JP2012093559A - Photosensitive resin composition, and photosensitive element, method for forming barrier wall of image display device and method for manufacturing image display device using the photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing dissolution of a transparent electrode substrate even when a voltage is applied under high temperature and high humidity conditions, and to provide a photosensitive element using the composition, and a method for forming a barrier wall of an image display device and an image display device using these materials.SOLUTION: The photosensitive resin composition is used for forming a barrier wall that separates pixels in an image display device, and the composition includes the following components. They are: (A) a binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D) a compound having an epoxy group. The component (B) contains a compound expressed by general formula (1).

Description

  The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for forming partition walls of an image display device, and a method for manufacturing an image display device.

  2. Description of the Related Art In recent years, an image display device (PLD: Paper Like Display) that is as thin as paper, can be freely carried, and can display characters and images has attracted attention. Such an image display device has visibility and portability, which are the advantages of paper as a normal printed matter, and is capable of electrically rewriting information, so that it can be used as an alternative to paper in terms of environment and cost. Practical application is being attempted.

  As a display technique of the image display device, various types such as a type in which particles are moved by electrophoresis or the like, a liquid crystal type, and an electrochemical type have been devised (for example, see Non-Patent Document 1). In particular, as a type for moving particles, methods such as a microcapsule electrophoresis method, a microcup electrophoresis method, an electronic powder fluid method, and a toner display have been studied. In these systems, white and black particles as a display medium are sealed between transparent electrodes, an electric field is applied, and these particles are electrically moved to form and display a white / black image. In addition, there are active driving and passive driving as driving methods of the image display device, and a back technology (panel circuit) for the image display device has been studied.

  In the case of the particle movement type image display device, a partition wall for enclosing white / black particles as described above is required. As a method for forming such partition walls, a mold transfer method, a screen printing method, a sand blast method, a photolithography method, an additive method, and the like have been proposed (for example, see Patent Document 1). Among these, a photolithographic method that can form a high-definition pattern efficiently by irradiation with actinic rays using a photosensitive resin composition has attracted attention.

  In addition, recently, there are also reports on realizing full color display by examining flexibility and combining a color filter with white / black image display (for example, see Non-Patent Document 2).

  Further, when performing full color display, a color filter is used in combination with a white / black display image display device, and thus it is essential to improve the contrast between pixels. Therefore, a light shielding layer for shielding light between the pixels is required. In the case of monochrome display, in order to increase the brightness of the image of the image display device without using a color filter, transparency rather than light shielding properties may be required.

  The partition walls of the image display device using the photolithography method are formed as follows. That is, a step of laminating a light shielding layer called a black matrix on a transparent electrode substrate by photolithography, and further, a photosensitive resin composition is applied on the light shielding layer or a photosensitive film is laminated on the photosensitive resin composition layer. A step of irradiating a predetermined portion of the photosensitive resin composition layer with actinic rays to photocure the exposed portion, and a step of removing the unexposed portion to form a photocured product pattern. Therefore, in general, the photosensitive resin composition for forming the partition walls of the image display device is required to have sensitivity, resolution, and adhesion to the substrate.

  Moreover, when manufacturing an image display apparatus, the process obtained by filling the display medium, such as particle | grains, in the pattern obtained at the said process, the process of heat-processing the said photocured material pattern, the process of sticking an electrode substrate, etc. are further included. Thereby, the image display apparatus which uses the hardened | cured material of the photosensitive resin composition layer as a partition is obtained.

JP 2007-178881 A

Akira Suzuki, “Latest Trends in Electronic Paper 2007”, October 10, 2007, Journal of the Imaging Society of Japan, Vol. 46, No. 5: 372-384 (2007) Tanuma Itsuo, “Flexible Electronic Paper Using Electron Powder Fluid”, October 10, 2007, Journal of the Imaging Society of Japan, Vol. 46, No. 5: 396-400 (2007)

  In the step of attaching the electrode substrate, since a voltage is applied under high temperature and high humidity, there is a problem that an electrode portion in close contact with the cured product of the photosensitive resin composition is dissolved.

  The present invention has been made in view of the above problems, and a photosensitive resin composition capable of suppressing dissolution of a transparent electrode substrate even when a voltage is applied under high temperature and high humidity, and a photosensitive property using the same. It is an object of the present invention to provide an element, a method for forming a partition wall of an image display device using these materials, and an image display device.

  The present inventor is a photosensitive resin composition for forming a partition for separating pixels in an image display device, wherein the photosensitive resin composition comprises (A) component: carboxyl group and ethylenic group in the molecule. Binder polymer having an unsaturated group, (B) component: photopolymerizable compound, (C) component: photopolymerization initiator, (D) component: a compound having an epoxy group. The present invention was completed by finding that the photosensitive resin composition containing the compound represented by the general formula (1) can suppress dissolution of the electrode.

（一般式（１）中、Ｒ^１及びＲ^２はそれぞれ独立に水素原子又はメチル基を示し、ｍ及びｎはそれぞれ独立に０〜５０の整数を示す。ただし、ｍ＋ｎは１以上の整数である。）

(In General Formula (1), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and m and n each independently represent an integer of 0 to 50. However, m + n is an integer of 1 or more. .)

  The present invention also relates to a photosensitive resin composition containing an inorganic black pigment in which the component (E) is preferably titanium black as an example. Thereby, the contradicting characteristics of light sensitivity and light shielding property can be maintained in a well-balanced manner. On the other hand, in order to improve the brightness of the image display device, there is a case where a photosensitive resin composition for forming a partition wall containing no inorganic black pigment (component (E)) and a photosensitive element using the same are required. Therefore, it may be added as necessary.

  Furthermore, this invention relates to the photosensitive resin composition in which the said (B) component further contains the compound represented by following General formula (2). Thereby, dissolution of the electrode substrate can be suppressed.

