surface energy region 44 (first condition), and the virtual landing range 62E is within the virtual landing range 62E. Even when landing at the position farthest from the virtual dripping position 62C, the functional liquid 61 touches the first high surface energy region 43 (second condition), and the following equations (1) and (2) Thus, a dripping tolerance range can be expressed.

Allowable dropping range 61F: X <± (L + 2S−D−2α) / 2 Formula (1)
Allowable drop 61G: X <± (L + D-2α) / 2 Formula (2)

  Here, X: distance between the center position 43C of the first high surface energy region 43 and the dropping center position 61C of the functional liquid 61, D: diameter at the time of flight of the functional liquid 61, α: landing position variation of the functional liquid 61 , L: line width of the first high surface energy region 43, S: distance between the first high surface energy region 43 and the second high surface energy region 44.

Next, when formulas (1) and (2) are put together, the allowable dropping range 61H is expressed by the following formula (3).
When S ≦ D: X <± (L + 2S−D−2α) / 2
In the case of S> D: X <± (L + D-2α) / 2 Formula (3)

  Thus, the shape of the high surface energy region (specifically, the line width L in the direction adjacent to the second high surface energy region 44 in the first high surface energy region 43 or the first high surface energy region 43 and the second The permissible drop 61H is determined by taking into account the distance S) of the high surface energy region 44 and the landing range of the functional liquid.

(Second procedure)
In the next step (second procedure), an arbitrary position within the permissible dropping range determined in the first procedure is determined as the dropping position of the functional liquid with respect to the first high surface energy region 43.

That is, in the second procedure, as shown in FIG. 7, the dropping position of the functional liquid 61 is determined so as to be within the dripping allowable range 61H.
Since the dropping position of the functional liquid 61 is determined so as to be within the dripping allowable range, the functional liquid can be selectively supplied to the first high surface energy region 43, and therefore the first high surface energy region 43 is selected. Thus, the conductive layer 71 can be formed. Although the dropping position of the functional liquid can be freely determined within the allowable dropping range, it is preferable to give priority to the center position of the first high surface energy region (X = 0 position in the X-axis direction). . When the functional liquid is dropped at the center position of the first high surface energy region 43, the uniform conductive layer 71 can be formed in the first high surface energy region 43.

  Here, for the sake of simplicity, the case where the functional liquid is supplied to a linear high surface energy region extending in a certain direction was considered, but the shape of the high surface energy is not limited to this, and is a regular polygon. Any shape including a polygon, a perfect circle, an ellipse and the like may be used.

  Moreover, in this invention, the said 1st procedure and 2nd procedure are performed about each of several high surface energy area | regions, and the dripping position of each functional liquid is determined. In other words, the same concept can be used when a conductive layer is formed in the second high surface energy region 44.

FIG. 8 shows a method for determining the dropping position when the functional liquid 61 is dropped on both the first high surface energy region 43 and the second high surface energy region 44.
Here, first, the permissible drop ranges 61H and 61I are first determined for each of the first high surface energy region 43 and the second high surface energy region 44 (first procedure). Next, dropping positions 61C and 61D are determined for each of the first high surface energy region 43 and the second high surface energy region 44. At this time, landing ranges 61E and 61E determined by the dropping positions 61C and 61D are determined. The dropping positions 61C and 61D are determined so that 'does not overlap each other (second procedure).

  By doing in this way, the uniform conductive layer 71 can be formed on each of the high surface energy regions 43 and 44 without straddling both the first high surface energy region 43 and the second high surface energy region 44. it can.

  As described above, the dropping position of the functional liquid is determined based on the shape of the high surface energy region, but the entire printing surface on which the high surface energy region is formed is divided into a plurality of sections, and the dropping is performed for each section. Preferably the position is determined. The method of partitioning is arbitrary, but for example, a place where the width of the high surface energy region as shown in FIG. 9 changes (dotted line portion in the figure) or a place where the density of the high surface energy region as shown in FIG. 10 changes ( It can be partitioned by a dotted line portion in the figure.

[Structure of active matrix substrate]
Next, the schematic structure of the active matrix substrate according to the present invention will be described.
FIG. 11 is a diagram illustrating an active matrix substrate according to the present invention.
The active matrix substrate 120 includes a pixel circuit 130 formed on the substrate 20 and a wiring 140 connected to the pixel circuit 130. An electrode PAD150 connected to the wiring may be provided as necessary. Although not shown in FIG. 11, the wiring 140 or the electrode PAD 150 is connected to the drive circuit in order to supply a signal or power to the pixel circuit.

12A and 12B are diagrams illustrating the pixel circuit 130. FIG. 12A is a top view (a plan view seen from above), and FIG. 12B is a cross section taken along line AA in FIG. FIG. Note that FIG. 12B shows a portion of a transistor included in the pixel circuit.
Referring to FIGS. 12A and 12B, the active matrix substrate 120 according to the present invention includes a transistor 270, a gate signal line 280, a source signal line 290, and a common signal line 300.

