JP2012106416A - Adhesion material application apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesion material application apparatus in which a structural restriction attributable to the detection of a residual amount of an adhesion material can be reduced, and an increase in the number of components can be suppressed.SOLUTION: The printing apparatus (adhesion material application apparatus) 100 includes: a servo motor 723 for supplying solder paste 111 by causing a solder container 110 and a piston 112 to make a relative movement; a motor control means for performing drive control of the servo motor 723 based on the value of detection by an encoder 723a and controlling an amount of supply of the solder paste 111; a squeegee 711 for applying the solder paste 111; and a residual amount calculating means for calculating information on the residual amount of the solder paste 111 contained in the solder container 110 based at least on the information to make the connection between the relative position of the solder container 110 and the piston 112, and the drive position of the servo motor 723, and the present position of the servo motor 723 detected by the encoder 723a.

Description

  The present invention relates to an adhesive material application device, and more particularly to an adhesive material application device capable of detecting the remaining amount of the adhesive material.

  2. Description of the Related Art Conventionally, an adhesive material application device that can detect the remaining amount of an adhesive material is known (for example, see Patent Document 1).

  Patent Document 1 includes a cartridge that is provided with a supply port and stores solder paste, a pressure plate that pushes out the solder paste in the cartridge, and an air cylinder that presses the pressure plate and supplies the solder paste from the cartridge. An adhesive material applicator is disclosed. In this adhesive material coating apparatus, the user can read the indication mark attached to the displacement rod that moves in accordance with the displacement of the pressure plate (the extrusion of the solder paste) by the scale of the scale plate fixedly provided. It is configured as follows. As a result, the adhesive material application apparatus according to Patent Document 1 can detect (confirm) the remaining amount of solder paste in the cartridge that cannot be visually confirmed from the outside.

JP 2001-253046 A

  However, in the adhering material application apparatus of Patent Document 1, it is necessary to provide a displacement rod or scale plate dedicated to the remaining amount detection in order to detect the remaining amount of the adhering material (solder paste). There is a problem that the number of parts is increased while being structurally restricted.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to reduce structural constraints caused by detection of the remaining amount of attached material and to increase the number of parts. It is providing the adhesion material application device which can control.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, an adhesive material application device according to one aspect of the present invention pushes an adhesive material from a storage container through a supply port by relatively moving a storage container that stores the adhesive material and an extrusion unit. And a motor having position detecting means for detecting a driving position corresponding to a relative position between the container and the pushing portion, and a relative movement between the container and the pushing portion. Motor control means for controlling the supply amount of the adhering material by performing motor drive control based on the motor driving position detected by the means, and application means for applying the adhering material supplied from the storage container to the substrate; Information obtained in advance that relates the relative position between the storage container and the pushing portion and the drive position of the motor, and the current detection position at the current relative position between the storage container and the pushing portion. Based at least on the current position of the motor detected by, and a remaining amount calculation means for calculating information about the remaining amount of the contained deposited material container.

  In the adhering material application device according to one aspect of the present invention, as described above, the motor control that controls the supply amount of the adhering material based on the motor having the position detecting unit and the driving position of the motor detected by the position detecting unit. Means of the adhering material stored in the storage container based at least on the information relating the relative position between the storage container and the pushing portion and the drive position of the motor and the current position of the motor detected by the position detection means. By providing the remaining amount calculating means for calculating the information on the remaining amount, it is possible to calculate the information on the remaining amount of the attached material using the position detecting means for performing the supply control of the attached material by the motor. For this reason, since it is possible to perform both the supply control of the adhering material and the detection of the remaining amount of adhering material (calculation of the remaining amount) using a motor having a position detecting means, a member dedicated to detecting the remaining amount of adhering material There is no need to provide it. Thereby, the structural restriction resulting from detection of the remaining amount of the adhering material can be reduced, and an increase in the number of parts can be suppressed.

  In the adhering material application apparatus according to the above aspect, preferably, the remaining amount calculating means further includes information on the remaining amount of the adhering material stored in the storage container based on information on the internal volume of the storage container acquired in advance. Is calculated. If constituted in this way, if the actual amount of displacement between the container and the pushing part is calculated from the information relating the relative position between the container and the pushing part and the driving position of the motor, and the current position of the motor, The volume (remaining amount) of the adhering material remaining in the storage container can be obtained using the calculated actual displacement amount and information on the internal volume of the storage container.

  In this case, preferably, the remaining amount calculating means is a first reference of the motor detected by the position detecting means when the containing container and the pushing portion are located at a first relative position where the volume inside the containing container is maximized. The position, the second reference position of the motor detected by the position detecting means when the container and the pushing part are located at the second relative position where the volume inside the container is minimized, and the container and the pushing part. Based on the current position of the motor detected by the position detection means at the current relative position and the dimensional information on the internal volume of the storage container acquired in advance, the remaining amount of the adhering material stored in the storage container is obtained. It is configured. If comprised in this way, from the 1st reference position of the motor at the time of full capacity (maximum internal volume), the 2nd reference position of the motor at the time of empty quantity (minimum internal volume), and the current position of the motor, the adhering material The remaining amount can be calculated as a percentage of the full amount. Further, by using this ratio and dimensional information about the internal volume of the storage container, the volume (remaining amount) of the adhered material can be easily obtained even when storage containers having different dimensions such as diameter are used.

  In the adhering material application apparatus according to the one aspect described above, preferably, the adhering material remaining amount is calculated based on the remaining amount of the adhering material calculated by the remaining amount calculating unit and the application volume of the adhering material per one substrate. At least one of the number of substrates to which the adhering material can be applied and the workable time according to the remaining amount of the adhering material can be calculated. If comprised in this way, the information regarding the residual amount of adhesion | attachment material can be obtained as workable time according to the number of the board | substrates which can apply | coat, or a residual amount. Thereby, the user can grasp | ascertain easily the timing which performs the replacement | exchange operation | work of adhesion material from the board | substrate number which can be apply | coated, and workable time.

  In this case, preferably, the application area calculating means for obtaining the application area of the adhesion material applied to one substrate, the application area per substrate calculated by the application area calculation means, and the adhesion material applied to the substrate Based on the application volume calculation means for determining the application volume of the adhering material per substrate based on the application thickness, the remaining amount of the adhering material obtained by the remaining amount calculation means, and the application volume obtained by the application volume calculation means And a substrate number calculating means for obtaining the number of substrates to which the adhesive material can be applied according to the remaining amount of the adhesive material. With this configuration, the application volume of the adhering material per substrate in addition to the remaining amount of the adhering material can be calculated by calculation, so that the number of substrates on which the adhering material can be applied can be easily obtained. .

  In the configuration capable of calculating the number of substrates that can be applied according to the remaining amount of the adhering material or the workable time according to the remaining amount of the adhering material, preferably, the application area of the adhering material applied to one substrate is An application volume calculation means for determining the application volume of the adhering material per substrate based on the application area calculating means to be obtained, the application area calculated by the application area calculating means, and the application thickness of the adhering material to be applied to the substrate; Work cycle time acquisition means for acquiring a work cycle time corresponding to the application work time of the adhesive material required for one substrate, the remaining amount of the adhesive material obtained by the remaining amount calculation means, and the application volume obtained by the application volume calculation means And a work time calculating means for obtaining a workable time according to the remaining amount of the adhering material based on the work cycle time obtained by the work cycle time obtaining means. If comprised in this way, the work possible time according to the residual amount of adhering material can be calculated | required easily.

  In the configuration including the application area calculation unit and the application volume calculation unit, the application unit preferably applies the adhesion material to the substrate through a mask in which an opening corresponding to the application region of the adhesion material to the substrate is formed. The application area calculation means is based on any one of mask design information, inspection information for inspecting the application state of the substrate on which the adhesive material is applied, or image information obtained by imaging the mask. The application volume calculating means obtains the application thickness of the adhesion material to be applied to the substrate based on the thickness dimension of the mask, and obtains the application area. Based on the obtained application thickness, the application volume of the adhering material per substrate is determined. If comprised in this way, based on the information normally used at the time of board production, such as information about a mask for performing screen printing of an adhesion material (design information and thickness dimension of a mask), inspection information, and image information of a mask, The application volume can be easily calculated.

  The adhering material application apparatus according to the above aspect preferably further includes a display unit and a remaining amount display control unit that displays information on the remaining amount of the adhering material obtained by the remaining amount calculating unit on the display unit. If comprised in this way, since the user can acquire the information regarding the residual amount of adhesion material visually from a display part, he can grasp | ascertain the timing which performs the replacement | exchange operation | work of adhesion material more easily.

