JP2012059421A - Manufacturing method for connector device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress an increase in man-hour while realizing a connector device that has connection posts and a coupling post, differing in shape from each other, at a header.SOLUTION: In a first resist forming process, molding holes 34 which are opened circularly to expose land parts 231 are formed in a first resist 31 formed on a surface of a rigid substrate 30 on a side where posts are formed. In a following first plating process, copper electroplating is carried out to deposit a metal material on surfaces of the land parts 231, and a metal material is charged in the molding holes 34 to form connection posts 221 and a neck part 223 of a coupling post 222. In a following second resist forming process, a second resist 35 is formed on the first resist so as to cover parts of the molding holes 34 where the connection posts 221 are formed. In a following second plating process, copper electroplating is carried out to form a head part 224 of the coupling post 222 outside the molding hole 34.

Description

  The present invention relates to a method of manufacturing a connector device including a socket and a header that are mechanically coupled to each other and electrically connected.

  This type of connector device is used for mechanically coupling and electrically connecting a pair of circuit boards, for example. That is, the first circuit board to which the socket is connected and the second circuit board to which the header is connected are electrically connected to each other in a state where the header is coupled to the socket.

  Electronic devices such as mobile phones are required to be further reduced in size and weight, and accordingly, connector devices that are further reduced in thickness for connecting circuit boards in electronic devices have been proposed. (For example, refer to Patent Document 1).

  In the connector device (board connection connector assembly) described in Patent Document 1, the header (male connector) includes a header board (male side base) and a plurality of header terminals (male side terminals) arranged on the surface of the header board. Post (bump). The post has a circular cross-sectional neck projecting from the surface of the header substrate and a head continuous to the tip of the neck, and the vertical cross-section is formed in a so-called mushroom shape. The socket (female connector) includes a socket substrate (female base) having a through hole (notch) formed at a position corresponding to each post, and a pad part (female side terminal) formed at the peripheral edge of the through hole. have.

  In this connector device, the post inserted into the through hole is hooked on the periphery of the through hole in the socket to couple the socket and the header, and in this state, the pad portion and the pad portion are electrically connected. Thereby, even if the height of the post is lowered, the socket and the header can be coupled, and thus the connector device can be thinned.

  Here, Patent Document 1 discloses a configuration in which the peripheral portion of the socket substrate through-hole in the socket has elasticity that allows the head of the post to pass through the through-hole. In this configuration, when the post is pushed into the through hole, the peripheral part of the through hole of the socket substrate is elastically deformed, the head of the post passes through the through hole, and the socket and the header are coupled. Therefore, it is relatively easy to connect the socket and the header.

JP 2007-134169 A

  However, in the connector device having the above configuration, all the posts as header terminals are formed in a mushroom shape, and when the socket and the header are coupled, they are caught on the periphery of the through hole. Therefore, depending on the number of terminals, the socket and the header are coupled. Have trouble. That is, when the number of terminals (that is, the number of posts) is small, the mechanical coupling strength between the socket and the header becomes insufficient, and the header may be easily detached from the socket. On the other hand, when the number of terminals is large, the mechanical coupling strength between the socket and the header becomes unnecessarily large, and it may be difficult to remove the header from the socket.

  Therefore, the applicant of the present application considers classifying the plurality of posts into a connection post that electrically connects the socket and the header and a connection post that mechanically connects the socket and the header. That is, for example, if only the coupling post is made into a mushroom shape and the connection post has a uniform cylindrical shape, the number of coupling posts can be adjusted regardless of the number of terminals, so that a good connection between the socket and header can be achieved. It is thought that the coupling can be realized.

  However, in manufacturing a connector device having posts having different shapes, it is usually necessary to form each shape of the post separately and connect it to the header board, compared to a connector device having only posts of the same shape. There is a problem that man-hours increase.

  The present invention has been made in view of the above reasons, and a connector device manufacturing method capable of suppressing an increase in man-hours while realizing a connector device having a connection post and a connection post having different shapes in a header. The purpose is to provide.