［一般式（２）中、Ｒ^３、Ｒ^４及びＲ^５は各々独立に、下記一般式（３）：

[In General Formula (2), R ³ , R ⁴ and R ⁵ are each independently the following General Formula (3):

（一般式（３）中、Ｒ^６は水素原子又はメチル基を示し、Ｘは炭素数２〜６のアルキレン基を示し、Ｚ^１は単結合又は２価の有機基を示し、ｋは１〜３０の整数を示す。）で表される基、或いは、下記一般式（４）：

(In General Formula (3), R ⁶ represents a hydrogen atom or a methyl group, X represents an alkylene group having 2 to 6 carbon atoms, Z ¹ represents a single bond or a divalent organic group, and k represents 1 to Or a group represented by the following general formula (4):

（一般式（４）中、Ｒ^７は水素原子又はメチル基を示し、Ｚ^２は単結合又は２価の有機基を示し、Ｙは炭素数２〜６のアルキレン基を示し、ｍは１〜１０の整数を示し、ｎは１〜１０の整数を示し、ｌは０〜１０の整数を示す。）で表される基を示し、Ｒ^３、Ｒ^４及びＲ^５のうちの少なくとも１つは上記一般式（４）で表される基を示す。］

(In General Formula (4), R ⁷ represents a hydrogen atom or a methyl group, Z ² represents a single bond or a divalent organic group, Y represents an alkylene group having 2 to 6 carbon atoms, and m represents 1 to 10 represents an integer, n represents an integer of 1 to 10, and l represents an integer of 0 to 10.), and at least one of R ³ , R ⁴ and R ⁵ is The group represented by the general formula (4) is shown. ]

In this invention, it is preferable in the compound represented by General formula (4) that n is an integer of 4-25. In addition, it is preferable that Z ¹ and Z ² are a divalent group represented by the following general formula (5).

  The present invention also provides a photosensitive element comprising a support and a photosensitive resin composition layer comprising the photosensitive resin composition of the present invention formed on the support. By using such a photosensitive element, it is possible to form a partition wall that can suppress breakage at the time of bending while suppressing dissolution of the electrode, which is a problem when forming the partition wall of the image display device. Moreover, according to this photosensitive element, the photocured material pattern excellent in the resolution and the adhesiveness can be formed with high sensitivity.

  In the photosensitive element, the thickness of the photosensitive resin composition layer is preferably 10 to 100 μm. As a result, it is possible to further reduce the thickness and contrast of the image display device.

  The present invention is also a method for forming a partition wall of an image display device having flexibility, comprising at least a transparent electrode disposed on a display surface and a partition wall for separating pixels, on the substrate of the image display device, A lamination step of laminating a photosensitive resin composition layer comprising the photosensitive resin composition of the present invention, and an exposure step of irradiating a predetermined portion of the photosensitive resin composition layer with an actinic ray to photocure an exposed portion; And a developing step of forming a photocured product pattern by removing a portion other than the exposed portion of the photosensitive resin composition layer.

  The present invention further relates to a method for manufacturing a flexible image display device comprising at least a transparent electrode disposed on a display surface and a partition wall for separating pixels, and the partition wall of the image display device according to the present invention is formed. Provided is a method for manufacturing an image display device, comprising the step of forming the partition wall by a method.

  According to the method for forming the partition wall of the image display device and the method for manufacturing the image display device, since the partition wall is formed by the photosensitive resin composition of the present invention described above, the dissolution of the electrode when forming the partition wall is suppressed. can do.

  Moreover, it is preferable that the manufacturing method of the said image display apparatus further includes the process of filling a display medium in the said partition, and the process of affixing a board | substrate on the opposite side of a partition so as to oppose one board | substrate.

  Although the detailed factor by which the effect of this invention is acquired is not clear, the photosensitive resin composition of this invention contains (A) component-(D) component, especially (B) component is represented by General formula (1). It is expected that the inclusion of the specific compound represented will contribute to the effects of the invention. ADVANTAGE OF THE INVENTION According to this invention, the partition for image display apparatuses which can suppress melt | dissolution of the electrode at the time of applying a voltage under constant temperature and humidity can be formed.

  Hereinafter, preferred embodiments of the present invention will be described. In this specification, (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto, (meth) acrylate means acrylate and corresponding methacrylate, and (meth) acryloyl means acryloyl and it. Means the corresponding methacryloyl.

(Photosensitive resin composition)
The photosensitive resin composition of the present invention is a photosensitive resin composition for forming a partition wall of an image display device, and the photosensitive resin composition has a carboxyl group and an ethylenic group in the molecule as the component (A). A binder polymer having an unsaturated group, a photopolymerizable compound as the component (B), a photopolymerization initiator as the component (C), a compound having an epoxy group as the component (D), and the component (B) It contains a compound represented by the general formula (1).

  Hereinafter, each component which can be used with the photosensitive resin composition of this invention is demonstrated in detail.

Component (A): Binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule As the component (A) that can be used in the present invention, a film having a carboxyl group and an ethylenically unsaturated group in the molecule is used. There is no particular limitation as long as it can impart properties, and examples thereof include acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and urethane resins. Among these, acrylic resins are preferable from the viewpoint of alkali developability. These can be used alone or in combination of two or more. Examples of combinations of two or more types of binder polymers include two or more types of binder polymers composed of different copolymer components, two or more types of binder polymers having different weight average molecular weights, two or more types of binder polymers having different degrees of dispersion, and the like. Can be mentioned. A polymer having a multimode molecular weight distribution described in JP-A No. 11-327137 can also be used.

  Component (A) is, for example, radical polymerization of a polymerizable monomer having a carboxyl group and another polymerizable monomer, and then adding a monomer having an ethylenically unsaturated bond to the polymerizable monomer. Can be manufactured. Examples of the polymerizable monomer include polymerizable styrene derivatives such as styrene, vinyl toluene, α-methyl styrene, p-methyl styrene, and p-ethyl styrene; acrylamide; acrylonitrile; vinyl alcohol such as vinyl-n-butyl ether. (Meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, (meth) acrylic acid glycidyl ester, 2 , 2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, (meth) acrylic acid, α-bromo (meth) Acrylic acid, α-chrome Lu (meth) acrylic acid, β-furyl (meth) acrylic acid, β-styryl (meth) acrylic acid; maleic acid, maleic anhydride, maleic acid monomethyl ester, maleic acid monoethyl ester, maleic acid monoisopropyl ester, etc. Maleic acid monoesters; fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid, maleimide compounds and the like. The polymerizable monomer having a carboxyl group preferably includes (meth) acrylic acid from the viewpoint of developability and stability, and is preferably an alkyl (meth) acrylate having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate. The ester is preferable in that it can react with an isocyanate group-containing (meth) acrylic acid ester described later to suppress moisture permeability. Moreover, it is preferable that the (meth) acrylate which has cycloalkyl groups, such as dicyclopentanyl (meth) acrylate, is included.

  Moreover, these can be used as a homopolymer alone or in combination of two or more as a copolymer.

  Examples of the (meth) acrylic acid alkyl ester include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, (meth ) Hexyl acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and structural isomers thereof.