  In this case, preferably, the information on the remaining amount includes the remaining amount of the adhering material, the ratio of the remaining amount of the adhering material stored in the storage container, the number of substrates on which the adhering material can be applied, and the remaining amount of the adhering material. One of the available work hours is included. By configuring in this way, it is possible to easily grasp the timing for performing the replacement operation of the adhered material from any one of the remaining amount of the adhered material, the ratio of the remaining amount of the adhered material, the number of substrates that can be applied, and the workable time. it can.

  In the adhering material application apparatus according to the above aspect, preferably, a warning is displayed on the display unit when the information about the remaining amount of the adhering material obtained by the display unit and the remaining amount calculating means reaches a predetermined threshold value set in advance. Warning display control means for causing By configuring in this way, for example, when preparation work is required for replacement of the adhering material, the preparatory work is started after the warning by calculating the time required for the preparation work as a predetermined threshold. Thus, the preparatory work can be completed in accordance with the timing when the adhered material becomes empty. Thereby, it is possible to suppress generation of useless waiting time during the replacement work of the adhered material.

  In the adhering material application apparatus according to the above aspect, the adhering material is preferably a solder paste, and the container is a cylindrical solder container having an upper opening and a bottom and containing the solder paste, and an extrusion unit. Is a piston that is slidably fitted to the inner peripheral portion of the upper opening of the cylindrical solder container and has a supply port, and a motor having a position detection means is a servo having an encoder that detects the rotational position of the motor. The motor further includes a ball screw shaft for moving the solder container and the piston relative to each other, and the servo motor rotates the ball screw shaft to move the piston relative to the solder container to move the solder paste from the solder container. Is extruded and supplied through a supply port. If comprised in this way, the structure which supplies a solder paste using the servomotor which has an encoder can be obtained easily.

1 is a perspective view illustrating an overall configuration of a printing apparatus according to an embodiment of the present invention. 1 is a side view showing an overall configuration of a printing apparatus according to an embodiment of the present invention. It is a figure for demonstrating the mask used for the printing apparatus by one Embodiment of this invention. It is a schematic diagram which shows the solder supply part of the printing apparatus by one Embodiment of this invention. It is a block diagram which shows the control part of the printing apparatus by one Embodiment of this invention. It is a figure for demonstrating the 1st reference position of the solder supply part of FIG. It is a figure for demonstrating the 2nd reference position of the solder supply part of FIG. It is a flowchart for demonstrating the solder remaining amount monitoring process of the printing apparatus by one Embodiment of this invention. It is a flowchart for demonstrating the acquisition process of the consumption solder amount of the printing apparatus by one Embodiment of this invention. It is a schematic diagram which shows the display aspect of the residual amount of solder in the modification of the printing apparatus by one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The structure of the printing apparatus 100 according to an embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, an example will be described in which the “adhesive material coating apparatus” of the present invention is applied to a printing apparatus that performs solder printing on a printed board.

  As shown in FIGS. 1 and 2, the printing apparatus 100 according to the present embodiment is provided on a base 1, a substrate transport unit 2 that is provided on the base 1 and transports a printed circuit board 200, and above the substrate transport unit 2. And a printing unit 3 that prints solder on the printed circuit board 200. The printed circuit board 200 is an example of the “board” in the present invention. The board conveyance unit 2 is provided between the conveyor 4a that carries in the printed board 200 before printing, the conveyor 4b that carries out the printed board 200 after printing, and the conveyors 4a and 4b, and holds the printed board 200. And a substrate positioning / elevating device 5 for placing the printed circuit board 200 at a printing position P (see FIG. 2) in contact with the lower surface of the mask 300 described later. The conveyors 4a and 4b are provided so as to extend in the substrate transport direction (X direction). In addition, the printing unit 3 includes a mask support unit 6 (see FIG. 1) that supports a mask 300 used for printing, a printing unit 7 that prints solder on the printed circuit board 200 through the mask 300, and a printing unit 7 at the time of printing. And a drive unit 8 that drives the printer in the printing direction (Y direction). A mask recognition camera 91 is provided on the substrate positioning lift 5.

  As shown in FIG. 3, the mask 300 is made of a plate-like member having a thickness t and having flexibility. The mask 300 has an opening region 301 in which a large number of openings 310 are formed in a predetermined pattern corresponding to the solder application region to be applied to the printed circuit board 200. The mask 300 is fixed to a frame 302 made of a highly rigid member. The mask 300 is produced based on Gerber data (mask design information) including position information and opening size information of each opening 310 formed in the mask 300.

  As shown in FIGS. 1 and 2, the substrate positioning lifting device 5 includes a Y-axis table 51, an X-axis table 52, an R-axis table 53, and a Z-axis table 54, and includes an X direction, a Y direction, and a Z direction. The printed circuit board 200 can be moved in the direction and the R direction (the direction of rotation in the horizontal plane).

  As shown in FIG. 2, a rail 51a is provided on the base 1 so as to extend in the Y direction, and the Y-axis table 51 is slidably attached to the rail 51a. Further, the Y-axis table 51 is configured to be driven in the Y direction by a servo motor and a ball screw mechanism (not shown). On the Y-axis table 51, a rail 52a is provided so as to extend in the X direction. The X-axis table 52 is slidably attached to the rail 52a, and the X-axis table is driven by a servo motor and a ball screw mechanism (not shown). 52 is configured to be driven in the X direction with respect to the Y-axis table 51. A support mechanism 53a is provided on the X-axis table 52, and the R-axis table 53 is rotatably supported by the support mechanism 53a in a horizontal plane. Further, the R-axis table 53 is rotationally driven by a servo motor and a ball screw mechanism (not shown). A guide shaft 54 a that is fixed to the Z-axis table 54 and extends in the Z direction is inserted into the R-axis table 53, and the Z-axis table 54 is moved relative to the R-axis table 53 by a servo motor and a ball screw mechanism 54 b (not shown). It is configured to be driven in the direction.

  The Z-axis table 54 is provided with a pair of conveyors 55 extending in the X direction. As shown in FIG. 1, the conveyor 55 is arranged so as to be connected to the conveyors 4a and 4b in a state where the Z-axis table 54 is lowered. Thereby, it is possible to transfer the printed circuit board 200 before printing from the conveyor 4a to the conveyor 55 and transfer the printed circuit board 200 after printing from the conveyor 55 to the conveyor 4b.

  Further, the Z-axis table 54 is provided with a lifting table 56 (see FIG. 2) that can be lifted in the vertical direction (Z direction) in the region between the pair of conveyors 55. A plurality of pins (not shown) for supporting the printed circuit board 200 from below are arranged on the upper surface of the lifting table 56, and the lifting table 56 is attached to the Z-axis table 54 via a slide shaft 56a extending in the vertical direction. On the other hand, it is slidably attached in the vertical direction. The lifting table 56 is configured to be driven in the Z direction by a servo motor and a rack and pinion mechanism (not shown). When the lifting table 56 is raised and lowered, the printed board 200 on the conveyor 55 is raised and positioned at the same height as the clamp pieces 57a and 57b, and is also held by the clamp pieces 57a and 57b. The lower surface of 200 is supported by a pin (not shown). Further, after the printing, after the holding of the printed board 200 by the clamp pieces 57a and 57b is released, the lifting table 56 is lowered, so that the printed board 200 can be placed on the conveyor 55.

  The Z-axis table 54 is provided with clamp pieces 57 a and 57 b that clamp the printed circuit board 200 on the conveyor 55. The clamp piece 57a is fixed to the Z-axis table 54, while the clamp piece 57b is provided to be movable in the Y direction. Thereby, the printed circuit board 200 can be clamped by the clamp piece 57a and the clamp piece 57b.

  The mask support 6 is fixedly installed above the substrate positioning lift 5 via the frame members 1a and 1b of the base 1, and a pair of support plates 6a for supporting the vicinity of the outer edge of the mask 300 from below (FIG. 1). The mask 300 is supported by a clamp piece 6b that presses the upper surface of the frame 302 of the mask 300 placed on the support plate 6a from above.

  The printing unit 7 slides on the upper surface of the mask 300 while pressing the solder to squeeze the solder onto the printed circuit board 200 through the opening of the mask 300, and the solder supply for supplying the solder onto the mask 300. And a support member 73 that supports the solder supply unit 72 and the squeegee unit 71 and can reciprocate in the printing direction (Y direction).

