JP2012073198A - Microchip for analyzer, analysis system, and method for manufacturing microchip for analyzer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microchip for an analyzer, which can be properly positioned when being manufactured and used, and to provide an analysis system and a method for manufacturing the microchip for an analyzer.SOLUTION: A microchip 101 includes two substrates 1 combined with each other, and a positioning region 2 which is to be brought into contact with positioning means in order to combine them is formed on each of two substrates 1.

Description

  The present invention relates to an analysis device microchip, an analysis system, and an analysis device microchip manufacturing method using, for example, electrophoresis.

  As an analysis method for analyzing the concentration or amount of a specific component contained in a sample, for example, an analysis method using capillary electrophoresis is widely practiced. In capillary electrophoresis, a separation channel having a relatively small cross-sectional area is filled with an electrophoresis solution, and the sample is introduced near one end of the separation channel. When voltage is applied to both ends of the separation channel, an electroosmotic flow is generated in which the electrophoresis solution moves from the positive electrode side to the negative electrode side by electrophoresis. In addition, when the voltage is applied, the specific component tends to move according to the electrophoretic mobility. Accordingly, the specific component moves according to a velocity vector obtained by synthesizing the velocity vector of the electroosmotic flow and the velocity vector of movement by electrophoresis. By this movement, the specific component is separated from other components. By detecting the separated specific component by, for example, an optical method, the amount and concentration of the specific component can be analyzed.

  23 to 25 show an example of a conventional method for manufacturing a microchip to be loaded in an analyzer using capillary electrophoresis. First, as shown in FIG. 23, two substrates 901 and 902 are prepared. The substrates 901 and 902 are made of a transparent resin such as an acrylic resin. A positioning hole 904 is formed in the substrate 901. A groove 903 and a positioning projection 905 are formed on the substrate 902. Next, as illustrated in FIG. 24, the substrate 901 and the substrate 902 are bonded so that the positioning protrusion 905 passes through the positioning hole 904. And as shown in FIG. 25, the front-end | tip of the positioning protrusion 905 is made into a flat shape by heating with a heater, for example. Thereby, the microchip 900 is completed. The groove 903 constitutes a separation channel in which a specific component is separated by electrophoresis.

  However, the substrates 901 and 902 are often formed of the same or similar resin. For this reason, the positioning hole 904 and the positioning projection 905 do not have a great difference in hardness. The positioning accuracy when these are fitted is determined by the degree of deformation of each of the positioning hole 904 and the positioning projection 905. If there is no significant difference in hardness between each other, it is difficult to predict what kind of tendency the positional deviation will be caused by these deformations. This can be a factor that hinders increasing the positioning accuracy of the substrates 901 and 902. Further, if the positioning protrusion 905 is damaged or deformed, proper positioning cannot be achieved. For this reason, after the substrate 902 is formed, the positioning protrusion 905 is required to be sufficiently protected before being bonded to the substrate 901. Therefore, the work efficiency is reduced and the manufacturing cost is increased. Furthermore, the microchip 900 is required to be accurately positioned with respect to the analyzer in which the microchip 900 is mounted not only at the time of manufacture but also at the time of use. However, the positioning holes 904 and the positioning protrusions 905 are used only for positioning at the time of manufacture and do not contribute to positioning at the time of use.

JP 2008-224431 A

  The present invention has been conceived under the circumstances described above, and is a microchip for an analyzer, an analysis system, and a microchip for an analyzer that can be appropriately positioned during manufacture and use It is an object of the present invention to provide a manufacturing method.

  The microchip for an analyzer provided by the first aspect of the present invention includes two substrates combined with each other, and each of the two substrates is brought into contact with a positioning means when combining them. A positioning area is formed.

  In a preferred embodiment of the present invention, the positioning region includes a positioning surface.

  In a preferred embodiment of the present invention, the positioning region includes a recess that is recessed in a direction perpendicular to the thickness direction of the substrate, and the bottom surface of the recess is the positioning surface.

  In a preferred embodiment of the present invention, the positioning surfaces of the two substrates are flush with each other.

  In a preferred embodiment of the present invention, the positioning region includes a through hole that penetrates the substrate in the thickness direction, and an inner surface of the through hole serves as the positioning surface.

  In a preferred embodiment of the present invention, a separation channel for performing separation using electrophoresis and a liquid reservoir connected to the end of the separation channel are formed, and the inner surface of the liquid reservoir is The positioning surface is used.