  The transistor 270 is a stacked structure in which the wettability changing layer 31, the gate electrode 210 and the storage capacitor electrode 250, the wettability changing layer 32, the source electrode 230 and the drain electrode 240, and the semiconductor layer 260 are sequentially stacked on the substrate 20. It is. In the wettability changing layer 32, the thickness region other than the surface layer becomes the gate insulating layer 220.

  More specifically, the wettability changing layer 31 in which the high surface energy part 201 and the low surface energy part 202 are formed in the vicinity of the surface is laminated on the substrate 20. Further, a gate electrode 210 and a storage capacitor electrode 250 which are conductive layers are formed on the high surface energy portion 201 of the wettability changing layer 31. On the wettability changing layer 31, a wettability changing layer 32 (gate insulating layer 220) is laminated so as to cover the gate electrode 210 and the storage capacitor electrode 250.

  Further, a high surface energy part 221 and a low surface energy part 222 are formed in the vicinity of the surface of the wettability changing layer 32, and a source electrode 230 and a drain electrode 240 that are conductive layers are formed on the high surface energy part 221. Yes. A gap is provided between the source electrode 230 and the drain electrode 240, and a semiconductor layer 260 is formed on the source electrode 230 and the drain electrode 240 so as to fill the gap.

  The gate signal line 280, which is a conductive layer, extends from the gate electrode 210 in one direction (the vertical direction in FIG. 12A). Further, the source signal line 290 that is a conductive layer is extended in a direction substantially orthogonal to the extending direction of the gate signal line 280 (left and right direction in FIG. 12A). In addition, the common signal line 300 which is a conductive layer extends with respect to the extending direction of the gate signal line 280 or the source signal line 290 from the storage capacitor electrode 250 (the extending direction of the gate signal line 280 in FIG. 12A). It extends substantially in parallel.

  The gate signal line 280 and the common signal line 300 are formed on the high surface energy part 201 of the wettability changing layer 31. The source signal line 290 is formed on the high surface energy portion 221 of the wettability changing layer 32. In this configuration, the wettability changing layer 32 also functions as the gate insulating layer 220, and the source signal line 290 also functions as the source electrode 230.

  As described above, the pixel circuit 130 includes the stacked structure according to the present invention, and the gate electrode 210, the source electrode 230, the drain electrode 240, the storage capacitor electrode 250, and the gate signal line 280 are used as the conductive layers of the stacked structure. The source signal line 290 and the common signal line 300 are provided, and all of these are formed on the high surface energy portion of the wettability changing layer. However, it is not necessary to form all of these on the high surface energy part of the wettability changing layers 31 and 32, and at least one of them should be formed on the high surface energy part of the wettability changing layers 31 and 32. Thus, the predetermined effect of the present embodiment is achieved.

[Method for manufacturing active matrix substrate]
Next, a method for manufacturing an active matrix substrate according to the present invention will be described.
13 and 14 are views illustrating a method for manufacturing an active matrix substrate according to the present invention. 13 (a) and 14 (a) are active matrix substrates, and FIGS. 13 (b) and 14 (b) are top views (plan views from above) of the pixel circuit, FIG. 13 (c). 14C is a cross-sectional view taken along the line AA ′ in FIGS. 13B and 14B.

  First, in the step shown in FIG. 13, the wettability changing layer 31 is formed on the substrate 20 by the method described with reference to FIG. And the high surface energy part 201 and the low surface energy part 202 are formed in the surface vicinity of the wettability change layer 200 by the method demonstrated using FIG. Furthermore, the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 are formed on the high surface energy portion 201 of the wettability changing layer 200 by the method described with reference to FIGS. To do.

  Next, in the step shown in FIG. 14, the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 are covered on the wettability changing layer 31 by the method described with reference to FIG. The wettability changing layer 32 (gate insulating layer 220) is stacked. And the high surface energy part 221 and the low surface energy part 222 are formed in the surface vicinity of the wettability change layer 32 by the method demonstrated using FIG. Further, the source electrode 230, the drain electrode 240, and the source signal line 290 are formed on the high surface energy portion 221 of the wettability changing layer 32 by the method described with reference to FIGS. 4 and 5.

  Next, after the step shown in FIG. 14, the semiconductor layer 260 is formed so as to be in contact with both the source electrode 230 and the drain electrode 240, whereby the active matrix substrate 120 shown in FIG. 11 is completed.

Next, as a more detailed explanation, a method for determining the dropping position of the functional liquid in the step shown in FIG. 14 will be described with reference to FIG.
FIG. 15A is a view showing a printing surface onto which the functional liquid is dropped, FIG. 15B is a top view of the pixel circuit, and FIG. 15C is AA ′ in FIG. It is sectional drawing which follows a line.