  A manufacturing method of a connector device according to the present invention is a manufacturing method of a connector device including a socket and a header that are mechanically coupled and electrically connected to each other, and the socket has a through-hole penetrating in the thickness direction. A plurality of socket substrates and a pad portion made of a conductive material are included, and the header is formed of a header substrate and a through hole on a first surface that is one surface of the header substrate made of a conductive material in the thickness direction. Column sockets provided at corresponding positions, and the socket substrate has an elastic film having elasticity and a pad portion formed around the through hole, and the plurality of posts are sockets and headers. And a connecting post for mechanically connecting the socket and the header, and the plurality of through holes are formed at positions corresponding to the connecting posts. Including a connecting through hole and a connecting through hole formed at a position corresponding to the connecting post, and the connecting post has a shape or thickness that is uniform in the direction perpendicular to the first surface. When the socket and the header are joined, the elastic membrane is elastically deformed to widen the connection through hole while being inserted into the connection through hole to electrically connect the pad portion and the header. The coupling post has a neck projecting from the first surface and a head that is continuous with the tip of the neck and is thicker than the neck. At the time of coupling the socket and the header, at least the head is As a process of manufacturing the header of the connector device, the rigid that becomes the base of the header board is inserted through the coupling through hole while expanding the coupling through hole by elastically deforming the elastic membrane to the position where it passes through the coupling through hole. Board A circuit forming step of forming a conductor pattern on one surface corresponding to the first surface, and a first resist having a molding hole opened on one surface of the rigid substrate after the circuit forming step. A first resist forming step to be formed, and plating after the first resist forming step and filling the molding hole with a conductive material, thereby forming at least a part of the neck portion of the coupling post and the connection post into the molding hole. A first resist is formed on the first resist so as to cover a portion of the molding hole in which the connection post is formed in the first resist after the first plating process. A second resist forming step, a second plating step of forming a head continuously with the neck portion outside the molding hole by further plating after the second resist forming step, and after the second plating step And a resist stripping step for stripping the first resist and the second resist.

  In the method for manufacturing the connector device, the second resist forming step includes laminating a second resist having an opening surface larger than the molding hole and having a head molding hole communicating with the molding hole on the first resist, In the second plating step, it is desirable to form a head in the head molding hole by filling the head molding hole with a conductive material.

  The present invention has an advantage that an increase in man-hours can be suppressed while realizing a connector device having a connection post and a connection post having different shapes in a header.

It is a schematic sectional drawing which shows the manufacturing method of the header of the connector apparatus which concerns on embodiment. The structure of a connector apparatus same as the above is shown, (a) is a perspective view of a state where the socket and the header are separated, and (b) is a perspective view of the state where the socket and the header are coupled. It is a front view which shows the structure of a connector apparatus same as the above. It is a top view which shows the structure of a header same as the above. The structure of a socket same as the above is shown, (a) is a perspective view, (b) is a cross-sectional view. It is a schematic sectional drawing which shows the connection state of a connector apparatus same as the above. It is a perspective view which shows the usage example of a connector apparatus same as the above. It is a top view of the rigid board | substrate used for description of the manufacturing method of a header same as the above.

  As shown in FIGS. 2 and 3, the connector device 1 of the present embodiment includes a socket 10 and a header 20 that are mechanically coupled and electrically connected to each other.

  The socket 10 has a strip-shaped socket substrate 11 that is long in one direction, and a pad portion 12 (see FIG. 5) made of a conductive material. The header 20 includes a strip-shaped header substrate 21 that is long in one direction, and a plurality of posts that are made of a conductive material and are provided on a first surface 210 that is one surface in the thickness direction of the header substrate 21. . There are two types of posts: a connection post 221 that electrically connects the socket 10 and the header 20 and a coupling post 222 that mechanically connects the socket 10 and the header 20 (hereinafter, there is no particular distinction between them). Sometimes referred to simply as “post 22”).

  In the following, the thickness direction of the socket substrate 11 and the header substrate 21 is the vertical direction, the longitudinal direction is the left-right direction, the short direction is the front-rear direction, that is, the upper, lower, left, and right in FIG. Will be described. However, these directions are not intended to limit the orientation when the connector device 1 is used.

  The header substrate 21 is formed of a rigid substrate made of an insulating material such as a glass epoxy substrate (FR4). In the header substrate 21, a surface (upper surface) facing the socket substrate 11 constitutes a first surface 210 as shown in FIG. 3. The post 22 is formed in a column shape protruding from the first surface 210 of the header substrate 21.

  A plurality of connection posts 221 are provided on the first surface 210 with a predetermined interval in the left-right direction, with a plurality of the connection posts 221 arranged in the front-rear direction at a predetermined interval. In the header 20 of the present embodiment, 10 sets (2 sets in total) of connection posts 221 are provided, with 2 sets as one set. Here, the pairs of connection posts 221 adjacent in the left-right direction are arranged so that the positions in the front-rear direction are shifted from each other, and the connection posts 221 are in a so-called staggered arrangement. With this arrangement, it is possible to ensure a relatively large distance between adjacent connection posts 221 while keeping the area of the region where the connection posts 221 are arranged small.

  The connection post 221 is formed to have a uniform thickness over the entire length in the vertical direction (that is, the direction orthogonal to the first surface 210). In this embodiment, the connection post 221 is formed in a columnar shape having a circular cross section along the first surface 210, and the outer diameter thereof is set to a constant value over the entire length.

