JP2011228476A - Laminated structure and its manufacturing method, multilayer wiring board, active matrix substrate and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated structure allowing high-throughput manufacturing of a laminated structure having a fine conductive layer, even in the case of using an ink jet method, as well as to provide a laminated structure, a multilayer wiring board, an active matrix substrate, and an image display device.SOLUTION: High surface energy parts 40 of the same pattern are arranged periodically at fixed intervals on a substrate, and an interval between discharge nozzle 1 and 2, along a main scanning direction ( x-axis direction ) of an inkjet device, is then made to coincide with the pattern interval of the high surface energy parts 40 so that functional liquid droplets d are dropped selectively to form a conductive layer which is to be a source electrodes 230, source electrode lines 290, and drain electrodes 240.

Description

  The present invention relates to a laminated structure, a method for manufacturing the same, a multilayer wiring board, an active matrix substrate, and an image display device.

  As a method for forming an electrode, an insulator, a semiconductor, or the like in an electric circuit or the like, there is an ink jet method in which a functional liquid containing these functional materials is supplied to a predetermined position on a substrate. The ink-jet method has advantages in that the number of steps is small and the material efficiency is high, without requiring expensive equipment and facilities, compared to the photolithography and etching methods conventionally used in the manufacture of semiconductor devices. is doing. However, on the other hand, it is difficult to control droplets of 1 pL or less, and there is a lower limit on the size of the droplets. When a plurality of nozzles are used, the landing positions of the functional liquid vary. In general, it has been difficult to form a fine pattern having a line width of 50 μm or less because of wet spreading.

  On the other hand, Patent Document 1 discloses a method for manufacturing a laminated structure using a wettability changing layer in which surface energy changes due to energy application. By applying energy to the wettability changing layer and forming a high surface energy part that is hydrophilic to the functional liquid and a low surface energy part that is hydrophobic to the functional liquid, the high surface energy part is selectively used. When a functional liquid containing a conductive material is dropped, a laminated structure including a fine conductive layer can be formed.

  However, since the manufacturing method described in Patent Document 1 can control the movement of the functional liquid by controlling the surface energy of the wettability changing layer, a finer pattern can be formed compared to the conventional inkjet method. However, since the inkjet method in which throughput is a problem is used, there is a problem that the manufacturing cost of the laminated structure increases as a result.

  The present invention has been made in view of the above problems in the prior art, and a manufacturing method for manufacturing a laminated structure having a fine conductive layer with a high throughput even when an inkjet method is used, and the manufacturing method. It is an object of the present invention to provide a laminated structure, a multilayer wiring board, an active matrix substrate, and an image display device that are manufactured by using the above.

The present invention provided to solve the above problems is as follows.
[1] A wettability changing material including a wettability changing material whose surface energy is changed by applying energy, and having at least two parts having different surface energies, and two parts having different surface energies in the wettability changing layer And a conductive layer having a predetermined pattern formed on a high surface energy portion having a high surface energy, and a wettability changing layer containing a wettability changing material (wetting change layer 30). (FIG. 1), energy is imparted to a part of the wettability changing layer, and a low surface energy part (low surface energy part 50) having a low surface energy and the surface are applied to the wettability changing layer. A second step of forming a high surface energy part (high surface energy part 40) with high energy (FIG. 2), a plurality of nozzles (droplet discharge nozzles 93 in one direction); ) Are arranged at regular nozzle intervals, the stage (stage 102) for supporting the substrate (substrate 20) after the second step, and the inkjet head Using an inkjet apparatus (inkjet apparatus 100, FIG. 5) including a moving mechanism (Y-axis direction moving mechanism 105) that relatively moves the stage, the functional liquid containing the conductive material (functional liquid 61) is A third step of selectively dropping onto the surface energy part (FIG. 3), and drying the functional liquid dropped onto the high surface energy part to contain the conductive material on the high surface energy part ( A conductive layer 71) (FIG. 4), and the high surface energy portion of the same pattern is surrounded at regular intervals on the substrate after the second step. In the third step, the interval between the plurality of nozzles in a predetermined direction of the ink jet apparatus is made to coincide with the pattern interval of the high surface energy portion. Method (FIGS. 10, 11, and 20).
[2] The stacked structure according to [1], wherein, in the third step, the interval between the plurality of nozzles in a predetermined direction of the inkjet apparatus is adjusted by rotating the inkjet head. Manufacturing method (FIG. 11).
[3] In the third step, the relative movement direction of the stage in the ink jet apparatus is made to coincide with the longitudinal direction as the pattern shape of the high surface energy portion. ] The manufacturing method of the laminated structure as described in FIG.
[4] A laminated structure produced using the method for producing a laminated structure according to any one of [1] to [3].
[5] A multilayer wiring board having at least a substrate, an insulating layer, and an electrode layer, having the multilayer structure according to [4], wherein the conductive layer constitutes at least a part of the electrode layer. A multilayer wiring board characterized by that.
[6] Gate electrode (gate electrode 210), gate insulating layer (gate insulating layer 220), source electrode (source electrode 230), drain electrode (drain electrode 240), storage capacitor electrode (storage capacitor electrode 250), and semiconductor layer ( A transistor (transistor 270) including a semiconductor layer 260), a gate signal line (gate signal line 280) extending in one direction from the gate electrode, and an extending direction of the gate signal line from the source electrode The source signal line (source signal line 290) extending in a substantially orthogonal direction and the storage capacitor electrode are extended substantially in parallel to the extending direction of the gate signal line or the source signal line. In an active matrix substrate including a common signal line (common signal line 300), the laminate structure according to [4] is provided, and the conductive layer includes the conductive layer, An active matrix substrate comprising at least one of a gate electrode, the source electrode, the drain electrode, the storage capacitor electrode, the gate signal line, the source signal line, and the common signal line ( Active matrix substrate 400, FIG. 14).
[7] An image display device (image display device 500, FIG. 5) comprising an image display device (image display device 550) and the active matrix substrate (active matrix substrate 400) described in [6]. 17).

