JP2012084855A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2012084855A
JP2012084855A JP2011196147A JP2011196147A JP2012084855A JP 2012084855 A JP2012084855 A JP 2012084855A JP 2011196147 A JP2011196147 A JP 2011196147A JP 2011196147 A JP2011196147 A JP 2011196147A JP 2012084855 A JP2012084855 A JP 2012084855A
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light emitting
support
conductive layer
emitting element
emitting device
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JP6166863B2 (en
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Keiichi Maki
圭一 巻
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Toshiba Hokuto Electronics Corp
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Abstract

PROBLEM TO BE SOLVED: To stably hold a light-emitting device with a support having translucency and conductivity with a low contact resistance.SOLUTION: The light-emitting device includes a first support 10, a second support 20, a light-emitting device 32, and an intermediate layer 30. The first support 10 has translucency and includes a first base 12 and a first conductive layer 14 formed on a surface of the first base 12. The second support 20 includes a second base 22 and a second conductive layer 24 formed on a surface of the second base 22, and is arranged such that the first conductive layer 14 and the second conductive layer 24 are opposed to each other. Electrodes 33, 34 of the light-emitting device 32 are in contact with the first conductive layer 14 and the second conductive layer 24. The intermediate layer 30 is charged between the first support 10 and the second support 20, and is formed of an electrical insulating material having translucency. At least one of the first support 10 and the second support 20 has flexibility.

Description

本発明は、透光性および導電性を持つ支持体で支持した発光素子を備えた発光装置に関する。   The present invention relates to a light emitting device including a light emitting element supported by a support having translucency and conductivity.

発光素子を基材などに電気的に接続する方法として、素子発光面電極では導電接続材料として金属細線を用いたワイヤボンディング法による接続が、反対側電極ではハンダあるいは導電性ペーストを用いた接続が一般的である。   As a method for electrically connecting a light emitting element to a substrate or the like, the element light emitting surface electrode is connected by a wire bonding method using a thin metal wire as a conductive connecting material, and the opposite electrode is connected using solder or a conductive paste. It is common.

特許文献１には、ワイヤボンディング法を用いない発光素子の接続方法が開示されている。この方法では、素子電極と基材導電層の接続のため、導電接続材料として前駆体層が必要である。   Patent Document 1 discloses a method for connecting light emitting elements without using a wire bonding method. In this method, a precursor layer is required as a conductive connection material for connection between the device electrode and the base conductive layer.

特開２００９−３８３３１号公報JP 2009-38331 A

ワイヤボンディング法で発光素子を電気的に接続する場合、ワイヤが金属細線であるため、発光素子側と基材側とに同種あるいは金などの透光性をもたない電極に接続する必要がある。また、一般的なハンダあるいは導電性ペーストは、透光性を持たない。   When the light emitting element is electrically connected by the wire bonding method, since the wire is a thin metal wire, it is necessary to connect the light emitting element side and the substrate side to the same kind or electrodes having no translucency such as gold. . Further, general solder or conductive paste does not have translucency.

そこで、本発明は、発光素子を透光性および導電性を持つ支持体で安定して保持し、かつ、接触抵抗を小さくすることを目的とする。   Accordingly, an object of the present invention is to stably hold a light-emitting element with a light-transmitting and conductive support and reduce contact resistance.

上述の課題を解決するため、本発明は、発光装置において、第１基体とその第１基体の表面に形成された第１導電層とを備えた透光性を持つ第１支持体と、第２基体とその第２基体の表面に形成された第２導電層とを備えて前記第１導電層と前記第２導電層とが対向するように配置された第２支持体と、前記第１導電層に接する第１電極と前記第２導電層に接する第２電極とを備えた発光素子と、前記第１支持体と前記第２支持体との間に充填された透光性を持つ電気絶縁性の中間層と、を有し、前記第１支持体および前記第２支持体の少なくとも一方は屈曲性を持つことを特徴とする。   In order to solve the above-described problems, the present invention provides a light-emitting device including a first base having translucency, which includes a first base and a first conductive layer formed on a surface of the first base. A second support including a second substrate and a second conductive layer formed on a surface of the second substrate, the first conductive layer and the second conductive layer being opposed to each other; A light-emitting element having a first electrode in contact with a conductive layer and a second electrode in contact with the second conductive layer, and a light-transmitting electricity filled between the first support and the second support An insulating intermediate layer, wherein at least one of the first support and the second support is flexible.

本発明によれば、発光素子を透光性および導電性を持つ支持体で安定して保持し、かつ、接触抵抗を小さくすることができる。   According to the present invention, the light emitting element can be stably held by the support having translucency and conductivity, and the contact resistance can be reduced.

本発明に係る発光装置の第１の実施の形態における一部拡大断面図である。It is a partially expanded sectional view in 1st Embodiment of the light-emitting device which concerns on this invention. 本発明に係る発光装置の第１の実施の形態の斜視図である。1 is a perspective view of a first embodiment of a light emitting device according to the present invention. 本発明に係る発光装置の第２の実施の形態における一部拡大断面図である。It is a partially expanded sectional view in 2nd Embodiment of the light-emitting device which concerns on this invention. 本発明に係る発光装置の第２の実施の形態の端部近傍の断面図である。It is sectional drawing of the edge part vicinity of 2nd Embodiment of the light-emitting device which concerns on this invention.

本発明に係る発光装置の実施の形態を、図面を参照して説明する。なお、同一または類似の構成には同一の符号を付し、重複する説明は省略する。   Embodiments of a light emitting device according to the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or similar structure, and the overlapping description is abbreviate | omitted.

［第１の実施の形態］
図１は、本発明に係る発光装置の第１の実施の形態における一部拡大断面図である。図２は、本実施の形態の発光装置の斜視図である。また、図２には、発光装置４０と電源との接続状態を模式的に示した。 [First Embodiment]
FIG. 1 is a partially enlarged sectional view of a light emitting device according to a first embodiment of the present invention. FIG. 2 is a perspective view of the light emitting device of the present embodiment. FIG. 2 schematically shows a connection state between the light emitting device 40 and the power source.