  Moreover, as a monomer, it is preferable that an isocyanate group containing acrylic acid ester, an isocyanate group containing methacrylic acid ester, a glycidyl group containing acrylic acid ester, a glycidyl group containing methacrylic acid ester, etc. are included, for example. Thus, for example, when a (meth) acrylic acid alkyl ester having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate described above is included as a monomer, these monomers react to further increase the crosslinking density. Raising the moisture permeability can be suppressed.

  The acid value of the component (A) is preferably 30 mgKOH / g or more, more preferably 80 mgKOH / g or more, further preferably 130 mgKOH / g or more, and 180 mgKOH in terms of excellent resolution. Particularly preferred is /. In terms of excellent developer resistance and adhesion, it is preferably 250 mgKOH / g or less, more preferably 240 mgKOH / g or less, further preferably 230 mgKOH / g or less, and 220 mgKOH / g or less. It is particularly preferred. In addition, when developing with a solvent as a development process, it is preferable to prepare by suppressing the usage-amount of the polymerizable monomer which has a carboxyl group.

  Here, the acid value can be measured as follows. That is, first, about 1 g of a resin solution whose acid value is to be measured is precisely weighed, and then 30 g of acetone is added to this resin solution to dissolve it uniformly. Next, an appropriate amount of phenolphthalein as an indicator is added to the solution, and titration is performed using a 0.1N aqueous KOH solution. And an acid value is computed by following Formula.

A = 10 × Vf × 56.1 / (Wp × I)
In the formula, A represents the acid value (mgKOH / g), Vf represents the titration amount (mL) of a 0.1N KOH aqueous solution, Wp represents the mass (g) of the measured resin solution, and I was measured. The ratio (mass%) of the non volatile matter in a resin solution is shown.

The weight average molecular weight of component (A) (measured by gel permeation chromatography (GPC) and converted by a calibration curve using standard polystyrene) is 20,000 or more in terms of excellent developer resistance. Preferably, it is 23,000 or more, more preferably 25,000 or more. From the viewpoint of shortening the development time, it is preferably 300,000 or less, more preferably 150,000 or less, and even more preferably 100,000 or less. The weight average molecular weight of the binder polymer is measured by gel permeation chromatography and converted using a standard polystyrene calibration curve. The measurement conditions of gel permeation chromatography (GPC) are as shown below.
[GPC measurement conditions]
Pump: Hitachi L-6000 (manufactured by Hitachi, Ltd.)
Column: Gelpack GL-R420 + Gelpack GL-R430 +
Gelpack GL-R440 (three in total) (above, manufactured by Hitachi Chemical Co., Ltd., trade name) Eluent: Tetrahydrofuran Measurement temperature: 25 ° C
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd.)

  The content of the component (A) is preferably 40 parts by mass or more, in terms of excellent coating properties of the photosensitive resin composition, with respect to 100 parts by mass of the total amount of the components (A) and (B), and 45 masses. Part or more is more preferable. In the point which is excellent in the mechanical strength of a photocured material, 70 mass parts or less are preferable with respect to 100 mass parts of total amounts of (A) component and (B) component, and 60 mass parts or less are more preferable.

(B) Component: Photopolymerizable Compound The photosensitive resin composition of the present invention contains a compound represented by the following general formula (1) as an essential component. In the following general formula (1), m + n is an integer of 1 or more, but is preferably 3 or more, more preferably 5 or more in terms of suppressing moisture permeability.

（一般式（１）中、Ｒ^１及びＲ^２はそれぞれ独立に水素原子又はメチル基を示し、ｍ及びｎはそれぞれ独立に０〜５０の整数を示す。ただし、ｍ＋ｎは１以上の整数である。）

(In General Formula (1), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and m and n each independently represent an integer of 0 to 50. However, m + n is an integer of 1 or more. .)

  Although there is no restriction | limiting in particular as another (B) component which can be used for this invention, It is preferable to contain the compound which has an isocyanuric ring structure. As a compound which has an isocyanuric ring structure, the compound represented by following General formula (2) is mentioned, for example.

［一般式（２）中、Ｒ^３、Ｒ^４及びＲ^５は各々独立に、下記一般式（３）：

[In General Formula (2), R ³ , R ⁴ and R ⁵ are each independently the following General Formula (3):

（一般式（３）中、Ｒ^６は水素原子又はメチル基を示し、Ｘは炭素数２〜６のアルキレン基を示し、Ｚ^１は単結合又は２価の有機基を示し、ｋは１〜３０の整数を示す。）で表される基、或いは、下記一般式（４）：

(In General Formula (3), R ⁶ represents a hydrogen atom or a methyl group, X represents an alkylene group having 2 to 6 carbon atoms, Z ¹ represents a single bond or a divalent organic group, and k represents 1 to Or a group represented by the following general formula (4):

（一般式（４）中、Ｒ^７は水素原子又はメチル基を示し、Ｚ^２は単結合又は２価の有機基を示し、Ｙは炭素数２〜６のアルキレン基を示し、ｍは１〜１０の整数を示し、ｎは１〜１０の整数を示し、ｌは０〜１０の整数を示す。）で表される基を示し、Ｒ^３、Ｒ^４及びＲ^５のうちの少なくとも１つは前記一般式（４）で表される基を示す。］

(In General Formula (4), R ⁷ represents a hydrogen atom or a methyl group, Z ² represents a single bond or a divalent organic group, Y represents an alkylene group having 2 to 6 carbon atoms, and m represents 1 to 10 represents an integer, n represents an integer of 1 to 10, and l represents an integer of 0 to 10.), and at least one of R ³ , R ⁴ and R ⁵ is The group represented by the general formula (4) is shown. ]

  In the general formulas (3) and (4), examples of the alkylene group having 2 to 6 carbon atoms represented by X and Y include, for example, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, Examples thereof include a neopentylene group and a hexylene group, and an ethylene group or a propylene group is preferable.

  In the general formula (3), k is preferably an integer of 3 to 20, more preferably an integer of 4 to 15, and more preferably 5 to 10 from the viewpoints of electrode dissolution and developer resistance. Particularly preferred is an integer.

  In the general formula (4), m is preferably 2 to 8 and more preferably 4 to 6 from the viewpoint of the elastic modulus of the cured film to be obtained. In addition, n is preferably an integer of 2 to 10, more preferably an integer of 3 to 8, and particularly preferably an integer of 4 to 6, from the viewpoint of the elastic modulus of the obtained cured film. Furthermore, l is preferably an integer of 1 to 5, more preferably an integer of 1 to 3, from the viewpoint of the elastic modulus of the resulting cured film.