  As shown in FIG. 2, the squeegee unit 71 is provided on the side surface of the support member 73 on the arrow Y1 direction side, and the printed circuit board 200 supported by the lifting table 56 during printing is in contact with the lower surface of the mask 300. A squeegee 711 that slides on the upper surface of the mask 300, an elevating mechanism 712 (see FIG. 1) that moves the squeegee 711 up and down and applies a downward printing pressure load to the squeegee 711 during printing, and an X direction And a rotation mechanism portion 713 for rotating the squeegee 711 around the extending rotation shaft 713b. At the time of printing, the squeegee 711 is lowered by the lifting mechanism 712 and brought into contact with the mask 300, and when the printing direction is changed, the squeegee 711 is rotated by the lifting mechanism 712 being lifted. It is rotated by the part 713. The rotation mechanism unit 713 is configured to rotate the squeegee 711 at a predetermined inclination angle so that the solder pressing surface 711a faces the arrow Y1 direction or the arrow Y2 direction during printing. Thereby, it is possible to perform printing in the direction of the arrow Y1 and printing in the direction of the arrow Y2 with one squeegee 711. The squeegee 711 is an example of the “application unit” in the present invention.

  The elevating mechanism 712 includes a fixing portion 712a fixed to the side surface of the support member 73, a servo motor 712b (see FIG. 1) provided on the side of the fixing portion 712a in the X direction, a ball screw shaft 712c, and a servo motor. And a belt 712d for transmitting the rotation of the motor shaft 712b to the ball screw shaft 712c. By rotating the ball screw shaft 712c via the belt 712d by the servo motor 712b, the movable portion 712e screwed with the ball screw shaft 712c can be moved in the vertical direction. The movable portion 712e is attached to the fixed portion 712a via a compression coil spring (not shown), and the driving force of the servo motor 712b is transmitted to the movable portion 712e via the belt 712d, the ball screw shaft 712c, and the compression coil spring. In addition, the squeegee 711 presses the printed board 200 in a state where the lower surface is supported by the elevating table 56 and is in contact with the lower surface of the mask 300, and becomes a printing pressure load.

  The rotation mechanism unit 713 includes a servo motor 713a provided in the movable unit 712e and a rotation shaft 713b to which the squeegee 711 is fixed. The rotation of the motor shaft of the servo motor 713a is configured to be transmitted to the rotation shaft 713b by a plurality of gears (not shown).

  As shown in FIG. 4, the solder supply unit 72 is a piston support that supports a solder container support unit 721 that supports a solder container 110 containing solder and a piston 112 that extrudes the solder paste 111 in the solder container 110. And a servo motor 723 and a ball screw shaft 724 for moving the solder container 110 and the piston 112 relative to each other. As shown in FIG. 1, the solder supply unit 72 is supported so as to be movable in the X direction by a support unit 725 provided on the front surface side (arrow Y1 direction side) of the squeegee unit 71. Specifically, the support portion 725 includes a ball screw shaft 725a extending in the X direction and a servo motor 725b that rotationally drives the ball screw shaft 725a. The solder supply unit 72 is supported by the support unit 725 via a nut (not shown) that is screwed onto the ball screw shaft 725a. The solder supply unit 72 can be moved in the X direction by rotationally driving the ball screw shaft 725a by the servo motor 725b. The solder container 110, the solder paste 111, and the piston 112 are examples of the “container container”, the “adhesive material”, and the “extrusion part” of the present invention, respectively. The servo motor 723 is an example of the “motor” in the present invention.

  As shown in FIG. 4, the solder container support 721 holds the solder container 110 containing the solder paste 111 in which the solder powder and the flux are mixed with the upper opening 110 a of the solder container 110 facing downward. It is the plate-shaped support member comprised. A ball screw shaft 724 is screwed into the end portion of the solder container support portion 721. The solder container support 721 is configured to be movable up and down along the ball screw shaft 724 by the rotation of the ball screw shaft 724. Here, in this embodiment, it is possible to use a commercially available container that is distributed in a state in which the solder paste 111 is accommodated as the solder container 110. Such a commercially available solder container 110 has a cylindrical shape including a bottom portion whose one end is closed and an upper opening 110a whose other end is open. Solder paste 111 is accommodated in such a solder container 110, and the upper opening 110a is sold in a state of being sealed with a lid member (not shown). In the present embodiment, the piston 112 is fitted in the upper opening 110a instead of the lid member, and the solder container 110 is simply set on the solder container support part 721, so that an operation such as replacing the solder paste 111 with another accommodating part is required. It can be used for supplying solder as it is.

  The piston support part 722 is fixedly provided in the solder supply part 72. The piston support portion 722 supports the ball screw shaft 724 in a rotatable manner, and fixedly supports the servo motor 723 connected to the end of the ball screw shaft 724 and the piston 112. For this reason, by rotating the ball screw shaft 724 by the servo motor 723, the solder container support 721 (solder container 110) can be moved up and down relatively with respect to the piston support 722 (piston 112). .

  The piston 112 is attached so as to penetrate the piston support portion 722 vertically, and includes a pressing portion 112a provided at the upper end and a shaft portion 112b extending vertically. In addition, a solder supply path 112c is formed in the piston 112 so as to penetrate vertically from the upper end of the pressing portion 112a to the lower end of the shaft portion 112b, and a supply port 113 at the lower end of the piston 112 (shaft portion 112b). Communicate. The pressing portion 112a is formed in a shape corresponding to the inner diameter da of the solder container 110 so as to be slidably fitted into the upper opening 110a of the solder container 110. Accordingly, a space for accommodating the solder paste 111 is formed by the solder container 110 and the pressing portion 112a. The solder supply path 112c is configured to allow the supply space of the solder paste 111 between the solder container 110 and the pressing portion 112a to communicate with the supply port 113. When the solder container support portion 721 is lowered toward the piston support portion 722 by driving the servo motor 723, the solder container 110 is lowered, and the pressing portion 112 a of the piston 112 enters the solder container 110. As a result, the solder paste 111 accommodated in the solder container 110 is supplied so as to be pushed out from the supply port 113 through the solder supply path 112c. The solder paste 111 pushed out from the supply port 113 is supplied onto the mask 300 disposed below.

  In the present embodiment, the servo motor 723 includes an encoder 723 a that detects the rotational position (coordinates) of the servo motor 723. The servo motor 723 is configured to be drive-controlled (control of the supply amount of the solder paste 111) by the control unit 10 to be described later based on the detection value (rotational position) of the encoder 723a. As will be described later, the remaining amount of the solder paste 111 remaining in the solder container 110 is calculated based on the detected value (rotational position) of the encoder 723a. For this reason, in this embodiment, a dedicated sensor or a detection member for detecting the remaining amount of the solder paste 111 is not necessary. The encoder 723a is an example of the “position detecting means” in the present invention.

  As shown in FIG. 1, the drive unit 8 includes a pair of guide rails 81 that support the support member 73 movably in the Y direction, a ball screw shaft 82 that extends in the Y direction, and a servo motor 83 that rotates the ball screw shaft 82. Is included. The support member 73 is provided with a ball nut 73a (see FIG. 2) to which the ball screw shaft 82 is screwed. The support member 73 is configured to move in the Y direction when the ball screw shaft 82 is rotated by the servo motor 83. In the present embodiment, the squeegee unit 71 and the solder supply unit 72 are supported by the support member 73, and the support member 73 is driven by the drive unit 8. The two driving units 8 are configured to be integrally driven in the Y direction.

  The mask recognition camera 91 is provided on the Z-axis table 54 of the substrate positioning lifting device 5 with the imaging direction facing upward. Therefore, the mask recognition camera 91 is configured to be movable in the horizontal direction (XY direction) by the substrate positioning lifting device 5. The mask recognition camera 91 has a function of imaging the mask 300 from the lower surface side and acquiring imaging data for image recognition such as an opening 310 (see FIG. 3) and a positioning mark (not shown) formed in the mask 300. Have. As shown in FIG. 5, the printing apparatus 100 is provided with a substrate recognition camera 92 and an inspection camera 93, but are not shown in FIGS. 1 and 2. The board recognition camera 92 has a function of taking an image of the upper surface (solder printing surface) of the printed board 200 and acquiring image pickup data for image recognition such as a positioning mark and an identification mark formed on the printed board 200. The inspection camera 93 has a function of capturing an image of the printed circuit board 200 after solder printing and acquiring image data for inspecting the printing state of the solder.