この発光装置４０は、第１支持体１０と第２支持体２０と発光素子３２と中間層３０とを有している。発光素子３２は、発光ダイオード（ＬＥＤ）である。発光素子３２の一方の端部には、発光素子３２よりも面積が小さい第１電極３３が設けられている。発光素子３２の第１電極３３が設けられた端部に対して反対側の端部には、第２電極３４が設けられている。第１電極３３および第２電極３４は、たとえば金で形成されている。   The light emitting device 40 includes a first support 10, a second support 20, a light emitting element 32, and an intermediate layer 30. The light emitting element 32 is a light emitting diode (LED). A first electrode 33 having a smaller area than the light emitting element 32 is provided at one end of the light emitting element 32. A second electrode 34 is provided at the end opposite to the end where the first electrode 33 of the light emitting element 32 is provided. The first electrode 33 and the second electrode 34 are made of, for example, gold.

第１支持体１０は、平板状の第１基体１２と、第１基体の一方の表面に形成された第１導電層１４とからなる。第２支持体２０は、平板状の第２基体２２と、第２基体２２の一方の表面に形成された第２導電層２４とからなる。第１支持体１０および第２支持体２０は、いずれも屈曲性および透光性を有する。   The first support 10 includes a flat plate-like first base 12 and a first conductive layer 14 formed on one surface of the first base. The second support 20 includes a flat plate-like second base 22 and a second conductive layer 24 formed on one surface of the second base 22. Both the first support 10 and the second support 20 have flexibility and translucency.

第１基体１２および第２基体２２は、たとえばポリエチレンテレフタラート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリカーボネート（ＰＣ）、ポリエチレンサクシネート（ＰＥＳ）、アートン（ＡＲＴＯＮ）、アクリル樹脂などで形成することができる。第１基体１２および第２基体２２の厚さは、たとえば１２５μｍ程度である。   The first substrate 12 and the second substrate 22 are made of, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethylene succinate (PES), arton (ARTON), acrylic resin, or the like. Can do. The thickness of the first base 12 and the second base 22 is, for example, about 125 μm.

第１導電層１４および第２導電層２４は、たとえば酸化インジウムスズ（ＩＴＯ）、酸化亜鉛（ＺｎＯ）などで形成される。第１導電層１４および第２導電層２４の厚さは、たとえば１μｍ程度である。   The first conductive layer 14 and the second conductive layer 24 are made of, for example, indium tin oxide (ITO), zinc oxide (ZnO), or the like. The thickness of the first conductive layer 14 and the second conductive layer 24 is, for example, about 1 μm.

第２支持体２０は、第２導電層２４が第１導電層１４と対向するように配置される。第１支持体１０と第２支持体２０との間には、発光素子３２が配置される。発光素子３２の第１電極３３は、第１導電層１４に接している。発光素子３２の第２電極３４は、第２導電層２４と接している。   The second support 20 is disposed so that the second conductive layer 24 faces the first conductive layer 14. A light emitting element 32 is disposed between the first support 10 and the second support 20. The first electrode 33 of the light emitting element 32 is in contact with the first conductive layer 14. The second electrode 34 of the light emitting element 32 is in contact with the second conductive layer 24.

中間層３０は、第１支持体１０および第２支持体２０の間に充填されている。中間層３０は、透光性および屈曲性を持つ電気絶縁性の材料で形成される。ここで、透光性は、日本工業規格ＪＩＳＫ７１０５で測定した全光透過率が５０％以上であることが好ましい。中間層３０は、たとえばアクリル系エラストマーなどの熱可塑性樹脂で形成される。中間層３０の厚さは、発光素子３２の第１電極３３側の端部と第２電極３４側の端部の間の距離よりも小さく、たとえば１７５μｍないし２９０μｍである。   The intermediate layer 30 is filled between the first support 10 and the second support 20. The intermediate layer 30 is formed of an electrically insulating material having translucency and flexibility. Here, the translucency is preferably such that the total light transmittance measured by Japanese Industrial Standard JISK7105 is 50% or more. The intermediate layer 30 is formed of a thermoplastic resin such as an acrylic elastomer. The thickness of the intermediate layer 30 is smaller than the distance between the end on the first electrode 33 side and the end on the second electrode 34 side of the light emitting element 32, and is, for example, 175 μm to 290 μm.

第１支持体１０および第２支持体２０の形状は、たとえばシート状でほぼ同じ大きさの長方形であり、少しずれて対向している。その結果、第１支持体１０および第２支持体２０の端部には、第１導電層１４および第２導電層２４がそれぞれ第２支持体２０あるいは第１支持体１０に覆われずに露出している。中間層３０は、第１導電層１４および第２導電層２４がそれぞれ第２支持体２０あるいは第１支持体１０に覆われずに露出した部分に、若干はみ出している。露出した第１導電層１４および第２導電層２４には、それぞれ電源４２から延びた配線４４，４５が接続されている。   The shapes of the first support 10 and the second support 20 are, for example, sheet-like rectangles having substantially the same size, and face each other with a slight deviation. As a result, the first conductive layer 14 and the second conductive layer 24 are exposed at the ends of the first support 10 and the second support 20 without being covered by the second support 20 or the first support 10, respectively. is doing. The intermediate layer 30 slightly protrudes from a portion where the first conductive layer 14 and the second conductive layer 24 are exposed without being covered with the second support 20 or the first support 10. Wirings 44 and 45 extending from the power source 42 are connected to the exposed first conductive layer 14 and second conductive layer 24, respectively.

本実施の形態の発光装置４０は、５個の発光素子３２を有している。これらの発光素子３２は、電気的に並列に電源４２に接続されている。   The light emitting device 40 of this embodiment has five light emitting elements 32. These light emitting elements 32 are electrically connected to the power source 42 in parallel.

この発光装置４０は、たとえば以下の方法で製造される。   The light emitting device 40 is manufactured, for example, by the following method.

