JP2012049139A5 - - Google Patents

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Publication number
JP2012049139A5
JP2012049139A5 JP2011221092A JP2011221092A JP2012049139A5 JP 2012049139 A5 JP2012049139 A5 JP 2012049139A5 JP 2011221092 A JP2011221092 A JP 2011221092A JP 2011221092 A JP2011221092 A JP 2011221092A JP 2012049139 A5 JP2012049139 A5 JP 2012049139A5
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JP
Japan
Prior art keywords
plasma
frequency signal
high voltage
load electrode
ceramic tube
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JP2011221092A
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English (en)
Japanese (ja)
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JP5188615B2 (ja
JP2012049139A (ja
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Priority to JP2011221092A priority Critical patent/JP5188615B2/ja
Priority claimed from JP2011221092A external-priority patent/JP5188615B2/ja
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Publication of JP2012049139A5 publication Critical patent/JP2012049139A5/ja
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Publication of JP5188615B2 publication Critical patent/JP5188615B2/ja
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JP2011221092A 2011-10-05 2011-10-05 プラズマ発生装置、プラズマ点火装置、ガスチャンバ、および半導体回路表面の洗浄方法 Expired - Fee Related JP5188615B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011221092A JP5188615B2 (ja) 2011-10-05 2011-10-05 プラズマ発生装置、プラズマ点火装置、ガスチャンバ、および半導体回路表面の洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011221092A JP5188615B2 (ja) 2011-10-05 2011-10-05 プラズマ発生装置、プラズマ点火装置、ガスチャンバ、および半導体回路表面の洗浄方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009280581A Division JP4891384B2 (ja) 2009-12-10 2009-12-10 プラズマ発生装置

Publications (3)

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JP2012049139A JP2012049139A (ja) 2012-03-08
JP2012049139A5 true JP2012049139A5 (enExample) 2012-04-19
JP5188615B2 JP5188615B2 (ja) 2013-04-24

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JP2011221092A Expired - Fee Related JP5188615B2 (ja) 2011-10-05 2011-10-05 プラズマ発生装置、プラズマ点火装置、ガスチャンバ、および半導体回路表面の洗浄方法

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JP (1) JP5188615B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014184910A1 (ja) * 2013-05-15 2014-11-20 富士機械製造株式会社 プラズマ処理装置
KR102126948B1 (ko) * 2019-05-16 2020-06-25 주식회사 메디플 플라즈마 발생기판 및 발생장치
KR20230155005A (ko) 2022-03-30 2023-11-09 야마하 로보틱스 홀딩스 가부시키가이샤 웨이퍼 세정 장치 및 본딩 시스템

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270567A (ja) * 1985-09-25 1987-04-01 Hitachi Ltd トリガ機構
JP2589599B2 (ja) * 1989-11-30 1997-03-12 住友精密工業株式会社 吹出型表面処理装置
JP3899597B2 (ja) * 1997-01-30 2007-03-28 セイコーエプソン株式会社 大気圧プラズマ生成方法および装置並びに表面処理方法
JP3719352B2 (ja) * 1999-07-23 2005-11-24 三菱電機株式会社 プラズマ発生用電源装置及びその製造方法
JP5089032B2 (ja) * 2005-10-12 2012-12-05 長野日本無線株式会社 プラズマ処理装置用自動整合器の制御方法
JP4963360B2 (ja) * 2006-01-31 2012-06-27 国立大学法人茨城大学 携帯型大気圧プラズマ発生装置
US7571732B2 (en) * 2006-03-28 2009-08-11 Asm Japan K.K. Ignition control of remote plasma unit
JP4787104B2 (ja) * 2006-07-31 2011-10-05 株式会社新川 ボンディング装置
WO2008023523A1 (en) * 2006-08-22 2008-02-28 National Institute Of Advanced Industrial Science And Technology Method of forming thin film by microplasma processing and apparatus for the same
JP2008091218A (ja) * 2006-10-02 2008-04-17 Seiko Epson Corp プラズマ処理装置
JP2008210599A (ja) * 2007-02-26 2008-09-11 Nagano Japan Radio Co プラズマ処理装置
JP4891384B2 (ja) * 2009-12-10 2012-03-07 株式会社新川 プラズマ発生装置

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