JP2012079818A5 - - Google Patents

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Publication number
JP2012079818A5
JP2012079818A5 JP2010221763A JP2010221763A JP2012079818A5 JP 2012079818 A5 JP2012079818 A5 JP 2012079818A5 JP 2010221763 A JP2010221763 A JP 2010221763A JP 2010221763 A JP2010221763 A JP 2010221763A JP 2012079818 A5 JP2012079818 A5 JP 2012079818A5
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JP
Japan
Prior art keywords
substrate
induction
induction heating
heating
heating unit
Prior art date
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Pending
Application number
JP2010221763A
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English (en)
Japanese (ja)
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JP2012079818A (ja
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Publication date
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Priority to JP2010221763A priority Critical patent/JP2012079818A/ja
Priority claimed from JP2010221763A external-priority patent/JP2012079818A/ja
Publication of JP2012079818A publication Critical patent/JP2012079818A/ja
Publication of JP2012079818A5 publication Critical patent/JP2012079818A5/ja
Pending legal-status Critical Current

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JP2010221763A 2010-09-30 2010-09-30 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置 Pending JP2012079818A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010221763A JP2012079818A (ja) 2010-09-30 2010-09-30 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010221763A JP2012079818A (ja) 2010-09-30 2010-09-30 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置

Publications (2)

Publication Number Publication Date
JP2012079818A JP2012079818A (ja) 2012-04-19
JP2012079818A5 true JP2012079818A5 (https=) 2013-11-28

Family

ID=46239741

Family Applications (1)

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JP2010221763A Pending JP2012079818A (ja) 2010-09-30 2010-09-30 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置

Country Status (1)

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JP (1) JP2012079818A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7547126B2 (ja) 2020-09-08 2024-09-09 キオクシア株式会社 基板貼合装置、及び半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201420A (ja) * 1985-03-04 1986-09-06 Mitsubishi Electric Corp 分子線エピタキシ−装置
JP3516523B2 (ja) * 1995-05-30 2004-04-05 アネルバ株式会社 プラズマ処理装置
JP2000267589A (ja) * 1999-03-18 2000-09-29 Seiko Epson Corp 電気光学装置の製造装置および製造方法
JP2002144026A (ja) * 2000-11-06 2002-05-21 Fuji Electric Co Ltd ろう付け装置
JP2004342450A (ja) * 2003-05-15 2004-12-02 Kokusai Electric Semiconductor Service Inc 高周波誘導加熱装置及び半導体製造装置
US7569800B2 (en) * 2004-11-15 2009-08-04 Yonglai Tian Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
DE102006058493B4 (de) * 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
JP5226206B2 (ja) * 2006-12-22 2013-07-03 三井造船株式会社 誘導加熱を用いた熱処理方法および熱処理装置
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
JP4209457B1 (ja) * 2008-02-29 2009-01-14 三菱重工業株式会社 常温接合装置
US20100059182A1 (en) * 2008-09-05 2010-03-11 Jusung Engineering Co., Ltd. Substrate processing apparatus
TW201027594A (en) * 2009-01-07 2010-07-16 Advanced Optoelectronic Tech Method for bonding two matertials

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