まず、第１基体１２および第２基体２２となるポリエチレンテレフタラートのシートの一方の表面に、第１導電層１４および第２導電層２４となるＩＴＯの層をスパッタリングなどによって形成する。次に、中間層３０の材料であるアクリル系エラストマーに発光素子３２とほぼ同じ大きさの貫通孔を形成する。   First, an ITO layer to be the first conductive layer 14 and the second conductive layer 24 is formed on one surface of the polyethylene terephthalate sheet to be the first base 12 and the second base 22 by sputtering or the like. Next, a through-hole having substantially the same size as that of the light emitting element 32 is formed in the acrylic elastomer that is the material of the intermediate layer 30.

この中間層３０の材料を、第１支持体１０の第１導電層１４が形成された方の表面に密着させる。第１支持体１０の材料の表面に中間層３０の材料を密着させた後に発光素子３２とほぼ同じ大きさの貫通孔を形成してもよい。   The material of the intermediate layer 30 is brought into close contact with the surface of the first support 10 on which the first conductive layer 14 is formed. A through hole having substantially the same size as that of the light emitting element 32 may be formed after the material of the intermediate layer 30 is brought into close contact with the surface of the material of the first support 10.

その後、中間層３０の材料に形成された貫通孔に、発光素子３２を配置していく。発光素子３２をすべての貫通孔に配置した後、中間層３０の材料の第１支持体１０と反対側の表面に、第２支持体２０の第２導電層２４が形成された方の表面を密着させる。その後、熱ドラムで挟むことにより、加圧しながら加熱する。   Thereafter, the light emitting elements 32 are arranged in the through holes formed in the material of the intermediate layer 30. After the light emitting elements 32 are disposed in all the through holes, the surface of the second support 20 on which the second conductive layer 24 is formed is formed on the surface of the material of the intermediate layer 30 opposite to the first support 10. Adhere closely. Then, it heats, pressurizing by pinching with a thermal drum.

このようにして形成した発光装置４０を、第１支持体１０および第２支持体２０が屈曲性を持つ範囲で変形された状態で設置する。つまり、第１支持体１０および第２支持体２０が、塑性変形したり割れを生じたりしない弾性変形の範囲で変形されて設置される。その後、発光装置４０に電源４２を接続する。   The light emitting device 40 formed in this way is installed in a state where the first support 10 and the second support 20 are deformed within a range in which they have flexibility. That is, the first support body 10 and the second support body 20 are deformed and installed within a range of elastic deformation that does not cause plastic deformation or cracking. Thereafter, the power source 42 is connected to the light emitting device 40.

このような状態で、電源４２によって発光素子３２の電極３３，３４間に電圧が印加されることにより、発光素子３２は発光する。発光素子３２が発生した光は、中間層３０および第１支持体１０を透過する。つまり、その光は、発光装置４０の外部から視認されることになる。このように、本実施の形態では、平板状の発光装置４０を変形させた状態で発光させることができる。   In such a state, when a voltage is applied between the electrodes 33 and 34 of the light emitting element 32 by the power source 42, the light emitting element 32 emits light. The light generated by the light emitting element 32 passes through the intermediate layer 30 and the first support 10. That is, the light is visually recognized from the outside of the light emitting device 40. Thus, in this Embodiment, it can be made to light-emit in the state which deform | transformed the flat light-emitting device 40. FIG.

また、第２支持体２０も透光性を持つため、発光素子３２が発生した光は発光装置４０の両面から放出される。さらに、発光素子３２以外の部分が透光性を持つため、あたかも宙に浮いているような光を発することができる。   Further, since the second support 20 also has translucency, light generated by the light emitting element 32 is emitted from both surfaces of the light emitting device 40. Furthermore, since parts other than the light emitting element 32 have translucency, it is possible to emit light as if floating in the air.

発光素子３２自体が透光性を持つ場合には、第１支持体１０に設けられた第１導電層１４に接する第１電極３３を発光素子３２の端部よりも小さくしておくと、第１電極３３の端部の第１電極３３で覆われていない部分からも光が第１支持体１０に向かって放出される。その結果、発光装置４０の外部に到達する光量が増大する。   In the case where the light emitting element 32 itself has translucency, the first electrode 33 in contact with the first conductive layer 14 provided on the first support 10 is made smaller than the end of the light emitting element 32, Light is also emitted toward the first support 10 from a portion of the end of the one electrode 33 that is not covered with the first electrode 33. As a result, the amount of light reaching the outside of the light emitting device 40 increases.

複数の発光素子３２は、電気的に並列に電源４２に接続されている。つまり、それぞれの発光素子３２の電極３３，３４には同じ電圧が印加される。その結果、発光素子３２が同じものであれば、それぞれの発光素子３２には同じ電流が流れ、それぞれの発光素子３２の発光強度は同じとなる。また、第１導電層１４および第２導電層２４には、発光素子３２の数に比例した電流が流れることになる。第１導電層１４および第２導電層２４にＩＴＯを用いると、ＩＴＯは電気抵抗が比較的大きいため、電気回路の安定化に寄与する。   The plurality of light emitting elements 32 are electrically connected to the power source 42 in parallel. That is, the same voltage is applied to the electrodes 33 and 34 of the respective light emitting elements 32. As a result, if the light emitting elements 32 are the same, the same current flows through each light emitting element 32, and the light emission intensity of each light emitting element 32 is the same. In addition, a current proportional to the number of light emitting elements 32 flows through the first conductive layer 14 and the second conductive layer 24. When ITO is used for the first conductive layer 14 and the second conductive layer 24, the ITO has a relatively large electric resistance, which contributes to the stabilization of the electric circuit.