  On the other hand, one coupling post 222 is provided on each of the left and right sides of the region where the connection post 221 is disposed on the first surface 210. That is, the connection posts 221 are staggered in a region sandwiched between the pair of coupling posts 222 in the longitudinal direction of the first surface 210. Here, each coupling post 222 is disposed at the center of the first surface 210 in the front-rear direction (short direction).

  The coupling post 222 has a neck portion 223 that protrudes from the first surface 210, and a head portion 224 that is thicker than the neck portion 223 that is continuous with the tip of the neck portion 223. Here, the coupling post 222 has a circular cross section along the first surface 210 of each of the neck portion 223 and the head portion 224, and the outer diameter thereof is set larger at the head portion 224 than the neck portion 223. Has been. That is, the coupling post 222 is formed in a so-called mushroom shape by forming the head 224 on the distal end side to be thicker than the neck 223 on the proximal end side. Note that the head 224 is formed in a tapered shape whose outer diameter decreases as the distance from the neck 223 increases.

  Here, the amount of protrusion of the coupling post 222 from the first surface 210 is set larger than that of the connection post 221. In this embodiment, the height dimension of the neck part 223 excluding the head part 224 of the coupling post 222 is set so that the height dimension of the neck part 223 is larger than the height dimension of the connection post 221. The outer diameter of the neck portion 223 is set larger than the outer diameter of the connection post 221.

  As shown in FIG. 4, the conductor pattern 23 is formed on the first surface 210 of the header substrate 21, and each post 22 is formed on the conductor pattern 23. The conductor pattern 23 includes a circular land portion 231 formed at each position corresponding to the post 22, a lead portion 232 drawn from the land portion 231, and a through hole portion 233 that penetrates the front and back surfaces of the header substrate 21. Consists of.

  The lead-out portions 232 continuing to the land portion 231 where the connection posts 221 are formed are extended along the front-rear direction to the end portion closer to the land portion 231 of the front end portion or the rear end portion of the header substrate 21. The tip is continuous with the through-hole portion 233. On the other hand, the lead-out portion 232 that is continuous with the land portion 231 where the coupling post 222 is formed is extended toward two corner portions near the land portion 231 among the four corners of the header substrate 21, and the tip thereof is a through-hole portion 233. It is continuous.

  The through-hole portion 233 has an end surface through-hole structure that electrically connects the conductor patterns 23 on the front and back surfaces of the header substrate 21 by conducting conductive plating on the outer peripheral end surface of the header substrate 21. It is used when the header 20 is mounted on the.

  As shown in FIG. 5, the socket substrate 11 has a plurality of through holes penetrating in the thickness direction. This through hole is a hole through which the post 22 of the header 20 is inserted when the socket 10 and the header 20 are coupled, and is formed at each position corresponding to the plurality of posts 22. There are two types of through-holes: a connection through-hole 131 formed at a position corresponding to the connection post 221 and a coupling through-hole 132 formed at a position corresponding to the coupling post 222 (hereinafter, each When there is no particular distinction, there is simply “through-hole 13”).

  That is, on one surface in the thickness direction of the socket substrate 11, the connection through holes 131 are staggered in the same manner as the connection posts 221, and the coupling through holes 132 are formed on the left and right sides of the region where the connection through holes 131 are formed. Each one is formed.

  The socket substrate 11 is composed of a rigid substrate 111 and a flexible substrate 112 as shown in FIG. The rigid substrate 111 is made of, for example, a rigid substrate made of stainless steel (SUS material), and a sheet-like flexible substrate 112 is provided on a surface (the lower surface in FIG. 3) of the rigid substrate 111 on the header substrate 21 side. The socket substrate 11 is configured by being attached. The flexible substrate 112 is made of a flexible printed circuit board (FPC) in which a conductive pattern 120 including the pad portion 12 is formed on one surface of a flexible insulating film made of, for example, polyimide resin.

  Here, the flexible substrate 112 has the same size in the longitudinal direction (left and right direction) as the rigid substrate 111, but is larger in the short direction than the rigid substrate 111. Therefore, the flexible substrate 112 is attached to one surface of the rigid substrate 111 (the surface on the header substrate 21 side), so that both ends of the remaining short direction wrap around the back surface of the rigid substrate 111. It is wound around the rigid substrate 111.

  The through hole 13 is formed in the flexible substrate 112. In the present embodiment, each through-hole 13 is formed in a cross shape by a slit extending in the left-right direction and a slit extending in the front-rear direction intersecting each other at the center. Further, the coupling through-hole 132 of the through-hole 13 is formed so that a circular small hole is continuous with the slit at the intersection of the left-right slit and the front-rear slit. The dimensions of the through-holes 13 in the left-right direction and the front-rear direction are both set larger than the outer diameter of the post 22 corresponding to each through-hole 13.

  The rigid substrate 111 is formed with a plurality of escape holes 14 each opening in a circular shape and penetrating the rigid substrate 111 in the thickness direction. Each escape hole 14 is formed at each position corresponding to the through hole 13 so as to coincide with the through hole 13 and communicates with the through hole 13. Here, the through hole 13 has an opening area smaller than that of the escape hole 14, and the flexible substrate 112 projects into the escape hole 14 from the periphery of each escape hole 14 in the rigid substrate 111. Therefore, in a state where the post 22 of the header 20 is inserted into the through hole 13, the post 22 is inserted into the escape hole 14 through the through hole 13. The inner diameters of the plurality of escape holes 14 are set to be larger than the outer diameters of the posts 22 corresponding to the respective escape holes 14.

  Of the escape holes 14 communicating with the connection through holes 131, some of the escape holes 14 have a smaller inner diameter than the other escape holes 14, and the function of aligning the socket 10 and the header 20 is achieved. have. The escape hole 14 having an alignment function is formed so that the inner diameter is slightly larger than the outer diameter of the connection post 221. As a result, the escape hole 14 having an alignment function is displaced due to the relative movement of the socket 10 and the header 20 within the surface along the first surface 210 in a state where the connection post 221 is inserted. Is prevented from occurring. In the present embodiment, the escape hole 14 having an alignment function is located farthest from the center of the socket substrate 11 and is symmetrical with respect to the center of the socket substrate 11 (upper left and lower right in FIG. 2). ).

  The conductor pattern 120 is formed on the surface opposite to the rigid substrate 111 in the thickness direction of the flexible substrate 112. The conductor pattern 120 has a pad portion 12 around each through hole 13, and further has a lead portion 121 connected to each pad portion 12 formed around the connection through hole 131. The lead portion 121 is extended along the front-rear direction to the edge nearer to the pad portion 12 of the front end edge or the rear end edge of the flexible substrate 112, and the back surface side of the rigid substrate 111 together with the flexible substrate 112. It wraps around (top side).

  The pad portion 12 formed around the coupling through hole 132 has an arc shape on the outer periphery, whereas the pad portion 12 formed around the connection through hole 131 has an outer periphery shape on the connection through hole. It is a shape along 131.

  Here, the material and thickness dimensions of the pad portion 12 are determined so as to have not only conductivity but also elasticity (shape restoration property). Thereby, elasticity is given to at least a portion of the flexible substrate 112 where the pad portion 12 is formed. That is, in this embodiment, the portion of the flexible substrate 112 that protrudes into the escape hole 14 constitutes the elastic film 15 that is made of an elastic material and has the pad portion 12 formed thereon.

  Examples of the material having conductivity and elasticity include copper (Cu) and nickel (Ni). In this embodiment, the pad part 12 which has electroconductivity and elasticity is formed by plating nickel or nickel-type alloy to the copper pattern formed on the one surface of the insulating film. As an example, the thickness dimension is 25 μm for the insulating film, 8 μm for the copper pattern, and 2 μm for the nickel plating, but is not limited to these values.

  Here, when the socket 10 and the header 20 are coupled, the connection post 221 is inserted into the connection through hole 131 while elastically deforming the elastic film 15 to widen the connection through hole 131 as shown in FIG. . In this state, the elastic film 15 around the connection through hole 131 presses the pad portion 12 against the outer peripheral surface of the connection post 221 by its elasticity, so that the connection post 221 is connected to the pad portion 12 around the connection through hole 131. And electrically connected.

  However, the outer diameter of the connection post 221 is set to a constant value over the entire length in the vertical direction as described above. Therefore, the connection post 221 has no portion that is caught by the elastic film 15 in a state of being inserted through the connection through hole 131, and hardly contributes to the mechanical coupling between the socket 10 and the header 20.

  On the other hand, the coupling post 222 is inserted into the coupling through-hole 132 while elastically deforming the elastic film 15 to widen the coupling through-hole 132 when the socket 10 and the header 20 are coupled. As described above, the coupling post 222 is formed in a mushroom shape in which the head portion 224 on the distal end side is thicker than the neck portion 223 on the proximal end side.

  Therefore, when the head 224 passes through the coupling through-hole 132 when the coupling post 222 is inserted into the coupling through-hole 132, the elastic film 15 around the coupling through-hole 132 causes the elasticity of the coupling through-hole 132 due to its elasticity. Deforms to narrow the opening. Accordingly, as shown in FIG. 6, the head 224 of the coupling post 222 is caught on the periphery of the coupling through hole 132 in the elastic film 15 and is prevented from coming off from the coupling through hole 132.