  As shown in FIG. 5, control of each unit of the printing apparatus 100 is performed by the control unit 10. The control unit 10 includes an arithmetic processing unit 11, a storage unit 12, a motor control unit 13, an external input / output unit 14, an image processing unit 15, and a server communication unit 16. In addition, a display unit 101 is provided outside the printing apparatus 100, and the display unit 101 is controlled by the control unit 10. The display unit 101 is a touch panel type and can accept an input operation by a user.

  The arithmetic processing unit 11 is mainly configured by a CPU (Central Processing Unit), and is configured to read various programs and data from the storage unit 12 and control the entire control unit 10. In addition, the arithmetic processing unit 11 includes the “motor control unit”, “remaining amount calculation unit”, “application area calculation unit”, “application volume calculation unit”, “substrate number calculation unit”, “work cycle time acquisition” of the present invention. Means ”,“ working time calculation means ”,“ remaining amount display control means ”, and“ warning display control means ”.

  In the present embodiment, the arithmetic processing unit 11 functions as various arithmetic units that calculate information related to the remaining amount of the solder paste 111 in the solder container 110 by executing a program read from the storage unit 12 and calculates The remaining amount monitoring is performed to determine whether or not the information regarding the remaining amount of solder has reached a predetermined threshold set in advance by the user. In the present embodiment, four types of information regarding the remaining amount of solder are prepared. Specifically, the arithmetic processing unit 11 determines the ratio (percentage) of the remaining amount of the solder paste 111 in the solder container 110 to the full amount, the remaining amount (volume) of the solder paste 111 in the solder container 110, and the current It is possible to calculate the number of printable printed circuit boards 200 according to the remaining amount of solder and the possible workable time according to the remaining amount of solder. The arithmetic processing unit 11 monitors the remaining amount of the solder paste 111 (determines whether or not a predetermined threshold value has been reached) by using any one of the preset information among these four types of information. When the threshold value is reached, a warning for the user is displayed.

  Here, when the solder paste 111 is emptied, the user performs an exchange operation of the solder container 110. However, a predetermined preparation operation is required in advance for the exchange. That is, since the solder container 110 is refrigerated, it is necessary to return the solder container 110 to room temperature and uniformly agitate the flux and solder until the solder paste 111 can be used. It takes time. By monitoring the remaining amount of the solder paste 111 (determining whether or not a predetermined threshold value has been reached) and displaying a warning when the predetermined threshold value is reached, the user can detect when the solder paste 111 becomes empty. At the same time, it is possible to start the preparation of the replacement solder paste.

  In the present embodiment, the arithmetic processing unit 11 is configured to display one or more of the calculated four types of information on the display unit 101 and update in real time. Furthermore, the arithmetic processing unit 11 warns the user by displaying a warning message, changing a display pattern (display color or character) of the display unit 101, turning on a pilot lamp (not shown), etc. Is configured to do.

  The storage unit 12 includes an HDD (hard disk drive), a flash memory, and the like, and stores various programs and data related to the production of the printed circuit board 200. In the present embodiment, the Gerber data of the mask 300, the inspection information for inspecting the application state of the printed circuit board 200 to which the solder is applied, the imaging data by each camera, the dimensional information of the solder container 110, and the arithmetic processing unit 11 are used. Information relating to the remaining amount of solder paste 111 is stored in the storage unit 12. The Gerber data of the mask 300 is mask design information including position information and opening size information of each opening 310 (see FIG. 3) formed in the mask 300.

  The motor control unit 13 has a function of driving the above-described servo motors (servo motor 83, servo motor 712b, servo motor 713a, servo motor 723, servo motor 725b, etc.) based on the control instruction of the arithmetic processing unit 11. In addition, it has a function of acquiring a detection value (rotational position information) from an encoder (encoder 723a or the like) of each servo motor and outputting it to the arithmetic processing unit 11. In the present embodiment, the arithmetic processing unit 11 and the motor control unit 13 function as a motor control unit that controls the supply amount of the solder paste 111.

  The external input / output unit 14 has a function of transmitting and receiving signals associated with control of various valves, sensors, stopper mechanisms and the like provided in the printing apparatus 100. For example, the external input / output unit 14 is configured to acquire a detection signal of the solder paste 111 supplied on the mask 300 from an optical solder sensor (not shown) and output the detection signal to the arithmetic processing unit 11. This optical solder sensor is configured to be able to scan in the Y direction (squeegee movement direction), and can acquire the width of the solder paste 111 on the mask 300 in the Y direction. Based on the width of the solder paste 111 in the Y direction, the arithmetic processing unit 11 can calculate the amount of solder on the mask 300. During solder application (printing) work, supply control of the solder paste 111 (that is, drive control of the servo motor 723) is performed based on the calculated amount of solder on the mask 300.

  The image processing unit 15 has a function of performing image pickup control of the substrate recognition camera 92, the mask recognition camera 91, and the inspection camera 93 based on a control instruction from the arithmetic processing unit 11 and reading out image data. The server communication unit 16 has a function of communicating with an external server (not shown) by wire or wireless.

  Next, the calculation method of the information regarding the remaining amount of the solder paste 111 in the solder container 110 by the arithmetic processing unit 11 will be specifically described.

  When calculating the ratio (percentage) of the remaining amount of solder, the rotation position coordinates (first reference position) of the servo motor 723 when the solder paste 111 is full and the servo motor when the solder paste 111 is empty are calculated in advance by the user. Rotational position coordinates (second reference position) 723 are set. As shown in FIG. 6, the first reference position is a rotation indicated by a detection value of the encoder 723a at a relative position (relative position between the solder container 110 and the piston 112) where the volume of the solder container 110 (accommodating space) is maximum. Position coordinates. As shown in FIG. 7, the second reference position is a rotation indicated by a detection value of the encoder 723a at a relative position (relative position between the solder container 110 and the piston 112) where the volume of the solder container 110 (accommodating space) is minimized. Position coordinates. Based on the first reference position (remaining amount 100%) and the second reference position (remaining amount 0%) and the detected value (rotational position coordinates) of the current encoder 723a, the ratio (percentage) of the current remaining solder amount. Is calculated. That is, the current encoder 723a is set by setting the rotation position coordinates of the first reference position and the second reference position as information relating the relative position between the solder container 110 and the piston 112 and the rotation position coordinates of the servo motor 723. The ratio of the remaining solder amount is acquired from the detected value (rotational position coordinates).

  As shown in FIG. 4, when calculating the remaining solder volume (volume) in the solder container 110, the arithmetic processing unit 11 starts from the lead of the ball screw shaft 724 preset in the storage unit 12 to 1 of the servo motor 723. The amount of movement per pulse is acquired, and the remaining depth D in the solder container 110 is determined from the difference between the rotational position coordinates of the second reference position (when the air amount is empty) and the current detected value (rotational position coordinates) of the encoder 723a. Is calculated. Then, the cross-sectional area in the container is calculated from the diameter (inner diameter) da of the solder container 110 set in advance in the storage unit 12, and the product of the remaining depth D and the cross-sectional area in the container is calculated, thereby obtaining the remaining solder. A quantity (volume) is calculated. That is, the lead of the ball screw shaft 724 and the rotational position coordinates of the second reference position are set as information relating the relative position between the solder container 110 and the piston 112 and the rotational position coordinates of the servo motor 723, By setting the diameter (inner diameter) da of the solder container 110 as the volume-related information, the remaining solder amount (volume) is calculated.

  When calculating the number of printable printed circuit boards 200 according to the remaining amount of solder, the remaining solder volume (volume) is divided by the applied volume of the solder paste 111 per printed circuit board 200. Calculated. As shown in FIG. 3, the application volume of the solder paste 111 per one printed circuit board 200 is the total area (total application area) of the solder application area per one printed circuit board 200 and the thickness of the mask 300. Calculated from the product of t.

  The total solder application area is calculated using a method of using inspection information for inspecting the state of solder application to the printed circuit board 200, a method of using Gerber data (design information) of the mask 300, and a mask recognition camera 91 (FIG. 1). This is performed by any one of the three methods (mask scan) using the image information picked up by (see). The inspection information is information for inspecting the application state on the printed circuit board 200 after completion of printing. Since the printed pattern of the solder applied to the printed circuit board 200 reflects the opening area 301 (the opening part 310) of the mask 300, the printed object corresponding to the inspection object of the printed circuit board 200 (the individual opening part 310 of the mask 300). Based on the size information (size or diameter in the XY direction) of each solder application area on the substrate 200, the solder application area of the inspection object can be calculated. And the total area (total application area) about all the test objects on the printed circuit board 200 is obtained by adding the application areas of all the test objects.