  X in the general formula (3) is preferably an ethylene group or a propylene group, and m in the general formula (4) is preferably 4 to 10.

In the general formulas (3) and (4), Z ¹ and Z ² are preferably each independently a divalent group represented by the following general formula (5).

［一般式（５）中、ｐは１〜１０の整数を示す。］

[In general formula (5), p shows the integer of 1-10. ]

  Here, in the above general formula (5), p is preferably from 2 to 8, and more preferably from 4 to 7, from the viewpoint of the elastic modulus of the obtained cured film.

As what can be obtained with the compound represented by the general formula (2), for example, R ³ , R ⁴ and R ⁵ are groups represented by the general formula (4), R ⁷ is a methyl group, and Y is Examples include an ethylene group, m = 5, n = 3, l = 1, a group in which Z ² is a group represented by the above general formula (5) and p = 6 (manufactured by Nippon Cytec Industries, Ltd.).

  Furthermore, as the component (B) other than the above, it is preferable to include a compound having one ethylenically unsaturated bond in the molecule.

  Although there is no restriction | limiting in particular as said (B) component, In the point which is excellent in resolution, it is preferable that the compound represented by following General formula (6) is included.

［一般式（６）中、Ｒ^８は水素原子又はメチル基を示し、Ｒ^９は水素原子、メチル基又はハロゲン化メチル基のいずれかを示し、Ｒ^１０は炭素数１〜６のアルキル基、ハロゲン原子、水酸基のいずれかを示し、ｐは０〜４の整数を示す。なお、ｐが２以上の場合、複数存在するＲ^１０は同一でも異なっていてもよい。−（Ｏ−Ａ）−はオキシエチレン基及び／又はオキシプロピレン基を示し、−（Ｏ−Ａ）−の繰り返し総数ａは１〜４の整数を示す。］

[In General Formula (6), R ⁸ represents a hydrogen atom or a methyl group, R ⁹ represents a hydrogen atom, a methyl group or a halogenated methyl group, R ¹⁰ represents an alkyl group having 1 to 6 carbon atoms, It represents either a halogen atom or a hydroxyl group, and p represents an integer of 0 to 4. When p is 2 or more, a plurality of R ¹⁰ may be the same or different. -(OA)-represents an oxyethylene group and / or an oxypropylene group, and the total number a of-(OA)-represents an integer of 1 to 4. ]

  Examples of the compound represented by the general formula (6) that can be obtained include γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β. '-(Meth) acryloyloxyethyl-o-phthalate, β-hydroxypropyl-β'-(meth) acryloyloxyethyl-o-phthalate, and the like, among others, γ-chloro-β-hydroxypropyl-β '-(Meth) acryloyloxyethyl-o-phthalate is preferred. Examples of γ-chloro-β-hydroxypropyl-β'-methacryloyloxyethyl-o-phthalate include FA-MECH (manufactured by Hitachi Chemical Co., Ltd., product name).

Furthermore, as other (B) component, for example, polyethylene glycol di (meth) acrylate (having 2 to 14 ethylene groups), polypropylene glycol di (meth) acrylate (having 2 to 14 propylene groups) Polyalkylene glycol di (meth) acrylates such as trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, trimethylolpropane propoxytri (meth) acrylate Trimethylolpropane (meth) acrylate compounds such as: tetramethylolmethane tri (meth) acrylate, tetramethylolmethane (meth) acrylate compounds such as tetramethylolmethane tetra (meth) acrylate Dipentaerythritol (meth) acrylate compounds such as dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate; bisphenol A dioxyethylene di (meth) acrylate, bisphenol A trioxyethylene di (meth) acrylate, Examples thereof include bisphenol A dioxyethylene di (meth) acrylate such as bisphenol A deoxyoxyethylene di (meth) acrylate; trimethylolpropane triglycidyl ether triacrylate, bisphenol A diglycidyl ether acrylate, and the like.
The said (B) component can be used individually or in combination of 2 or more types.

The content of the component (B) is in the range of 30 to 60 parts by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B) from the viewpoints of resolution and adhesion, and film formability. It is preferable to use 35 to 55 parts by mass.

Component (C): Photopolymerization initiator The component (C) that can be used in the present invention is not particularly limited as long as it matches the light wavelength of the exposure machine to be used. Specifically, for example, benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy-4′-dimethylaminobenzophenone, 2-benzyl-2 -Aromatic ketones such as dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1, 2-ethylanthraquinone, Phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2, -Benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenantharaquinone, 2-methyl-1,4-naphthoquinone, Quinones such as 2,3-dimethylanthraquinone; benzoin ether compounds such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin; benzyl derivatives such as benzyl dimethyl ketal; 9- Acridine derivatives such as phenylacridine, 1,7-bis (9,9′-acridinyl) heptane; N-phenylglycine, N-phenylglycine derivatives; coumarin compounds; 2- (o-chloroph Nyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole Dimers, imidazole dimers such as 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; (4-methoxyphenyl) -2,2-dimethoxy-2-phenylethane-1-one, 1- (4-methoxyphenyl) -2-methoxy-2-ethoxy-2-phenylethane-1-one, 1- (4-Methoxyphenyl) -2-methoxy-2-propoxy-2-phenylethane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one ( It referred benzyl dimethyl ketal); and the like. Further, the substituents of the aryl groups of two 2,4,5-triarylimidazoles may be the same to give the target compound, or differently give an asymmetric compound. Moreover, a combination of a thioxanthone compound and a tertiary amine compound may be used, such as a combination of diethylthioxanthone and dimethylaminobenzoic acid. These can be used alone or in combination of two or more.

  Among these, from the viewpoint of improving resolution, it is preferable to include an acridine derivative and a benzyl derivative, and it is particularly preferable to include 1,7-bis (9,9'-acridinyl) heptane.

  The content of the component (C) is preferably 0.1 parts by mass or more and 0.2 parts by mass or more in terms of excellent photosensitivity with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable that Further, with respect to 100 parts by mass of the total amount of the component (A) and the component (B), 20 parts by mass or less is preferable, and 10 parts by mass or less is more preferable in terms of excellent photocuring inside the photosensitive resin composition. preferable.

  In the case where 1,7-bis (9,9′-acridinyl) heptane is included as the component (C), the content thereof is light relative to 100 parts by mass of the total amount of the components (A) and (B). In the point which is excellent in a sensitivity, 0.05-1 mass part is preferable, and it is more preferable that it is 0.1-0.5 mass part.