  In a preferred embodiment of the present invention, there are formed a separation channel for performing separation using an electrophoresis method, and a concave portion for an analyzer that is recessed from the surface of the substrate toward the separation channel. The inner surface of the analyzer recess is the positioning surface.

  The analysis system provided by the second aspect of the present invention includes a microchip having a positioning region, and an analyzer having positioning means for determining the position of the microchip by contacting the positioning region. .

  In a preferred embodiment of the present invention, the positioning region includes a positioning surface.

  In a preferred embodiment of the present invention, the microchip is formed with a separation channel for performing separation using electrophoresis and a liquid reservoir connected to an end of the separation channel, The inner surface of the liquid reservoir is used as the positioning surface, and the analyzer is used for introducing a liquid into the liquid reservoir or discharging a liquid from the liquid reservoir, and a nozzle that contacts the inner surface of the liquid reservoir. I have.

  In a preferred embodiment of the present invention, the microchip is provided with a separation channel for performing separation using an electrophoresis method and a concave portion for an analyzer that is recessed toward the separation channel, The inner surface of the concave portion for the analyzer is used as the positioning surface, and the analyzer includes an analyzer that is used for component analysis of the liquid flowing in the separation channel and that contacts the inner surface of the concave portion for the analyzer. Yes.

  According to a third aspect of the present invention, there is provided a method of manufacturing a microchip for an analysis apparatus, comprising: a step of preparing two substrates each having a positioning region; and a positioning means separated from the substrate. Combining the two substrates in a state in which the positioning region of the substrate is brought into contact therewith.

  In a preferred embodiment of the present invention, the positioning region includes a positioning surface.

  In a preferred embodiment of the present invention, the positioning region includes a recess recessed in a direction perpendicular to the thickness direction of the substrate, and the bottom surface of the recess is used as the positioning surface.

  In a preferred embodiment of the present invention, in the step of combining the two substrates, the positioning surfaces of the two substrates are flush with each other.

  In a preferred embodiment of the present invention, the positioning region includes a through hole penetrating the substrate in the thickness direction, and an inner surface of the through hole is used as the positioning surface.

  In a preferred embodiment of the present invention, the substrate is formed with a separation channel for performing separation using electrophoresis and a liquid reservoir tank connected to an end of the separation channel. The inner surface of the reservoir is used as the positioning surface.

  In a preferred embodiment of the present invention, the substrate is formed with a separation channel for performing separation using electrophoresis and a concave portion for analyzer that is recessed from the surface of the substrate toward the separation channel. The inner surface of the concave portion for analyzer is used as the positioning surface.

    According to this embodiment, at the time of manufacturing the microchip, the position of the two substrates can be accurately determined by bringing the positioning region of the two substrates into contact with the positioning means. It is. Further, when the microchip is used, the positioning area can be used for positioning the microchip and the analyzer on which the microchip is mounted. Therefore, appropriate positioning can be realized both during manufacture and use of the microchip.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a perspective view which shows the microchip for analyzers based on 1st Embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a principal part expanded sectional view which shows the microchip for analyzers of FIG. It is sectional drawing which follows the IV-IV line of FIG. It is a principal part expanded sectional view which shows the microchip for analyzers of FIG. It is a top view which shows the board | substrate of the microchip for analyzers of FIG. It is a bottom view which shows the board | substrate of the microchip for analyzers of FIG. It is a perspective view which shows an example of the manufacturing method of the microchip for analyzers of FIG. It is a principal part top view which shows an example of the analysis system using the microchip for analyzers of FIG. It is a principal part top view which shows the other example of the analysis system using the microchip for analyzers of FIG. It is principal part sectional drawing which shows the manufacturing method of the microchip for analyzers based on 2nd Embodiment of this invention. It is principal part sectional drawing which shows the analysis system using the microchip for analyzers of FIG. It is principal part sectional drawing which shows the analysis system using the microchip for analyzers of FIG. It is principal part sectional drawing which shows the manufacturing method of the microchip for analyzers based on 3rd Embodiment of this invention. It is principal part sectional drawing which shows the analysis system using the microchip for analyzers of FIG. It is principal part sectional drawing which shows the analysis system using the microchip for analyzers of FIG. It is a top view which shows the microchip for analyzers based on 4th Embodiment of this invention. It is a top view which shows the microchip for analyzers based on 5th Embodiment of this invention. It is a top view which shows the microchip for analyzers based on 6th Embodiment of this invention. It is a perspective view which shows the other example of the manufacturing method of the microchip for analyzers based on 1st Embodiment of this invention. It is a perspective view which shows the microchip for analyzers based on 7th Embodiment of this invention. It is sectional drawing which follows the XXI-XXI line of FIG. It is principal part sectional drawing which shows an example of the manufacturing method of the conventional microchip for analyzers. It is principal part sectional drawing which shows an example of the manufacturing method of the conventional microchip for analyzers. It is principal part sectional drawing which shows an example of the conventional microchip for analyzers.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 5 show a microchip for an analyzer according to the first embodiment of the present invention. The microchip 101 of the present embodiment has a structure in which two substrates 1 are bonded to each other, and includes a positioning region 2, a separation channel 3, an introduction tank 41, a discharge tank 42, a light emitting side concave part 5, and a light receiving side concave part. Two 6 are formed. The microchip 101 has a configuration in which two sets of analysis paths for performing analysis using capillary electrophoresis are formed on the upper surface side and the lower surface side in FIG. The specific component to be analyzed in this analysis includes, for example, hemoglobin represented by A1c when blood is used as a sample, but is not limited thereto.

