JP2014235817A - Lighting body and lighting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a degree of freedom of an arrangement position and a degree of freedom of a layout, and to improve design performance.SOLUTION: A lighting body comprises: a light permeability base board 2 including a conductive layer 5 to which a semiconductor light emitting element 4 functioning as a light source is connected, and which has light permeability, and a transparent protection layer 6 laminated on the conductive layer and formed of a transparent resin material; and a covering body 3 which is formed of a transparent material and covers the light permeability base board. By this constitution, since the light permeability base board is covered with the covering body and held, a constraint on an arrangement and a layout is reduced, high transparency is secured, a degree of freedom of an arrangement position and a degree of freedom of a layout can be improved, and design performance can be improved.

Description

  The present invention relates to a technical field of an illuminating body and an illuminating unit that use a semiconductor light emitting element as a light source and have a translucent substrate.

JP 2010-15910 A

  There is an illuminating body that is used in various applications and irradiates light in a predetermined direction. For example, such an illuminating body is used as a vehicular lamp.

  Some illuminators used as vehicular lamps use a semiconductor light emitting element, for example, a light emitting diode as a light source (see, for example, Patent Document 1). As described above, the use of the semiconductor light emitting element as the light source makes it possible to reduce the light source and to reduce the size of the vehicular lamp.

  In the illumination body described in Patent Document 1, a plurality of semiconductor light emitting elements are mounted on the surface of a flexible substrate, a plurality of planar metal substrates are joined to the back surface of the flexible substrate, and the metal substrate is attached to a bracket. It has been.

  By configuring the illuminating body as described above, the metal substrate ensures good attachment to the bracket, and also ensures high flexibility of the portion where the metal substrate does not exist, thereby improving the degree of freedom of shape. It has been.

  However, in the illuminating body described in Patent Document 1, since the metal substrate is configured to be attached to the bracket, the attachment position with respect to the vehicle is limited to the position where the bracket is present, and the degree of freedom and design of the arrangement position are limited. There is a problem that the degree of freedom is low.

  In addition, since a plurality of metal substrates for attachment to the bracket are provided, there is also a problem that the translucency is low, the metal substrate is easily visible from the outside, and the design is accordingly low.

  Therefore, an object of the present invention is to overcome the above-described problems, to improve the degree of freedom of arrangement position and the degree of freedom of design, and to improve design.

  1stly, in order to solve the above-mentioned subject, the illuminating body which concerns on this invention is connected with the semiconductor light-emitting element which functions as a light source, and the transparent resin material laminated | stacked on the said conductive layer and laminated | stacked on the said conductive layer. A translucent substrate including the formed transparent protective layer, and a covering formed of a transparent material and covering the translucent substrate.

  As a result, the translucent substrate is covered and held by the cover, and light is transmitted through the cover and the translucent substrate.

  2ndly, in the above-mentioned illuminating body which concerns on this invention, it is desirable to use a transparent conductive film as said conductive layer.

  Thereby, high translucency is ensured.

  3rdly, in the above-mentioned illuminating body which concerns on this invention, it is desirable that the said translucent board | substrate is formed as a flexible board | substrate which has flexibility.

  As a result, the translucent substrate can be bent along the shape of the covering.

  4thly, in the above-mentioned illuminating body which concerns on this invention, it is desirable for a reflective film to be formed in one surface of the said transparent protective layer or the said covering body.

  As a result, the amount of light reflected by the reflective film and irradiated to the outside increases.

  In order to solve the above-described problem, the illumination unit according to the present invention is an illumination unit including a plurality of illumination bodies, and the illumination body is connected to a semiconductor light emitting element that functions as a light source and has light transmittance. A translucent substrate including a conductive layer and a transparent protective layer laminated on the conductive layer and formed of a transparent resin material, and a covering formed of a transparent material and covering the translucent substrate, The illuminating body is formed by overlapping.

  Thereby, in each illuminating body, the translucent substrate is covered and held by the covering body, and light is transmitted through the covering body and the translucent substrate.

  According to the illuminating body and the illuminating unit of the present invention, since the translucent substrate is covered and held by the covering body, restrictions on arrangement and design are reduced and high translucency is ensured, and the degree of freedom in arrangement position is improved. In addition, it is possible to improve the degree of design freedom and to improve the design.

Embodiments of the illuminating body and the illuminating unit of the present invention are shown together with FIGS. 2 to 7, and this figure is an enlarged sectional view of the illuminating body. It is a schematic diagram which shows the optical path in an illuminating body. It is an expanded sectional view showing an example in which a reflective film was formed. The modification of an illuminating body is shown with FIG. 5, and this figure is an expanded sectional view. It is an expansion perspective view. It is a schematic perspective view which shows an example of an illumination unit. It is a schematic rear view which shows the example of application of a lighting body or a lighting unit.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention illumination body and a lighting unit is demonstrated with reference to an accompanying drawing.

  In addition, the illuminating body and the illumination unit described below are used as, for example, a vehicular lamp. Examples of vehicle lamps include tail lamps, stop lamps, cornering lamps, hazard lamps, turn signal lamps, position lamps, clearance lamps, back lamps and other indicator lamps, and a combination of these lamps such as tail lamps and stop lamps. Applicable to various beacon lamps such as combination lamps.

  In addition, the illuminating body and the lighting unit are lamps other than the vehicular lamps, for example, general lighting such as illuminating lamps indoors and outdoors, lamps in railways other than vehicles, aircraft, ships, construction machinery, and various industrial and commercial lamps. It can be widely used as a lighting device.

  Below, the example which applied this invention lighting body and the lighting unit to the vehicle lamp is shown. The lighting unit is composed of a plurality of lighting bodies.

  The illuminating body 1 is formed in a thin plate shape, and has a translucent substrate 2 and a covering 3 (see FIG. 1).

  The translucent substrate 2 includes conductive layers 5 and 5 connected to the semiconductor light emitting elements 4, 4,... Functioning as a light source, and a transparent protective layer 6 formed of a transparent resin material stacked on the conductive layers 5 and 5. , 6.

  As the semiconductor light emitting element 4, for example, a light emitting diode (LED) is used, and the size is, for example, about 0.3 mm square. The semiconductor light-emitting elements 4, 4,. The semiconductor light emitting element 4 is provided with electrodes (not shown) on both surfaces in the thickness direction of the illuminating body 1.

  The conductive layers 5 and 5 are spaced apart from each other in the thickness direction of the illuminating body 1, and surfaces facing each other are formed as connection surfaces 5a and 5a. .. Are disposed between the conductive layers 5, 5, and the electrodes of the semiconductor light emitting elements 4, 4,... Are formed on the connection surfaces 5a, 5a, respectively. Connected to the terminal.

  The conductive layer 5 is light transmissive and has a thickness of, for example, about 0.1 mm to 0.3 mm. Examples of the conductive layer 5 include ITO (Indium Tin Oxide) and ATO (Antimony Doped Tindioxide). A transparent conductive film is used. The conductive layer 5 is not limited to the transparent conductive film, and may have a high light transmittance. For example, the base material is formed of a transparent material, and a plurality of conductive wires are meshed inside the base material. It may be configured to be embedded.

  A transparent adhesive is applied between the conductive layers 5 and 5, the conductive layers 5 and 5 are joined together by the adhesive, and a layer to which the adhesive is applied is provided as the insulating layer 7. Therefore, the insulating layer 7 exists in the same position as the position where the semiconductor light emitting elements 4, 4,.

  The transparent protective layers 6 and 6 are laminated on the surfaces of the conductive layers 5 and 5 opposite to the connection surfaces 5a and 5a, respectively. The thickness of the transparent protective layer 6 is, for example, about 0.4 mm. The transparent protective layer 6 is formed of a transparent resin material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). The transparent protective layers 6, 6 protect the conductive layers 5, 5 and the semiconductor light emitting elements 4, 4,.

  The translucent substrate 2 configured as described above has a thickness of about 1 mm, for example, and is formed as a flexible substrate having flexibility.

  The covering 3 is provided so as to cover the translucent substrate 2 from the outside. For example, the translucent substrate 2 is embedded in the covering 3. The covering 3 may be formed in, for example, a single plate shape, and may be attached so as to cover the translucent substrate 2 from one surface side in the thickness direction. It forms in plate shape and may be affixed so that the translucent board | substrate 2 may be covered from the both sides in the thickness direction.

  The covering 3 is formed of a transparent resin material or glass material. As the resin material, for example, acrylic or polycarbonate is used.

  As described above, the translucent substrate 2 is covered with the cover 3 from the outside. However, since the translucent substrate 2 is formed as a flexible substrate having flexibility, it is bent along the shape of the cover 3. Covered with the covering 3 in a state of being covered.

  Therefore, the translucent substrate 2 is formed as a flexible substrate having flexibility, so that the illuminating body 1 is covered with the covering 3 in a stable state regardless of the shape of the covering 3. It is comprised and the improvement of the freedom degree of design of the illuminating body 1 can be aimed at.

  Further, since the translucent substrate 2 has flexibility, the use of the covering 3 is widened, and as the covering 3, a transparent part constituting the vehicle, for example, a cover or window (window) of a vehicle lamp is used. it can.

  In the illuminating body 1 configured as described above, when light is emitted from the semiconductor light emitting elements 4, 4,..., A part of the emitted light is directed to one surface 3 a of the covering 3. The light A directed to one surface 3a is irradiated to the outside from one surface 3a (light A shown in FIG. 2), or is internally reflected (or totally reflected) by one surface 3a and travels to the other surface 3b. . The light that has been internally reflected by one surface 3a and directed toward the other surface 3b is internally reflected by the other surface 3b and again travels toward one surface 3a or is transmitted through the other surface 3b. In addition, one surface 3a of the covering 3 functions as an irradiation surface for irradiating the light effectively irradiated to the irradiation target to the outside.

  When light is emitted from the semiconductor light emitting elements 4, 4,..., A part of the emitted light is directed to the other surface 3b of the covering 3 (light B shown in FIG. 2). The light B traveling toward the other surface 3b is internally reflected (or totally reflected) by the other surface 3b and travels toward one surface 3a or is transmitted through the other surface 3b. The light that is internally reflected by the other surface 3b and travels toward one surface 3a is irradiated from the one surface 3a to the outside, or is internally reflected by one surface 3a and travels toward the other surface 3b.

  As described above, when light is emitted from the semiconductor light emitting elements 4, 4,..., There is light that is internally reflected by the one surface 3 a or the other surface 3 b of the covering 3, and multiple reflection occurs.

  In the illuminating body 1, a reflective film 8 formed by vapor deposition of metal such as aluminum may be formed on the other surface 3b of the covering 3 (see FIG. 3). By forming the reflection film 8 on the other surface 3b in this way, light reflected by the reflection film 8 is reduced and light leaking from the other surface 3b is reduced, and light reaching the one surface 3a is increased. The amount of light irradiated to the outside increases, and the utilization efficiency of light emitted from the semiconductor light emitting elements 4, 4,... And the illuminance of the illuminator 1 can be improved.

  In the case of the illuminating body 1 configured such that one surface in the thickness direction of the translucent substrate 2 is covered with the covering 3, the reflective film 8 is provided on the outer surface of the covering 3 or the outer surface of the transparent protective layer 6. It is formed.

  Next, a modified example of the illumination body will be described (see FIGS. 4 and 5).

  Note that the illuminating body 1A according to the modified example described below is different from the illuminating body 1 in that the conductive layer is connected to one surface of the semiconductor light emitting element as compared with the illuminating body 1 described above. Thus, only different portions will be described in detail, and the other portions will be denoted by the same reference numerals as the same portions in the illuminating body 1 and description thereof will be omitted.

  The illuminating body 1A is formed in a thin plate shape, and has a translucent substrate 2A and a covering 3 (see FIGS. 4 and 5).

  The translucent substrate 2A includes conductive layers 5A and 5A connected to the semiconductor light emitting elements 4A, 4A,... And transparent protective layers 6 and 6 formed of a transparent resin material stacked on the conductive layers 5A and 5A. Have.

  As the semiconductor light emitting element 4A, for example, a light emitting diode (LED) is used, and the size is, for example, about 0.3 mm square. The semiconductor light emitting elements 4A, 4A,... Are spaced apart in a direction orthogonal to the thickness direction of the illuminating body 1A, and are in a predetermined array state. The semiconductor light emitting element 4A is provided with a pair of electrodes (not shown) on one surface in the thickness direction of the illuminating body 1A.

  The conductive layers 5A and 5A are arranged on one surface side of the semiconductor light emitting elements 4A and 4A, and surfaces facing the semiconductor light emitting elements 4A, 4A,... Are formed as connection surfaces 5a and 5a, respectively. The pair of electrodes of the semiconductor light emitting elements 4A, 4A,... Are connected to the electrode terminals formed on the connection surfaces 5a and 5a, respectively.

  The conductive layer 5A is light transmissive and has a thickness of, for example, about 0.1 mm to 0.3 mm. Examples of the conductive layer 5A include ITO (Indium Tin Oxide) and ATO (Antimony Doped Tindioxide). A transparent conductive film is used. Note that, similarly to the conductive layer 5, the conductive layer 5 </ b> A may be configured, for example, such that a base material is formed of a transparent material and a plurality of conductive wires are embedded in a mesh shape inside the base material.

  One transparent protective layer 6 is laminated on the surface of the conductive layer 5A opposite to the connection surface 5a, the other transparent protective layer 6 is laminated on the connection surface 5a of the conductive layer 5A, and the other transparent protective layer 6 emits semiconductor light. The elements 4A, 4A,... Are embedded. The conductive layers 5A, 5A and the semiconductor light emitting elements 4A, 4A,... Are protected by the transparent protective layers 6, 6.

  The translucent substrate 2A configured as described above has a thickness of about 1 mm, for example, and is formed as a flexible substrate having flexibility.

  The covering 3 is provided so as to cover the translucent substrate 2A from the outside.

  Since the state when light is emitted from the semiconductor light emitting element 4A in the illuminating body 1A configured as described above is the same as that in the case of the illuminating body 1 described above, description thereof is omitted.

  Even in the illuminating body 1 </ b> A, similarly to the illuminating body 1, the reflective film 8 by metal vapor deposition such as aluminum may be formed on the other surface 3 b of the covering 3.

  In the illuminating body 1A, the conductive layers 5A, 5A are arranged on one surface side of the semiconductor light emitting elements 4A, 4A,. Therefore, the conductive layers 5A and 5A are not spaced apart from each other in the thickness direction, and the thickness can be reduced accordingly.

  Next, the illumination unit 10 will be described (see FIG. 6).

  The lighting unit 10 includes a plurality of lighting bodies 1, 1,... (Or 1A, 1A,...), For example, three lighting bodies 1, 1, 1. Specifically, the illumination unit 10 is joined in a state where the illumination bodies 1, 1, 1 are overlapped in the thickness direction. In addition, when the illuminating bodies 1, 1, and 1 are joined by an adhesive, a transparent adhesive is used. For example, as shown in FIG. 6, the illumination units 1, 1, 1 may be stacked in a state where the illumination units 10 are shifted in a direction orthogonal to the thickness direction, in order to improve design properties.

  As described above, the lighting unit 10 is configured by stacking the plurality of lighting bodies 1, 1, 1, thereby increasing the thickness and ensuring high strength of the lighting unit 10.

  Further, in each of the illuminators 1, 1, 1, multiple reflections of light emitted from the semiconductor light emitting elements 4, 4,... Occur, and multiple reflections overlap in the thickness direction of the illumination unit 10. Therefore, a sense that light is emitted from more semiconductor light emitting elements 4, 4,... Than the number of semiconductor light emitting elements 4, 4,. Can be planned.