Component (D): Compound having epoxy group Examples of the component (D) that can be used in the present invention include compounds having an epoxy group (oxirane ring).

  Examples of the compound having an epoxy group include bisphenol A type epoxy resins such as bisphenol A diglycidyl ether, bisphenol F type epoxy resins such as bisphenol F diglycidyl ether, bisphenol S type epoxy resins such as bisphenol S diglycidyl ether, and biphenol. Biphenol type epoxy resin such as diglycidyl ether, bixylenol type epoxy resin such as bixylenol diglycidyl ether, hydrogenated bisphenol A type epoxy resin such as hydrogenated bisphenol A glycidyl ether, dicyclopentadiene type epoxy resin, cresol novolac type epoxy Examples thereof include resins and dibasic acid-modified diglycidyl ether type epoxy resins thereof.

  Commercial products can be used as these compounds. Examples of bisphenol A diglycidyl ether include Epicoat 828, Epicoat 1001 and Epicoat 1002 (all trade names, manufactured by Japan Epoxy Resin Co., Ltd.) and Epicron 1055 (produced by DIC Corporation, trade names).

  Examples of bisphenol F diglycidyl ether include Epicoat 807 (trade name, manufactured by Japan Epoxy Resin Co., Ltd.), and examples of bisphenol S diglycidyl ether include EBPS-200 (trade name, manufactured by Nippon Kayaku Co., Ltd.) and Epicron EXA-1514 (manufactured by DIC Corporation, trade name) and the like can be mentioned.

  Examples of the biphenol diglycidyl ether include YL-6121 (trade name, manufactured by Japan Epoxy Resin Co., Ltd.). Examples of the bixylenol diglycidyl ether include YX-4000 (trade name, manufactured by Japan Epoxy Resin Co., Ltd.). Etc.

  Furthermore, examples of the hydrogenated bisphenol A glycidyl ether include ST-2004 and ST-2007 (both manufactured by Tohto Kasei Co., Ltd., trade names), and the dicyclopentadiene type epoxy resin includes Epicron HP-7200L (DIC). (Trade name, manufactured by Co., Ltd.) and the like, and examples of the cresol novolac type epoxy resin include Epicron N-670-EXP-S (trade name, manufactured by DIC Corporation). In addition, examples of the dibasic acid-modified diglycidyl ether type epoxy resin include ST-5100 and ST-5080 (both manufactured by Tohto Kasei Co., Ltd., trade names).

  Among these, a cresol novolac type epoxy resin is preferable in terms of suppressing dissolution of the electrode. Moreover, the said (D) component can be used individually or in combination of 2 or more types.

Component (E): Inorganic black pigment Examples of the component (E) that can be used in the present invention include titanium black, carbon black, cobalt black, and the like, in that the transmittance at 360 nm and 405 nm is good. Titanium black is preferred.

  The content of the component (E) is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more in terms of excellent light shielding properties with respect to 100 parts by mass of the total amount of the components (A) and (B). Is more preferable. Moreover, 10 mass parts or less are preferable at the point which is excellent in adhesiveness and resolution, and 5 mass parts or less are more preferable.

  The photosensitive resin composition containing the components as described above may further comprise a dye such as malachite green, a photochromic agent such as tribromophenylsulfone or leucocrystal violet, a thermochromic inhibitor, p-toluenesulfonamide, if necessary. Plasticizers such as, pigments other than black, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents, etc. About 0.01-20 mass parts can each be contained with respect to 100 mass parts of total amounts of (A) component and (B) component. These can be used alone or in combination of two or more.

  The photosensitive resin composition of the present invention containing the components as described above can be obtained, for example, by uniformly kneading and mixing the contained components with a roll mill, a bead mill or the like. If necessary, it can be dissolved in a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether or a mixed solvent thereof to obtain a solid content of 30 It can be used as a solution of about ˜60% by mass.

  A method for forming a photosensitive resin composition layer on a substrate for an image display device using the obtained photosensitive resin composition is not particularly limited, but the photosensitive resin composition is used as a liquid resist on the substrate. It can be applied and dried. Moreover, a protective film can be coat | covered on the photosensitive resin composition layer as needed. Further, as will be described in detail later, it is preferable to use the photosensitive resin composition layer in the form of a photosensitive element. When used as a liquid resist, examples of the protective film in the case of coating and using a protective film after coating include polymer films such as polyethylene and polypropylene.

  The photosensitive element of this invention is equipped with the support body and the photosensitive resin composition layer which consists of the said photosensitive resin composition formed on it. As the support, for example, a polymer film such as polyethylene terephthalate, polypropylene, polyethylene, or polyester can be preferably used. The thickness of the polymer film is preferably about 1 to 100 μm, more preferably 5 to 50 μm, and still more preferably 10 to 30 μm.

  Although the formation method of the photosensitive resin composition layer on a support body is not specifically limited, It can implement preferably by apply | coating and drying the solution of the photosensitive resin composition. The thickness of the photosensitive resin composition layer to be applied varies depending on the use, but is preferably about 10 to 100 μm in thickness after drying. When used as a partition wall of an image display device, the thickness of the photosensitive resin composition layer is more preferably 10 to 70 μm, and further preferably 15 to 60 μm in terms of excellent contrast.

  The coating can be performed by a known method such as a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, or a bar coater. Drying can be performed, for example, at 70 to 150 ° C. for about 2 to 30 minutes. Further, the amount of the remaining organic solvent in the photosensitive resin composition layer is preferably 2% by mass or less from the viewpoint of preventing diffusion of the organic solvent in the subsequent step.

  You may coat | cover the photosensitive resin composition layer surface using a protective film on the photosensitive resin composition layer apply | coated on the support body. The protective film preferably has a smaller adhesive strength between the photosensitive resin composition layer and the protective film than the adhesive strength between the photosensitive resin composition layer and the support, and is preferably an olefin film such as polyethylene or polypropylene or polyethylene terephthalate. Is used as a representative polyester film. When using the polyester film as a support and using the same kind of polyester film as the protective film, it is preferable to use a protective film whose surface is in contact with the photosensitive resin layer. These protective films are preferably low fisheye films. Here, “fish eye” means that a material is melted, kneaded, extruded, biaxially stretched, when a film is produced by an extrusion method, a casting method, etc., foreign materials, undissolved materials, oxidized degradation products, etc. Means incorporated into the film. That is, “low fish eye” means that the above-mentioned foreign matter or the like in the film is small. Furthermore, the photosensitive film may have an intermediate layer and a protective layer such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer in addition to the photosensitive resin composition layer, the support, and the optional protective film. Good.