  The substrate 1 is a long rectangular plate member made of a transparent resin and serves as a main body of the macro chip 101. Examples of the transparent resin include PDMS (silicone resin), PMMA (acrylic resin), PS (polystyrene resin), and PC (polycarbonate resin). Furthermore, the material of the substrate 1 includes glass such as quartz glass. The size of the substrate 1 is, for example, about 58 mm in length, about 9 mm in width, and about 1.5 mm in thickness.

  The positioning region 2 is used for positioning when the microchip 101 is manufactured and used, and includes a positioning recess 26 and a positioning surface 22 in this embodiment. The positioning recess 26 is formed in each of the two substrates 1 and is recessed in the width direction. In the present embodiment, the positioning recess 26 has an opening length in the longitudinal direction of the substrate 1 of about 3 mm and a depth of about 0.5 mm, and has a constant shape in the thickness direction of the substrate 1. . The bottom surface of the positioning recess 26 is a positioning surface 21. The positioning surface 21 is a surface perpendicular to the width direction of the substrate 1 and has a dimension in the length direction of the substrate 1 of about 1 mm. The positioning surface 22 is one end surface in the longitudinal direction of the substrate 1 and is perpendicular to the longitudinal direction of the substrate 1. The dimensional accuracy of the positioning surfaces 21 and 22 is about 1 to 5 μm.

  The separation channel 3 extends long in the longitudinal direction of the substrate 1 and is used to separate a specific component to be analyzed in capillary electrophoresis. The separation channel 3 is, for example, a rectangular shape with a cross-sectional shape of 40 μm square, and the length thereof is about 30 mm. In the present embodiment, two separation channels 3 that are parallel to each other are formed in the microchip 101. As shown in FIG. 5, one separation channel 3 is configured to enter one substrate 1. The other separation channel 3 is configured to enter the other substrate 1.

  The introduction tank 41 is a tank into which an electrophoresis solution called a buffer used in capillary electrophoresis or a sample to be analyzed is introduced, and is connected to one end of the separation channel 3 as shown in FIG. An example of the electrophoresis solution is 100 mM malic acid-arginine buffer (pH 5.0) + 1.5% chondroitin sulfate C sodium. The sample is blood, for example. In the present embodiment, the introduction tank 41 passes through one of the substrates 1 and has a cross-sectional shape that is substantially elliptical with a longitudinal dimension of 5.6 mm and a width dimension of 1.2 mm.

  The discharge tank 42 is a tank into which an electrophoresis solution called a buffer used in capillary electrophoresis and a sample to be analyzed are introduced, and is connected to the other end of the separation channel 3 as shown in FIG. In the present embodiment, the discharge tank 42 penetrates one of the substrates 1, and the cross-sectional shape thereof is a substantially elliptical shape having a longitudinal dimension of 5.6 mm and a width dimension of 1.2 mm.

  The light emitting side concave portion 5 has a shape recessed in the thickness direction from the surface of the substrate 1 and is a portion on which light for performing an analysis using capillary electrophoresis is incident. As shown in FIG. 4, the light emitting side recess 5 includes an outer recess 51 and an inner recess 52.

  The outer recessed portion 51 is a portion recessed from the surface of the substrate 1 and has a cross-sectional shape of a circle having a diameter of about 3 mm and a depth of about 0.8 mm. The inner concave portion 52 is a portion recessed from the bottom surface of the outer concave portion 51, and has a cross-sectional shape of a circle having a diameter of about 0.6 mm and a depth of about 0.2 mm. A bottom surface of the inner concave portion 52 is a translucent surface 521. The translucent surface 521 is a surface through which light for analysis is transmitted. The inner recess 52 overlaps the separation channel 3 when viewed in the thickness direction of the substrate 1. Each inner recess 52 is formed in the substrate 1 on the side opposite to the substrate 1 on the side where the separation flow path 3, which is in a positional relationship overlapping when viewed in the thickness direction of the substrate 1.