  First, as shown in FIG. 15A, the printing surface is divided into three sections (sections I, II, and III) of an electrode PAD, a wiring, and a pixel circuit. Since these sections have different functions, in general, the width or density of the high surface energy region is often different. Therefore, it is preferable to optimize the dropping position and the dropping amount of the functional liquid for each section by dividing the section into three sections. For example, in the electrode PAD section (section I) where the width of the high surface energy region is relatively large, the pixel circuit section (section III) where the droplet volume is relatively large and the density of the high surface energy region is high Then, the functional liquid can be efficiently supplied to the printing surface of the active matrix substrate by relatively reducing the droplet volume.

Next, a method for determining the dropping position of the functional liquid with respect to the section III of the pixel circuit 131 will be described with reference to FIG.
A section III of the pixel circuit 131 is a section in which circuit elements including transistors are periodically arranged for each pixel. Here, an area of 2 vertical pixels and 2 horizontal pixels is considered.

  FIG. 16A is a diagram in which a drop allowable range 231A for the high surface energy region 231 corresponding to the source electrode formation region is calculated. The virtual liquid landing range of the functional liquid touches the high surface energy region 241. FIG. Even when the functional liquid lands on the position farthest from the virtual dripping position within the virtual landing range, the functional liquid touches the high surface energy region 231 so that the dripping allowable range for the high surface energy region 231 is Determined.

  FIG. 16B is a diagram in which a dripping allowable range 241A for the high surface energy region 241 corresponding to the source electrode formation region is calculated. The virtual liquid landing range of the functional liquid is in the high surface energy region 231. Even when the functional liquid is landed at a position farthest from the virtual dropping position within the virtual landing range so as not to touch, the dripping allowable range with respect to the high surface energy area 241 is ensured so that the functional liquid touches the high surface energy area 241. Is decided.

Based on the obtained drop allowable range, the drop position is determined as shown in FIG.
Here, in the method for forming a functional film of the present invention, it is preferable that the center position in the predetermined direction of the first high surface energy region is determined as the dropping position of the functional liquid within the drop allowable range. Further, it is preferable to determine a center position of the first high surface energy region in a direction adjacent to the second high surface energy region as a dropping position of the functional liquid, and further, the dropping allowance. It is preferable that a center position in a direction perpendicular to a direction adjacent to the second high surface energy region in the first high surface energy region is determined as the dropping position of the functional liquid. is there.

  For example, in FIG. 16C, the dropping positions 231C and 241C of the functional liquid with respect to the high surface energy regions 231 and 241 are within the drop allowable ranges 231A and 241A, and the center of the high surface energy region (source electrode (high The surface energy region 241) is the center in the line width direction (horizontal direction in the figure), and the drain electrode (high surface energy region 231) is the center in the short side direction (vertical direction in the figure). Further, the dropping positions 231C. The two landing ranges calculated from 241C do not overlap each other.

  The number of functional liquid drops need not be one drop per pixel, and may be a plurality of drops per pixel within the range satisfying the above conditions, or may be one drop per plurality of pixels.

[Drawing production equipment]
Next, a drawing manufacturing apparatus according to the present invention will be described.
FIG. 17 is a schematic view illustrating the mechanism of the drawing manufacturing apparatus according to the present invention.
The drawing manufacturing apparatus according to the present invention includes a mechanism for drawing a drawing with vector data, and manufactures an inkjet printing drawing that describes a dropping position of a functional liquid in the inkjet device. Specifically, the following mechanism is sequentially executed to manufacture an ink jet printed drawing.

(Mechanism m1) First, a drawing is created in which two different regions representing the low surface energy region 50S and the plurality of high surface energy regions 43S, 44S are represented by vector data in a compartmentalized manner.

(Mechanism m2) The shape of the plurality of high surface energy regions 43S, 44S is automatically extracted from the drawing produced by the mechanism m1, and becomes a target for dropping the functional liquid selected from the plurality of high surface energy regions 43S, 44S. Based on the dimensions of the first high surface energy region 43S, the distance between the first high surface energy region 43S and the two second high surface energy regions 44S, and the landing range of the functional liquid, An automatic calculation of the dripping allowable range 43A for allowing the functional liquid to selectively touch only the surface energy region 43S is shown in the figure. Next, the size of the first high surface energy region 44S to be dropped with the functional liquid selected from the plurality of high surface energy regions 43S and 44S, the first high surface energy region 44S and the two second surface energy regions 44S. Based on the distance from the high surface energy region 43S and the landing range of the functional liquid, the dripping allowable range 44A for allowing the functional liquid to selectively touch only the first high surface energy area 44S is automatically calculated and illustrated. . The landing range of the functional fluid is obtained based on the diameter D of the functional fluid and the landing variation α.