  The manufactured photosensitive element is usually wound around a cylindrical core and stored. In addition, it is preferable to wind up so that a support body may become an outer side at this time. An end face separator is preferably installed on the end face of the roll-shaped photosensitive element roll from the viewpoint of end face protection, and a moisture-proof end face separator is preferably installed from the viewpoint of edge fusion resistance. The term “edge fusion” as used herein refers to a phenomenon in which the photosensitive resin composition layer exudes from the end face, also called cold flow. When this phenomenon occurs, it becomes a foreign matter generation source when the partition wall is formed, which is an undesirable phenomenon. Further, as a packing method, it is preferable to wrap and package in a black sheet having small moisture permeability and excellent light shielding properties. Examples of the core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and ABS resin (acrylonitrile-butadiene-styrene copolymer).

  Next, the formation method and manufacturing method of the partition of the image display apparatus using the photosensitive resin composition and / or photosensitive element of this invention are demonstrated. A lamination step of laminating a photosensitive resin composition or a photosensitive resin composition layer using a photosensitive element on a substrate of an image display device, and a predetermined portion of the photosensitive resin composition layer is irradiated with actinic rays. An exposure step of photocuring the exposed portion and a developing step of removing a portion other than the exposed portion to form a photocured product pattern.

  First, the above-described photosensitive resin composition layer of the present invention is laminated on an electrode substrate of an image display device. Examples of the substrate include an insulating substrate such as a glass substrate or a polymer film substrate or a semiconductor substrate such as a silicon substrate on which electrodes such as ITO, IZO, and Ag wire / ink are formed. As an electrode forming method, a method of patterning an electrode material laminated by a method such as vapor deposition or sputtering using a photolithography method, a method of patterning a photosensitive electrode material, or the like can be used. There are no particular restrictions on the method of forming this electrode. As a method for laminating on the electrode substrate, the above-described coating method can be used, and a photosensitive element can also be used.

In the laminating method using the photosensitive element, when a protective film is present on the photosensitive resin composition layer, it is laminated on the substrate while removing the protective film. As the lamination condition, for example, by heating the photosensitive resin composition layer to about 70 to 130 ° C., it is pressure-bonded on the substrate with a pressure of about 0.1 to 1 MPa (about 1 to 10 kgf / cm ² ). The method of laminating | stacking is mentioned, It is also possible to laminate | stack under reduced pressure. An electrode pattern is usually formed on the surface of the substrate, but it may be flat or uneven as necessary.

  After lamination of the photosensitive resin composition, the photosensitive resin composition layer is irradiated with an actinic ray in an image form to photocur the exposed portion. As a method of irradiating actinic rays in an image form, there is a method of setting a mask pattern on the photosensitive resin composition layer and irradiating the image form with an actinic ray and photocuring the photosensitive resin composition layer in the exposed portion. is there. The mask pattern may be a negative type or a positive type, and a commonly used one can be used. As the light source of actinic light, a known light source, for example, a light source that effectively emits ultraviolet light, visible light, or the like, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, or a xenon lamp is used. As an exposure method, a direct drawing exposure method in which a pattern is directly drawn with a laser without using a mask pattern can also be used.

  A photocured material pattern is formed on the substrate for an image display device by selectively removing the photosensitive resin composition layer in the unexposed portion after the exposure by development. In the development step, when a support is present, the support is removed prior to development. Development is performed by removing unexposed portions by wet development, dry development, or the like using a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent. In the present invention, it is preferable to use an alkaline aqueous solution. Examples of the alkaline aqueous solution include a dilute solution of 0.1 to 5 mass% sodium carbonate, a dilute solution of 0.1 to 5 mass% potassium carbonate, a dilute solution of 0.1 to 5 mass% potassium hydroxide, and the like. . The pH of the alkaline aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin composition layer. Moreover, you may mix surfactant, an antifoamer, an organic solvent, etc. in alkaline aqueous solution. Examples of the development method include a dip method, a spray method, brushing, and slapping. The spray method is preferable for improving the resolution.

  As a treatment after development, the formed photocured product pattern may be further cured by a heat treatment at about 60 to 250 ° C., if necessary.

Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples without departing from the technical idea of the present invention.
(Examples 1-5 and Comparative Examples 1-7)
Component (C): Photopolymerization initiator EAB (N, N′-tetraethyl-4,4′-diaminobenzophenone, manufactured by Hodogaya Chemical Co., Ltd., trade name) 0.05 g, TPS (tribromomethylphenylsulfone, Sumitomo Sei) Manufactured by Kasei Co., Ltd., product name) 0.5 g, N-1717 (1,7-bis (9-acridinyl) heptane, manufactured by ADEKA Corporation, product name) 0.3 g, I-651 (benzyldimethyl ketal, Ciba Specialty Chemical Co., Ltd., trade name) 3g
Component (D): Compound having an epoxy group, Epicron N-670-EXP-S (cresol novolac type epoxy resin, manufactured by DIC Corporation, trade name) 12.8 g
(E) component: inorganic black pigment BT-1HCA (titanium black dispersion, manufactured by Gemco Co., Ltd., trade name) 0.59 g
(Other ingredients)
Fluorene DOPA-17HF (dispersant, manufactured by Kyoeisha Chemical Co., Ltd., trade name) 0.25 g, SZ-6030 (methacryloyloxypropyltrimethoxysilane, Toray Dow Corning Co., Ltd., trade name) 5 g, toluene 12 g, methanol 4 g Was mixed to obtain a solution.

  The components (A) and (B) shown in Table 1 were dissolved in this solution to obtain a photosensitive resin composition. Next, this photosensitive resin composition solution was uniformly applied on a 16 μm thick polyethylene terephthalate film (trade name: FB-40, manufactured by Toray Industries, Inc.) and dried for 10 minutes with a hot air convection dryer at 90 ° C. A photosensitive element was obtained by protection with a protective film made of polyethylene (tensile strength in the film longitudinal direction: 16 MPa, tensile strength in the film width direction: 12 MPa, trade name: NF-15, manufactured by Tamapoly Co., Ltd.). The film thickness after drying of the photosensitive resin composition layer was 45 μm.

  A polyethylene protective film is placed on the ITO surface of a PET substrate with ITO (R-300 manufactured by Toyobo Co., Ltd.) so that the photosensitive resin composition layer is in contact with the surface of the PET substrate with ITO. Lamination was performed through a laminating roll heated to 110 ° C. while peeling. The structure of the completed laminate is a PET base with ITO, a photosensitive resin composition layer, and a polyethylene terephthalate film (support) from the bottom. The obtained laminate was evaluated for film properties, sensitivity, adhesion, resolution, and electrode solubility.

