JP2012046781A5 - - Google Patents
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- Publication number
- JP2012046781A5 JP2012046781A5 JP2010188148A JP2010188148A JP2012046781A5 JP 2012046781 A5 JP2012046781 A5 JP 2012046781A5 JP 2010188148 A JP2010188148 A JP 2010188148A JP 2010188148 A JP2010188148 A JP 2010188148A JP 2012046781 A5 JP2012046781 A5 JP 2012046781A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- copper plating
- polytetrafluoroethylene
- treating
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188148A JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188148A JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012046781A JP2012046781A (ja) | 2012-03-08 |
| JP2012046781A5 true JP2012046781A5 (fr) | 2013-08-29 |
Family
ID=45901966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010188148A Pending JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012046781A (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11364714B2 (en) * | 2013-10-11 | 2022-06-21 | Sumitomo Electric Printed Circuits, Inc. | Fluororesin base material, printed wiring board, and circuit module |
| JP2015122448A (ja) * | 2013-12-24 | 2015-07-02 | 住友電工プリントサーキット株式会社 | フッ素樹脂基材、プリント配線板、生体情報測定デバイス及び人工臓器 |
| CN106567114A (zh) * | 2016-11-02 | 2017-04-19 | 华南理工大学 | 一种abs塑料表面喷涂活化的电镀方法 |
| JP6925814B2 (ja) * | 2017-02-02 | 2021-08-25 | 株式会社電子技研 | 樹脂および樹脂の製造方法 |
| WO2018147205A1 (fr) * | 2017-02-13 | 2018-08-16 | 東洋炭素株式会社 | Procédé de prétraitement pour placage, procédé de placage, article pré-traité pour placage et article plaqué |
| US20230340220A1 (en) | 2020-07-27 | 2023-10-26 | Ushio Denki Kabushiki Kaisha | Fluorine resin surface modification method, surface-modified fluorine resin production method, joining method, material having surface-modified fluorine resin, and joined body |
| CN113923893B (zh) * | 2021-09-23 | 2023-10-20 | 华中科技大学 | 一种大气压下等离子体容性耦合放电镀铜的装置及方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5696207A (en) * | 1994-12-09 | 1997-12-09 | Geo-Centers, Inc. | Fluroropolymeric substrates with metallized surfaces and methods for producing the same |
| JP2007150221A (ja) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | 多層回路基板およびその製造方法 |
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2010
- 2010-08-25 JP JP2010188148A patent/JP2012046781A/ja active Pending
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