  Here, since the coupling through hole 132 is formed with a circular small hole at the intersection of both slits as described above, the coupling post 222 is inserted in the coupling through hole 132 in the coupled state. The neck 223 is inserted into the small hole of the through hole 132 for use. Therefore, as compared with the connection post 221, the coupling post 222 has a smaller deformation amount (curvature) of the elastic film 15 in a state of being inserted into the through hole 13.

  Further, when the coupling post 222 is inserted into the coupling through-hole 132, the elastic film 15 around the coupling through-hole 132 presses the pad portion 12 against the outer peripheral surface of the neck 223, so that the coupling post 222 is coupled. The pad portion 12 around the through hole 132 is electrically connected. However, in this embodiment, since the lead portion 121 is not connected to the pad portion 12 around the coupling through hole 132, the coupling post 222 does not contribute to the electrical connection between the socket 10 and the header 20.

  Further, when the coupling between the socket 10 and the header 20 is released, the coupling post 222 is pulled out from the coupling through hole 132 while elastically deforming the elastic film 15 to widen the coupling through hole 132. At this time, although the head 224 is caught by the peripheral edge of the coupling through-hole 132 in the elastic membrane 15, if the elastic membrane 15 is pulled out with a certain large force, the elastic membrane 15 is elastically deformed so that the head 224 passes through the coupling through-hole 132. To do.

  That is, when the socket 10 and the header 20 are coupled, the user aligns the positions of the through hole 13 and the post 22, and then moves the socket substrate 11 from the upper side with respect to the header substrate 21 (in FIG. 6). Press in the direction of the arrow. Thereby, the connection post 221 is inserted into the connection through hole 131 and the socket 10 and the header 20 are electrically connected. Further, the head portion 224 of the coupling post 222 is caught by the peripheral edge of the coupling through hole 132 in the elastic film 15 to prevent the coupling post 222 from coming off from the coupling through hole 132, thereby mechanically coupling the socket 10 and the header 20. .

  Further, when releasing the connection between the socket 10 and the header 20, the user may pull the socket substrate 11 upward from the header substrate 21. As a result, the coupling post 222 is pulled out from the coupling through hole 132 to release the mechanical coupling between the socket 10 and the header 20, and the connection post 221 is pulled out from the connection through hole 131 to The electrical connection with the header 20 is released.

  Therefore, the connector device 1 configured as described above has an advantage that the socket 10 and the header 20 can be easily attached and detached.

  The connector device 1 having the above-described configuration is used for mechanically coupling and electrically connecting a pair of circuit boards as shown in FIG. 7, for example. In the example of FIG. 7, the socket 10 is connected to the first circuit board 101, and the header 20 is connected to the second circuit board 102. Here, as an example, the second circuit board 102 is a mother board of a computer (not shown), the first circuit board 101 is connected to a camera (not shown), and the socket 10 and the header 20 are coupled. Sometimes a computer and a camera are connected.

  Here, the first circuit board 101 is made of a flexible printed board, and the lead part 121 of the conductor pattern 120 of the socket board 11 is connected to the circuit pattern 103 formed on the upper surface side thereof. Here, the second circuit board 102 is made of a rigid board, and the header 20 is formed by soldering the through hole portion 233 of the header board 21 to a circuit pattern (not shown) formed on the upper surface side thereof. Surface mounted. As a result, the fixing of the header 20 to the first circuit board 101 and the electrical connection are simultaneously performed.

  According to the connector device 1 of the present embodiment described above, the post 22 provided on the header 20 is connected between the connection post 221 that electrically connects the socket 10 and the header 20 and between the socket 10 and the header 20. It is divided into a coupling post 222 for mechanical coupling. Therefore, the mechanical coupling strength between the socket 10 and the header 20 is adjusted to an appropriate size by adjusting the number of coupling posts 222 regardless of the number of terminals (that is, the number of connection posts 221). 10. Good connection between the header 20 and the header 20 can be realized.

  That is, regardless of the number of terminals (that is, the number of connection posts 221), if the number of connection posts 222 is reduced, the mechanical connection strength between the socket 10 and the header 20 is reduced, and the header 20 is removed from the socket 10. It becomes easy to come off. On the other hand, if the number of coupling posts 222 is increased, the mechanical coupling strength between the socket 10 and the header 20 is increased, and the header 20 is less likely to be detached from the socket 10.

  In addition, a plurality of connecting posts 221 are provided side by side in the longitudinal direction of the first surface 210, and the coupling posts 222 are provided in the center of the first surface 210 in the short direction, so a small number The coupling post 222 can secure the coupling strength between the socket 10 and the header 20. That is, since the coupling post 222 is provided at the center of the first surface 210 in the short direction, the socket 10 and the header 20 are mechanically coupled at one position in the short direction of the first surface 210. And a stable coupled state can be realized.

  Furthermore, since the coupling post 222 has a larger amount of protrusion from the first surface 210 than the connection post 221, the socket 10 and the header 20 are coupled before the connection post 221. The coupling post 222 is inserted into the through hole 13. Thereby, it can be avoided that the connection post 221 is connected to the pad portion 12 in a state where the relative positions of the socket 10 and the header 20 in the plane along the first surface 210 are shifted. In short, since the connection post 221 is inserted into the through hole 13 after the connection post 222, the relative positions of the socket 10 and the header 20 are aligned and the connection post 222 is inserted into the connection through hole 132. After that, the socket 10 and the header 20 are electrically connected.

  In addition, the header 20 and the socket 10 are mechanically coupled by the head portion 224 being hooked on the peripheral edge of the coupling through-hole 132 in the elastic membrane 15, so that the coupling strength between the socket 10 and the header 20 is the elastic membrane. It can be adjusted by 15 elasticity or the like. Further, since the contact pressure between the pad portion 12 and the connection post 221 is secured by the elastic film 15 around the connection through hole 131, the contact pressure of the electrical connection portion between the socket 10 and the header 20 is It can be adjusted by the elasticity of the elastic film 15 or the like. Therefore, in the connector device 1, a desired coupling strength and a desired contact pressure can be ensured regardless of the height of the socket 10 and the header 20, so that the socket 10 and the header 20 can be reduced in height. Can do.

  In addition, since the socket 10 and the header 20 are not relatively moved in the plane along the first surface 210 when the socket 10 and the header 20 are attached / detached, in the plane along the first surface 210. The connector device 1 can be downsized.

  Next, the manufacturing method of the connector apparatus 1 of this embodiment mentioned above is demonstrated. Here, the manufacturing method of the header 20 is demonstrated with reference to FIG.

  First, the worker forms a conductor pattern 23 on one surface (corresponding to the first surface 210) of the rigid substrate 30 that becomes the header substrate 21 as shown in FIG. 1A (circuit formation). Process). In this circuit formation process, the operator forms a through-hole portion 233 having an end surface through-hole structure on a cut line 300 serving as an outer peripheral edge of the header substrate 21 of the rigid substrate 30 as shown in FIG. A through hole 301 penetrating in the thickness direction is formed. Further, the operator performs plating (for example, electroless copper plating) on the through-hole 301 to form through-hole plating that becomes the through-hole portion 233 on the inner peripheral surface of the through-hole 301.

  Then, the worker forms a first resist 31 (see FIG. 1D) used for forming the post 22 on the conductor pattern 23 by plating on one surface of the rigid substrate 30 (first first). Resist forming step). Here, the first resist 31 may also be formed on the other surface side of the rigid substrate 30. In the first resist formation step, the operator exposes the central portion of the land portion 231 to the first resist 31 formed on the surface of the rigid substrate 30 on the side on which the post 22 is to be formed using photolithography technology. A forming hole having a circular shape is formed.

  Specifically, as shown in FIG. 1B, the first resist 31 is laminated on a rigid substrate 30, and is formed from a negative dry film 32 that can be patterned into a desired shape by exposure and development. It is formed. In the present embodiment, the worker laminates three dry films 32 each having a thickness of 75 μm.

  As shown in FIG. 1C, the operator irradiates light (ultraviolet light) after laminating a mask 33 having an opening formed on the dry film 32 (exposure). Thereafter, the operator removes the portion of the dry film 32 where light is blocked by the mask 33 (portion other than the opening) by development, whereby a molding hole 34 is formed as shown in FIG. A first resist 31 is formed.

  After the resist formation step, the operator performs acidic degreasing, soft etching using sodium persulfate (50 g / L), and sulfuric acid treatment using sulfuric acid (diluted by 10 wt%) to remove copper oxide. , Improve the adhesion of plating.

  Thereafter, the operator deposits a metal material (copper here) on the surface of the land portion 231 by performing electrolytic copper (Cu) plating (first plating step). In the first plating step, as shown in FIG. 1E, the connection post 221 and the neck portion 223 of the coupling post 222 are formed by filling the molding hole 34 in the first resist 31 with a metal material. . At this time, the operator adjusts the thickness dimension of the copper plating (that is, the height dimension of the connection post 221) to 170 μm ± 10% by managing the current value and time.

  Then, as shown in FIG. 1 (f), the worker forms a second resist 35 on the first resist 31 so as to cover the portion of the molding hole 34 in which the connection post 221 is formed. (Second resist formation step). In the second resist formation step, the operator forms the second resist 35 by sticking a mask tape on the first resist 31.

  Thereafter, the operator further performs electrolytic copper plating to form the head 224 of the coupling post 222 outside the molding hole 34 as shown in FIG. 1G (second plating step). That is, except for the portion covered with the second resist 35, copper plating is performed until the metal material overflows from the opening surface of the molding hole 34, so that the portion filled in the molding hole 34 of the metal material is the neck portion. 223, the portion overflowing from the molding hole 34 becomes the head 224.

  After the head 224 of the coupling post 222 is formed in the second plating step, the operator peels off the first resist 31 and the second resist 35 as shown in FIG. Process). Thereafter, the worker performs nickel plating and gold (Au) plating on the post 22 formed on the rigid substrate 30.

  Finally, the operator cuts out each header board 21 from the rigid board 30 (dicing process). In this dicing process, the header substrate 21 is cut by a cut line 300 (see FIG. 8) connecting the through holes 301 in the rigid substrate 30 to form a through hole portion 233 having an end surface through hole structure.

  In the first and second plating steps, it is desirable to use insoluble electrode copper plating instead of soluble electrode copper plating generally used as electrolytic copper plating. That is, in soluble electrode copper plating using a soluble electrode (copper electrode plate), the shape of the electrode changes with plating, and the height of the post 22 formed may vary. In contrast, insoluble electrode copper plating normally uses an iridium oxide electrode, and plating is performed while replenishing copper ions with a chemical solution, so that the shape of the electrode does not change, and thus variations in the height of the post 22 can be reduced. There are advantages.

  Moreover, as a manufacturing method of the header 20, in order to stabilize the shape of the head 224 of the coupling post 222, the following method may be employed.

  That is, in the second resist formation step, the operator forms a head molding hole (not shown) having a larger opening area than the molding hole 34 and communicating with the molding hole 34 in the second resist 35. In the second plating step, the operator performs copper plating so that the metal material does not overflow from the opening surface of the head molding hole. Thereby, the part overflowing from the opening surface of the shaping | molding hole 34 among metal materials in a 2nd plating process will be settled in a head shaping | molding hole. Therefore, the shape of the head 224 in the plane along the first surface 210 can be regulated by the opening shape of the head molding hole, and the shape of the head 224 is stabilized.

  Furthermore, only a part of the neck portion 223 may be formed in the first plating step, and the remaining portion of the neck portion 223 may be formed in the second plating step. In this case, the height dimension of the connection bump 221 and the height dimension of only the neck portion 223 of the coupling bump 222 can be made different.

  Next, a method for manufacturing the socket 10 will be described.

  The operator first forms the through hole 13 in the insulating film that is the basis of the flexible substrate 112 (through hole forming step). Then, an operator forms the conductor pattern 120 containing the pad part 12 by plating on one surface of an insulating film (pad plating process). By this pad plating step, the elastic film 15 to which the elasticity by the pad portion 12 is imparted is formed around the through hole 13 in the flexible substrate 112.

  Then, the operator wraps the flexible substrate 112 around the rigid substrate 111 in which the escape hole 14 is formed, and attaches the flexible substrate 112 to the rigid substrate 111 with an adhesive, thereby forming the socket 10.

  According to the manufacturing method of the connector device 1 described above, the neck portion (at least a part) 223 of the connection post 221 and the coupling post 222 is formed by the first resist forming step and the first plating step. can do. Furthermore, the head portion 224 of the coupling post 222 can be formed by the subsequent second resist formation step and second plating step.

  In short, the posts 22 having different shapes are formed simultaneously during the series of manufacturing steps until the middle (formation of the connection post 221 and formation of the neck portion 223 of the coupling post 222). Therefore, even if it is the connector apparatus 1 which has the post | mailbox 22 from which a shape mutually differs, compared with the case where these post | mailboxes 22 are manufactured completely separately, a man-hour can be reduced and the simplification of a manufacturing method can be aimed at. .

  By the way, in the said embodiment, although the socket board | substrate 11 is a 2 layer structure of the rigid board | substrate 111 and the flexible board | substrate 112, it may be not only this example but a 1 layer structure. That is, the socket substrate 11 may be a single substrate, and only the portion around the through hole 13 may be formed thin so that flexibility is imparted. In this configuration, the process of attaching the flexible substrate 112 to the rigid substrate 111 is not necessary, and the manufacturing process can be simplified.