<Evaluation of film properties>
After producing the photosensitive element, it was stored at 10 ° C. or less, and after 60 days, the occurrence of wrinkles on the surface of the photosensitive resin composition layer was evaluated. The case where wrinkles were not observed within 2 months was regarded as “good”, and the situation was evaluated when the occurrence was observed. The results are shown in Table 1.

<Evaluation of sensitivity>
Using a parallel light exposure machine EXM-1201 (manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp, a phototool having a 41-step tablet was brought into close contact with the laminated polyethylene terephthalate film for exposure. After the exposure, the polyethylene terephthalate film was peeled off, and an unexposed portion was removed by spraying a 1% by mass aqueous sodium carbonate solution at 30 ° C. The energy amount (exposure amount) at which the number of remaining step steps after development of the 41-step tablet was 29.0 was defined as sensitivity (mJ / cm ² ). It shows that a sensitivity is so high that the numerical value of this energy amount is small. Table 1 shows the evaluation results.

<Evaluation of adhesion>
Using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) EXM-1201 having a high-pressure mercury lamp, the line width / space width is 10/300 to 80/300 (unit: μm, space width constant) as a negative for adhesion evaluation ) And a phototool having a 41-step tablet are closely attached to the polyethylene terephthalate film of the laminate, and the amount of energy of the remaining step after development of the 41-step tablet is 29.0. Exposure was performed. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass sodium carbonate aqueous solution was sprayed at 30 ° C. to remove the unexposed part and evaluate the adhesion. Adhesiveness is expressed by the width (μm) of the line that remains without being peeled off by the developer. The smaller the value, the higher the adhesiveness because the thin line is in close contact with the glass substrate without being peeled off. Indicates. Table 1 shows the evaluation results.

<Evaluation of resolution>
On a polyethylene terephthalate film of a laminate, a phototool having a 41-step tablet and a phototool having a wiring pattern with a line width / space width of 30/30 to 200/200 (unit: μm) as a negative for resolution evaluation Using a collimated light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) EXM-1201 having a high-pressure mercury lamp lamp, exposure is performed with an energy amount such that the number of remaining step stages after development of the 41-step tablet is 29.0. It was. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C. to remove the unexposed part and evaluate the resolution. The resolution is represented by the smallest space width (μm) in which the unexposed portion is removed well by the development process, and the smaller this value, the better the resolution. Table 1 shows the evaluation results.

<Solubility of electrode>
On the ITO surface of an ITO-TEG (Test Element Group) substrate (line width / space width is 80/80 (unit: μm)), the photosensitive element is disposed on the ITO-TEG substrate surface. Lamination was carried out through a laminating roll heated to 110 ° C. while peeling off the polyethylene protective film so as to come into contact. The structure of the finished laminate is an ITO-TEG substrate, a photosensitive resin composition layer, and a polyethylene terephthalate film from the bottom. The obtained laminate was exposed with an energy amount such that the number of remaining steps after development was 29.0 using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) EXM-1201 having a high-pressure mercury lamp. After the exposure, the polyethylene terephthalate film was peeled off, and an unexposed portion was removed by spraying a 1% by mass aqueous sodium carbonate solution at 30 ° C. Then, it left still for 1 hour in the box-type dryer (Mitsubishi Electric Corporation make, model number: NV50-CA) heated to 120 degreeC. Next, a direct current voltage of 80 V was applied under the conditions of 60 ° C. and 90% RH, the resistance value of the anode after 100 hours was measured, and the rate of increase from the initial value was calculated from the following formula. The resistance increase rate of less than 100% was evaluated as “◯”, 100% or more as “Δ”, and the case where the electrode was dissolved and the resistance value could not be measured was evaluated as “×”. Table 1 shows the evaluation results.
Resistance increase rate (%) = (Anode resistance value after 100 hours) × 100 / (Initial value of anode resistance value) −100

配合量の単位：ｇ
○：電極の抵抗値上昇率１００％未満、△：上昇率１００％以上、×：溶解ありのため測定不可
＊１（ＭＩＳ−１１５）；メタクリル酸−2-ヒドロキシエチル／メタクリル酸／Ｎ−シクロヘキシルマレイミド／ジシクロペンタニルメタクリレート共重合体（質量比３９．５／１５／１３．５／３２、２−イソシアネートエチルメタクリレート１．５ｍｍｏｌ／ｇ付加（綜研化学株式会社製 商品名：フォレットＭＩＳ−１１５）
＊２（樹脂A）；メタクリル酸／メタクリル酸メチル／メタクリル酸ブチル共重合体（樹脂Ａ、質量比３０／３５／３５、重量平均分子量５０,０００、酸価１９６ｍｇＫＯＨ／ｇ）の４８質量％メチルセロソルブ／トルエン（質量比６／４）溶液９３．７５ｇ（固形分４５ｇ）
＊３（ＨＴ−９０８２−９５）；末端にヒドロキシル基を有するポリカーボネート化合物、有機イソシアネート及び２−ヒドロキシエチルアクリレートを反応させて得られた光重合性化合物、重量平均分子量４０００（日立化成工業株式会社製、商品名：ＨＴ−９０８２−９５）
＊４（ＵＡ２１ＥＢ）；トリス（ヒドロキシエチル）イソシアヌレート（新中村化学工業株式会社製、商品名ＮＫオリゴＵＡ−２１）
＊５（ＪＴＸ−０３９Ｂ）；上記一般式（２）で表される化合物であって、Ｒ^３及びＲ^４が上記一般式（３）で表される基、Ｒ^５が上記一般式（４）で表される基、Ｒ^６がメチル基、Ｘがエチレン基、ｋ＝７、Ｒ^７がメチル基、Ｙがエチレン基、ｍ＝５、ｎ＝４、ｌ＝１、Ｚ^１及びＺ^２が上記一般式（５）で表される基、ｐ＝６、である化合物（日本サイテックインダストリーズ株式会社製、サンプル名）
＊６（ＦＡ−０２３Ｍ）；(ＥＯ)(ＰＯ)(ＥＯ)変性ポリプロピレングリコール＃700ジメタクリレート（日立化成工業株式会社製、商品名：ＦＡ−０２３Ｍ）
＊７（ＦＡ-０２４Ｍ）；(ＰＯ)(ＥＯ)(ＰＯ)変性ポリエチレングリコールジメタクリレート（日立化成工業株式会社製、商品名：ＦＡ−０２４Ｍ）
＊８（ＡＰＧ−４００）；上記一般式（１）で表される化合物であって、ｍ＋ｎ＝７、であるプロピレングリコールジアクリレート（新中村化学工業社製商品名：ＡＰＧ−４００）
＊９（ＦＡ−ＭＥＣＨ）；γ−クロロ−β−ヒドロキシプロピル−β’−メタクリロイルオキシエチル−ｏ−フタレート（日立化成工業株式会社製、商品名：ＦＡ−ＭＥＣＨ）