  The light-receiving side recess 6 has a shape that is recessed in the thickness direction from the surface of the substrate 1 and is a part from which light for analysis using capillary electrophoresis is emitted. In the present embodiment, the light-receiving side recess 6 has a substantially truncated cone shape, and has an opening having a circular shape with a diameter of about 2 mm and a depth of about 0.13 mm.

  As shown in FIG. 4, the light receiving side recess 6 has a transmission surface 61 and a reflection surface 62. The transmission surface 61 is the bottom surface of the light receiving side recess 6 and has a circular shape with a diameter of about 33 μm. The reflecting surface 62 is a surface that hits the side surface of the truncated cone. Each light-receiving side recess 6 is formed on the side opposite to the light-emitting side recess 5 with the separation channel 3 interposed therebetween. When viewed in the thickness direction of the substrate 1, the center of the transmission surface 61 and the center line of the separation channel 3 face each other so as to coincide with each other. Each light-receiving side recess 6 is formed on the substrate 1 on the side where the separation channel 3 facing the transmission surface 61 enters.

  Next, a manufacturing method of the microchip 101 will be described below with reference to FIGS.

  First, two substrates 1 shown in FIGS. 6 and 7 are prepared. These substrates 1 have the same configuration, and are formed, for example, by molding using a resin material. The substrate 1 is formed with a positioning region 2, a groove 31, an introduction tank 41, a discharge tank 42, a light emitting side concave part 5, and a light receiving side concave part 6.

  As shown in FIG. 6, the introduction tank 41, the discharge tank 42, the light emitting side recess 5, and the light receiving side recess 6 appear on the surface side of the substrate 1. Among these, the introduction tank 41, the discharge tank 42, and the light emitting side recess 5 are arranged in series in the longitudinal direction of the substrate 1.

  On the other hand, as shown in FIG. 7, the introduction tank 41, the discharge tank 42, and the groove 31 appear on the back side of the substrate 1. The groove 31 is a part for configuring the separation channel 3 described above.

  The positioning region 2 is constituted by the positioning recess 26 and the positioning surface 22 as described above. In the present embodiment, the substrate 1 has two positioning recesses 26 formed at both ends in the width direction.

  Next, as shown in FIG. 8, the two substrates 1 are bonded so that the back surfaces of the substrates 1 face each other. Positioning means 700 is used for positioning the bonding. The positioning means 700 includes positioning blocks 711 and 712.

  The positioning block 711 extends in the thickness direction of the substrate 1 and has a positioning surface 721 that is perpendicular to the width direction of the substrate 1. The positioning surface 721 has a longitudinal dimension of the substrate 1 of, for example, about 0.9 mm. The positioning block 712 extends in the thickness direction of the substrate 1 and has a positioning surface 722 that is perpendicular to the longitudinal direction of the substrate 1. The positioning blocks 711 and 712 are made of a metal such as stainless steel, for example.

  When the two substrates 1 are overlapped, the positioning block 711 is disposed on one side in the width direction of the two substrates 1, and the positioning block 712 is positioned on one side in the longitudinal direction of the substrate 1. Then, the positioning surface 721 and the positioning surfaces 21 of the two substrates 1 are brought into contact with each other, and the positioning surface 722 and the positioning surfaces 22 of the two substrates 1 are brought into contact with each other. In this state, the two substrates 1 are bonded together. Thereby, the above-mentioned microchip 101 is obtained. In the microchip 101, the positioning surfaces 21 and the positioning surfaces 22 of the two substrates 1 are flush with each other.

  Next, an example of the analysis system according to the present invention will be described with reference to FIG.

  The analysis system 800 shown in the figure includes an analysis device 801 and a microchip 101. The analysis apparatus 801 is an apparatus that performs analysis using, for example, capillary electrophoresis, and uses the loaded microchip 101 to introduce an electrophoretic solution and a sample, separation by applying a voltage, and measurement using an optical technique. I do. In addition to the positioning means 850 shown in the figure, the analyzer 801 includes an introduction nozzle, an analysis unit, a control unit, and the like (not shown).