第１支持体１０は屈曲性を持ち、中間層３０の厚さは発光素子３２に比べて小さい。このため、第１支持体１０は、発光素子３２を中心として外側に若干突出した状態に弾性変形する。この弾性変形によって、第１支持体１０は発光素子３２に向かって付勢された状態となる。その結果、第１導電層１４と電極３３との接触状態が向上し、接触抵抗が小さくなる。また、発光素子３２は、安定して支持される。   The first support 10 has flexibility, and the thickness of the intermediate layer 30 is smaller than that of the light emitting element 32. For this reason, the first support 10 is elastically deformed in a state of slightly protruding outward with the light emitting element 32 as the center. Due to this elastic deformation, the first support 10 is biased toward the light emitting element 32. As a result, the contact state between the first conductive layer 14 and the electrode 33 is improved, and the contact resistance is reduced. Further, the light emitting element 32 is stably supported.

同様に、第２支持体２０も屈曲性を持つ。このため、第２導電層２４と第２電極３４との接触状態も向上し、接触抵抗が小さくなる。また、発光素子３２はさらに安定して支持される。   Similarly, the second support 20 has flexibility. For this reason, the contact state between the second conductive layer 24 and the second electrode 34 is also improved, and the contact resistance is reduced. Further, the light emitting element 32 is supported more stably.

なお、発光装置４０全体を屈曲させる必要がない場合には、第１支持体１０あるいは第２支持体２０の一方を、硝子などの屈曲性を持たない材料で形成してもよい。この場合であっても、第１支持体１０および第２支持体２０のいずれかが屈曲性を持っていれば、第１支持体１０および第２支持体２０のいずれかは発光素子３２に向かって付勢された状態となり、接触抵抗の減少および安定した支持が図られる。   In addition, when it is not necessary to bend the light emitting device 40 as a whole, one of the first support 10 and the second support 20 may be formed of a material having no flexibility such as glass. Even in this case, if one of the first support 10 and the second support 20 has flexibility, either the first support 10 or the second support 20 faces the light emitting element 32. Therefore, the contact resistance is reduced and stable support is achieved.

第１導電層１４および第２導電層２４の材料として、発光素子３２よりも柔らかいものを用いると、第１導電層１４および第２導電層２４が発光素子３２に押しつけられることによって、発光素子３２の外形に合わせて変形する。その結果、第１導電層１４および第２導電層２４と発光素子３２の電極３３，３４との接触状態が向上し、接触抵抗が減少する。
［第２の実施の形態］
図３は、本発明に係る発光装置の第２の実施の形態における一部拡大断面図である。 When a material softer than the light emitting element 32 is used as the material of the first conductive layer 14 and the second conductive layer 24, the first conductive layer 14 and the second conductive layer 24 are pressed against the light emitting element 32, whereby the light emitting element 32. Deforms to match the external shape. As a result, the contact state between the first conductive layer 14 and the second conductive layer 24 and the electrodes 33 and 34 of the light emitting element 32 is improved, and the contact resistance is reduced.
[Second Embodiment]
FIG. 3 is a partially enlarged cross-sectional view of a light emitting device according to a second embodiment of the present invention.

この発光装置４１は、第１の実施の形態の発光装置４０（図１参照）に、第３支持体５０と第２中間層６０と第２発光素子６２とを追加したものである。また、第１基体１２の第１導電層１４に対して反対側の面には第４導電層１５が設けられている。   The light emitting device 41 is obtained by adding a third support 50, a second intermediate layer 60, and a second light emitting element 62 to the light emitting device 40 (see FIG. 1) of the first embodiment. A fourth conductive layer 15 is provided on the surface of the first base 12 opposite to the first conductive layer 14.

第２発光素子６２は、発光ダイオード（ＬＥＤ）である。第２発光素子３２の両端部には、一対の電極３３，３４が設けられている。第２発光素子３２の電極３３，３４は、たとえば金で形成されている。   The second light emitting element 62 is a light emitting diode (LED). A pair of electrodes 33 and 34 are provided at both ends of the second light emitting element 32. The electrodes 33 and 34 of the second light emitting element 32 are made of, for example, gold.

第３支持体５０は、平板状の第３基体５２と、第３基体５２の表面に設けられた第３導電層５４とからなる。第３基体５２は、屈曲性および透光性を有する。   The third support 50 includes a flat plate-like third base 52 and a third conductive layer 54 provided on the surface of the third base 52. The third base 52 has flexibility and translucency.

第３基体５２は、たとえばポリエチレンテレフタラート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリカーボネート（ＰＣ）、ポリエチレンサクシネート（ＰＥＳ）、アートン（ＡＲＴＯＮ）、アクリル樹脂などで形成することができる。第３基体５２の厚さは、たとえば１２５μｍ程度である。   The third substrate 52 can be formed of, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethylene succinate (PES), arton (ARTON), acrylic resin, or the like. The thickness of the third base 52 is, for example, about 125 μm.

第３導電層５４および第４導電層１５は、たとえば酸化インジウムスズ（ＩＴＯ）、酸化亜鉛（ＺｎＯ）などで形成される第３導電層５４および第４導電層１５の厚さは、たとえば１μｍ程度である。   The third conductive layer 54 and the fourth conductive layer 15 are formed of, for example, indium tin oxide (ITO), zinc oxide (ZnO) or the like. The thickness of the third conductive layer 54 and the fourth conductive layer 15 is, for example, about 1 μm. It is.

第３支持体５０は、第３導電層５４が第１支持体１０の第４導電層１５と対向するように配置される。第１支持体１０第３支持体５０との間には、第２発光素子６２が配置される。第２発光素子６２の第１電極６３は、第３導電層５４に接している。第２発光素子３２の第２電極６４は、第１支持体１０の第４導電層１５と接している。   The third support 50 is disposed so that the third conductive layer 54 faces the fourth conductive layer 15 of the first support 10. Between the first support 10 and the third support 50, the second light emitting element 62 is disposed. The first electrode 63 of the second light emitting element 62 is in contact with the third conductive layer 54. The second electrode 64 of the second light emitting element 32 is in contact with the fourth conductive layer 15 of the first support 10.