(Mechanism m3) An arbitrary position within the allowable dropping range 43A produced by the mechanism m2 is determined and illustrated as a dropping position 43P of the functional liquid with respect to the first high surface energy region 43S. Next, an arbitrary position within the allowable drop range 44A produced by the mechanism m2 is determined and illustrated as a functional liquid dropping position 44P with respect to the first high surface energy region 44S. In addition, the arbitrary position here is a dripping position input with reference to the illustrated dripping allowable range, for example. Alternatively, a mechanism for automatically calculating the dropping position with reference to the allowable dropping range by inputting only the number of dropped droplets may be provided.

(Mechanism m4) Vector data in which the dropping positions 43P and 44P prepared by the mechanism m3 are described is converted into raster data and output.
In this way, it is possible to obtain an ink jet printing drawing that describes the dropping position of the functional liquid in the ink jet device.

[Inkjet device]
Next, a drawing manufacturing apparatus according to the present invention will be described.
FIG. 18 is a schematic view illustrating the structure of an inkjet apparatus according to the present invention.
18 includes a surface plate 101, a stage 102, a droplet discharge head 103, an X-axis direction moving mechanism 104 connected to the droplet discharge head 103, and a Y-axis connected to the stage 102. A direction moving mechanism 105 and a control device 106 are provided.
The stage 102 is provided for the purpose of supporting the substrate 20, and includes a fixing mechanism such as an adsorption mechanism (not shown) that adsorbs the substrate 20. Further, a heat treatment mechanism for drying the functional liquid 61 dropped on the substrate 20 may be provided.

  The droplet discharge head 103 is a head including a plurality of droplet discharge nozzles (droplet discharge nozzle 93 shown in FIG. 4), and the plurality of droplet discharge nozzles are placed on the lower surface of the droplet discharge head 103 in the X-axis direction. Are lined up at regular intervals. The functional liquid 61 is discharged from the droplet discharge nozzle to the substrate 20 supported by the stage 102. For example, a piezo method can be used as a droplet discharge mechanism of the droplet discharge head 103. In this case, a droplet is discharged by applying a voltage to a piezo element in the droplet discharge head 103.

  The X-axis direction moving mechanism 104 includes an X-axis direction drive shaft 107 and an X-axis direction drive motor 108. The X-axis direction drive motor 108 is a stepping motor or the like. When a drive signal in the X-axis direction is supplied from the control device 106, the X-axis direction drive shaft 107 is operated and the droplet discharge head 103 moves in the X-axis direction. .

  The Y-axis direction moving mechanism 105 includes a Y-axis direction drive shaft 109 and a Y-axis direction drive motor 110. When a drive signal in the X-axis direction is supplied from the control device 106, the stage 102 moves in the Y-axis direction.

  The control device 106 supplies a discharge control signal to the droplet discharge head 103. Further, a drive signal in the X-axis direction is supplied to the X-axis direction drive motor 108, and a drive signal in the Y-axis direction is supplied to the Y-axis direction drive motor 110, respectively. The control device 106 is electrically connected to the droplet discharge head 103, the X-axis direction drive motor 108, and the Y-axis direction drive motor 110, but the wiring is not shown. Further, the supply of the discharge control signal or the X-axis / Y-axis drive signal from the control device 106 is performed based on the raster data describing the dropping position of the functional liquid. This raster data is produced by the drawing production apparatus of FIG. 17, but this production function may be built in the inkjet apparatus 100 itself.

  The inkjet apparatus 100 discharges droplets of the functional liquid 61 onto the substrate 20 fixed on the stage 102 while relatively scanning the droplet discharge head 103 and the stage 102.

  A rotating mechanism that operates independently of the X-axis direction moving mechanism 104 may be provided between the droplet discharge head 103 and the X-axis direction moving mechanism 104. By operating the rotation mechanism to change the relative angle between the droplet discharge head 103 and the stage 102, the pitch between the droplet discharge nozzles can be adjusted. Further, a Z-axis direction moving mechanism that operates independently of the X-axis direction moving mechanism 104 may be provided between the droplet discharge head 103 and the X-axis direction moving mechanism 104. By moving the droplet discharge head 103 in the Z-axis direction, the distance between the substrate 20 and the nozzle surface can be arbitrarily adjusted. Further, a rotation mechanism that operates independently of the Y-axis direction moving mechanism 105 may be provided between the stage 102 and the Y-axis direction moving mechanism 105. By operating the rotation mechanism, it is possible to discharge droplets onto the substrate 20 in a state where the substrate 20 fixed on the stage 102 is rotated at an arbitrary angle.

[Laminated structure manufacturing equipment]
FIG. 19 is a schematic view illustrating the structure of the laminated structure manufacturing apparatus according to the present invention.
As shown in FIG. 19, the laminated structure manufacturing apparatus corresponds to the substrate transport mechanism for transporting the substrate 20 to each mechanism and the first step shown in FIGS. The wettability changing layer forming mechanism for forming the wettability changing layer 30 having the surface energy regions 50 and the high surface energy regions 41 and 42 having different surface energy regions, and the ink jet device 100 shown in FIG. In response to the second step shown in FIG. 5, an ink jet printing mechanism that selectively drops the functional liquid 61 onto a predetermined position on the surface of the wettability changing layer 30 that is the printing surface of the substrate 20, and a third step shown in FIG. And a mechanism for forming the conductive layer 71 by drying and solidifying the functional liquid 61 on the wettability changing layer 30.