Unit of compounding amount: g
○: Resistance increase rate of electrode is less than 100%, Δ: Rate of increase is 100% or more, X: Measurement is impossible due to dissolution * 1 (MIS-115); Methacrylic acid-2-hydroxyethyl / methacrylic acid / N-cyclohexyl Maleimide / dicyclopentanyl methacrylate copolymer (mass ratio 39.5 / 15 / 13.5 / 32, 2-isocyanatoethyl methacrylate 1.5 mmol / g addition (trade name: Foret MIS-115, manufactured by Soken Chemical Co., Ltd.)
* 2 (resin A): 48% by mass methyl methacrylate / methyl methacrylate / butyl methacrylate copolymer (resin A, mass ratio 30/35/35, weight average molecular weight 50,000, acid value 196 mgKOH / g) Cellosolve / toluene (mass ratio 6/4) solution 93.75 g (solid content 45 g)
* 3 (HT-9082-95); photopolymerizable compound obtained by reacting a hydroxyl group-terminated polycarbonate compound, organic isocyanate and 2-hydroxyethyl acrylate, weight average molecular weight 4000 (manufactured by Hitachi Chemical Co., Ltd.) Product name: HT-9082-95)
* 4 (UA21EB); Tris (hydroxyethyl) isocyanurate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name NK Oligo UA-21)
* 5 (JTX-039B); a compound represented by the above general formula (2), wherein R ³ and R ⁴ are groups represented by the above general formula (3), and R ⁵ is the above general formula (4). R ⁶ is a methyl group, X is an ethylene group, k = 7, R ⁷ is a methyl group, Y is an ethylene group, m = 5, n = 4, l = 1, Z ¹ and Z ² are Compound represented by general formula (5), p = 6 (Nippon Cytec Industries, Ltd., sample name)
* 6 (FA-023M); (EO) (PO) (EO) modified polypropylene glycol # 700 dimethacrylate (manufactured by Hitachi Chemical Co., Ltd., trade name: FA-023M)
* 7 (FA-024M); (PO) (EO) (PO) modified polyethylene glycol dimethacrylate (manufactured by Hitachi Chemical Co., Ltd., trade name: FA-024M)
* 8 (APG-400); a propylene glycol diacrylate represented by the general formula (1), wherein m + n = 7 (trade name: APG-400, manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 9 (FA-MECH); γ-chloro-β-hydroxypropyl-β′-methacryloyloxyethyl-o-phthalate (manufactured by Hitachi Chemical Co., Ltd., trade name: FA-MECH)

  As is clear from Table 1, the binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule of component (A) and the photopolymerizable compound represented by general formula (1) of component (B) are contained. In Examples 1 to 5, it was possible to prevent dissolution of the transparent electrode.

Claims (11)

In an image display device, a photosensitive resin composition for forming a partition separating pixels,
The photosensitive resin composition is
(A) component: a binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule;
(B) component: a photopolymerizable compound,
Component (C): photopolymerization initiator,
(D) component: contains a compound having an epoxy group,
The photosensitive resin composition in which the said (B) component contains the compound represented by following General formula (1).

(In General Formula (1), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and m and n each independently represent an integer of 0 to 50. However, m + n is an integer of 1 or more. .)   Furthermore, (E) component: The photosensitive resin composition of Claim 1 containing an inorganic type black pigment. The photosensitive resin composition according to claim 1 or 2, wherein the component (B) further contains a compound represented by the following general formula (2).

[In General Formula (2), R ³ , R ⁴ and R ⁵ are each independently the following General Formula (3):

(In General Formula (3), R ⁶ represents a hydrogen atom or a methyl group, X represents an alkylene group having 2 to 6 carbon atoms, Z ¹ represents a single bond or a divalent organic group, and k represents 1 to Or a group represented by the following general formula (4):

(In General Formula (4), R ⁷ represents a hydrogen atom or a methyl group, Z ² represents a single bond or a divalent organic group, Y represents an alkylene group having 2 to 6 carbon atoms, and m represents 1 to 10 represents an integer, n represents an integer of 1 to 10, and l represents an integer of 0 to 10.), and at least one of R ³ , R ⁴ and R ⁵ is The group represented by the general formula (4) is shown. ]   The photosensitive resin composition of Claim 3 whose n in the compound represented by the said General formula (4) is an integer of 4-25. Wherein Z ¹ and the Z ² is a divalent group represented by the following general formula (5), according to claim 3 or claim 4 photosensitive resin composition.

[In general formula (5), p shows the integer of 1-10. ]   The photosensitive resin composition in any one of Claims 1-5 in which the inorganic type black pigment of the said (E) component contains titanium black.   A photosensitive element provided with the photosensitive resin composition layer which consists of a photosensitive resin composition in any one of Claims 1-6 formed on the support body and this support body.   The photosensitive element of Claim 7 whose film thickness of the said photosensitive resin composition layer is 10-100 micrometers. A method for forming a partition wall of an image display device having flexibility, comprising at least a transparent electrode disposed on a display surface and a partition wall for separating pixels.
A laminating step of laminating a photosensitive resin composition layer made of the photosensitive resin composition according to any one of claims 1 to 6 on a substrate of the image display device;
An exposure step of irradiating a predetermined portion of the photosensitive resin composition layer with an actinic ray to photocure an exposed portion; and
A development step of removing a portion other than the exposed portion of the photosensitive resin composition layer to form a photocured product pattern;
A method for forming a partition wall of an image display device. A method of manufacturing an image display device having flexibility, comprising at least a transparent electrode disposed on a display surface and a partition wall for separating pixels,
The manufacturing method of an image display apparatus which has the process of forming the said partition by the method of Claim 9. Filling the partition with a display medium;
A step of attaching the substrate to the opposite side of the partition so as to face one of the substrates;
The method for manufacturing an image display device according to claim 10, further comprising: