JP2012074743A5 - - Google Patents
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- Publication number
- JP2012074743A5 JP2012074743A5 JP2012005848A JP2012005848A JP2012074743A5 JP 2012074743 A5 JP2012074743 A5 JP 2012074743A5 JP 2012005848 A JP2012005848 A JP 2012005848A JP 2012005848 A JP2012005848 A JP 2012005848A JP 2012074743 A5 JP2012074743 A5 JP 2012074743A5
- Authority
- JP
- Japan
- Prior art keywords
- resin insulation
- surface side
- main surface
- insulation layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 65
- 229920005989 resin Polymers 0.000 claims description 65
- 238000009413 insulation Methods 0.000 claims description 46
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 239000012774 insulation material Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 239000012784 inorganic fiber Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000012779 reinforcing material Substances 0.000 claims 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012005848A JP5449413B2 (ja) | 2012-01-16 | 2012-01-16 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012005848A JP5449413B2 (ja) | 2012-01-16 | 2012-01-16 | 多層配線基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010173305A Division JP5079059B2 (ja) | 2010-08-02 | 2010-08-02 | 多層配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012074743A JP2012074743A (ja) | 2012-04-12 |
| JP2012074743A5 true JP2012074743A5 (enrdf_load_stackoverflow) | 2012-05-31 |
| JP5449413B2 JP5449413B2 (ja) | 2014-03-19 |
Family
ID=46170548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012005848A Expired - Fee Related JP5449413B2 (ja) | 2012-01-16 | 2012-01-16 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5449413B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5990421B2 (ja) * | 2012-07-20 | 2016-09-14 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体パッケージ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006287056A (ja) * | 2005-04-01 | 2006-10-19 | Ngk Spark Plug Co Ltd | 配線基板および配線基板の製造方法 |
| JP5284235B2 (ja) * | 2008-09-29 | 2013-09-11 | 日本特殊陶業株式会社 | 半導体パッケージ |
| JP4473935B1 (ja) * | 2009-07-06 | 2010-06-02 | 新光電気工業株式会社 | 多層配線基板 |
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2012
- 2012-01-16 JP JP2012005848A patent/JP5449413B2/ja not_active Expired - Fee Related