  When using the Gerber data of the mask 300, the size information (dimension or diameter in the XY direction) of each opening 310 of the mask 300 is extracted from the entire Gerber data, and each opening is extracted from this size information. The opening area of 310 can be calculated. By adding the opening areas of all the openings 310, the total area (total application area) for all the openings 310 of the mask 300 is obtained. Further, when using a method by mask scanning, the mask recognition camera 91 is used to capture an image of the mask 300, image recognition processing is performed on the captured image data, and the opening area of the opening 310 included in the image data is determined. get. This is repeated over the entire opening region 301, and the total area (total coating area) for all the openings 310 of the mask 300 is obtained by adding the acquired opening areas. The solder paste per printed circuit board 200 is obtained from the product of the total area (total coated area) of the solder application area per one printed circuit board 200 obtained by any of the above and the thickness t of the mask 300. A coating volume of 111 is calculated.

  When calculating the workable time according to the remaining amount of solder, the cycle time required for the printing work of one printed circuit board 200 (after the printed circuit board 200 is unloaded from the printing apparatus 100, the next printed circuit board 200 is unloaded. Time interval until it is done). By calculating the product of this cycle time and the number of coatable sheets corresponding to the solder remaining amount, the workable time corresponding to the solder remaining amount is calculated.

  Next, with reference to FIGS. 1, 2, and 5 to 8, the production (solder printing) operation of the printing apparatus 100 according to the present embodiment and the solder remaining amount monitoring process in the production operation will be described. The following solder remaining amount monitoring process is executed by controlling each unit of the printing apparatus 100 by the control unit 10 (arithmetic processing unit 11).

  When production is started, first, preparation for starting printing is performed. Specifically, in step S1, the user rotates the position coordinates of the first reference position when the solder paste 111 is full (see FIG. 6) and the second reference position when the solder paste 111 is empty (see FIG. 6). 7)) is set. Next, in step S2, the calculation unit 11 of the control unit 10 selects a remaining amount monitoring method. The remaining amount monitoring method set in advance by the user is read from the storage unit 12 to select the remaining amount monitoring method. The remaining amount monitoring method may be selected by accepting a user operation input via the touch panel (display unit 101).

  When the ratio (percentage) is selected as the remaining amount monitoring method, the process proceeds to step S3, where the arithmetic processing unit 11 sets the remaining amount warning percentage (threshold). Similarly, when the volume is selected as the remaining amount monitoring method, the process proceeds to step S4, where the arithmetic processing unit 11 sets the remaining amount warning volume (threshold). In step S <b> 5, the arithmetic processing unit 11 sets the diameter (dimension information) da of the solder container 110 for calculating the volume of the solder paste 111.

  When the application possible number of printed circuit boards 200 is selected as the remaining amount monitoring method, the process proceeds to step S6, where the arithmetic processing unit 11 sets the remaining amount warning number (threshold value). If the workable time is selected as the remaining amount monitoring method, the process proceeds to step S7, and the remaining amount warning time (threshold value) is set by the arithmetic processing unit 11. In these cases (when the process proceeds to step S6 or step S7), the process proceeds to step S8, and the arithmetic processing unit 11 obtains the solder consumption amount (application volume of the solder paste 111) per printed circuit board 200. It is determined whether or not. If the amount of solder consumption per printed circuit board 200 has not been acquired, the process proceeds to step S9, and the process of calculating the amount of solder consumed per printed circuit board 200 (the volume of solder paste 111 applied) is performed. The Note that the processing for calculating the amount of solder consumed per printed circuit board 200 will be described in detail later. If the amount of solder consumed per printed circuit board 200 has been acquired or the amount of solder consumed has been calculated in step S9, the process proceeds to step S5, where the arithmetic processing unit 11 calculates the volume of the solder paste 111. The diameter (dimension information) da of the solder container 110 is set.

  In addition, the threshold value of each remaining amount monitoring method and the setting of the diameter (dimension information) of the solder container 110 are performed by the arithmetic processing unit 11 reading the information set in advance from the storage unit 12, and the server communication unit The information may be acquired from a server (not shown) via 16 (see FIG. 5), or may be set by accepting a user operation input via the touch panel (display unit 101, see FIG. 5). Good.

  When the above steps are completed, preparation for starting printing is completed. Next, in step S10, the printed circuit board 200 to be produced (application object) is carried from the conveyor 4a (see FIG. 1) to the conveyor 55 (see FIG. 1) of the substrate positioning lifting device 5. Then, the printed board 200 is lifted by the board positioning lift 5 and moved to the printing position P (see FIG. 2).

  Next, in step S11, a solder printing operation is performed on the printed circuit board 200 disposed at the printing position P. During the first printing, the servo motor 723 and the servo motor 725 b are driven by the arithmetic processing unit 11, and a predetermined amount of the solder paste 111 is supplied onto the mask 300. At this time, the arithmetic processing unit 11 controls the solder supply unit 72 to be supplied at a constant discharge amount while the solder supply unit 72 is moved in the X direction at a predetermined speed. As a result, since a uniform amount of solder paste 111 can be supplied on the mask 300 in parallel with the direction in which the squeegee 711 extends (X direction), it is possible to suppress the occurrence of uneven solder application. is there. Then, the squeegee 711 is lowered by driving the servo motor 712b, and a predetermined printing pressure load is applied to the mask 300. In this state, printing is performed by moving the printing unit 7 in the Y direction by driving the servo motor 83. As a result, solder is printed on the printed circuit board 200 in contact with the lower surface of the mask 300 corresponding to the pattern of the opening of the mask 300. When printing is finished, the Y-direction movement of the printing unit 7 is stopped, the squeegee 711 is raised by driving the servo motor 712b, and the squeegee 711 is rotated by changing the tilt angle by driving the servo motor 713a. 7 is further moved from the print end position by a predetermined amount in the Y direction and stopped. When printing is next performed on the printed circuit board 200, the printing unit 7 is controlled to move in the reverse direction to perform printing. That is, forward pass printing and return pass printing are performed alternately.

  When printing is completed, the printed printed board 200 is unloaded and the solder paste 111 on the mask 300 is replenished in parallel, and the next printing is prepared. Specifically, in step S12, the printed board 200 after printing is lowered by the board positioning lift 5 and the printed board 200 after printing is carried out from the board positioning lift 5 via the conveyor 4b. In step S13, the cycle time required for printing one printed circuit board 200 (the time interval from when the printed printed circuit board 200 is unloaded to when the next printed printed circuit board 200 is unloaded) is set. It is measured.

  In parallel with this, in step S14, the servo motors 723 and 725b are driven by the arithmetic processing unit 11, and a predetermined amount of the solder paste 111 is replenished onto the mask 300 in parallel and uniformly with the extending direction (X direction) of the squeegee 711. Is done. At this time, the arithmetic processing unit 11 controls the amount of the solder paste 111 on the mask 300 to be always constant based on the width of the solder paste 111 on the mask 300 in the Y direction. In step S15, the detected value (rotational position coordinate) from the encoder 723a of the servo motor 723 is read via the motor control unit 13, and the current coordinate of the servo motor 723 is acquired by the arithmetic processing unit 11.

  Next, proceeding to step S16, the arithmetic processing unit 11 determines the remaining amount monitoring method selected in the same manner as in step S2.

  If the selected remaining amount monitoring method is a ratio (percentage), the process proceeds to step S17, and the rotational position coordinates of the first reference position (when full) and the rotational position of the second reference position (when empty). Based on the coordinates and the current coordinates of the servo motor 723 acquired in step S15, the ratio (percentage) of the remaining amount of the solder paste 111 inside the solder container 110 is calculated.

  If the selected remaining amount monitoring method is volume, the process proceeds to step S18 and the solder container 110 in the solder container 110 calculated from the difference between the coordinates of the second reference position (when empty) and the current coordinates of the servo motor 723 is entered. Based on the remaining depth D and the cross-sectional area in the container calculated from the diameter (inner diameter) da of the solder container 110, the remaining solder amount (volume) is calculated.

  If the selected remaining amount monitoring method is the number of printable substrates 200 that can be applied, the process proceeds to step S19, and the remaining solder amount (volume) calculated by the above method and the printed circuit board 200 acquired in step S9. Based on the solder application volume per sheet, the number of coatable sheets corresponding to the remaining amount of solder is calculated.

  If the selected remaining amount monitoring method is the workable time, the process proceeds to step S20, and it is determined whether or not the cycle time required for the printing work has been measured. If the cycle time can be measured, the process proceeds to step S21, and the workable time corresponding to the remaining amount of solder is calculated based on the number of coatable sheets calculated by the above method and the obtained cycle time. When the cycle time cannot be acquired, such as at the first printing, the calculation of the workable time is skipped.

  When the information regarding the remaining amount to be monitored is acquired from any of the above steps S17 to S19 and S21, the remaining amount information displayed on the display unit 101 is updated in real time, and the process proceeds to step S22. In Step S22, whether or not the acquired remaining amount (percentage, volume, number of coatable sheets or workable time) has reached the specified amount (threshold value) set in any of Steps S3, S4, S6 and S7. Is judged.

  If the remaining amount has not reached the threshold value, the process proceeds to step S23, and it is determined whether or not printing of the printed circuit board 200 for the number of produced sheets based on the production program is completed. If printing of the printed circuit boards 200 for the number of produced sheets has not been completed, the process returns to step S10, and loading and printing of the next printed circuit board 200 is started.

  On the other hand, when the remaining amount reaches the threshold value, the process proceeds to step S24, and a predetermined warning is displayed on the display unit 101 to urge preparation for replacing the solder container 110. That is, display processing such as a warning message such as “Please prepare a new solder container” is performed. Based on this warning, the user starts the preparation work of the replacement solder paste (the work of returning the refrigerated solder paste to room temperature and stirring the flux and solder).

  In step S25, it is determined whether or not the remaining amount of solder is not empty. That is, it is determined whether or not the current coordinate of the servo motor 723 has reached the rotational position coordinate (second reference position) at the time of empty. If the remaining amount of solder is not empty, the process proceeds to step S23, and the printing operation is continued until printing of the printed board 200 for the number of produced sheets is completed. Further, when printing of the printed board 200 for the number of produced sheets is completed before the remaining amount of solder becomes empty, the production ends.

  On the other hand, if the remaining amount of solder is empty, the operation of the printing apparatus 100 is stopped in step S25, and a solder replacement operation is performed by the user. At this time, the servo motor 83 and the servo motor 725 b stop the operation of the printing apparatus 100 after the solder supply unit 72 is moved to a predetermined solder container replacement position (working position). As described above, since the user can start the preparation work of the solder paste for replacement based on the remaining amount warning, the user can start the replacement work of the solder container 110 immediately after the operation of the printing apparatus 100 is stopped. Can do. Therefore, if the piston 112 is fitted into the replacement solder container 110 by the user and the solder container 110 is set in the solder container support portion 721, printing can be resumed immediately.

  As described above, the remaining solder amount monitoring process at the time of printing by the printing apparatus 100 according to this embodiment is performed.

  Next, referring to FIG. 1, FIG. 3, FIG. 5 and FIG. 9, the amount of solder consumed per printed circuit board 200 in step S9 of the remaining solder amount monitoring process in FIG. The calculation process (subroutine) will be described. This calculation process is executed by the arithmetic processing unit 11 of the control unit 10.

  As shown in FIG. 9, first, in step S31, the arithmetic processing unit 11 acquires the thickness t (see FIG. 3) of the mask 300 from the storage unit 12. Subsequently, in step S32, an acquisition method for acquiring the total area of the opening region of the mask 300 is selected. Specifically, a method using inspection information for inspecting the solder application state on the printed circuit board 200, a method using Gerber data of the mask 300, and a method using image information captured by the mask recognition camera 91 (mask scan). ) And the method preset by the user is selected.

  When the method using the inspection information is selected, the operation information is read from the storage unit 12 (see FIG. 5) by the arithmetic processing unit 11. In step S33, based on the size information (dimension or diameter in the XY direction) about the inspection target of the solder print pattern (individual application portions corresponding to the individual openings 310 of the mask 300), The application area is calculated. In step S34, the calculated application area is added. In step S35, it is determined whether or not the calculation has been completed for all inspection objects (individual solder application portions) on the printed circuit board 200, and calculation and addition of the application area are repeated until all the inspection objects are completed. It is. As a result, the total area (total application area) for all inspection objects on the printed circuit board 200 is calculated. When the total application area is calculated, the process proceeds to step S36, and the application volume of the solder paste 111 per printed board 200 is calculated from the product of the total application area and the thickness t of the mask 300.

  When the method using the Gerber data of the mask 300 is selected, in step S37, an extraction condition for extracting size information of the opening 310 (see FIG. 3) of the mask 300 from the Gerber data is set. In step S38, the size information of each opening 310 is extracted based on the set extraction condition. When the opening area for one opening 310 is calculated from the size information in step S39, the calculated opening area is added in step S40. In step S41, it is determined whether or not the calculation has been completed for all the openings 310 of the mask 300, and the calculation and addition of the opening area are repeated until all the openings 310 are completed. As a result, the total area of all the openings 310 on the mask 300 (the total opening area of the entire opening region 301) is calculated. When the total opening area is calculated, the process proceeds to step S36, and the application volume of the solder paste 111 per printed board 200 is calculated from the product of the total opening area and the thickness t of the mask 300.

  When the method using the image information is selected, in step S42, the angle of view (the size of the field of view) of the mask recognition camera 91 (see FIG. 1) and the recognition target area (the size of the entire opening region 301 of the mask 300). ), The imaging position and the number of imaging times of the mask recognition camera 91 are acquired. Next, in step S43, the mask 300 is imaged by the mask recognition camera 91 at the acquired imaging position. In step S44, image recognition processing is performed on the captured image data, and the opening area of the opening 310 included in the image data captured by the mask recognition camera 91 is calculated. In step S45, the calculated opening area is added. In step S46, it is determined whether or not the calculation of the opening area has been completed for the acquired number of times of imaging, and imaging for the number of times of imaging, calculation of the opening area in the image data, and addition of the opening area are performed. Repeated. As a result, the opening area included in the image data of the entire mask 300 (the total opening area of the entire opening region 301) is calculated. When the total opening area is calculated, the process proceeds to step S36, and the application volume of the solder paste 111 per printed board 200 is calculated from the product of the total opening area and the thickness t of the mask 300.

  As described above, the calculation processing of the application volume of the solder paste 111 per one printed circuit board 200 is performed. By dividing the calculated remaining solder amount by the coating volume per sheet, the number of coatable sheets corresponding to the remaining solder amount is calculated.

  In the present embodiment, as described above, the servo motor 723 having the encoder 723a and the control unit that controls the supply amount of the solder paste 111 based on the drive position (rotational position coordinates) of the servo motor 723 detected by the encoder 723a. 10 (arithmetic processing unit 11 and motor control unit 13), information (first reference position and second reference position) relating the relative position between solder container 110 and piston 112 and the drive position of servo motor 723, and encoder Soldering by the servo motor 723 is provided by providing an arithmetic processing unit 11 that calculates information on the remaining amount of the solder paste 111 accommodated in the solder container 110 based at least on the current position of the servo motor 723 detected by the 723a. An encoder 723a for controlling the supply of the paste 111 is used. It is possible to calculate the information about the remaining amount of solder paste 111 and. For this reason, both the supply control of the solder paste 111 and the remaining amount detection (calculation of the remaining amount) of the solder paste 111 can be performed using the servo motor 723 having the encoder 723a, so that the remaining amount of the solder paste 111 is detected. There is no need to provide a dedicated member. Thereby, the structural restrictions resulting from the detection of the remaining amount of the solder paste 111 can be reduced, and an increase in the number of components can be suppressed.

  Further, in the present embodiment, as described above, the arithmetic processing unit 11 is information regarding the remaining amount of the solder paste 111 accommodated in the solder container 110 based on the diameter (inner diameter) da of the solder container 110 acquired in advance. Is calculated. With this configuration, the information (second reference position and lead of the ball screw shaft 724) relating the relative position between the solder container 110 and the piston 112 and the drive position of the servo motor 723, the current coordinates of the servo motor 723, and If the remaining depth D in the solder container 110 is calculated from the above, the solder paste 111 remaining in the solder container 110 using the remaining depth D and the cross-sectional area in the container calculated from the diameter (inner diameter) da. Can be obtained.

  In the present embodiment, as described above, the arithmetic processing unit 11 detects the first reference position (see FIG. 6) of the servomotor 723 detected by the encoder 723a when it is full, and the encoder 723a detects when it is empty. Based on the second reference position of the servo motor 723 (see FIG. 7), the current position of the servo motor 723 detected by the encoder 723a, and the dimensional information about the internal volume of the solder container 110 acquired in advance. The remaining amount of the solder paste 111 accommodated in 110 is determined. With this configuration, the remaining amount of the solder paste 111 is fully satisfied from the first reference position at the time of full (maximum internal volume), the second reference position at the time of empty (minimum internal volume), and the current position. It can be calculated as a percentage with respect to the amount. Further, by using this ratio (percentage) and dimensional information about the internal volume of the solder container 110, the volume (remaining amount) of the solder paste 111 can be easily obtained even when the solder container 110 having a different diameter or the like is used. Obtainable.

