JP2012044094A - Electronic component attachment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component attachment device which can shorten a cycle time by reducing the occurrence of poor attachment by performing more appropriate processing when carry back of an electronic component is detected.SOLUTION: An electronic component attachment device 1 comprises an imaging apparatus 76 capable of imaging the attachment position of a substrate 3, a determination means 53 for determining whether or not there is any evidence that an electronic component P carried back is pressed onto a solder applied to the attachment position thus imaged, and a processing execution means 54 for interrupting or correcting attachment of the electronic component P based on the determination results from the determination means 53.

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

  The electronic component mounting apparatus mounts the electronic component sucked by the suction nozzle of the component transfer device on the substrate transported by the substrate transport device and stopped at the specified position. In such an electronic component mounting apparatus, it is possible to prevent defective mounting by checking whether the electronic component is securely mounted on the printed circuit board. Therefore, Patent Document 1 discloses an apparatus for detecting take-back of an electronic component based on images of the tip portion of the suction nozzle taken immediately before and immediately after the electronic component mounting operation. Here, taking the electronic component home means taking the electronic component sucked by the suction nozzle without mounting it at the mounting position of the printed circuit board. Patent Document 2 discloses an apparatus for confirming whether or not an electronic component is mounted at a mounting position based on an image of the printed circuit board imaged immediately after the mounting operation of the electronic component by a circuit board camera that detects a reference position of the printed circuit board. Is disclosed.

JP 2007-287986 A JP 2008-218706 A

Here, there are various causes for bringing back the electronic component, such as, for example, a positional error between the mounting position and the suction nozzle and a shortage of solder applied to the printed circuit board. For this reason, when the suction nozzle takes the electronic component home, in the process of simply mounting the electronic component again, the same electronic component may be taken home.
The present invention has been made in view of such circumstances, and when it is detected that an electronic component has been taken home, it is possible to reduce the occurrence of defective mounting and shorten the cycle time by performing more appropriate processing. An object of the present invention is to provide an electronic component mounting apparatus.

In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that a substrate transport apparatus that transports a substrate in a transport direction along a transport path and stops at a specified position, and a plurality of types of electronic devices mounted on the substrate. A component supply device for supplying a component, a component transfer device for sucking the electronic component supplied by the suction nozzle from the component supply device and mounting the component on the mounting position of the substrate stopped at the specified position, and the suction In the electronic component mounting apparatus comprising: a take-out detection device that detects that the electronic component sucked by the nozzle is brought back without being mounted at the mounting position of the substrate;
An imaging device capable of imaging the mounting position of the board, and the imaging device that indicates the mounting position where the electronic component was supposed to be mounted when the take-out detection device detects that the electronic component is brought home by the suction nozzle. The electronic component based on the determination result by the determination means and the determination means for determining whether or not there is a trace of the electronic component brought back on the solder applied to the mounting position imaged at the mounting position And a process execution means for performing a mounting interruption process or a mounting correction process.

  According to a second aspect of the present invention, in the first aspect, the component transfer device mounts the electronic component at the mounting position of the substrate by lowering the suction nozzle to a lower end position. The processing execution means is to perform a descending end position correction process for correcting the descending end position of the suction nozzle when the determining means determines that the pressed trace is absent.

  According to a third aspect of the present invention, in the second aspect, the processing execution unit includes a nozzle tip sensor that measures a tip position of the suction nozzle at a predetermined position, and according to a measurement result of the nozzle tip sensor. The descent end position correction process is performed by correcting the descent end position of the suction nozzle.

  According to a fourth aspect of the present invention, in the second or third aspect, the processing execution unit includes a substrate height sensor that measures an upper surface height of the substrate, and corresponds to a measurement result of the substrate height sensor. Then, the descent end position correction process is performed by correcting the descent end position of the suction nozzle.

  A feature of the invention according to claim 5 is that, according to any one of claims 1 to 4, the processing execution means is applied to the mounting position when the determination means determines that the pressed trace is present. The solder state correction process for correcting the state of the solder that has been performed is performed.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the processing execution unit checks the dirt on the tip of the suction nozzle when the suction nozzle brings back the electronic component. The nozzle tip portion contamination check means is provided.

  According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the imaging device moves integrally with the suction nozzle by the component transfer device and recognizes a reference position of the substrate. It is to be a substrate camera.

  According to the first aspect of the invention, the electronic component mounting apparatus determines whether or not there is a trace of the electronic component being pressed on the solder applied to the mounting position when the take-back of the electronic component is detected. A mounting interruption process or a correction process is performed based on the result. The cause of the suction nozzle bringing back the electronic components may be a positional error between the upper surface of the substrate and the suction nozzle at the mounting position, or a lack of solder applied to the substrate or drying. Therefore, in the present invention, the solder state of the mounting position is acquired from the image of the mounting position imaged by the imaging device. As a result, it is possible to determine whether the electronic component has been brought home without being pressed against the solder, or has been brought home despite being pushed. Therefore, it is possible to determine whether the electronic component is brought back due to the position error or the solder applied to the mounting position. That is, more appropriate recovery can be performed as compared with the conventional case, so that occurrence of defective mounting can be reduced and cycle time can be shortened.