  Next, application examples of the illuminating bodies 1 and 1A and the illumination unit 10 described above will be described (see FIG. 7).

  The illuminating body 1, 1 </ b> A and the lighting unit 10 can be used as, for example, a marker lamp in a vehicle application, and can also be used as a lamp provided integrally with a sunroof or a window (window).

  Hereinafter, an example in which the illuminating body 1, 1 </ b> A or the illumination unit 10 is provided integrally with the rear window is shown.

  The rear window 21 of the vehicle 20 is formed of transparent glass or resin, and is formed large vertically and horizontally so as to be continuous with the bumper 22 in the vertical direction and continuous with the side parts 23 and 23 of the vehicle body in the horizontal direction. Since the large rear window 21 is provided in this way, almost the entire interior of the room can be visually recognized from the outside through the rear window 21. The rear window 21 is at least partially formed in a curved surface shape.

  The lighting body 1, 1 </ b> A or the lighting unit 10 is integrally provided at the lower end of the rear window 21, and a part of the rear window 21 is used as the covering body 3. The illuminators 1 and 1A and the illumination unit 10 function as a marker lamp such as a turn signal lamp that irradiates light to the rear or side of the vehicle.

  The illuminating body 1, 1 </ b> A and the illuminating unit 10 have high light transmittance because each part except the semiconductor light emitting elements 4, 4,..., 4 A, 4 A,. The room is visually recognized from the outside through the illuminating bodies 1, 1 </ b> A and the illumination unit 10 at the time of lighting. Accordingly, the illuminating body 1, 1 </ b> A and the lighting unit 10 function as a window (window) similarly to the rear window 21 when not lit and function as a vehicular lamp when lit, and thus function in addition to the improvement in design. It is possible to improve the performance.

  As described above, in the illuminating body 1, 1 </ b> A and the illumination unit 10, the semiconductor light emitting elements 4, 4 </ b> A are connected to each other, and the light transmissive conductive layers 5, 5 </ b> A are laminated on the conductive layer and are transparent resin materials A translucent substrate 2 and 2A including the formed transparent protective layer 6 and a covering 3 formed of a transparent material and covering the translucent substrate 2 and 2A are provided.

  Therefore, since the translucent substrates 2 and 2A are covered and held by the covering 3, there are less restrictions on arrangement and design, and high translucency is ensured, improving the degree of freedom of arrangement position and freedom of design. It is possible to improve the design and the design.

  In addition, by using a transparent conductive film as the conductive layers 5 and 5A, higher translucency can be ensured and the design can be further improved.

  DESCRIPTION OF SYMBOLS 1 ... Illuminating body, 2 ... Translucent substrate, 3 ... Cover body, 4 ... Semiconductor light emitting element, 5 ... Conductive layer, 6 ... Transparent protective layer, 7 ... Reflective film, 1A ... Illuminating body, 2A ... Translucent substrate 4A: Semiconductor light emitting device, 5A: Conductive layer, 10: Illumination unit

Claims (5)

A translucent substrate comprising a conductive layer connected to a semiconductor light-emitting element functioning as a light source and having a light transmission property, and a transparent protective layer laminated on the conductive layer and formed of a transparent resin material;
An illuminating body comprising: a covering body formed of a transparent material and covering the translucent substrate. The lighting body according to claim 1, wherein a transparent conductive film is used as the conductive layer. The lighting body according to claim 1, wherein the translucent substrate is formed as a flexible substrate having flexibility. The illuminating body according to claim 1, wherein a reflective film is formed on one surface of the transparent protective layer or the covering. A lighting unit including a plurality of lighting bodies,
The illuminating body includes a translucent substrate including a light-transmissive conductive layer connected to a semiconductor light-emitting element functioning as a light source, and a transparent protective layer laminated on the conductive layer and formed of a transparent resin material, and transparent A cover that is formed of a material and covers the translucent substrate;
A lighting unit formed by stacking a plurality of the lighting bodies.

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