  The positioning means 850 is for positioning the microchip 101 with respect to the analyzer 801 and includes positioning blocks 851, 852, and 853. The positioning block 851 has a positioning surface 855. The positioning surface 855 contacts the positioning surface 21 of the microchip 101. The microchip 101 formed using the substrate 1 described above is provided with positioning recesses 26 on both sides in the width direction. The positioning surface 21 with which the positioning surface 855 is brought into contact is the positioning surface 21 with which the positioning surface 721 of the positioning block 711 is in contact in FIG.

  The positioning block 853 is located on the opposite side of the positioning block 851 with the microchip 101 interposed therebetween. The positioning block 853 is movable forward and backward toward the positioning recess 26 located in the lower part of the drawing. The positioning block 853 is for pressing the microchip 101 against the positioning block 851.

  The positioning surface block 852 is at a position adjacent to one end in the longitudinal direction with respect to the microchip 101, and has a contact surface 856. The contact surface 856 is perpendicular to the longitudinal direction of the microchip 101 and contacts the positioning surface 22. The positioning blocks 851, 852, 853 are made of metal such as stainless steel, for example.

  By positioning the positioning surfaces 21 and 22 of the microchip 101 against the positioning surfaces 855 and 856 of the analyzer 801, the microchip 101 is positioned with respect to the analyzer 801. After this, the analysis using the capillary electrophoresis method including the introduction of the electrophoresis solution and the sample by the introduction nozzle described above, the separation of the specific component by applying the voltage across the separation channel 3, and the measurement using the optical means Is executed under the control of the control unit.

  Next, operations of the microchip 101 and the analysis system 800 will be described.

  According to the present embodiment, when the microchip 101 is manufactured, the positioning surface 21 of the two substrates 1 and the positioning surface 721 of the positioning block 711 are brought into contact with each other to thereby adjust the position in the width direction between the two substrates 1. It is possible to determine accurately. In addition, it is possible to accurately determine the longitudinal positions of the two substrates 1 by bringing the positioning surfaces 22 of the two substrates 1 and the positioning surfaces 722 of the positioning blocks 712 into contact with each other. Further, when the microchip 101 is used, the microchip 101 is moved in the width direction and the longitudinal direction by bringing the positioning surfaces 21 and 22 of the microchip 101 into contact with the positioning surfaces 855 and 856 of the positioning blocks 851 and 852. Accurate positioning with respect to the analyzer 801 is possible. In addition, the completed microchip 101 does not have a portion that does not contribute at all in the subsequent use, such as a positioning protrusion 905 shown in FIG. In addition, the management of the positioning surfaces 21 and 22 is considerably easier as compared to managing the positioning protrusions 905 so as not to be damaged.

  By bonding the two substrates 1 so that the positioning surfaces 21 and 22 provided on the two substrates 1 are flush with each other, the microchip 101 has the positioning surfaces 21 and 22 over the entire thickness direction. Will be provided. This is advantageous for positioning the microchip 101 relative to the analyzer 801.

  The positioning blocks 711 and 712 used at the time of manufacturing the microchip 101 and the positioning blocks 851, 852 and 853 used at the time of using the microchip 101 are all made of metal such as stainless steel and are equivalent to the substrate 1 constituting the microchip 101. High hardness. As a result, the positioning blocks 711 and 712 and the positioning blocks 851, 852 and 853 that serve as the reference for positioning the substrate 1 or the microchip 101 are less likely to be unjustly deformed. This is suitable for accurately positioning the substrate 1 and the microchip 101.

  FIG. 10 shows another example of the positioning means 850 of the analysis system 800. In the illustrated example, the positioning means 850 is composed of two positioning blocks 854. Each positioning block 854 has a cylindrical shape whose axial direction is the thickness direction of the microchip 101. One positioning block 854 contacts the positioning surface 2 to determine the position of the microchip 101 in the width direction. The other positioning block 854 determines the position of the microchip 101 in the longitudinal direction by contacting the positioning recess 29 formed at one end of the microchip 101 in the longitudinal direction. Even with such a configuration, the microchip 101 can be properly positioned in the analysis system 800.

  11 to 19 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  FIG. 11 shows an example of a microchip manufacturing method according to the second embodiment of the present invention. In the present embodiment, the inner side surface of the outer recessed portion 51 of the light emitting side recessed portion 5 is the positioning surface 23, and the light emitting side recessed portion 5 constitutes the positioning region 2.

  In this embodiment, two positioning blocks 713 are used. Each positioning block 713 has a cylindrical shape and has a diameter that can be inserted without causing an excessive gap in the outer recess 51. A side surface of the positioning block 713 is a positioning surface 723. The two positioning blocks 713 are supported by a casing (not shown) having sufficient rigidity, for example, and can reciprocate in the longitudinal direction.

