JP2012073300A5 - - Google Patents

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Publication number
JP2012073300A5
JP2012073300A5 JP2010216240A JP2010216240A JP2012073300A5 JP 2012073300 A5 JP2012073300 A5 JP 2012073300A5 JP 2010216240 A JP2010216240 A JP 2010216240A JP 2010216240 A JP2010216240 A JP 2010216240A JP 2012073300 A5 JP2012073300 A5 JP 2012073300A5
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JP
Japan
Prior art keywords
substrate bonding
information includes
reference information
final ultimate
bonding apparatus
Prior art date
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Application number
JP2010216240A
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English (en)
Japanese (ja)
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JP5612418B2 (ja
JP2012073300A (ja
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Priority to JP2010216240A priority Critical patent/JP5612418B2/ja
Priority claimed from JP2010216240A external-priority patent/JP5612418B2/ja
Publication of JP2012073300A publication Critical patent/JP2012073300A/ja
Publication of JP2012073300A5 publication Critical patent/JP2012073300A5/ja
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Publication of JP5612418B2 publication Critical patent/JP5612418B2/ja
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JP2010216240A 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法 Active JP5612418B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010216240A JP5612418B2 (ja) 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010216240A JP5612418B2 (ja) 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法

Publications (3)

Publication Number Publication Date
JP2012073300A JP2012073300A (ja) 2012-04-12
JP2012073300A5 true JP2012073300A5 (enrdf_load_stackoverflow) 2013-11-07
JP5612418B2 JP5612418B2 (ja) 2014-10-22

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ID=46169563

Family Applications (1)

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JP2010216240A Active JP5612418B2 (ja) 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法

Country Status (1)

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JP (1) JP5612418B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117390572B (zh) * 2023-12-11 2024-04-19 深圳蓝狐思谷科技有限公司 一种贴合的真空异常监测系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4249307B2 (ja) * 1998-12-28 2009-04-02 株式会社アルバック 真空蒸着装置における基板割れ検出装置及び検出方法
JP2003131241A (ja) * 2001-10-24 2003-05-08 Matsushita Electric Ind Co Ltd 液晶基板の貼り合わせ方法
JP2005189504A (ja) * 2003-12-25 2005-07-14 Kyoshin Engineering:Kk 液晶脱泡装置及び方法
JP4598463B2 (ja) * 2004-09-21 2010-12-15 芝浦メカトロニクス株式会社 真空装置、基板貼り合わせ装置、及び基板貼り合わせ方法
JP2006235603A (ja) * 2005-01-27 2006-09-07 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ判定方法及び基板貼り合わせ方法

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