According to the manufacturing method of the laminated structure of the present invention, the high surface energy portions of the same pattern are periodically arranged at regular intervals on the substrate after the second step. In the third step, Since the interval between the plurality of nozzles in the predetermined direction of the ink jet device is made to coincide with the pattern interval of the high surface energy portion, the number of main scans can be reduced, and as a result, a conductive layer can be formed with higher throughput. In addition, even when the pattern interval of the high surface energy part (arrangement interval of the laminated structure) is narrower than the nozzle interval, by using an inkjet head having a rotation mechanism, the intervals (nozzles) of a plurality of nozzles in a predetermined direction of the inkjet apparatus can be obtained. The interval projected in the main scanning direction of the inkjet head) can be made to coincide with the pattern interval of the high surface energy portion, so that a laminated structure having an arbitrary arrangement interval can be formed with high throughput. Furthermore, in the third step, the relative movement direction of the stage in the ink jet apparatus is matched with the longitudinal direction as the pattern shape of the high surface energy portion, so that the conductive layer is formed on the high surface energy portion. Since the functional liquid dropped on the liquid crystal can be dropped at shorter time intervals, the influence of solidification due to drying of the dropped functional liquid can be reduced, and as a result, a conductive layer with high film thickness uniformity can be formed.
Moreover, according to the laminated structure of the present invention, a fine laminated structure can be provided at low cost by using the method for producing a laminated structure of the present invention.
Further, according to the multilayer wiring board of the present invention, since the multilayer structure of the present invention is used, a fine multilayer wiring board can be provided at low cost.
Further, according to the active matrix substrate of the present invention, since the laminated structure of the present invention is used, a fine active matrix substrate can be provided at low cost.
Further, according to the image forming apparatus of the present invention, since the active matrix substrate of the present invention is used, an inexpensive and high-performance image display apparatus can be provided.

It is explanatory drawing of the 1st process in the manufacturing method of the laminated structure which concerns on this invention. It is explanatory drawing of the 2nd process in the manufacturing method of the laminated structure which concerns on this invention. It is explanatory drawing of the 3rd process in the manufacturing method of the laminated structure which concerns on this invention. It is explanatory drawing of the 4th process in the manufacturing method of the laminated structure which concerns on this invention. It is the schematic which shows the structural example of the inkjet apparatus used with the manufacturing method of the laminated structure which concerns on this invention. It is the schematic which shows the printing procedure example (1) of the inkjet apparatus shown in FIG. It is the schematic which shows the printing procedure example (2) of the inkjet apparatus shown in FIG. It is the schematic which shows the printing procedure example (3) of the inkjet apparatus shown in FIG. It is the schematic which shows the printing procedure example (4) of the inkjet apparatus shown in FIG. It is the schematic which shows the method (1) for reducing the X-axis direction printing resolution in the manufacturing method of the laminated structure which concerns on this invention. It is the schematic which shows the method (2) for reducing the X-axis direction printing resolution in the manufacturing method of the laminated structure which concerns on this invention. It is the schematic which shows the manufacturing procedure (1) of the active matrix substrate which concerns on this invention. It is the schematic which shows the manufacturing procedure (2) of the active matrix substrate which concerns on this invention. It is the schematic which shows the manufacturing procedure (3) of the active matrix substrate which concerns on this invention. FIG. 13 is a schematic diagram illustrating a relationship between a functional liquid dropping position and a nozzle position when forming a stacked structure including a gate electrode, a storage capacitor electrode, a gate signal line, and a common signal line in the manufacturing procedure of FIG. 12. It is the schematic which shows the relationship between the dripping position of a functional liquid, and a nozzle position at the time of forming the laminated structure which has a source electrode, a drain electrode, and a source signal line in the manufacture procedure of FIG. It is sectional drawing which shows the structure of the image display apparatus which concerns on this invention. 2 is a schematic diagram illustrating a configuration of a laminated structure of Test Example 1. FIG. 1 is a schematic diagram illustrating a configuration of an active matrix substrate of Example 1. FIG. FIG. 3 is a schematic diagram illustrating a relationship between a dripping position of a functional liquid and a nozzle position with respect to a high surface energy portion when forming a source electrode, a drain electrode, and a source signal line in Example 1.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
In the method for manufacturing a laminated structure according to the present invention, the wettability changing layer 30 is formed by applying energy such as ultraviolet rays to the first step (FIG. 1) for forming the wettability changing layer 30 and a part of the wettability changing layer 30. The second step (FIG. 2) for forming the low surface energy part 50 and the high surface energy part 40 in 30 and the first functional liquid 61 containing a conductive material are selectively applied onto the high surface energy part 40. And a fourth step (FIG. 4) in which the functional liquid 61 is dried to form the conductive layer 71.

