JP2012060172A5 - - Google Patents
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- JP2012060172A5 JP2012060172A5 JP2011276729A JP2011276729A JP2012060172A5 JP 2012060172 A5 JP2012060172 A5 JP 2012060172A5 JP 2011276729 A JP2011276729 A JP 2011276729A JP 2011276729 A JP2011276729 A JP 2011276729A JP 2012060172 A5 JP2012060172 A5 JP 2012060172A5
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本発明の一態様によれば、サファイア基板の上に形成され、窒化物半導体を含むn型半導体層と、窒化物半導体を含むp型半導体層と、前記n型半導体層と前記p型半導体層との間に設けられ、窒化物半導体を含む複数の量子井戸層を含む発光部と、前記発光部と前記p型半導体層との間に設けられ、0.001以上0.05以下の第1Al組成比を有するAlGaNを含み、0.5ナノメートル以上5ナノメートル以下の厚さを有する第1層と、前記第1層と前記p型半導体層との間に設けられ、0.1以上0.2以下の第2Al組成比を有するAlGaNを含みp型不純物濃度が前記第1層よりも高い第2層と、前記第1層と前記発光部との間において、前記複数の量子井戸層のうちで前記p型半導体層に最も近いp側量子井戸層に接し、厚さが3ナノメートル以上で8ナノメートル以下であり、Inz1Ga1−z1N(0≦z1<1)を含む中間層と、を備えたことを特徴とする半導体発光素子が提供される。 According to one aspect of the present invention, is formed on a sapphire substrate, and the n-type semiconductor layer comprising a nitride semiconductor, a p-type semiconductor layer comprising a nitride semiconductor, the p-type semiconductor as the previous SL n-type semiconductor layer A light emitting portion including a plurality of quantum well layers including a nitride semiconductor, and provided between the light emitting portion and the p-type semiconductor layer. A first layer including AlGaN having a 1Al composition ratio and having a thickness of not less than 0.5 nanometers and not more than 5 nanometers; provided between the first layer and the p-type semiconductor layer; a second higher layer than the unrealized p-type impurity concentration of AlGaN said first layer having a first 2Al composition ratio of 0.2 or less, in between the light emitting portion and the first layer, the plurality of quantum well In contact with the p-side quantum well layer closest to the p-type semiconductor layer Thickness is at 8 nm or less in 3 nm or more, the semiconductor light emitting element is provided which is characterized in that and an including the intermediate layer In z1 Ga 1-z1 N ( 0 ≦ z1 <1) The
これに対し、実施形態に係る半導体発光素子110においては、中間層40m及び第1層41を設けることで、Al組成比Axが高い第2層42の自発分極の影響を井戸層32に与えることを抑制できるため、エネルギーバンド特性を所望の状態に制御できる。これにより、電子のオーバーフローを低減させ、かつ活性層への正孔の注入効率も上げることが可能となり、発光効率が高い。 On the other hand, in the semiconductor light emitting device 110 according to the embodiment, by providing the intermediate layer 40m and the first layer 41, the well layer 32 is affected by the spontaneous polarization of the second layer 42 having a high Al composition ratio Ax. Therefore, the energy band characteristic can be controlled to a desired state. Thereby, it is possible to reduce the overflow of electrons and increase the efficiency of injecting holes into the active layer, and the light emission efficiency is high.
Claims (3)
窒化物半導体を含むp型半導体層と、
前記n型半導体層と前記p型半導体層との間に設けられ、窒化物半導体を含む複数の量子井戸層を含む発光部と、
前記発光部と前記p型半導体層との間に設けられ、0.001以上0.05以下の第1Al組成比を有するAlGaNを含み、0.5ナノメートル以上5ナノメートル以下の厚さを有する第1層と、
前記第1層と前記p型半導体層との間に設けられ、0.1以上0.2以下の第2Al組成比を有するAlGaNを含みp型不純物濃度が前記第1層よりも高い第2層と、
前記第1層と前記発光部との間において、前記複数の量子井戸層のうちで前記p型半導体層に最も近いp側量子井戸層に接し、厚さが3ナノメートル以上で8ナノメートル以下であり、Inz1Ga1−z1N(0≦z1<1)を含む中間層と、
を備えたことを特徴とする半導体発光素子。 An n-type semiconductor layer formed on a sapphire substrate and including a nitride semiconductor ;
A p-type semiconductor layer including a nitride semiconductor ;
Provided between the pre-Symbol n-type semiconductor layer and the p-type semiconductor layer, a light emitting unit including a plurality of quantum well layers containing nitride semiconductor,
It is provided between the light emitting part and the p-type semiconductor layer, includes AlGaN having a first Al composition ratio of 0.001 or more and 0.05 or less, and has a thickness of 0.5 nanometers or more and 5 nanometers or less. The first layer;
Provided between the p-type semiconductor layer and the first layer, the second is unrealized p-type impurity concentration of AlGaN is higher than the first layer having a first 2Al composition ratio of 0.1 to 0.2 Layers,
Between the first layer and the light emitting portion, the p-side quantum well layer closest to the p-type semiconductor layer among the plurality of quantum well layers is in contact with a thickness of 3 nanometers or more and 8 nanometers or less. and by and, in z1 Ga 1-z1 N (0 ≦ z1 <1) the including the intermediate layer,
A semiconductor light emitting device comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011276729A JP5337862B2 (en) | 2011-12-19 | 2011-12-19 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011276729A JP5337862B2 (en) | 2011-12-19 | 2011-12-19 | Semiconductor light emitting device |
Related Parent Applications (1)
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JP2010031457A Division JP4892618B2 (en) | 2010-02-16 | 2010-02-16 | Semiconductor light emitting device |
Related Child Applications (1)
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JP2012235345A Division JP5554387B2 (en) | 2012-10-25 | 2012-10-25 | Semiconductor light emitting device |
Publications (3)
Publication Number | Publication Date |
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JP2012060172A JP2012060172A (en) | 2012-03-22 |
JP2012060172A5 true JP2012060172A5 (en) | 2012-12-13 |
JP5337862B2 JP5337862B2 (en) | 2013-11-06 |
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JP2011276729A Expired - Fee Related JP5337862B2 (en) | 2011-12-19 | 2011-12-19 | Semiconductor light emitting device |
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JP (1) | JP5337862B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6001446B2 (en) * | 2012-12-28 | 2016-10-05 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
EP3050130A4 (en) * | 2013-09-27 | 2017-03-01 | Intel Corporation | Forming led structures on silicon fins |
JP6991783B2 (en) | 2017-08-23 | 2022-01-13 | キヤノン株式会社 | Article transport method, article transport device, optical element manufacturing method, optical element manufacturing device, program, recording medium |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4401610B2 (en) * | 2001-12-28 | 2010-01-20 | 日亜化学工業株式会社 | Nitride semiconductor laser device |
JP4628651B2 (en) * | 2003-04-02 | 2011-02-09 | 日亜化学工業株式会社 | Manufacturing method of nitride semiconductor light emitting device |
WO2005034301A1 (en) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | Nitride semiconductor device and method for manufacturing same |
JP2006245165A (en) * | 2005-03-02 | 2006-09-14 | Sony Corp | Semiconductor light-emitting element |
JP2007207827A (en) * | 2006-01-31 | 2007-08-16 | Toshiba Corp | Semiconductor laser device |
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2011
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