第２中間層６０は、第１支持体１０および第３支持体５０の間に充填されている。第２中間層６０は、透光性および屈曲性を持つ電気絶縁性の材料で形成される。ここで、透光性は、日本工業規格ＪＩＳＫ７１０５で測定した全光透過率が５０％以上であることが好ましい。第２中間層６０は、たとえばアクリル系エラストマーなどの熱可塑性樹脂で形成される。第２中間層６０の厚さは、第２発光素子６２の第１電極６３側の端部と第２電極６４側の端部の間の距離よりも小さく、たとえば１７５μｍないし２９０μｍである。   The second intermediate layer 60 is filled between the first support 10 and the third support 50. The second intermediate layer 60 is formed of an electrically insulating material having translucency and flexibility. Here, the translucency is preferably such that the total light transmittance measured by Japanese Industrial Standard JISK7105 is 50% or more. The second intermediate layer 60 is made of a thermoplastic resin such as an acrylic elastomer. The thickness of the second intermediate layer 60 is smaller than the distance between the end portion on the first electrode 63 side and the end portion on the second electrode 64 side of the second light emitting element 62, for example, 175 μm to 290 μm.

図４は、本実施の形態における発光装置の端部近傍の断面図である。   FIG. 4 is a cross-sectional view of the vicinity of the end portion of the light emitting device in the present embodiment.

第３支持体５０の形状は、第１支持体１０および第２支持体２０とほぼ同じ大きさの長方形のシート状である。第３支持体５０は、第１支持体１０に対して第２支持体２０と同じ方向に少しずれて対向している。その結果、一方の端部では、第１導電層１４および第４導電層１５が露出している。また、他方の端部では、第２導電層２４および第３導電層５４が間隙を挟んで対向している。   The shape of the third support 50 is a rectangular sheet having substantially the same size as the first support 10 and the second support 20. The third support 50 faces the first support 10 with a slight shift in the same direction as the second support 20. As a result, the first conductive layer 14 and the fourth conductive layer 15 are exposed at one end. At the other end, the second conductive layer 24 and the third conductive layer 54 face each other with a gap therebetween.

端部で露出した第１導電層１４および第４導電層１５は、たとえばコネクタ７０によって互いに電気的に接続されている。間隙を挟んで対向している第２導電層２４および第３導電層５４には、それぞれ電源４２から延びた配線４４，４５が接続されている。   The first conductive layer 14 and the fourth conductive layer 15 exposed at the end are electrically connected to each other by a connector 70, for example. Wirings 44 and 45 extending from the power source 42 are connected to the second conductive layer 24 and the third conductive layer 54 facing each other with a gap therebetween.

この発光装置４１は、たとえば以下の方法で製造される。   The light emitting device 41 is manufactured, for example, by the following method.

まず、第１基体１２となるポリエチレンテレフタラートのシートの両表面に、第１導電層１４および第４導電層１５となるＩＴＯの層をスパッタリングなどによって形成する。また、第２基体２２および第３基体５２となるポリエチレンテレフタラートのシートの一方の表面に、第２導電層２４および第３導電層５４となるＩＴＯの層をスパッタリングなどによって形成する。   First, ITO layers to be the first conductive layer 14 and the fourth conductive layer 15 are formed on both surfaces of the polyethylene terephthalate sheet to be the first base 12 by sputtering or the like. Further, an ITO layer to be the second conductive layer 24 and the third conductive layer 54 is formed on one surface of the polyethylene terephthalate sheet to be the second base 22 and the third base 52 by sputtering or the like.

次に、中間層３０および第２中間層６０の材料であるアクリル系エラストマーに発光素子３２あるいは第２発光素子６２とほぼ同じ大きさの貫通孔をそれぞれ形成する。この中間層３０および第２中間層６０の材料を、第１支持体１０の両面にそれぞれ密着させる。第１支持体１０の材料の両表面に第１中間層３０および第２中間層６０の材料を密着させた後に第１発光素子３２あるいは第２発光素子６２とほぼ同じ大きさの貫通孔を形成してもよい。   Next, through holes having substantially the same size as the light emitting element 32 or the second light emitting element 62 are formed in the acrylic elastomer that is the material of the intermediate layer 30 and the second intermediate layer 60, respectively. The materials of the intermediate layer 30 and the second intermediate layer 60 are adhered to both surfaces of the first support 10 respectively. After the materials of the first intermediate layer 30 and the second intermediate layer 60 are brought into close contact with both surfaces of the material of the first support 10, a through hole having substantially the same size as the first light emitting element 32 or the second light emitting element 62 is formed. May be.

その後、中間層３０の材料に形成された貫通孔に、発光素子３２を配置していく。また、第２中間層６０の材料に形成された貫通孔に、第２発光素子６２を配置していく。第１発光素子３２をすべての貫通孔に配置した後、中間層３０の材料の第１支持体１０と反対側の表面に、第２支持体２０の第２導電層２４が形成された方の表面を密着させる。第２発光素子６２をすべての貫通孔に配置した後、第２中間層６０の材料の第１支持体１０と反対側の表面に、第３支持体５０の第３導電層５４が形成された方の表面を密着させる。その後、熱ドラムで挟むことにより、加圧しながら加熱する。   Thereafter, the light emitting elements 32 are arranged in the through holes formed in the material of the intermediate layer 30. Further, the second light emitting element 62 is arranged in the through hole formed in the material of the second intermediate layer 60. After the first light emitting elements 32 are disposed in all the through holes, the second conductive layer 24 of the second support 20 is formed on the surface of the material of the intermediate layer 30 opposite to the first support 10. Adhere the surface. After arranging the second light emitting elements 62 in all the through holes, the third conductive layer 54 of the third support 50 was formed on the surface of the second intermediate layer 60 opposite to the first support 10. Adhere the surface of the side. Then, it heats, pressurizing by pinching with a thermal drum.

あるいは、第１の実施の形態における発光装置４０と同様のものを２種類製造しておき、それらを接着させることによって、本実施の形態の発光装置４１を製造してもよい。この場合、第１基体１２は、２枚の絶縁性のシートを貼りあわせたものとなる。   Alternatively, the light emitting device 41 of the present embodiment may be manufactured by manufacturing two types of light emitting devices 40 similar to those of the first embodiment and bonding them. In this case, the first base 12 is a laminate of two insulating sheets.

このようにして形成した発光装置４１を、第１支持体１０、第２支持体２０および第３支持体５０が屈曲性を持つ範囲で変形された状態で設置する。つまり、第１支持体１０、第２支持体２０および第３支持体５０のいずれもが、塑性変形したり割れを生じたりしない弾性変形の範囲で変形されて設置される。その後、発光装置４１に電源４２を接続する。   The light emitting device 41 thus formed is installed in a state where the first support body 10, the second support body 20, and the third support body 50 are deformed within a range having flexibility. That is, all of the first support body 10, the second support body 20, and the third support body 50 are deformed and installed in a range of elastic deformation that does not cause plastic deformation or cracking. Thereafter, the power source 42 is connected to the light emitting device 41.

このような状態で、電源４２によって発光素子３２，６２の電極３３，３４間に電圧が印加されることにより、第１発光素子３２および第２発光素子６２は発光する。第１発光素子３２が発生した光は、第１中間層３０、第１支持体１０、第２中間層６０および第３支持体５０を透過し、第３支持体５０の外面から視認される。また、第１発光素子３２が発生した光は、第２支持体２０の外面からも視認される。同様に、第２発光素子６２が発生した光は、第３支持体５０の外面および第２支持体２０の外面から視認される。つまり、それらの光は、発光装置４１の外部から視認されることになる。   In such a state, when a voltage is applied between the electrodes 33 and 34 of the light emitting elements 32 and 62 by the power source 42, the first light emitting element 32 and the second light emitting element 62 emit light. The light generated by the first light emitting element 32 passes through the first intermediate layer 30, the first support 10, the second intermediate layer 60, and the third support 50 and is visually recognized from the outer surface of the third support 50. The light generated by the first light emitting element 32 is also visually recognized from the outer surface of the second support 20. Similarly, the light generated by the second light emitting element 62 is visible from the outer surface of the third support 50 and the outer surface of the second support 20. That is, those lights are visually recognized from the outside of the light emitting device 41.

異なる中間層に配置された発光素子が発生した光は、外部に到達するまでに通過する媒体の材質・厚さが異なる。そこで、必要に応じて、それぞれの中間層に配置された発光素子に流す電流を変化させて、外部から視認される発光強度が同程度になるように調整してもよい。   The light generated by the light emitting elements arranged in different intermediate layers differs in the material and thickness of the medium that passes through before reaching the outside. Therefore, if necessary, the current flowing through the light emitting elements arranged in the respective intermediate layers may be changed so that the emission intensity visually recognized from the outside is approximately the same.

また、第１支持体１０および第３支持体５０のいずれかが屈曲性を持っていれば、第１支持体１０および第３支持体５０のいずれかは第２発光素子６２を中心として外側に若干突出した状態に弾性変形する。この弾性変形によって、第１支持体１０および第３支持体５０のいずれかは、第２発光素子６２に向かって付勢された状態となる。その結果、第２発光素子６２の電極３４，３５のいずれかは、第４導電層１５あるいは第３導電層５４第１との接触状態が向上し、接触抵抗が小さくなる。また、第２発光素子６２は、安定して支持される。   Further, if either the first support body 10 or the third support body 50 is flexible, either the first support body 10 or the third support body 50 is located outward with the second light emitting element 62 as the center. Elastically deforms into a slightly protruding state. Due to this elastic deformation, one of the first support body 10 and the third support body 50 is biased toward the second light emitting element 62. As a result, one of the electrodes 34 and 35 of the second light emitting element 62 is improved in contact with the fourth conductive layer 15 or the third conductive layer 54, and the contact resistance is reduced. Further, the second light emitting element 62 is stably supported.

同一の中間層３０，６０に配置された発光素子３２，６２同士を過度に近接させると、支持体１０，２０，５０の弾性変形による付勢が小さくなる。このため、電極３４，３５と導電層１４，１５，２４，５２との接触状態が悪化したり、発光素子３２，６２の支持の安定が損なわれる可能性がある。   When the light emitting elements 32 and 62 arranged in the same intermediate layer 30 and 60 are excessively brought close to each other, the urging force due to elastic deformation of the supports 10, 20 and 50 is reduced. For this reason, the contact state between the electrodes 34 and 35 and the conductive layers 14, 15, 24 and 52 may be deteriorated, or the support of the light emitting elements 32 and 62 may be lost.

しかし、本実施の形態のように近接させる発光素子３２，６２を異なる中間層３０，６０に配置することにより、それらの発光素子３２，６２の間に存在する第１支持体１０が弾性変形する。これにより、異なる中間層３０，６０に配置された発光素子３２，６２を近接して配置した場合であっても、電極３４，３５と導電層１４，１５，２４，５２との接触状態を適切に維持したり、発光素子３２，６２を安定して支持することができる。ただし、この場合であっても、異なる中間層３０，６０に配置された発光素子３２，６２を過度に近接させると、その間の第１支持体１０が十分に変形できない可能性もある。そこで、異なる中間層３０，６０に配置された発光素子３２，６２は、第１支持体１０の厚さ程度は離間して配置した方がよい。   However, by disposing the light emitting elements 32 and 62 to be close to each other in the different intermediate layers 30 and 60 as in the present embodiment, the first support 10 existing between the light emitting elements 32 and 62 is elastically deformed. . Thereby, even when the light emitting elements 32 and 62 arranged in different intermediate layers 30 and 60 are arranged close to each other, the contact state between the electrodes 34 and 35 and the conductive layers 14, 15, 24 and 52 is appropriately set. The light emitting elements 32 and 62 can be stably supported. However, even in this case, if the light emitting elements 32 and 62 arranged in the different intermediate layers 30 and 60 are excessively brought close to each other, the first support body 10 between them may not be sufficiently deformed. Therefore, it is preferable that the light emitting elements 32 and 62 arranged in the different intermediate layers 30 and 60 are arranged apart from each other by the thickness of the first support 10.