  In the present embodiment, as described above, the printing apparatus 100 is based on the remaining amount of the solder paste 111 calculated by the arithmetic processing unit 11 and the application volume of the solder paste 111 per printed board 200. The number of substrates to which the solder paste 111 can be applied according to the remaining amount of the solder paste 111 and the workable time according to the remaining amount of the solder paste 111 can be calculated. If comprised in this way, the information regarding the residual amount of the solder paste 111 can be obtained as workable time according to the number of the board | substrates which can be apply | coated, and residual amount. Thereby, the user can easily grasp the timing of performing the replacement work of the solder paste 111 from the number of substrates that can be applied and the workable time.

  In the present embodiment, as described above, the arithmetic processing unit 11 obtains the application area of the solder paste 111 to be applied to the printed circuit board 200 and applies the application area of the printed circuit board 200 to one printed circuit board 200. Based on the applied thickness of the solder paste 111 (the thickness t of the mask 300), the applied volume of the solder paste 111 per printed circuit board 200 is obtained. Then, the arithmetic processing unit 11 can apply the solder paste 111 according to the remaining amount of the solder paste 111 based on the remaining amount (volume) of the solder paste 111 and the applied volume of the printed circuit board 200 per sheet. The number of substrates 200 is obtained. With this configuration, the application volume of the solder paste 111 per printed circuit board 200 in addition to the remaining amount of the solder paste 111 can be calculated by calculation. It can be easily obtained.

  In the present embodiment, as described above, the arithmetic processing unit 11 acquires a cycle time corresponding to the solder paste 111 application work time required for one printed circuit board 200, and obtains the remaining amount of the solder paste 111. Based on (volume), the obtained application volume of one printed circuit board 200, and the cycle time, the workable time corresponding to the remaining amount of the solder paste 111 is obtained. If comprised in this way, the work possible time according to the residual amount of the solder paste 111 can be calculated | required easily.

  Further, in the present embodiment, as described above, the arithmetic processing unit 11 is configured such that the mask Gerber data (design information), inspection information for inspecting the application state of the printed circuit board 200 to which the solder paste 111 is applied, or Based on any of the image information obtained by imaging the mask 300, the application area of the solder paste 111 applied to one printed circuit board 200 is obtained. The arithmetic processing unit 11 acquires the application thickness of the solder paste 111 applied to the printed circuit board 200 based on the thickness dimension t of the mask 300, and the printed circuit board based on the application area and the acquired application thickness t. An application volume of 200 solder pastes 111 per sheet is obtained. If comprised in this way, the information normally used at the time of production of the printed circuit board 200, such as the information (gerber data and thickness dimension) about the mask 300 for performing screen printing of the solder paste 111, inspection information, and image information of the mask 300 Based on the above, it is possible to easily calculate the application volume.

  Further, in the present embodiment, as described above, the arithmetic processing unit 11 is configured to display information on the obtained remaining amount of the solder paste 111 on the display unit 101. If comprised in this way, since the user can acquire the information regarding the residual amount of the solder paste 111 visually from the display part 101, it can grasp | ascertain the timing which performs the replacement | exchange work of the solder paste 111 more easily. it can.

  Further, in the present embodiment, as described above, the information regarding the remaining amount includes the remaining amount (volume) of the solder paste 111, the ratio (percentage) of the remaining amount, the number of print boards 200 that can be applied, and the solder paste 111. One of the available work time according to the remaining amount of With this configuration, the solder paste 111 can be easily replaced from the remaining amount of the solder paste 111, the ratio (percentage) of the remaining amount, the number of printable printed circuit boards 200, and the workable time. Can be grasped.

  In the present embodiment, as described above, the arithmetic processing unit 11 determines the information regarding the obtained remaining amount of the solder paste 111 (the remaining amount (volume) of the solder paste 111, the percentage, the number of pieces that can be applied, and the workability). A warning is displayed on the display unit 101 when any one of the time reaches a predetermined threshold value set in advance. With this configuration, the time required for the preparatory work for replacing the solder paste 111 is back calculated and set as a predetermined threshold value, so that the user starts the preparatory work after the warning and the solder paste 111 Preparatory work can be completed according to the timing when it becomes empty. Thereby, it is possible to suppress generation of useless waiting time when the solder paste 111 is replaced.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which the adhesive material applying apparatus of the present invention is applied to a printing apparatus that prints solder on a printed board is shown, but the present invention is not limited to this. An apparatus other than a (solder) printing apparatus, such as an adhesive material application apparatus for applying an adhesive for fixing a component for fixing an electronic component mounted on a printed circuit board to the printed circuit board. You may apply to. Further, as described above, an adhesive material other than the solder paste may be used as the adhesive material of the present invention.

  In the above embodiment, as shown in FIG. 8, information on the remaining amount of the solder paste 111 according to the selected remaining amount monitoring method (the remaining amount (volume) of the solder paste 111, the percentage, the number of pieces that can be applied, In addition, although an example is shown in which any one of the workable times) is calculated, the present invention is not limited to this. In the present invention, a plurality of pieces of information regarding the remaining amount may be calculated regardless of the selected remaining amount monitoring method. In this case, as in the modification shown in FIG. 10, a plurality of pieces of information regarding the calculated remaining amount may be displayed on the display unit 101 and updated in real time.

  Here, in FIG. 10, as the information regarding the remaining amount of the solder paste 111, three examples of the remaining amount ratio (percentage), the number of printable printed circuit boards 200, and the continuous workable time are displayed. Is shown. Here, in (a) of FIG. 10, the ratio (50%) of the remaining amount of solder is displayed with hatched portions and numerical values together with a schematic diagram of the solder container. Further, the number of printable printed circuit boards 200 (80 sheets) and the workable time (26 minutes) are displayed on the display unit 101. In FIG. 10B, as the remaining amount of solder decreases, the ratio of remaining solder amount (20%), the number of producible sheets (15 sheets), and the workable time (5 minutes) are updated in real time. Yes. Here, when the remaining amount ratio (percentage) is selected as the remaining amount monitoring method (threshold = 20%), the shaded portion indicating the remaining amount is displayed in the normal state (FIG. 10A). For example, the warning color (for example, yellow) may be changed from gray to a warning color to the user. In FIG. 10C, the state where the solder runs out and the ratio of the remaining amount of solder (0%), the number of coatable sheets (0 sheets), and the workable time (0 minutes) are all zero. Show. In this modification, three examples of the remaining amount percentage, the number of coatable sheets, and the workable time are displayed. However, four pieces of information including the remaining amount (volume) may be displayed. Alternatively, any one or two of the four pieces of information may be displayed.

  When configured as in this modification, the user can visually recognize the remaining amount of the solder paste 111 from the display on the display unit 101, so that the remaining amount of solder can be more easily grasped. it can. In addition, it is sufficient for the user to grasp the percentage of the remaining amount when the remaining amount of solder is close to the full amount, and when the remaining amount of solder is medium, the number of producible products is useful as a guide. If the remaining amount of solder is close to an empty amount, it is conceivable to prepare the replacement solder container 110 based on the workable time. In such a case, it is useful in that a plurality of information regarding the remaining amount of the solder paste 111 can be displayed on the display unit 101.

  In the above embodiment, an example is shown in which a commercially available solder container 110 that is distributed in a state where the solder paste 111 is accommodated can be used. However, the present invention is not limited to this. In the present invention, a dedicated solder container may be used to fill the solder paste every time the solder paste becomes empty. In addition, the solder container does not need to have a cylindrical shape, and the shape of the solder container is arbitrary. The piston may have any shape as long as it corresponds to the shape of the inner peripheral portion of the solder container.

  In the above embodiment, the example in which the solder container support 721 (solder container 110) is moved up and down with respect to the piston support 722 (piston 112) has been described, but the present invention is not limited thereto. Absent. In the present invention, the piston support part 722 may be configured to move with respect to the solder container support part 721. Further, only the piston 112 may be moved with respect to the solder container 110. Further, both the solder container support part 721 (solder container 110) and the piston support part 722 (piston 112) may be configured to be movable in a direction toward each other and a direction away from each other.

  Moreover, although the example which provided the solder supply path 112c and the supply port 113 in the piston 112 was shown in the said embodiment, this invention is not limited to this. In the present invention, the solder container 110 may be provided with a solder supply path and a supply port.

  Moreover, although the example which provided the servomotor 723 which has the encoder 723a was shown as an example of the motor of this invention in the said embodiment, this invention is not limited to this. For example, an electromagnetic linear motor having a magnetic scale or the like may be used. In this case, the ball screw shaft 724 is unnecessary, and the solder container support 721 may be directly driven. The “motor” of the present invention may be any motor as long as position detection is possible.

  In the above embodiment, as an example of the application unit of the present invention, an example is shown in which solder is applied by a screen printing method using a squeegee, but the present invention is not limited to this. In the present invention, for example, an adhesive material such as an adhesive may be applied directly from a nozzle (supply port) to a predetermined application region. Therefore, an appropriate application means may be selected in accordance with the type of attached material to be applied.

  Further, in the above embodiment, the remaining depth D in the solder container 110 is calculated from the difference between the lead of the ball screw shaft 724 and the coordinates of the second reference position (when the air amount is empty) and the current coordinates, and the solder Although the cross-sectional area in the container is calculated from the diameter (inner diameter) da of the container 110, the remaining solder volume (volume) is calculated based on the remaining depth D and the cross-sectional area in the container. The present invention is not limited to this. For example, since the current solder remaining ratio (percentage) is calculated based on the coordinates of the first reference position and the second reference position and the current coordinates, the capacity of the solder container 110 (solder at full capacity) is preliminarily calculated. If (volume) is set, it is possible to calculate the remaining solder amount (volume) based on the current ratio of the remaining solder amount and the capacity of the solder container 110.

  As described above, the method for calculating the remaining time (volume), the ratio (percentage) of the remaining solder amount, the number of printable printed circuit boards 200 and the workable time according to the remaining solder amount shown in the above embodiment is an example. The present invention is not limited to this. In the present invention, information (first reference position and second reference position, information on the lead of the ball screw shaft 724, etc.) relating the relative position between the solder container and the piston and the drive position of the servo motor, and the current position of the servo motor. As long as the information on the remaining amount of solder is calculated based at least on the basis of the above, any calculation method may be used.

  Similarly, in the above-described embodiment, the total application area of the solder per board is calculated by the method using the inspection information of the printed circuit board 200, the method using the Gerber data of the mask 300, and the mask recognition camera 91. Although the example performed by one of the three methods is shown, the present invention is not limited to this. The total application area of the solder may be calculated by a method other than the above three methods. The same applies to the calculation of the solder coating volume per substrate.

  Further, in the above-described embodiment, the information on the remaining amount of solder includes four (4) (4) (4) the ratio (percentage) of the remaining amount of solder paste 111, the remaining amount (volume), the number of substrates that can be applied, and the workable time. Although an example has been shown in which it is possible to calculate (type) information, the present invention is not limited to this. Information other than the above four types of information may be calculated as information regarding the remaining amount of solder. Alternatively, only one, two, or three of the above four types of information may be calculated.

11 Calculation processing unit (motor control means, remaining amount calculation means, application area calculation means, application volume calculation means, substrate number calculation means, work cycle time acquisition means, work time calculation means, remaining amount display control means, warning display control means )
13 Motor controller (motor control means)
100 Printing device (Adhesive material coating device)
101 Display 110 Solder container (container)
110a Upper opening 111 Solder paste (adhesive material)
112 Piston (extruded part)
113 Supply port 200 Printed circuit board (board)
300 mask 310 opening 711 squeegee (coating means)
723 Servo motor (motor)
723a encoder (position detection means)
724 Ball screw shaft t Mask thickness dimension

Claims (11)

It is configured to supply the adhering material by relatively moving the accommodating container for accommodating the adhering material and the pushing portion and extruding the adhering material from the accommodating container through the supply port. A motor having a position detecting means for detecting a drive position corresponding to a relative position between the container and the pushing portion, and a relative movement;
Motor control means for controlling the supply amount of the adhesion material by performing drive control of the motor based on the drive position of the motor detected by the position detection means;
Application means for applying the adhesion material supplied from the container to the substrate;
Information acquired in advance and related to the relative position between the container and the pusher and the drive position of the motor, and the current relative position between the container and the pusher are detected by the position detection means. And a remaining amount calculating means for calculating information relating to the remaining amount of the adhering material stored in the storage container based at least on the current position of the motor.   The remaining amount calculating means is further configured to calculate information on the remaining amount of the adhering material stored in the storage container based on information on the internal volume of the storage container acquired in advance. Item 2. The adhering material coating apparatus according to Item 1.   The remaining amount calculating means is a first reference position of the motor that is detected by the position detecting means when the containing container and the pushing portion are located at a first relative position where the volume inside the containing container is maximized. A second reference position of the motor detected by the position detecting means when the storage container and the push-out portion are positioned at a second relative position where the volume inside the storage container is minimized, and the storage container On the basis of the current position of the motor detected by the position detecting means at the current relative position with respect to the push-out unit and the dimensional information on the internal volume of the storage container acquired in advance. The adhesive material application device according to claim 2, wherein the adhesive material application device is configured to obtain a remaining amount of the adhesive material.   Based on the remaining amount of the adhering material calculated by the remaining amount calculating means and the application volume of the adhering material per substrate, the number of substrates to which the adhering material can be applied according to the remaining amount of the adhering material, or the adhering material The adhering material coating apparatus according to claim 1, wherein at least any one of the workable time according to the remaining amount of the work can be calculated. An application area calculating means for obtaining an application area of an adhesive material applied to one substrate;
An application volume calculating means for obtaining an application volume of the adhering material per substrate based on the application area per substrate calculated by the application area calculating means and an application thickness of the adhering material applied to the substrate;
Based on the remaining amount of the adhering material obtained by the remaining amount calculating means and the application volume obtained by the applying volume calculating means, the number of substrates for obtaining the number of substrates on which the adhering material can be applied according to the remaining amount of the adhering material. The adhesion material coating apparatus according to claim 4, further comprising a calculation unit. An application area calculating means for obtaining an application area of an adhesive material applied to one substrate;
An application volume calculating means for obtaining an application volume of the adhering material per substrate based on the application area calculated by the application area calculating means and an application thickness of the adhering material applied to the substrate;
A work cycle time acquisition means for acquiring a work cycle time corresponding to the application work time of the adhering material required for one substrate;
Based on the remaining amount of the adhered material obtained by the remaining amount calculating means, the application volume obtained by the applied volume calculating means, and the work cycle time obtained by the work cycle time obtaining means, The adhesion material coating apparatus according to claim 4, further comprising a work time calculation unit that obtains a workable time according to. The application means is configured to apply the adhesion material to the substrate through a mask in which an opening corresponding to the application area of the adhesion material to the substrate is formed,
The application area calculation means is based on any one of the design information of the mask, inspection information for inspecting the application state of the substrate on which the adhesion material is applied, or image information obtained by imaging the mask. , Configured to obtain the application area of the adhesive material applied to one substrate,
The application volume calculation means acquires the application thickness of the adhesion material applied to the substrate based on the thickness dimension of the mask, and the adhesion material per substrate based on the application area and the acquired application thickness. The adhesion material application device according to claim 5 or 6, wherein the application material application device is configured to obtain an application volume of the adhesive material. A display unit;
The adhesion material coating apparatus according to claim 1, further comprising: a remaining amount display control unit that displays information on the remaining amount of the adhesion material obtained by the remaining amount calculation unit on the display unit. .   The information on the remaining amount includes the remaining amount of the adhering material, the ratio of the remaining amount of the adhering material stored in the container, the number of substrates on which the adhering material can be applied, and the workable time according to the remaining amount of the adhering material. The adhesion material application device according to claim 8 containing any of these. A display unit;
10. A warning display control unit that displays a warning on the display unit when information on the remaining amount of the adhered material obtained by the remaining amount calculating unit reaches a predetermined threshold value set in advance. The adhesion material coating device according to any one of the above. The adhesion material is a solder paste,
The storage container is a cylindrical solder container that has an upper opening and a bottom and stores the solder paste,
The pushing portion is a piston that slidably fits to the inner peripheral portion of the upper opening of the cylindrical solder container and has the supply port.
The motor having the position detecting means is a servo motor having an encoder for detecting a rotational position of the motor,
A ball screw shaft for relatively moving the solder container and the piston;
The servo motor is configured to push and supply solder paste from the solder container through the supply port by rotationally driving the ball screw shaft and moving the piston relative to the solder container. The adhesion material coating device according to any one of claims 1 to 10.

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