As described above, according to the method for forming a functional film according to the present invention, from the diameter of the functional liquid at the time of flight, the landing position variation of the functional liquid, and the shape of the high surface energy area, only in the desired high surface energy area. Since the allowable drop range for contact with the functional liquid is estimated and the dropping position is determined based on this, a laminated structure in which a functional film having a predetermined pattern is stably formed in a desired region can be obtained.
Moreover, by using the laminated structure according to the present invention, an inexpensive and fine multilayer wiring board can be provided.
Further, by using the laminated structure according to the present invention, an inexpensive and fine active matrix substrate can be provided.
Further, by using the active matrix substrate according to the present invention, an inexpensive and high-performance image display device can be provided.
Moreover, the development period of an inkjet printing drawing is shortened by using the drawing manufacturing apparatus which concerns on this invention.
Moreover, by using the laminated structure manufacturing apparatus according to the present invention, an inexpensive and high-performance laminated structure can be provided.

Hereinafter, the present invention will be described more specifically with reference to examples.
Example 1
Example 1 is an example relating to a manufacturing method (method of forming a functional film) of the laminated structure 10A illustrated in FIG.
FIG. 20 is a diagram illustrating the method for manufacturing the laminated structure according to the first embodiment. 20A is a plan view, and FIG. 20B is a cross-sectional view taken along the line AA ′ in FIG.

  First, an NMP solution containing a wettability changing material was spin-coated on the glass substrate 20. As the wettability changing material, a polyimide material represented by the following structural formula (I) was used. Next, after pre-baking in an oven at 100 ° C., heat treatment was applied in an oven at 300 ° C. to form the wettability changing layer 30.

  Subsequently, a photomask having a plurality of linear opening patterns is manufactured, and ultraviolet light (ultra-high pressure mercury lamp) having a wavelength of 300 nm or less is exposed to a part on the wettability changing layer 30, so that the wettability changing layer 30 is exposed. A pattern composed of the first high surface energy region 41, the second high surface energy region 42, and the low surface energy region 50 was formed. The produced photomask is previously provided with nine types of opening patterns having different sizes, and the line width L of the first high surface energy region 41, the first high surface energy region 41, and the second high surface. Nine types of laminated structures having different combinations of the intervals S with the energy region 42 are produced.

  Subsequently, a functional liquid (having a diameter of about 25 μm at the time of flight and a landing position variation of ± 15 μm) was dropped on each pattern of combinations of the line width L and the spacing S shown in Table 1 below. In addition, the combination of the line width L and the space | interval S shown in following Table 1 includes both the case where the formula (1) is satisfied and the case where it is not satisfied. In addition, the combinations of the line width L and the spacing S shown in Table 1 below all satisfy Expression (2).

  Specifically, a functional liquid composed of hydrophilic ink containing Ag nanoparticles was selectively dropped only on the first high surface energy region 41 of the high surface energy part by an inkjet method. The dropping position is the center position 41C of the first high surface energy region 41 (line center of the first high surface energy region 41; X = 0). The surface tension of this functional liquid is about 30 mN / m and the viscosity is 10 mPa · s. The contact angle of the functional liquid measured by the droplet method with respect to the high surface energy part is about 5 °, and the contact angle with respect to the low surface energy part is It was about 30 °. By using a piezo-type inkjet head with 100 nozzles and adjusting the drive voltage, the average volume of the functional liquid ejected from the liquid droplet ejection nozzle is about 8 pL (the diameter during flight is about 25 μm). Went. At this time, the distance between the substrate and the droplet discharge nozzle is 0.5 mm, and the landing position variation of all 100 nozzles is ± 15 μm.

  Subsequently, after the functional liquid was dropped onto the first high surface energy region 41, the functional liquid was dried and solidified in an oven at 100 ° C. to form the conductive layer 71, thereby producing the laminated structure 10A.

Table 1 shows the results of evaluation of how the conductive layer 71 is formed by observing the manufactured laminated structure 10A with a metal microscope.
As shown in Table 1, when both formula (1) and formula (2) are satisfied (when the numerical value in the column of formula (1) in Table 1 is positive), the first high surface energy region In the case where the conductive layer 71 is formed only on 41 and the expression (2) is satisfied but the expression (1) is not satisfied (when the numerical value in the column of the expression (1) in Table 1 is negative), the second A conductive layer 71 was also formed in the high surface energy region 42. That is, it was confirmed that the conductive layer 71 can be stably formed only in the first high surface energy region 41 by satisfying both of the expressions (1) and (2). In Table 1, “◯” means that the conductive layer 71 is formed only in the first high surface energy region 41, and “×” indicates that the conductive layer 71 is also formed in the second high surface energy region 42. It means that it was formed.

(Example 2)
Example 2 is an example related to the manufacturing method (functional film forming method) of the laminated structure 10A shown in FIG.
In Example 2, a photomask having a linear opening pattern different from the photomask used in Example 1 is used, and the dropping center position is set to the center position 41C (first position of the first high surface energy region 41). The laminated structure 10A is manufactured by the same method as in Example 1 except that the line center of the region 41 of 1 is changed from X = 0).

  With respect to each pattern of combinations of line width L and interval S shown in Table 2 below, a functional liquid (a diameter of about 25 μm at the time of flight, landing position variation ± 15 μm) was dropped to produce a laminated structure 10A. Table 2 shows the results of evaluating the produced laminated structure 10A with a metal microscope and evaluating how the conductive layer 71 is formed. All combinations of the line width L and the spacing S shown in Table 2 below satisfy Expression (1). Further, the combinations of the line width L and the spacing S shown in Table 2 below include both cases where the expression (2) is satisfied and cases where the expression (2) is not satisfied.

  As shown in Table 2, when both formula (1) and formula (2) are satisfied (when the value in the column of formula (2) in Table 2 is positive), the first high surface energy region In the case where the conductive layer 71 is formed only on 41 and the formula (1) is satisfied but the formula (2) is not satisfied (when the numerical value in the column of the formula (2) in Table 2 is negative), the second A conductive layer 71 was also formed in the high surface energy region 42. That is, it was confirmed that the conductive layer 71 can be stably formed only in the first high surface energy region 41 by satisfying both of the expressions (1) and (2). In Table 2, “◯” means that the conductive layer 71 is formed only in the first high surface energy region 41, and “×” indicates that the conductive layer 71 is also formed in the second high surface energy region 42. It means that it was formed.

(Example 3)
Example 3 is an example relating to a method of manufacturing the active matrix substrate 120A shown in FIG. 21A is an active matrix substrate, FIG. 21B is a plan view of the pixel circuit, and FIG. 21C is a cross-sectional view taken along the line AA ′ in FIG. 21B. .

  The active matrix substrate 120A is obtained by replacing the transistor 270 in the pixel circuit 130 of the active matrix substrate 120 illustrated in FIG. 12 with the transistor 270A. The transistor 270 </ b> A is obtained by removing the wettability changing layer 31 from the transistor 270. That is, in the transistor 270A, the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 are directly formed on the substrate 20.

  FIG. 21B shows a pixel circuit of four pixels on the active matrix substrate 120A. Actually, a total of 40000 pixels, which are 200 pixels high and 200 pixels wide, are arranged in a matrix. .

The dimensions of each part are as follows.
-The pixel size corresponds to 160 PPI and is about 159 μm.
-Diameter D when the functional fluid is flying = approximately 25 μm, landing position variation α = ± 15 μm.
The line width L1 of the source electrode 230 is 40 μm.
The horizontal width L2 of the drain electrode 240 is 65 μm and the vertical width L3 is 89 μm.
Channel length L4 = 5 μm expressed as the distance between the source electrode 230 and the drain electrode 240.
The distance S3 between the source electrode 230 and the drain electrode 240 is 25 μm.
The spacing S4 between adjacent drain electrodes 240 is 94 μm.

  Hereinafter, the manufacturing method of the active matrix substrate 120A will be described, but since the polyimide material, the functional liquid, and the dropping conditions of the functional liquid are set to be the same as those in the first embodiment, the description thereof is omitted.

  First, a gate electrode 210, a storage capacitor electrode 250, a gate signal line 280, and a common signal line 300 were formed on a substrate 20 made of a glass substrate by using a photolithography method. Next, an NMP solution containing a polyimide material is applied onto the substrate 20 by a spin coating method, pre-baked in an oven at 100 ° C., and then subjected to heat treatment in an oven at 300 ° C. to form the wettability changing layer 32. Formed. Thereafter, using a photomask having a predetermined pattern, ultraviolet light is exposed to a part on the wettability changing layer 32, and the pattern composed of the high surface energy part 221 and the low surface energy part 222 on the wettability changing layer 32. Formed.

  Next, the functional liquid was selectively dropped onto the high surface energy portion 221 and heat-treated to form the source electrode 230, the drain electrode 240, and the source signal line 290.

  Next, a solution obtained by dissolving an organic semiconductor polymer synthesized by a scheme as shown in the following chemical formula (II) in toluene was applied by an inkjet method to form a semiconductor layer 260, and an active matrix substrate 120A was manufactured.

FIG. 22 shows an example of the dropping position of the functional liquid when the source electrode 230, the drain electrode 240, and the source signal line 290 are formed in the third embodiment.
Here, according to the method for forming a functional film of the present invention described above, the drop allowable range for the high surface energy region for forming the source electrode 230 and the drain electrode 240 is calculated in advance, and the drop position is determined so as to be within the drop allowable range. is doing. Therefore, as shown in FIG. 22, the landing ranges 430 and 440 calculated from the respective dropping positions do not overlap each other, and the droplets dropped within the landing range surely touch the desired high surface energy region. .

  More specifically, the functional liquid dropping center position 430C for forming the source electrode 230 is set to a position on the center line 230C of the source electrode 230, and when forming the source electrode 230, one drop is placed every 159 μm. Yes. Further, the functional liquid dropping center position 440C for forming the drain electrode 240 is set as the gravity center position of the drain electrode 240, and one drop is formed for each drain electrode when the drain electrode 240 is formed. Thus, by determining the dropping position of the functional liquid, it was possible to stably form a fine electrode having a line width L1 = 40 μm and a channel length L4 = 5 μm.

Example 4
In Example 4, a display device was manufactured by attaching an electrophoretic element to the active matrix substrate 120A manufactured in Example 3. The electrophoretic element is a layer composed of microcapsules and a PVA binder, in which microcapsules containing isopar colored with titanium oxide particles oil blue are mixed with a PVA aqueous solution and coated on a polycarbonate substrate on which a transparent electrode made of ITO is formed. Formed. When this substrate and the active matrix substrate were laminated to form a display device and operated, an image with high contrast could be displayed. In addition, by using a high-definition active matrix substrate with 160 PPI, 10 pt characters could be clearly displayed.

  The preferred embodiments and examples have been described in detail above, but the present invention is not limited to the above-described embodiments and examples, and the above-described embodiments are not deviated from the scope described in the claims. Various modifications and substitutions can be made to the embodiments.

10, 10A Laminated structure 20 Substrate 30, 31, 32 Wetting property change layer 41, 43 First high surface energy region (first region of high surface energy part)
41C, 43C Center position of first high surface energy region 42, 44 Second high surface energy region (second region of high surface energy part)
43A, 44A, 61F, 61G, 61H, 61I, 231A, 241A Functional liquid dropping allowable range 43P, 44P, 61C, 61D, 231C, 241C, 430C, 440C Functional liquid dropping central position (dropping position)
43S, 44S High surface energy region 50, 50S, 202, 222 Low surface energy region 61, 62 Functional liquid 61E, 61E ', 400, 430, 440 Functional liquid landing range 62C Virtual drop position 62E Virtual landing range 71 Conductive layer 91 Photomask 92 Ultraviolet ray 93 Droplet discharge nozzle 100 Inkjet device 101 Surface plate 102 Stage 103 Droplet discharge head 104 X-axis direction moving mechanism 105 Y-axis direction moving mechanism 106 Controller 107 X-axis direction drive shaft 108 X-axis direction drive motor 109 Y-axis direction drive shaft 110 Y-axis direction drive motor 120, 120A Active matrix substrate 130, 130A, 131 Pixel circuit 140 Wiring 150 Electrode PAD
201, 221 High surface energy portion 210 Gate electrode 220 Gate insulating layer 230 Source electrode 230C Center line 231 High surface energy region corresponding to source electrode formation region 240 Drain electrode 241 High surface energy region corresponding to source electrode formation region 250 Retention capacity Electrode 260 Semiconductor layer 270, 270A Transistor 280 Gate signal line 290 Source signal line 300 Common signal line α Variation in landing position of functional liquid D Diameter of functional liquid in flight L Line width of first high surface energy region L1 Source electrode Line width L2 Horizontal width of drain electrode L3 Vertical width of drain electrode L4 Channel length S Spacing between first high surface energy region and second high surface energy region S3 Spacing between source electrode and drain electrode S4 Spacing between adjacent drain electrodes X First high table Distance dropping the center position of the center position and the functional fluid of energy regions

JP-A-2005-310962 JP 2005-12181 A

Claims (16)

A functional film forming method for forming a functional film of a predetermined pattern on a plurality of high surface energy regions that are not connected to each other across a low surface energy region,
A first step of previously forming a low surface energy region and a plurality of adjacent high surface energy regions across the low surface energy region on the printing surface;
A second step of selectively supplying a functional liquid to the plurality of high surface energy regions formed on the printing surface using an inkjet method;
A third step of drying and solidifying the functional liquid supplied to the plurality of high surface energy regions to form a functional film having a predetermined pattern;
In the second step, the first high surface energy is separated from the first high surface energy region and the low surface energy region to be dropped by the functional liquid selected from the plurality of high surface energy regions. When the functional liquid is supplied to the first high surface energy region based on the shape of one or a plurality of second high surface energy regions adjacent to the region and the landing range of the functional liquid, A first procedure for determining a drop allowable range for touching only the first high surface energy region without touching the one or more second high surface energy regions; and then any position within the drop allowable range And a second procedure for determining the dropping position of the functional liquid with respect to the first high surface energy region, and performing the first procedure and the second procedure for each of the plurality of high surface energy regions Method of forming a functional film and determining the dropping position of each of the functional fluid Te.   2. The method for forming a functional film according to claim 1, wherein a center position in a predetermined direction of the first high surface energy region is determined as a dropping position of the functional liquid within the allowable dropping range. .   The center position in a direction adjacent to the second high surface energy region in the first high surface energy region within the dripping allowable range is determined as a dropping position of the functional liquid. 3. A method for forming a functional film according to 2.   A center position in a direction perpendicular to a direction adjacent to the second high surface energy region in the first high surface energy region within the allowable drop range is determined as a dropping position of the functional liquid. The method for forming a functional film according to claim 2, wherein:   In the second step, the dropping of the functional liquid is performed so that the landing ranges calculated from the dropping positions of the functional liquids in the adjacent high surface energy areas among the plurality of high surface energy areas do not overlap each other. The method for forming a functional film according to claim 1, wherein the position is determined.   In the second step, the printing surface is divided into a plurality of sections, and the first and second procedures are executed for each of the plurality of high surface energy regions for each section, and the dropping positions of the respective functional liquids The method for forming a functional film according to claim 1, wherein the functional film is determined.   The first step expresses a first procedure for forming a wettability changing layer including a material whose surface energy is changed by applying energy on the printed surface, and a low surface energy region and a high surface energy region. A second step of forming a high surface energy region by selectively applying energy to a part of the printing surface on the basis of a drawing in which two different regions are illustrated. The method for forming a functional film according to claim 1.   The method for forming a functional film according to claim 7, wherein the energy is applied using light.   A photomask is manufactured based on a drawing in which two different regions representing a low surface energy region and a high surface energy region are partitioned, and a high surface energy region is formed by light irradiation through the photomask. The method for forming a functional film according to claim 8. A wettability changing layer that includes a material whose surface energy changes by application of energy and has different surface energy regions consisting of a low surface energy region and a high surface energy region; and a high surface energy region of the wettability changing layer. A laminated structure comprising a conductive layer formed,
A laminated structure, wherein the conductive layer is formed using the method for forming a functional film according to claim 1. In a multilayer wiring board having at least a substrate, an insulating layer, and an electrode layer,
A multilayer structure comprising the multilayer structure according to claim 10, wherein the conductive layer formed on the high surface energy region of the multilayer structure is used as at least part of the electrode layer. Wiring board. A transistor including a gate electrode, a gate insulating layer, a source electrode, a drain electrode, a storage capacitor electrode, and a semiconductor layer; a wiring connected to any one of the gate electrode, the source electrode, the drain electrode, and the storage capacitor electrode; and a connection to the wiring In an active matrix substrate including an electrode PAD to be
The stacked structure according to claim 10, wherein the conductive layer formed on the high surface energy region of the stacked structure includes the gate electrode, the source electrode, the drain electrode, the storage capacitor electrode, An active matrix substrate, which is used as at least one of the wiring and the electrode PAD.   An image display device comprising: an image display element; and the active matrix substrate according to claim 12. A drawing manufacturing apparatus for manufacturing an inkjet printing drawing that describes a dropping position of a functional liquid in an inkjet device,
A mechanism for creating a drawing represented by vector data in which two different regions representing a low surface energy region and a plurality of high surface energy regions are partitioned,
The shapes of the plurality of high surface energy regions are extracted from the drawing, and the first high surface energy region and the low surface energy region to be dropped from the functional liquid selected from the plurality of high surface energy regions are separated from each other. Based on the shape of one or a plurality of second high surface energy regions adjacent to the first high surface energy region and the landing range of the functional liquid, it is selective only to the first high surface energy region. A mechanism for automatic calculation of the permissible dripping range for the functional liquid to touch
A mechanism for determining and illustrating an arbitrary position within the permissible drop range as a drop position of the functional liquid with respect to the first high surface energy region; and
A mechanism for converting and outputting vector data describing the dropping position into raster data;
An apparatus for producing a drawing, comprising: An inkjet apparatus comprising a stage for supporting a substrate, a droplet discharge head, a movement / rotation mechanism connected to the stage, a movement / rotation mechanism connected to the droplet discharge head, and a control device,
A function liquid ejection control signal and a stage drive signal are supplied from the control device based on raster data describing the dropping position of the functional liquid output from the drawing manufacturing apparatus according to claim 14. Inkjet device characterized. A substrate transfer mechanism;
A mechanism for forming a wettability changing layer composed of regions having different surface energies composed of a low surface energy region and a high surface energy region on the printing surface;
An ink jet printing mechanism comprising the ink jet device according to claim 15, wherein a functional liquid is selectively dropped at a predetermined position on the surface of the wettability changing layer;
A mechanism for drying and solidifying the functional liquid;
A laminated structure manufacturing apparatus comprising: