JP2012080141A - Soldering structure and electronic apparatus with soldering structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure required solder joint strength while preventing generation of a solder ball by minimizing displacement of a component to be mounted in a soldering structure where a circular component, or the like, is mounted by soldering using a land formed on a circuit board and in an electronic apparatus with the soldering structure.SOLUTION: A gear type land 30 has protrusions 32 formed radially on the outer periphery of a circular portion 31. The circular portion 31 has a diameter substantially equal to that of the circular seat 21 of a mounting component 20. The mounting component 20 is a spring type pin contact component. The spring type pin contact component 20 is a spring pin.

Description

  The present invention relates to a soldering structure in which circular parts or the like are mounted by soldering using lands formed on a substrate, and an electronic apparatus including the same.

  As known in Patent Document 1, a wiring circuit pattern having a component connection portion is formed on an insulating substrate, and this wiring circuit pattern is covered with a resist, and an opening is formed in the resist on the component connection portion to form a land. In a printed circuit board, for example, a land shape for mounting a component having a terminal having a relatively large area, such as a collector terminal of a power mold transistor, is formed slightly larger than the shape of the terminal, There is a technique in which an opening having an opening longer than the depth is provided at least at one place on the periphery of the land.

  According to Patent Document 1, since the land shape is formed to be slightly larger than the terminal shape, even if the electronic component tries to move due to some impact or vibration on the printed circuit board when the solder is melted, it is pulled back by the surface tension of the solder, Since the original position is maintained, it is correctly soldered to a predetermined position. In addition, since the opening portion having a longer frontage dimension than the depth dimension is provided at the periphery of the land, a fillet with a long hem is formed, so that the quality of soldering can be easily confirmed visually and optically, It can be used as a surplus solder container.

  Further, as known from Patent Document 2, a printed circuit board for mounting a surface mounting component such as QFP with pinned and narrowed lead wires and a cylindrical chip component for surface mounting on the same surface; A soldering land of a desired shape for the chip component provided in place on the printed circuit board; and a cream solder printing area of a required area including a portion of the soldering land; There is a technique in which the desired shape of the soldering land is a shape in which melted cream solder gathers in the center of the land.

  According to Patent Document 2, by using a cream solder printing area having a required area including a soldering land portion for a chip component, the chip component can be used as compared with a land for a surface mounting component such as QFP. A large amount of cream solder can be applied on and around the soldering land. Moreover, since the soldering lands for chip parts are shaped so that the melted solder paste is collected in the center of the lands, according to the pattern shape of the soldering lands, the same surface of the printed circuit board, It is possible to mount a surface mounting component such as QFP having a multi-pin configuration and a narrow lead wire pitch and a surface mounting cylindrical chip component. For this reason, it is possible to perform a reliable soldering operation without causing a phenomenon that becomes an obstacle, and in particular, there is an advantage that the shape is suitable for a chip-type electronic component for surface mounting. is there.

  By the way, when the seat 111 of the spring pin 110 which is the spring type pin contact component is circular as a substrate mounting land of the surface mount type spring type pin contact component (spring pin 110), as shown in FIG. A circular land 120 having a diameter larger than the diameter was used.

JP 2000-196229 A JP-A-6-6021

However, as a problem in the case of FIG. 5, there is play on the land dimensions in all directions, so that the spring pin 110 is mounted out of the center position of the circular land 120 as shown in FIG. 6. there were.
In addition, as shown in FIG. 7, when the land 130 having the same size as or close to the seat 111 of the spring pin 110 is used, the fillet 140 is not sufficiently formed and the solder joint strength is weakened. Since there is no place for the solder to escape, unnecessary parts are lifted and the inclination is increased, or the generation of the solder balls 141 is induced.

Further, as shown in FIG. 8, for example, when a component is to be arranged at the edge of the board end 101 of the substrate 100, the land shape is changed to a partially deformed land 150 in order to maintain the clearance C from the board edge 101 to the pattern. To do. That is, a partially deformed land 150 having a straight portion 151 parallel to the plate end 101 is formed.
However, in this case, the side where the fillet 140 can be formed and the side where the fillet 140 can be formed are formed. As shown in FIG. 9, the spring pin 110 is pulled by the fillet 140 on one side and the center position with respect to the partially deformed land 150 is shifted. There has been a problem that the spring pin 110 is inclined and the inclination of the spring pin 110 is increased.