  In the first step, a wettability changing layer 30 is formed by applying a solution containing the wettability changing material onto the substrate 20 by spin coating or the like and drying it.

  Here, a substrate such as a glass substrate, a silicon substrate, a stainless steel substrate, or a film substrate can be used as the substrate 20. As the film substrate, a polyimide (PI) substrate, a polyethersulfone (PES) substrate, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or the like can be used.

  The wettability changing layer 30 includes a wettability changing material whose surface energy (critical surface tension) is changed by application of energy such as heat, electron beam, ultraviolet light, and plasma. As this wettability changing material, a polymer material having a hydrophobic group in the side chain can be used. As the polymer material, specifically, a material in which a side chain having a hydrophobic group is bonded to a main chain having a skeleton such as polyimide or (meth) acrylate directly or via a bonding group is used. it can. As the hydrophobic group, a fluoroalkyl group containing a fluorine atom or a hydrocarbon group containing no fluorine element can be used.

  When a polymer material having a structure having a hydrophobic group in the side chain is used as the wettability changing material, the wettability changing layer 30 including the low surface energy portion 50 is formed on the substrate 20.

  In the second step, a part of the wettability changing layer 30 is exposed to ultraviolet rays 92 using a photomask 91. The wettability changing layer 30 in the portion exposed to the ultraviolet rays 92 is changed from a low surface energy (hydrophobic) to a high surface energy (hydrophilicity) by breaking the bond of the hydrophobic group. For this reason, the pattern which consists of the high surface energy part 40 and the low surface energy part 50 can be formed on the wettability change layer 30.

  In the third step, the functional liquid 61 containing a conductive material is selectively placed on the high surface energy portion 40 from a droplet discharge nozzle (also referred to as discharge nozzle or nozzle) 93. As the means for arranging the functional liquid 61, an ink jet method having a feature that fine droplets can be accurately dropped one by one is suitable.

  The functional liquid 61 containing a conductive material includes Au, Ag, Cu, Pt, Al, Ni, Pd, Pb, In, Sn, Zn, TI, and alloys thereof, indium oxide, zinc oxide, tin oxide, gallium oxide, and the like. Ink in which fine metal particles composed of transparent conductors are dispersed in organic solvent or water, ink in which metal complex is dissolved in organic solvent or water, doped PANI (polyaniline) or PEDOT (polyethylenedioxythiophene) Examples thereof include an aqueous solution of a conductive polymer doped with PSS (polyethylene sulfonic acid). In order to use in the ink jet method, the surface tension of the functional liquid 61 is desirably 20 mN / m or more and 50 mN / m or less, and the viscosity is desirably 2 mPa · s or more and 50 mPa · s or less.

FIG. 5 is a schematic view showing an embodiment of the structure of the ink jet apparatus.
The inkjet apparatus 100 is connected to a surface plate 101, a stage 102, a droplet discharge head (also referred to as an inkjet head) 103, an X-axis direction moving mechanism 104 connected to the droplet discharge head 103, and the stage 102. A Y-axis direction moving mechanism 105 and a control device 106 are provided.

  The stage 102 is provided for the purpose of supporting the substrate 20, and includes a fixing mechanism such as an adsorption mechanism (not shown) that adsorbs the substrate 20. Further, a heat treatment mechanism for drying the functional liquid 61 dropped on the substrate 20 may be provided.

  The droplet discharge head 103 is an ink jet head including a plurality of droplet discharge nozzles 93, and the plurality of droplet discharge nozzles 93 are arranged on the lower surface of the droplet discharge head 103 at regular intervals along the X-axis direction. Yes. The functional liquid 61 is discharged from the droplet discharge nozzle 93 to the substrate 20 supported on the stage 102. For example, a piezo method can be used as a droplet discharge mechanism of the droplet discharge head 103. In this case, a droplet is discharged by applying a voltage to a piezo element in the droplet discharge head 103.

  The X-axis direction moving mechanism 104 includes an X-axis direction drive shaft 107 and an X-axis direction drive motor 108. The X-axis direction drive motor 108 is a stepping motor or the like. When a drive signal in the X-axis direction is supplied from the control device 106, the X-axis direction drive shaft 107 is operated and the droplet discharge head 103 moves in the X-axis direction. .

  The Y-axis direction moving mechanism 105 includes a Y-axis direction drive shaft 109 and a Y-axis direction drive motor 110. When a drive signal in the Y-axis direction is supplied from the control device 106, the stage 102 moves in the Y-axis direction.

  The control device 106 supplies a discharge control signal to the droplet discharge head 103. Further, a drive signal in the X-axis direction is supplied to the X-axis direction drive motor 108, and a drive signal in the Y-axis direction is supplied to the Y-axis direction drive motor 110, respectively. The control device 106 is connected to the droplet discharge head 103, the X-axis direction drive motor 108, and the Y-axis direction drive motor 110, but the wiring thereof is not shown.