  In the above embodiment, the pad portion 12 around the coupling through-hole 132 is provided to ensure the elasticity of the elastic film 15 and contributes to the electrical connection between the socket 10 and the header 20. Although not limited to this example. That is, the lead portion 121 is connected to the pad portion 12 around the coupling through-hole 132, and the coupling post 222 contributes to the electrical connection between the socket 10 and the header 20 with the coupling through-hole 132 inserted. It may be a configuration.

  Even in this case, the mechanical coupling strength between the socket 10 and the header 20 can be adjusted to an appropriate size by adjusting the number of the coupling posts 222 regardless of the number of the connection posts 221. Thus, by using the coupling posts 222 for electrical connection, the number of the connection posts 221 can be reduced, and the connector device 1 can be further miniaturized.

  Furthermore, the post 22 is not limited to a columnar shape with a circular cross section, and may have another shape such as a prismatic shape with a polygonal cross section. Here, even if the connecting post 221 does not have a uniform thickness over the entire length in the vertical direction as in the above embodiment, the contact pressure with the pad portion 12 can be ensured when the connecting post 221 is inserted into the connecting through hole 131. Any shape is acceptable. That is, the connecting post 221 does not have to be thick at the tip end like the coupling post 222, and may have a tapered shape that becomes thinner as it is away from the first surface 210 in a direction orthogonal to the first surface 210. Good.

  The shape of the through hole 13 is not limited to a cross shape, and may be a hole shape formed by intersecting three or more slits at the center of each other, a circular shape, a star shape, or the like. Further, the through-hole 13 may be formed by a cut formed in the elastic film 15 and opened with the deformation of the elastic film 15 only when the socket 10 and the header 20 are coupled. The elasticity of the elastic film 15 can also be adjusted by the shape of the through hole 13.

  In addition, the material and dimension of each part of the connector apparatus 1 illustrated in the said embodiment are examples, Comprising: It can change suitably according to a required function and performance.

DESCRIPTION OF SYMBOLS 1 Connector apparatus 10 Socket 11 Socket board 12 Pad part 15 Elastic film 20 Header 21 Header board 23 Conductive pattern 30 Rigid board 31 1st resist 34 Molding hole 35 2nd resist 131 Connection through-hole 132 Connection through-hole 210 1st 1 side 221 connecting post 222 coupling post 223 neck 224 head 231 land

Claims (2)

A manufacturing method of a connector device comprising a socket and a header that are mechanically coupled to each other and electrically connected,
The socket has a socket substrate formed with a plurality of through holes penetrating in the thickness direction, and a pad portion made of a conductive material,
The header includes a header substrate and a columnar post provided at each position corresponding to the through hole on the first surface that is made of a conductive material and is one surface in the thickness direction of the header substrate,
The socket substrate has elasticity and an elastic film formed with the pad portion around the through hole,
The plurality of posts includes a connection post that electrically connects the socket and the header, and a coupling post that mechanically couples the socket and the header;
The plurality of through holes include a connection through hole formed at a position corresponding to the connection post, and a coupling through hole formed at a position corresponding to the coupling post,
The connection post is formed in a shape having a uniform thickness in a direction perpendicular to the first surface or a shape that becomes thinner as the distance from the first surface increases. When the socket and the header are coupled, , While elastically deforming the elastic membrane and expanding the through hole for connection, the elastic film is inserted into the through hole for connection, and electrically connected to the pad portion,
The coupling post has a neck projecting from the first surface and a head that is continuous with the tip of the neck and is thicker than the neck. At the time of coupling the socket and the header, at least the head Until the portion passes through the coupling through-hole, the elastic membrane is elastically deformed and the coupling through-hole is expanded while being inserted,
As a process of manufacturing the header of the connector device,
A circuit forming step of forming a conductor pattern on one surface corresponding to the first surface of the rigid substrate that is the basis of the header substrate;
A first resist forming step of forming a first resist having a molding hole that exposes a part of the conductor pattern on the one surface of the rigid substrate after the circuit forming step;
By plating after the first resist forming step and filling the molding hole with a conductive material, at least a part of the neck portion and the connection post among the coupling posts are formed in the molding hole. A first plating step;
Second resist formation for forming a second resist on the first resist so as to cover a portion of the molding hole in which the connection post is formed in the first resist after the first plating step Process,
A second plating step of forming the head continuously with the neck portion outside the molding hole by further plating after the second resist forming step;
A method of manufacturing a connector device, comprising: a resist stripping step of stripping the first resist and the second resist after the second plating step.   In the second resist forming step, the second resist having an opening surface larger than the molding hole and having a head molding hole communicating with the molding hole is laminated on the first resist, and the second resist is formed. The method of manufacturing a connector device according to claim 1, wherein the plating step includes forming the head in the head molding hole by filling the head molding hole with a conductive material.

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