  An object of the present invention is to provide a soldering structure in which circular parts and the like are mounted by soldering using lands formed on a substrate, and an electronic device including the same, and suppress the mounting deviation of the parts, and required solder joint strength It is possible to ensure soldering and to prevent the generation of solder balls.

In order to achieve the above object, a soldering structure according to the first aspect of the present invention includes:
A substrate,
A resist that covers the surface of the substrate and has an opening;
A circular portion formed in the opening on the substrate and having substantially the same diameter as a circular seat of a mounting component mounted by soldering; and a plurality of convex portions radially provided on the outer periphery of the circular portion; A land comprising
The mounting component is mounted on the circular portion and soldered, and a fillet is formed including the convex portion and the substrate between the adjacent convex portions.
It is characterized by that.

  In order to achieve the above object, an electronic apparatus according to a second aspect of the present invention includes the above soldering structure.

  According to the present invention, mounting deviation of components can be suppressed, necessary solder joint strength can be ensured, and generation of solder balls can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS The structure of Embodiment 1 to which this invention is applied is shown, The top view (a) and side view (b) which showed the mounting by a gear type land. It is the top view (a) and side view (b) which showed the soldering state of FIG. FIG. 6 is a plan view (a) and a side view (b) showing a land shape of a substrate end as a second embodiment. It is the top view (a) and side view (b) which showed the soldering state of FIG. An ideal state of board mounting by a land larger than a conventional component seat is shown, and is a plan view (a) and a side view (b). It is the top view (a) and side view (b) which showed the example which will shift | deviate from the center position and mount. It is the top view (a) and side view (b) which showed the problem by a component seat and the same-shaped land. It is the top view (a) and side view (b) which showed the land shape of the conventional board | substrate edge. It is the top view (a) and side view (b) which showed the example which mounts inclining.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
FIG. 1 shows the structure of a land according to a first embodiment to which the present invention is applied. 10 is a substrate, 20 is a spring-type pin contact component (spring pin), 21 is a circular seat, 30 is a gear-type land, and 31 is circular. , 32 is a convex part, and 40 is a fillet.

  On the substrate 10, a gear-type land 30 for mounting the spring pin 20 that is a spring-type pin contact component is formed, and a region excluding the gear-type land 30 is covered with a resist. The gear-type land 30 is formed by radially forming a large number (eight in the illustrated example) of convex portions 32 on the outer periphery of the circular portion 31 at equal intervals, and the inner diameter of the gear, that is, the circular portion 31 is formed on the spring pin 20. The same diameter as the circular seat 21 is used, and the outer diameter of the gear, that is, the outer diameter of the convex portion 32 is set to a size that can secure a necessary fillet length.

  As described above, cream solder is applied to the gear-type land 30 by screen printing. The spring pin 20 is mounted on the circular seat 21 on the circular portion 31 of the gear-type land 30 to which the cream solder is applied in this manner, and is temporarily fixed. Thereafter, the solder on the gear-type land 30 is reflowed as known, whereby the terminal under the circular seat 21 of the spring pin 20 and the gear-type land 30 are connected.

  FIG. 2 shows a soldered state. As shown in the figure, the spring pin 20 is mounted at the center of the gear-type land 30, and the solder-type is less lifted and tilted with respect to the gear-type land 30. A sufficient fillet 40 is formed from the outer periphery of the circular seat 21 of the spring pin 20 to the convex portion 32 of the gear-type land 30 and in between.

When the gear-type land 30 is used as in the first embodiment, the mounting position shift is suppressed because the inner diameter of the gear, that is, the circular portion 31 is the same as the diameter of the circular seat 21 of the spring pin 20.
Moreover, since the fillet 40 length which requires the external shape of a gearwheel, ie, the outer diameter of the convex part 32, is ensured, required solder joint strength can be ensured.
Further, since there is a significant solder escape area between the fillet 40 and the gear teeth, that is, the convex portion 32, the solder float can be suppressed and the solder ball can be absorbed.

(Embodiment 2)
FIG. 3 shows the land shape at the end of the board. As in the first embodiment, 10 is a board, 20 is a spring-type pin contact component (spring pin), 21 is a circular seat, 30 is a gear-type land, 31 Is a circular portion, 32 is a convex portion, 40 is a fillet, 11 is a plate end, and 33 is a missing portion.
That is, in the second embodiment, when it is desired to place the spring pin 20 at the edge of the plate end 11 of the substrate 10, the three convex portions 32 are cut along the tangential direction of the circular portion 31 and parallel to the substrate end 11. A partially missing gear type land 30 having a straight missing portion 33 is used.

The partially missing gear-type land 30 is formed on the substrate 10 in the same manner as in the first embodiment described above, with the linear missing portion 33 positioned so as to maintain the clearance C from the substrate end 11 to the pattern. ing.
As in the first embodiment, the spring pin 20 is mounted on the circular seat 21 on the circular portion 31 of the partially missing gear-type land 30 coated with cream solder, and is temporarily fixed. Thereafter, the solder on the partially missing gear type land 30 is reflowed to connect the terminal below the circular seat 21 of the spring pin 20 to the partially missing gear type land 30.

  FIG. 4 shows a soldered state. As shown in the figure, the spring pin 20 is mounted at the center of the partially missing gear-type land 30 and has less solder floating than the partially missing gear-type land 30. There is little inclination. A sufficient fillet 40 is formed from the outer periphery of the circular seat 21 of the spring pin 20 to the convex portion 32 of the gear-type land 30 and in between. In addition, the fillet 40 is also formed in the missing portion 33 as illustrated.

As in the second embodiment, when it is desired to place the spring pin 20 at the edge of the plate end 11 of the substrate 10, a part of the gear, that is, three in the illustrated example, with the inner diameter of the gear, that is, the circular portion 31 as a limit. By performing the deformation of the land 30 that causes the protrusion 32 to be omitted, it is possible to dispose the spring pin 20 as a mounting component at the very end of the plate end 11 while maintaining the clearance C between the substrate end 11 and the pattern.
In this case, since the opposite side of the land 30 from the missing portion is gear-shaped, there is an effect of suppressing the center position shift of the spring pin 20 as described in the first embodiment.

  In the above embodiment, the mounting land for the spring pin is used. However, the present invention is not limited to this, and may be a land for mounting another spring-type pin contact component or a circular component. .

Moreover, in Embodiment 2, the convex part 32 was cut along the tangential direction of the circular part 31, and the partial missing gear | gear which has the missing part 33 which maintains the clearance C to the linear board | substrate edge 11 and a pattern in parallel is maintained. In the case of the curved substrate end 11, the convex portion 32 may be cut along a curve that does not cover the circular portion 31 and is parallel to the substrate end 11 while maintaining the clearance C. That is, a partially missing gear-type land 30 having a curved missing portion 33 that is parallel to the curved substrate end 11 while maintaining the clearance C may be used.
In short, in the case of the substrate end 11 having an arbitrary shape other than a linear shape, the convex portion 32 is cut along an arbitrary line that does not cover the circular portion 31 and is parallel to the substrate end 11 while maintaining the clearance C. What is necessary is just to set it as the partial missing gear type | mold land 30 which has the missing part 33 of the arbitrary shapes in parallel with the board | substrate edge 11 and clearance C maintained.

  Furthermore, the shape, number, etc. of the convex portions on the outer periphery of the circular portion are arbitrary, and it is needless to say that specific detailed structures and the like can be appropriately changed.

  A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.

(Appendix 1)
A land shape characterized in that convex portions are provided radially on the outer periphery of the circular portion.

(Appendix 2)
The land shape according to appendix 1, wherein the convex portion is cut along a tangential direction of the circular portion.

(Appendix 3)
The land shape according to appendix 1, wherein the convex portion is cut along an arbitrary line not extending over the circular portion.

(Appendix 4)
The land shape according to any one of appendices 1 to 3, wherein the circular portion has substantially the same diameter as a circular seat of a mounted component.

(Appendix 5)
The land shape according to appendix 4, wherein the mounted component is a spring-type pin contact component.

(Appendix 6)
The land shape according to appendix 5, wherein the spring-type pin contact part is a spring pin.

10 Substrate 11 Plate edge 20 Spring-type pin contact component (spring pin)
21 circular seat 30 gear type land 31 circular part 32 convex part 33 missing part 40 fillet

Claims (2)

A substrate,
A resist that covers the surface of the substrate and has an opening;
A circular portion formed in the opening on the substrate and having substantially the same diameter as a circular seat of a mounting component mounted by soldering; and a plurality of convex portions radially provided on the outer periphery of the circular portion; A land comprising
The mounting component is mounted on the circular portion and soldered, and a fillet is formed including the convex portion and the substrate between the adjacent convex portions.
A soldering structure characterized by that.   An electronic apparatus comprising the soldering structure according to claim 1.

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