さらに、異なる中間層３０，６０に配置された発光素子３２，６２を近接させて、第１支持体１０を挟んで少なくとも一部が重なるように配置してもよい。この場合であっても、第２支持体２０および第３支持体５０が屈曲性を持っていれば、第２支持体２０および第３支持体５０がそれぞれ弾性変形して、重なり合って配置された発光素子３２，６２を両端部側から付勢する。これにより、電極３４，３５と導電層１４，１５，２４，５２との接触状態は適切に維持され、発光素子３２，６２は安定して支持される。   Furthermore, the light emitting elements 32 and 62 arranged in the different intermediate layers 30 and 60 may be arranged close to each other so that at least a part of the light emitting elements 32 and 62 overlaps with the first support 10 interposed therebetween. Even in this case, as long as the second support body 20 and the third support body 50 have flexibility, the second support body 20 and the third support body 50 are elastically deformed and arranged in an overlapping manner. The light emitting elements 32 and 62 are urged from both ends. Accordingly, the contact state between the electrodes 34 and 35 and the conductive layers 14, 15, 24 and 52 is appropriately maintained, and the light emitting elements 32 and 62 are stably supported.

このように、本実施の形態では、２つの中間層３０，６０を設け、それぞれの中間層３０，６０に発光素子３２，６２を配置しているため、発光素子３２，６２を非常に近接して配置することができる。つまり、各層での回路形成密度を低下させることができる。   As described above, in the present embodiment, the two intermediate layers 30 and 60 are provided, and the light emitting elements 32 and 62 are arranged in the respective intermediate layers 30 and 60. Therefore, the light emitting elements 32 and 62 are very close to each other. Can be arranged. That is, the circuit formation density in each layer can be reduced.

その結果、発光素子の密度を高め、発光装置４１の発光強度を高めることができる。また、発光装置４１での発光によって描く図形、文字などの形態の自由度が高まる。さらに、異なる中間層３０，６０に配置された発光素子３２，６２として異なる色の光を発生させるものを用いると、混色によって多彩な色を発生させることができる。   As a result, the density of the light emitting elements can be increased and the light emission intensity of the light emitting device 41 can be increased. Further, the degree of freedom of shapes such as figures and characters drawn by light emission from the light emitting device 41 is increased. Furthermore, when the light emitting elements 32 and 62 arranged in the different intermediate layers 30 and 60 that generate light of different colors are used, various colors can be generated by color mixing.

また、発光ダイオードなどの発光素子３２，６２で異なる色を発生させるものは、素子の大きさが異なる場合がある。このような場合など、同一の中間層に高さの異なる発光素子を配置すると、高さの小さい発光素子はその両端部側の支持体での付勢がなくなり、電極３３，３４と導電層１４，１５，２４，５２との接触が維持できなくなったり、発光素子の支持の安定性が損なわれる可能性がある。しかし、本実施の形態のように、複数の中間層を設けることにより、高さが同じ発光素子のみを同一の中間層に配置することができる。その結果、高さの小さい発光素子も、その両端部側の支持体で十分に付勢することができ、電極と導電層との接触を適切に維持し、発光素子を安定して支持することができる。   In addition, the light emitting elements 32 and 62 such as light emitting diodes that generate different colors may have different element sizes. In such a case, when light emitting elements having different heights are arranged in the same intermediate layer, the light emitting elements having a small height are not biased by the support bodies on both end sides, and the electrodes 33 and 34 and the conductive layer 14 are removed. , 15, 24, 52 may not be maintained, or the support of the light emitting element may be impaired. However, as in this embodiment, by providing a plurality of intermediate layers, only light-emitting elements having the same height can be arranged in the same intermediate layer. As a result, even a light-emitting element with a small height can be sufficiently urged by the supports on both ends thereof, and the contact between the electrode and the conductive layer is appropriately maintained, and the light-emitting element is stably supported. Can do.

本実施の形態では、第１中間層３０に配置された第１発光素子３２と第２中間層６０に配置された第２発光素子６２とを電気的に直列に接続しているが、これらを並列に電源に接続してもよい。この場合、たとえば第１支持体１０の両面が露出した部分で、第１導電層１４と第４導電層１５とを独立して、電源４２に接続すればよい。このように異なる中間層に位置する発光素子を並列に電源４２に接続することにより、それらの発光素子を互いに独立して制御することができる。また、異なる中間層に位置する発光素子を並列に電源４２に接続することにより、それぞれの導電層を流れる電流を高めることなくより高い発光強度が得られる。
［他の実施の形態］
上述の各実施の形態は単なる例示であり、本発明はこれらに限定されない。たとえば、上述の実施の形態では、発光素子が配置された層は、１層または２層としていたが、３層以上の積層構造としてもよい。また、各実施の形態の特徴を組み合わせて実施することもできる。 In the present embodiment, the first light emitting element 32 disposed in the first intermediate layer 30 and the second light emitting element 62 disposed in the second intermediate layer 60 are electrically connected in series. You may connect to a power supply in parallel. In this case, for example, the first conductive layer 14 and the fourth conductive layer 15 may be independently connected to the power source 42 at the portion where both surfaces of the first support 10 are exposed. Thus, by connecting the light emitting elements located in different intermediate layers to the power supply 42 in parallel, the light emitting elements can be controlled independently of each other. Further, by connecting the light emitting elements located in different intermediate layers in parallel to the power source 42, higher light emission intensity can be obtained without increasing the current flowing through each conductive layer.
[Other embodiments]
The above-described embodiments are merely examples, and the present invention is not limited to these. For example, in the above-described embodiment, the layer in which the light emitting element is arranged is one layer or two layers, but may have a laminated structure of three or more layers. Moreover, it can also implement combining the characteristic of each embodiment.

１０…第１支持体、１２…第１基体、１４…第１導電層、１５…第４導電層、２０…第２支持体、２２…第２基体、２４…第２導電層、３０…中間層、３２…発光素子、３３…第１電極、３４…第２電極、４０…発光装置、４１…発光装置、４２…電源、４４…配線、４５…配線、５０…第３支持体、５２…第３基体、５４…第３導電層、６０…第２中間層、６２…第２発光素子 DESCRIPTION OF SYMBOLS 10 ... 1st support body, 12 ... 1st base | substrate, 14 ... 1st conductive layer, 15 ... 4th conductive layer, 20 ... 2nd support body, 22 ... 2nd base | substrate, 24 ... 2nd conductive layer, 30 ... Middle Layers 32... Light emitting element 33... First electrode 34. Second electrode 40. Light emitting device 41. Light emitting device 42. Power source 44 44 Wiring 45 Wiring 50 Third support 52 3rd base | substrate, 54 ... 3rd conductive layer, 60 ... 2nd intermediate | middle layer, 62 ... 2nd light emitting element

Claims (13)

第１基体とその第１基体の表面に形成された第１導電層とを備えた透光性を持つ第１支持体と、
第２基体とその第２基体の表面に形成された第２導電層とを備えて前記第１導電層と前記第２導電層とが対向するように配置された第２支持体と、
前記第１導電層と前記第２導電層とにそれぞれ接する一対の電極を備えた発光素子と、
前記第１支持体と前記第２支持体との間に充填された透光性を持つ電気絶縁性の中間層と、
を有し、前記第１支持体および前記第２支持体の少なくとも一方は屈曲性を持つことを特徴とする発光装置。 A translucent first support comprising a first substrate and a first conductive layer formed on the surface of the first substrate;
A second support comprising a second base and a second conductive layer formed on the surface of the second base, the second support being arranged so that the first conductive layer and the second conductive layer face each other;
A light emitting device comprising a pair of electrodes in contact with each of the first conductive layer and the second conductive layer;
An electrically insulating intermediate layer having translucency filled between the first support and the second support;
And at least one of the first support and the second support has flexibility. 前記中間層の厚さは前記発光素子の電極間の距離よりも小さいことを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein a thickness of the intermediate layer is smaller than a distance between electrodes of the light emitting element. 前記第１支持体および前記第２支持体はいずれも屈曲性を持つことを特徴とする請求項１または請求項２に記載の発光装置。   The light emitting device according to claim 1 or 2, wherein both the first support and the second support have flexibility. 前記第１電極は前記第２電極よりも小さいことを特徴とする請求項１ないし請求項３のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein the first electrode is smaller than the second electrode. 前記発光素子は複数であることを特徴とする請求項１ないし請求項４のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein there are a plurality of the light emitting elements. 前記第１基体は平板状であって、
前記第１支持体は前記前記第１基体の前記第１導電層に対して反対側の面に第４導電層を備え、
第３基体とその基体の表面に形成された第３導電層とを備えて前記第４導電層と前記第３導電層とが対向するように配置された透光性を持つ第３支持体と、
前記第３導電層と前記第４導電層とにそれぞれ接する一対の電極を備えた第２発光素子と、
前記第１支持体と前記第３支持体との間に充填された透光性を持つ電気絶縁性の第２中間層と、
をさらに有し、
前記第１支持体および前記第３支持体の少なくとも一方は屈曲性を持つことを特徴とする請求項１ないし請求項５のいずれか１項に記載の発光装置。 The first base has a flat plate shape,
The first support includes a fourth conductive layer on a surface of the first base opposite to the first conductive layer,
A third support having translucency, comprising a third base and a third conductive layer formed on the surface of the base, and arranged so that the fourth conductive layer and the third conductive layer face each other; ,
A second light-emitting element comprising a pair of electrodes in contact with the third conductive layer and the fourth conductive layer,
An electrically insulating second intermediate layer having translucency filled between the first support and the third support;
Further comprising
6. The light emitting device according to claim 1, wherein at least one of the first support and the third support has flexibility. 前記第２中間層の厚さは前記第２発光素子の電極間の距離よりも小さいことを特徴とする請求項６に記載の発光装置。   The light emitting device according to claim 6, wherein a thickness of the second intermediate layer is smaller than a distance between electrodes of the second light emitting element. 前記第１発光素子の電極間の距離は前記第２発光素子の電極間の距離とは異なることを特徴とする請求項６または請求項７に記載の発光装置。   The light emitting device according to claim 6 or 7, wherein a distance between the electrodes of the first light emitting element is different from a distance between the electrodes of the second light emitting element. 前記第１発光素子が発光する光の色は前記第２発光素子が発光する色とは異なることを特徴とする請求項６ないし請求項８のいずれか１項に記載の発光装置。   9. The light emitting device according to claim 6, wherein a color of light emitted from the first light emitting element is different from a color emitted from the second light emitting element. 前記第２発光素子は前記第１発光素子と前記第１基体を挟んで少なくとも一部が重なっていることを特徴とする請求項６ないし請求項９のいずれか１項に記載の発光装置。   10. The light emitting device according to claim 6, wherein at least a part of the second light emitting element overlaps the first light emitting element with the first base interposed therebetween. 前記第２発光素子の前記第１基体との対向位置は前記第１発光素子の前記第１基体の対向位置と前記第１基体の厚さ以上離れていることを特徴とする請求項６ないし請求項１０のいずれか１項に記載の発光装置。   The position of the second light emitting element facing the first base is separated from the position of the first light emitting element facing the first base by a thickness greater than the thickness of the first base. Item 11. The light emitting device according to any one of Item 10. 前記第２支持体と第２中間層と前記第３支持体とはいずれも透光性を持つことを特徴とする請求項６ないし請求項１１のいずれか１項に記載の発光装置。   The light emitting device according to any one of claims 6 to 11, wherein all of the second support, the second intermediate layer, and the third support have translucency. 前記第１支持体と前記第２支持体と前記第３支持体とはいずれも屈曲性を持つことを特徴とする請求項６ないし請求項１２のいずれか１項に記載の発光装置。
13. The light emitting device according to claim 6, wherein the first support body, the second support body, and the third support body are all flexible.
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