  The inkjet apparatus 100 discharges droplets of the functional liquid 61 onto the substrate 20 fixed on the stage 102 while relatively scanning the droplet discharge head 103 and the stage 102. A rotation mechanism that operates independently of the X-axis direction moving mechanism 104 may be provided between the droplet discharge head 103 and the X-axis direction moving mechanism 104. By operating the rotation mechanism to change the relative angle between the droplet discharge head 103 and the stage 102, the pitch between the discharge nozzles can be adjusted. Further, a Z-axis direction moving mechanism that operates independently of the X-axis direction moving mechanism 104 may be provided between the droplet discharge head 103 and the X-axis direction moving mechanism 104. By moving the droplet discharge head 103 in the Z-axis direction, the distance between the substrate 20 and the nozzle surface can be arbitrarily adjusted. A rotation mechanism that operates independently of the Y-axis direction moving mechanism 105 may be provided between the stage 102 and the Y-axis direction moving mechanism 105. By operating the rotation mechanism, it is possible to discharge droplets onto the substrate 20 in a state where the substrate 20 fixed on the stage 102 is rotated at an arbitrary angle.

FIG. 6 is a diagram showing an example of a printing procedure of the ink jet apparatus shown in FIG.
(S11) First, in order to control the droplet discharge head 103 of the ink jet apparatus 100 by the control apparatus 106, the raster data for printing illustrated in a grid shape in the drawing is created. Here, as an example of data, monochrome binary data corresponding to ejection and non-ejection is illustrated, but the present invention is not necessarily limited to this.

(S12) Next, the control device 106 determines the print resolution and reads the print data, and determines the correspondence with each nozzle of the droplet discharge head 103. The print resolution means the size of one grid of print data. Here, both the X-axis direction print resolution and the Y-axis direction print resolution are set to 1/12 of the nozzle interval. In this case, for example, the X-axis coordinate range assigned to each nozzle is determined such that the nozzle 1 has X coordinates 1 to 12 on the print data, the nozzle 2 has 13 to 24, the nozzle 3 has 25 to 36, and so on. Is done.

(S13) Next, printing is performed using the inkjet apparatus 100.
As shown in FIG. 7, first, the Y-axis direction moving mechanism 105 is driven with the X-axis direction moving mechanism 104 fixed to move the droplet discharge head 103 relatively, and at the same time, the black and white binary values on the print data are changed. In response to this, the droplet discharge head 103 is controlled so as to discharge or not discharge, and the droplet is dropped at a position indicated by black. The scanning in the Y-axis direction at this time is called sub-scanning. In this sub-scanning, printing of the X-axis coordinate range corresponding to the X-axis coordinates 1, 13, 25,.

(S14) Next, as shown in FIG. 8, the X-axis direction moving mechanism 104 is controlled to move the droplet discharge head 103 in the X-axis direction relatively by an amount corresponding to the printing resolution. Note that scanning in the X-axis direction at this time is referred to as main scanning.

(S15) Next, as in step S13, the X-axis direction moving mechanism 104 is fixed, and while the Y-axis direction moving mechanism 105 is driven, the droplet discharge head 103 is controlled in accordance with the monochrome value on the print data. . In this sub-scan, the X coordinate range corresponding to 2, 14, 26,... Of the X axis coordinate corresponding to the nozzle position is printed.

  Thereafter, in the same procedure as described above, the main scanning in the X-axis direction and the sub-scanning in the Y-axis direction are repeated until the gap between the nozzles is filled, and printing is finally completed in the state shown in FIG. .

  In this printing method, the moving speeds of the X-axis direction moving mechanism 104 and the Y-axis direction moving mechanism 105 can be arbitrarily determined within a range in which the positioning accuracy of the drive motor is guaranteed, and the X-axis direction printing resolution can be determined. The Y-axis direction print resolution can also be arbitrarily determined.

  Actually, the frequency performance required for the nozzle varies depending on the movement speed in the Y-axis direction and the interval between the discharge positions (interval between the black grid and the black grid). The faster the Y-axis direction movement speed, the more the Y-axis direction discharge. As the position interval is narrower, ejection at a higher frequency is required. Therefore, if the upper discharge frequency of the droplet discharge head 103 is defined, the Y-axis direction moving speed can be increased as the Y-axis direction discharge position interval is wider, and the throughput is improved. In order to widen the discharge position interval in the Y-axis direction, it is effective to increase the volume of the functional liquid as much as possible and to form the conductive layer with a smaller number of functional liquid droplets. It is desirable to adjust the volume of the functional liquid according to the contact angle of the functional liquid with respect to the surface energy part and the high surface energy part and the width of the high surface energy part.

  As described above, the main factor that defines the throughput of the ink jet method is the number of main scans by the X-axis direction moving function. In the example shown in FIG. 6, since the X-axis direction printing resolution is 1/12 of the nozzle interval, 12 main scans are required. Therefore, for high throughput, it is important to set conditions that reduce the X-axis direction printing resolution.

FIG. 10 shows a method (1) for reducing the print resolution in the X-axis direction.
Here, a case is shown in which a laminated structure in which conductive layers having a linear pattern extending in the Y-axis direction are periodically arranged at regular intervals is manufactured, and the nozzle interval of the droplet discharge head 103 is set to a linear shape. It is made to correspond to the arrangement | sequence space | interval of the high surface energy part 40 (area | region enclosed with the dotted line in the figure). In this example, the main scanning direction of the droplet discharge head 103 and the nozzle arrangement direction are the same. In this case, since the nozzle interval and the arrangement interval of the high surface energy portions 40 coincide with each other, the functional liquid can be dropped onto all the high surface energy portions in one sub-scan.

FIG. 11 shows a method (2) for reducing the print resolution in the X-axis direction.
In this case, a stacked structure in which conductive layers having a linear pattern whose longitudinal direction is the Y-axis direction is periodically formed at regular intervals, and a high surface of the linear pattern whose longitudinal direction is the Y-axis direction is manufactured. An example in which the pattern interval of the energy unit 40 (region surrounded by a dotted line in the drawing) is narrower than the nozzle interval of the droplet discharge head 103 is shown. In this case, it is preferable to adjust the nozzle interval in a predetermined direction (X-axis direction, main scanning direction) of the inkjet apparatus 100 by rotating the droplet discharge head 103. Thereby, the interval (nozzle interval in a predetermined direction (X-axis direction, main scanning direction) of the ink jet apparatus 100) projected from the nozzle interval in the main scanning direction of the droplet discharge head 103 is changed to the pattern interval ( The arrangement interval of the laminated structures can be matched, and the functional liquid can be dripped onto all the high surface energy portions 40 in one sub-scan.

  In FIG. 10, the pattern shape of the high surface energy portion 40 is a linear shape. However, since the functional liquid is dropped on the high surface energy portion in one sub-scan, the function to the high surface energy portion 40 is performed. Since the dropping time interval of the liquid can be shortened and the influence of solidification due to drying of the dropped functional liquid can be reduced, a conductive layer with high film thickness uniformity can be formed as a result.

[Method for manufacturing active matrix substrate]
Next, the manufacturing method of the active matrix substrate of the present invention will be described.
As shown in FIG. 14, the active matrix substrate 400 of the present invention includes a transistor 270 including a gate electrode 210, a gate insulating layer 220, a source electrode 230, a drain electrode 240, a storage capacitor electrode 250, and a semiconductor layer 260, and a gate electrode 210. From the gate signal line 280 extending in one direction from the source electrode 230 and the source signal 230 to the source signal line 290 extending in a direction substantially orthogonal to the extending direction of the gate signal line 280 and from the storage capacitor electrode 250 And the common signal line 300 extending substantially parallel to the extending direction of the gate signal line 280 or the source signal line 290, and the method for manufacturing the laminated structure of the present invention described above as a characteristic configuration thereof The conductive layer 71 of the stacked structure includes a gate electrode 210, a source electrode 230, a drain structure. Down electrode 240, storage capacitor electrodes 250, the gate signal line 280, a source signal line 290, the common signal line 300, constitutes any one of at least To.
Further, the active matrix substrate 400 of the present invention has a plurality of transistors 270 arranged on a substrate 20 in a two-dimensional array.

  Further, the active matrix substrate 400 shown in FIG. 14 includes at least a substrate (substrate 20), an insulating layer (wetting change layers 31 and 32), an electrode layer (a gate electrode 210, a source electrode 230, a drain electrode 240, a storage capacitor). It can be regarded as a multilayer wiring board having an electrode 250, a gate signal line 280, a source signal line 290, and a common signal line 300), and is manufactured using the method for manufacturing a laminated structure of the present invention as a characteristic configuration. And the conductive layer 71 of the laminated structure constitutes at least a part of the electrode layer.

Here, as an example, a method for manufacturing an active matrix substrate according to the procedure shown in FIGS. 12 to 14 will be described.
(S21) First, the wettability changing layer 31 including the high surface energy part 41 and the low surface energy part 51 on the substrate 20 and the high structure as shown in FIG. On the surface energy part 41, the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 are formed.
(S22) Next, by using the above-described manufacturing method of the laminated structure again, as shown in FIG. 13, the wettability changing layer 32 including the high surface energy part 42 and the low surface energy part 52, and the high surface energy. A source electrode 230, a drain electrode 240, and a source signal line 290 are formed on the portion 42. In this configuration, the wettability changing layer 32 also functions as the gate insulating layer 220, and the source signal line 290 also functions as the source electrode 230.
(S23) Finally, as shown in FIG. 14, the active matrix substrate 400 is completed by forming the semiconductor layer 260 in contact with both the source electrode 230 and the drain electrode 240 by, for example, a microcontact printing method.

Here, the manufacturing method of the laminated structure of the present invention applied when manufacturing the active matrix substrate will be described in more detail.
15 shows a high surface energy portion 40 (indicated by a dotted line in the figure) when forming a laminated structure having the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 in FIG. The relationship between the dropping position of the functional liquid in the region (in the drawing, the black square position in the figure) and the nozzle position is shown. The nozzles are arranged in a direction orthogonal to the extending direction of the gate signal line 280 and the common signal line 300 of the active matrix substrate, and the extending direction of the gate signal line 280 and the common signal line 300 and the sub-scanning direction (Y-axis) Direction). By doing so, it is possible to form a laminated structure by two sub-scans.

  FIG. 16 shows a function of the high surface energy portion 40 (region surrounded by a dotted line in the drawing) when forming a stacked structure including the source electrode 230, the drain electrode 240, and the source signal line 290 in FIG. It shows the relationship between the dropping position of the liquid (in the figure, the position of the black cells) and the nozzle position. Nozzles are arranged in a direction orthogonal to the extending direction of the source signal lines 290 of the active matrix substrate, and the extending direction of the source signal lines 290 and the sub-scanning direction (Y-axis direction) coincide. By doing so, it is possible to form a laminated structure by two sub-scans.

Next, the image display apparatus according to the present invention will be described.
An image display apparatus according to the present invention includes an image display element and the active matrix substrate 400 described above.

FIG. 17 shows a configuration example of an image display device according to the present invention.
As shown in FIG. 17, the image display device 500 includes an active matrix substrate 400, a second substrate 501 having a transparent conductive film 502, and an image provided between the active matrix substrate 400 and the second substrate 501. The image display element on the drain electrode 240 that also serves as the pixel electrode is switched by the transistor 270. Here, as the second substrate 501, a plastic such as glass, polyester, polycarbonate, polyarylate, or polyethersulfone can be used. As the image display element 550, a method such as liquid crystal, electrophoresis, organic EL, or the like can be used.

  Since the liquid crystal display element using liquid crystal as the image display element 550 is driven by an electric field, the power consumption is small, and since the driving voltage is low, the driving frequency of the TFT can be increased, which is suitable for large-capacity display. Examples of the display method of the liquid crystal display element include TN, STN, guest-host type, polymer-dispersed liquid crystal (PDLC), etc., but PDLC is preferable in that a bright white display can be obtained in a reflective type. .

  In a reflective liquid crystal element or the like in which the image display element 550 is stacked on the active matrix substrate 400, an interlayer insulating film (not shown) is provided on the active matrix substrate 400, and is provided on the interlayer insulating film through a contact hole. The pixel electrode (not shown) is connected to the drain electrode 240 of the transistor 270.

  The electrophoretic display element is a dispersion in which particles exhibiting a first color (for example, white) are dispersed in a color dispersion medium exhibiting the second color, or two or more types that are colored in different colors (for example, white and black). The particles are dispersed in a colorless dispersion, and when the colored particles are charged in the dispersion medium, the position of the particles in the dispersion medium can be changed by the action of an electric field, whereby the display color is changed. Change. According to this display method, it is possible to display brightly and with a wide viewing angle, and since it has a display memory property, it is preferably used particularly from the viewpoint of power consumption.

  By using microcapsules in which the dispersion is wrapped with a polymer film, the display operation is stabilized and the display device can be easily manufactured. Microcapsules can be produced by a known method such as a coacervation method, an In-Situ polymerization method, or an interfacial polymerization method. As the white particles, titanium oxide is particularly preferably used, and surface treatment or compounding with other materials is performed as necessary. Examples of the dispersion medium include aromatic hydrocarbons such as benzene, toluene, xylene, naphthenic hydrocarbons, aliphatic hydrocarbons such as hexane, cyclohexane, kerosene, and paraffinic hydrocarbons, trichloroethylene, tetrachloroethylene, trichlorofluoroethylene, odor It is preferable to use an organic solvent having a high resistivity such as halogenated carbon (hydrocarbon) such as ethyl halide, fluorine-containing ether compound, fluorine-containing ester compound, or silicone oil. In order to color the dispersion medium, oil-soluble dyes such as anthraquinones and azo compounds having desired absorption characteristics are used. A surfactant or the like may be added to the dispersion for stabilization of dispersion.

  Since the organic EL element is a self-luminous type, vivid full color display can be performed. Further, since the EL layer is a very thin organic thin film, it has a high flexibility and is particularly suitable for being formed on a flexible substrate.

  Hereinafter, the present invention will be described in more detail with reference to test examples and examples. However, the present invention is not limited to the following test examples and examples, and the following test examples without departing from the scope of the present invention. Various modifications and substitutions can be made to the embodiments.

(Test Example 1)
Test Example 1 relates to a method for manufacturing the laminated structure shown in FIG.
First, an NMP (N-methyl-2-pyrrolidone) solution containing a wettability changing material was spin-coated on a glass substrate. As the wettability changing material, two types of polyimide materials A and B having different polymerization ratios represented by the following structural formula (I) were used. Next, after pre-baking in an oven at 100 ° C., heat treatment was applied in an oven at 300 ° C. to form the wettability changing layer 30. Here, the surface energy of the low surface energy portion is changed depending on the type of polyimide material.

  Subsequently, a photomask 91 having a plurality of linear opening patterns is manufactured, and ultraviolet light (ultra-high pressure mercury lamp) 92 having a wavelength of 300 nm or less is exposed to a part on the wettability changing layer 30, so that the wettability changing layer 30 is exposed. A pattern composed of a high surface energy portion 40 and a low surface energy portion 50 was formed thereon. The surface energy of the high surface energy portion 40 is changed by changing the amount of ultraviolet irradiation for each polyimide material. The produced photomask 91 is provided with three types of opening patterns having different sizes in advance, and the high surface energy portion 40 having three different widths (20, 25, 35 μm) is formed.

Subsequently, a functional liquid 61 made of hydrophilic ink containing Ag nanoparticles was selectively dropped onto the high surface energy part 40 by an inkjet method. The dropping center position at this time is the width center (X = 0) of the high surface energy part 40. The functional liquid 61 has a surface tension of about 30 mN / m and a viscosity of 10 mPa · s.
The contact angle with respect to the low surface energy portion 50 and the contact angle with respect to the high surface energy portion 40 of the functional liquid 61 measured using the droplet method is changed by six levels depending on the polyimide material type and the exposure amount (ultraviolet ray irradiation amount).

  As the ink jet method, a piezoelectric ink jet head is used, the drive waveform and the drive voltage are adjusted, and the average volume of the functional liquid 61 discharged from the droplet discharge nozzle 93 is about 7 pL (the diameter at the time of flight is about 24 μm). ), The functional liquid 61 was dropped onto the high surface energy part.

  Subsequently, the functional liquid 61 dropped on the high surface energy part 40 was dried and solidified in an oven at 100 ° C. to produce a laminated structure.

Table 1 shows the results of evaluating how the conductive layer 71 is formed by observing the produced laminated structure with a metal microscope. From Table 1, in order to stably form the conductive layer 71 only on the high surface energy part 40, the contact angle of the functional liquid 61 with respect to the low surface energy part 50 of the wettability changing layer 30 is 30 ° or more, It was found that the contact angle of the functional liquid 61 with respect to the high surface energy part 40 of the property change layer 30 is 10 ° or less, and the diameter when the functional liquid 61 flies is equal to or less than the width of the high surface energy part 40. .
That is, the volume of the droplet of the functional liquid 61 is adjusted according to the contact angle of the functional liquid 61 with respect to the low surface energy part 50 and the high surface energy part 40 of the wettability changing layer 30 and the width of the high surface energy part 40. Thus, the conductive layer 71 can be reliably formed only on the high surface energy part 40. Further, when the volume of the functional liquid 61 droplet is increased within an allowable range, the conductive layer 71 can be formed with a smaller number of dropped functional liquids. As a result, the frequency performance required for the ejection head is alleviated. A conductive layer can be formed with high throughput.

Example 1
Example 1 relates to a method of manufacturing the active matrix substrate shown in FIG. FIG. 19A is a top view of the active matrix substrate, and FIG. 19B is a cross-sectional view taken along the line AA ′ in FIG.
The active matrix substrate includes a gate electrode 210, a gate insulating layer 220, a source electrode 230, a drain electrode 240, a storage capacitor electrode 250, a transistor 270 including a semiconductor layer 260, and a gate signal line extending in one direction from the gate electrode 210. 280, a source signal line 290 extending from the source electrode 230 in a direction substantially orthogonal to the extending direction of the gate signal line 280, and the storage capacitor electrode 250 from the gate signal line 280 or the source signal line 290. A common signal line 300 extending substantially parallel to the extending direction. In FIG. 19, the source signal line 290 also functions as the source electrode 230.

  The active matrix substrate of this embodiment has the stacked structure of the present invention as a characteristic configuration, and the conductive layer 71 of the stacked structure forms a source electrode 230, a drain electrode 240, and a source signal line 290. is doing. FIG. 19 shows a configuration example of four pixels of the active matrix substrate. Actually, a total of 40000 pixels, which are 200 pixels high and 200 pixels wide, are arranged in a matrix. The pixel size corresponds to 150 PPI and is about 169 μm. The line width of the source electrode 230 is 35 μm, and the channel length expressed as the distance between the source electrode 230 and the drain electrode 240 is 5 μm.

Hereinafter, a method for manufacturing the active matrix substrate will be described. However, the polyimide material and the functional liquid 61 are the same as those used in Test Example 1, and thus the description thereof is omitted.
(S31) First, the gate electrode 210, the storage capacitor electrode 250, the gate signal line 280, and the common signal line 300 were formed on the glass substrate 20 by using a photolithography method.
(S32) Next, an NMP solution containing a polyimide material is applied onto the glass substrate 20 by spin coating, pre-baked in an oven at 100 ° C., and then subjected to heat treatment in an oven at 300 ° C. to wettability. A change layer 30 was formed.
(S33) Then, the photomask 91 having a predetermined pattern is used to expose part of the ultraviolet rays 92 on the wettability changing layer 30, and the high surface energy part 40 and the low surface energy part are formed on the wettability changing layer 30. A pattern consisting of 50 was formed.
(S34) Next, using the inkjet apparatus 100 shown in FIG. 5, the functional liquid 61 was selectively dropped onto the high surface energy part 40 by the inkjet method. At this time, the droplet discharge head 103 has 384 discharge nozzles 93 arranged at a nozzle interval of 150 PPI, which is the same as the pixel pitch of the active matrix substrate. Further, the Y-axis direction drive mechanism 105 is controlled at a stage speed of 500 mm / s.
In addition, the contact angle with respect to the low surface energy part 50 of the functional liquid 61 and the contact angle with respect to the high surface energy part 40 which were measured using the droplet method were 30 degrees and 10 degrees, respectively. The average volume of the functional liquid 61 discharged from the droplet discharge nozzle 93 was 20 pL (the diameter during flight was about 34 μm).

FIG. 20 is a relationship diagram between the dropping position of the functional liquid 61 and the nozzle position with respect to the high surface energy portion 40 when the source electrode 230, the drain electrode 240, and the source signal line 290 are formed in the present embodiment (step S34). Indicates.
The nozzles 1 and 2 as the droplet discharge nozzles 93 of the droplet discharge head 103 are arranged in a direction (X-axis direction) orthogonal to the extending direction of the source signal lines 290 of the active matrix substrate, and the source signal Since the extending direction of the line 290 and the sub-scanning direction (Y-axis direction) coincide with each other, it is possible to form a laminated structure by two sub-scans. Furthermore, only one functional liquid (droplet d) is dropped on both the source electrode 230 and the drain electrode 240 for each pixel.

  When performing such discharge control, the discharge position interval of the functional liquid 61 is 169 μm of the pixel pitch, and therefore the frequency required for the droplet discharge head 103 is 3 kHz even when scanning at a stage speed of 500 mm / s. In addition, since the droplet discharge head 103 is driven at a constant cycle, it was possible to maintain a very stable discharge state. In addition, the time required for one sub-scan was 1 second or less, and a very high throughput could be realized.

(S35) After the functional liquid 61 was dropped, the heat treatment was performed to form the source electrode 230, the drain electrode 240, and the source signal line 290.
(S36) Next, a solution obtained by dissolving an organic semiconductor polymer synthesized by a scheme as shown in the following formula (II) in toluene is applied by an inkjet method to form a semiconductor layer 260, and an active matrix substrate is manufactured. did.

  As described above, by using the present active matrix substrate manufacturing method, fine electrodes having a line width of 35 μm and a channel length of 5 μm can be stably formed with high throughput.

(Example 2)
In Example 2, an electrophoretic element as an image display element was bonded to the active matrix substrate manufactured in Example 1 to produce an image display device as shown in FIG. The electrophoretic element is obtained by mixing microcapsules encapsulating isopar colored with titanium oxide particles oil blue into a PVA aqueous solution and applying it on a polycarbonate substrate on which a transparent electrode made of ITO (indium tin oxide) is formed. And a layer made of PVA binder. When this substrate and the active matrix substrate were stacked and an image display device was formed and operated, an image with high contrast could be displayed. In addition, by using a high-definition active matrix substrate with 150 PPI, 10 pt characters could be clearly displayed.

  Although the present invention has been described with the embodiments shown in the drawings, the present invention is not limited to the embodiments shown in the drawings, and other embodiments, additions, modifications, deletions, etc. Can be changed within the range that can be conceived, and any embodiment is included in the scope of the present invention as long as the effects and advantages of the present invention are exhibited.

20 Substrate 30, 31, 32 Wetting change layer 40, 41, 42 High surface energy part 50, 51, 52 Low surface energy part 61 Functional liquid 71 Conductive layer 91 Photomask 92 Ultraviolet ray 93 Droplet discharge nozzle 100 Inkjet apparatus 101 Constant Panel 102 Stage 103 Liquid droplet ejection head (inkjet head)
104 X-axis direction moving mechanism 105 Y-axis direction moving mechanism 106 Controller 107 X-axis direction driving shaft 108 X-axis direction driving motor 109 Y-axis direction driving shaft 110 Y-axis direction driving motor 210 Gate electrode 220 Gate insulating layer 230 Source electrode 240 Drain electrode 250 Retention capacitance electrode 260 Semiconductor layer 270 Transistor (TFT)
280 Gate signal line 290 Source signal line 300 Common signal line 400 Active matrix substrate 500 Image display device 501 Second substrate 502 Transparent conductive film 550 Image display element d Droplet

JP-A-2005-310962

Claims (7)

A wettability changing material including a wettability changing material whose surface energy is changed by the application of energy, and having at least two parts having different surface energies, and the surface energy of the two parts having different surface energies in the wettability changing layer A method of manufacturing a laminated structure comprising a conductive layer having a predetermined pattern formed on a high surface energy portion having a high level,
A first step of forming a wettability changing layer comprising a wettability changing material;
A second step of applying energy to a part of the wettability changing layer, and forming a low surface energy part having a low surface energy and a high surface energy part having a high surface energy in the wettability changing layer;
An ink jet head in which a plurality of nozzles are arranged at a constant nozzle interval in one direction; a stage that supports the substrate after the second step; and a moving mechanism that moves the stage relative to the ink jet head. A third step of selectively dropping a functional liquid containing a conductive material onto the high surface energy portion using an inkjet device comprising:
A fourth step of drying the functional liquid dropped on the high surface energy part to form a conductive layer containing the conductive material on the high surface energy part, and
On the substrate after the second step, the high surface energy portions of the same pattern are periodically arranged at regular intervals,
In the third step, a method for manufacturing a laminated structure, wherein intervals between the plurality of nozzles in a predetermined direction of the inkjet device are made to coincide with pattern intervals of the high surface energy portion.   2. The method for manufacturing a laminated structure according to claim 1, wherein, in the third step, the interval between the plurality of nozzles in a predetermined direction of the inkjet apparatus is adjusted by rotating the inkjet head.   3. The laminated structure according to claim 1, wherein in the third step, a relative moving direction of the stage in the ink jet apparatus is made to coincide with a longitudinal direction as a pattern shape of the high surface energy portion. Body manufacturing method.   The laminated structure manufactured using the manufacturing method of the laminated structure as described in any one of Claims 1-3. In a multilayer wiring board having at least a substrate, an insulating layer, and an electrode layer,
5. A multilayer wiring board comprising the multilayer structure according to claim 4, wherein the conductive layer constitutes at least a part of the electrode layer. A transistor including a gate electrode, a gate insulating layer, a source electrode, a drain electrode, a storage capacitor electrode, and a semiconductor layer; a gate signal line extending in one direction from the gate electrode; and A source signal line extending in a direction substantially orthogonal to the extending direction, and a common signal line extending substantially parallel to the extending direction of the gate signal line or the source signal line from the storage capacitor electrode. In an active matrix substrate comprising a communication line,
The laminate structure according to claim 4,
The conductive layer constitutes at least one of the gate electrode, the source electrode, the drain electrode, the storage capacitor electrode, the gate signal line, the source signal line, and the common signal line. An active matrix substrate.   An image display device comprising: an image display element; and the active matrix substrate according to claim 6.