  A positioning block 713 is inserted into the light emitting side recess 5 of each substrate 1. Then, the two substrates 1 are bonded together by bringing the two positioning blocks 713 closer to each other. Thereby, the microchip 102 shown in FIG. 12 is obtained. In addition to positioning using the two positioning blocks 713, positioning by the positioning block 712 and the positioning surface 22 shown in FIG.

  As shown in FIG. 12, the analysis device 801 on which the microchip 102 is loaded includes the illustrated analysis unit 810. The analysis unit 810 is for performing analysis of a specific component by, for example, absorbance measurement or fluorescence measurement, and includes an irradiation unit 811 and a detection unit 820.

  The irradiating means 811 is for irradiating light emitted from a light source (not shown) to the light transmitting surface 521 of the light emitting recess 5, and includes an optical fiber 814, a holder 817, a case 818, and a spring 819. The light source includes, for example, an LED or a laser that emits blue light.

  The optical fiber 814 transmits light from the light source and includes a core 815 and a coating 816. The core 815 is a very thin wire made of a transparent resin. The coating 816 is for totally reflecting light traveling through the core 815 and is made of a material having a higher refractive index than that of the core 815.

  The holder 817 holds the tip portion of the optical fiber 814 and is generally called a ferrule. The portion near the tip of the holder 817 has a diameter that fits into the outer recess 51 of the microchip 102. The outer surface of this part is a positioning surface 857, and the holder 817 constitutes the positioning means 850 in this embodiment.

  The case 818 has a substantially cylindrical shape, and the holder 817 is inserted therethrough. The spring 819 is sandwiched between the holder 817 and the case 818, and exerts an elastic force that presses the holder 817 downward when the case 818 descends relative to the holder 817.

  The detection means 820 receives the light transmitted through the microchip 102 and generates an electrical signal corresponding to the received light. This electrical signal corresponds to the amount and concentration of a specific component contained in the sample, and is used for analyzing the sample.

  After placing the microchip 102 at a predetermined position of the analyzer 801, the irradiation means 811 is lowered toward the light emitting recess 5. Then, by fitting the tip of the holder 817 into the outer recess 51, the microchip 102 is positioned with respect to the analyzer 801 as shown in FIG. In addition to this positioning, positioning by the positioning block 852 and the positioning surface 22 shown in FIG. 9 may be used in combination.

  Also according to such an embodiment, positioning at the time of manufacture and use of the microchip 102 can be performed appropriately. Further, by configuring the positioning means 850 with the holder 817, it is possible to reduce the dedicated configuration for positioning provided in the analyzer 801. This is advantageous for reducing the cost of the analyzer 801.

  FIG. 14 shows an example of a microchip manufacturing method according to the third embodiment of the present invention. In the present embodiment, the inner surface of the introduction tank 41 of the substrate 1 is the positioning surface 24, and the introduction tank 41 constitutes the positioning region 2. In the present embodiment, the two positioning blocks 714 are inserted into the two introduction tanks 41 when the two substrates 1 are bonded together. A positioning surface 724 that fits into the introduction tank 41 is formed in the positioning block 714. With such a manufacturing method, the microchip 103 shown in FIG. 15 is obtained.

  When the microchip 103 is used, the microchip 103 is positioned with respect to the analyzer 801 using the introduction nozzle 830 provided in the analyzer 801. The introduction nozzle 830 is a nozzle for introducing an electrophoresis solution or a sample into the introduction tank 41. An insertion portion 831 is formed at the tip of the introduction nozzle 830. The cross-sectional shape of the insertion portion 831 is substantially the same as the cross-sectional shape of the introduction tank 41 and is fitted to each other. The outer surface of the insertion portion 831 is a positioning surface 858, and in this embodiment, the introduction nozzle 830 constitutes the positioning means 850.

  The introduction nozzle 830 is lowered toward the introduction tank 41, and the insertion portion 831 is inserted into the introduction tank 41 as shown in FIG. Thereby, the microchip 103 is positioned with respect to the analyzer 801. In addition to this positioning, positioning by the positioning block 852 and the positioning surface 22 shown in FIG. 9 may be used in combination.

  Also according to such an embodiment, positioning at the time of manufacture and use of the microchip 103 can be performed appropriately. Further, by configuring the positioning means 850 with the introduction nozzle 830, it is possible to reduce the dedicated configuration for positioning provided in the analyzer 801. This is advantageous for reducing the cost of the analyzer 801.

  FIG. 17 shows a microchip for an analyzer according to the fourth embodiment of the present invention. In the microchip 104 of the present embodiment, the positioning region 2 is constituted by the positioning recesses 26 and 26 '. The positioning recess 26 is the same as that provided in the microchip 101, and is formed in the substrate 1 located on the back side in the figure. The positioning recess 26 ′ is formed in the substrate 1 positioned on the near side in the figure, and the dimension in the longitudinal direction of the substrate 1 is larger than that of the positioning recess 26. The bottom surface of the positioning recess 26 'is a positioning surface 21'. The positioning surface 21 ′ is flush with the positioning surface 21.

  Also according to such an embodiment, it is possible to appropriately position the microchip 104 at the time of manufacture and use. As can be understood from the present embodiment, the positioning regions 2 formed on the respective substrates 1 do not have to have exactly the same configuration, as long as they can determine the positions of each other.

  FIG. 18 shows a microchip for an analyzer according to the fifth embodiment of the present invention. In the microchip 105 of this embodiment, the positioning region 2 is configured by the positioning hole 27. The positioning hole 27 is formed in each substrate 1 and penetrates the substrate 1 in the thickness direction. The inner surface of the positioning hole 27 is a positioning surface 25.

  Also according to such an embodiment, it is possible to appropriately position the microchip 105 at the time of manufacture and use. As can be understood from the present embodiment, the positioning region 2 formed on each substrate 1 may be located at a position separated in the thickness direction of the substrate 1.

  FIG. 19 shows a microchip for an analyzer according to the sixth embodiment of the present invention. In the microchip 106 of the present embodiment, the positioning region 2 is constituted by the positioning hole 27 and the positioning hole 28. The positioning hole 27 is formed in the substrate 1 located on the back side in the figure, and penetrates the substrate 1 in the thickness direction. The inner surface of the positioning hole 27 is a positioning surface 25. The positioning hole 28 is formed in the substrate 1 positioned in front of the figure. The positioning hole 28 has a cross shape in cross section and penetrates in the thickness direction. The four corners inside the positioning hole 28 are positions in contact with the positioning hole 27 as viewed in the thickness direction.

  In manufacturing the microchip 106, a cylindrical positioning block (not shown) that fits into the positioning hole 27 may be used. If the two substrates 1 are bonded together in a state where the positioning block is inserted through the positioning holes 27 and 28, the microchip 106 is obtained. According to such an embodiment, it is possible to appropriately position the microchip 106 at the time of manufacture and use.

  FIG. 20 shows another example of the manufacturing method of the microchip 101 described with reference to FIG. In the present embodiment, a pressing spring 730 that presses the substrates 1 is used. The pressing spring 730 is in contact with the vicinity of the end portion of the substrate 1 and exhibits an elastic force that presses the two substrates 1 together. This elastic force is strong enough to bond the substrates 1 to each other by bonding the materials without using an adhesive.

  Also by such a manufacturing method, the microchip 101 can be appropriately manufactured. As understood from the example of the present manufacturing method, the term “combination” in the present invention means that the substrates 1 are bonded together using an adhesive, and the materials of the substrates 1 are bonded together without using an adhesive. It is a concept that includes.

  21 and 22 show an analysis device microchip according to a seventh embodiment of the present invention. The microchip 107 of the present embodiment is different from the above-described embodiment in that it includes two clips 740. The clip 740 is made of resin, for example, and fulfills a function of combining the two substrates 1 in a state where the two substrates 1 are sandwiched. In addition, a positioning surface 741 is formed on the clip 740. When manufacturing the microchip 107, the two substrates 1 are sandwiched between the clips 740 with the positioning surface 741 in contact with the positioning surface 21. In this manufacturing method, the clip 740 is used as the positioning means 700. Further, when the microchip 107 is used, the outer surface of the clip 740 may be used as a positioning surface.

  Also according to such an embodiment, it is possible to appropriately position the microchip 107 at the time of manufacture and use. Further, as understood from the present embodiment, the term “combination” in the present invention is not limited to bonding, but is a concept indicating that the two substrates 1 are fixed to each other, and the means is not limited at all. .

  The analysis device microchip, the analysis system, and the analysis device microchip manufacturing method according to the present invention are not limited to the above-described embodiments. The specific configuration of the analysis device microchip, the analysis system, and the analysis device microchip manufacturing method according to the present invention can be varied in design in various ways.

101-107 Microchip 1 Substrate 2 Positioning regions 21, 21 ′, 22, 23, 24, 25 Positioning surfaces 26, 26 ′, 29 Positioning recesses 27, 28 Positioning holes 3 Separation flow path 31 Groove 41 Introducing tank 42 Discharging tank 5 Emitting side recess (analyzer recess)
51 Outer recessed portion 52 Inner recessed portion 521 Light transmitting surface 6 Light receiving side recessed portion 61 Light transmitting surface 62 Reflecting surface 700 Positioning means 711, 712, 713, 714 Positioning block 721, 722, 723, 724 Positioning surface 730 Press spring 740 Clip 741 Positioning surface 800 Analysis System 801 Analysis Device 810 Analysis Unit 811 Irradiation Unit 812 Light Source 813 Irradiation Unit 814 Optical Fiber 815 Core 816 Cover 817 Holder 818 Case 819 Spring 820 Detection Unit 830 Introduction Nozzle 831 Insertion Unit 835 Hose 840 Control Unit 850 Positioning Unit 851 852, 853, 854 Positioning block 855, 856, 857, 858 Positioning surface

Claims (18)

It has two substrates bonded together,
Each of the two substrates is provided with a positioning region for contacting a positioning means when combining them.   The analysis device microchip according to claim 1, wherein the positioning region includes a positioning surface. The positioning region includes a recess recessed in a direction perpendicular to the thickness direction of the substrate,
The microchip for an analyzer according to claim 2, wherein a bottom surface of the recess is the positioning surface.   The microchip for an analyzer according to claim 2 or 3, wherein the positioning surfaces of the two substrates are flush with each other. The positioning region includes a through hole penetrating the substrate in the thickness direction,
The microchip for an analyzer according to claim 2, wherein an inner surface of the through hole is the positioning surface. A separation channel for performing separation using an electrophoresis method and a liquid reservoir connected to the end of the separation channel are formed,
The microchip for an analyzer according to claim 2, wherein an inner surface of the liquid reservoir is the positioning surface. A separation flow path for performing separation using an electrophoresis method and a concave portion for an analyzer recessed from the surface of the substrate toward the separation flow path are formed,
The microchip for an analyzer according to claim 2, wherein an inner surface of the concave portion for the analyzer is the positioning surface. A microchip having a positioning region;
An analyzer having positioning means for determining the position of the microchip by contacting the positioning region;
An analysis system comprising:   The analysis system according to claim 8, wherein the positioning region includes a positioning surface. In the microchip, a separation channel for performing separation using an electrophoresis method and a liquid reservoir tank connected to an end of the separation channel are formed, and an inner surface of the liquid reservoir tank is connected to the positioning surface. Has been
The analysis system according to claim 9, wherein the analyzer is used for introducing a liquid into the liquid reservoir or discharging a liquid from the liquid reservoir, and includes a nozzle that contacts the inner surface of the liquid reservoir. The microchip includes a separation channel for performing separation using an electrophoresis method and an analyzer recess recessed toward the separation channel, and an inner surface of the analyzer recess is positioned on the positioning surface. It is said that
The analysis system according to claim 9, wherein the analysis device includes an analyzer that is used for component analysis of a liquid flowing through the separation flow path and is in contact with an inner surface of the concave portion for the analyzer. Providing two substrates each having a positioning region;
Combining the two substrates in a state in which the positioning region of each substrate is in contact with a positioning means that is separate from the substrate;
The manufacturing method of the microchip for analyzers which has this.   The method for manufacturing a microchip for an analyzer according to claim 12, wherein the positioning region includes a positioning surface. The positioning region includes a recess recessed in a direction perpendicular to the thickness direction of the substrate,
The manufacturing method of the microchip for analyzers of Claim 13 which uses the bottom face of the said recessed part as the said positioning surface.   The method for producing a microchip for an analyzer according to claim 13 or 14, wherein, in the step of combining the two substrates, the positioning surfaces of the two substrates are flush with each other. The positioning region includes a through hole penetrating the substrate in the thickness direction,
The method for manufacturing a microchip for an analyzer according to claim 13, wherein the inner surface of the through hole is used as the positioning surface. The substrate is formed with a separation channel for performing separation using an electrophoresis method and a liquid reservoir tank connected to an end of the separation channel,
The method for producing a microchip for an analyzer according to claim 13, wherein the inner surface of the liquid reservoir is used as the positioning surface. The substrate is provided with a separation channel for performing separation using an electrophoresis method and a concave portion for an analyzer that is recessed from the surface of the substrate toward the separation channel,
The manufacturing method of the microchip for analyzers of Claim 13 which uses the inner surface of the said recessed part for analyzers as said positioning surface.

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