  According to the second aspect of the present invention, the processing execution means is configured to perform the descending end position correction process for correcting the descending end position of the suction nozzle. The component transfer device lowers the suction nozzle that has sucked the electronic component to the lower end position, thereby pressing the electronic component on the solder applied to the mounting position of the substrate. However, if the determination means determines that there is no evidence of the electronic component being pressed against the solder, the cause of the electronic component being taken home may be, for example, the position error of the suction nozzle at the mounting position and at the lower end position. It is done. That is, it is considered that the mounting position and the suction nozzle become larger than the assumed distance due to deformation of the substrate and the electronic component does not reach the solder at the lowered end position, and the pressing is insufficient. Thus, with the above-described configuration, the lower end position is corrected, and the electronic component can be reliably mounted by pressing it against the solder applied to the mounting position of the substrate.

  According to the third aspect of the present invention, the processing execution means is configured to perform the descending end position correction process by correcting the descending end position of the suction nozzle according to the measurement result of the nozzle tip sensor. If there is no evidence of the electronic component being pressed against the solder, the cause of the electronic component being taken home is, for example, a stack of suction nozzles (defective expansion / contraction state). That is, it is considered that the suction nozzle is not sufficiently stretched by the stack of the suction nozzles, and the electronic component is not sufficiently pressed against the solder at the lower end position. Therefore, the processing execution means calculates the correction amount of the descending end position from the difference between the tip position where the tip of the suction nozzle should be located at a predetermined position and the measured tip position, for example, with the above configuration. . Thereby, the process execution means can correct the lower end position based on the calculated correction amount, press the electronic component against the solder applied to the mounting position of the substrate, and more reliably mount the electronic component.

  According to the fourth aspect of the present invention, the processing execution means is configured to perform the descending end position correction process by correcting the descending end position of the suction nozzle in accordance with the measurement result of the substrate height sensor. When there is no evidence of the electronic component being pressed against the solder, the cause of the electronic component being taken home is, for example, the board is deformed to warp downward, and the electronic component is not sufficiently pressed against the solder at the lower end position it is conceivable that. Therefore, the processing execution means can calculate the correction amount of the descending end position from the difference between, for example, the height at which the upper surface of the substrate is supposed to be located and the measured upper surface height of the substrate. Thereby, the process execution means can correct the descending end position and press the electronic component against the solder applied to the mounting position of the substrate, thereby mounting the electronic component on the substrate more reliably.

  According to the invention which concerns on Claim 5, a process execution means is set as the structure which performs the solder state correction | amendment process which correct | amends the state of the solder apply | coated to the mounting position. The component transfer device lowers the suction nozzle that has sucked the electronic component to the lower end position, thereby pressing the electronic component on the solder applied to the mounting position of the substrate. However, if the determination means determines that there is a trace of the electronic component being pressed against the solder, the cause of the electronic component being taken home is, for example, insufficient or dry solder applied to the substrate, or the electrode portion of the electronic component. Possible contact failure of solder. Therefore, with the above-described configuration, the process execution unit corrects the state so as to replenish solder, for example. By such solder state correction processing, the component transfer apparatus can perform appropriate recovery by mounting the electronic component again at the mounting position.

  According to the invention which concerns on Claim 6, the process execution means is set as the structure provided with the nozzle front-end | tip part dirt check means which checks the dirt of a suction nozzle front-end | tip part. When the take-out detection device detects the take-out of the electronic component, there is a possibility that solder or the like adheres to the tip of the suction nozzle and is contaminated. Thus, with the above-described configuration, the processing execution unit checks for contamination of the nozzle tip after, for example, discarding the electronic component brought back. This makes it possible to determine whether the electronic component is brought home due to dirt on the suction nozzle or other reasons such as a positional error between the upper surface of the substrate and the suction nozzle at the mounting position. If the suction nozzle is contaminated, for example, by replacing or cleaning the suction nozzle, a good mounting operation of the suction nozzle can be maintained.

  According to the invention which concerns on Claim 7, it is set as the structure by which an imaging device is a board | substrate camera which moves integrally with a suction nozzle with a component transfer apparatus, and recognizes the reference | standard position of a board | substrate. The electronic component mounting apparatus stops the substrate transported by the substrate transport device at a specified position, and mounts the electronic component on the substrate. At this time, a slight misalignment may occur on the substrate stopped at the specified position. For this reason, the electronic component mounting apparatus may recognize the position of the board previously provided on the board by the board camera and more reliably determine the mounting position of the electronic component. Therefore, in the present invention, when a board camera for recognizing the reference position (board mark) of the board is provided, the electronic component mounting apparatus is configured to also use the board camera as an imaging apparatus for imaging the board mounting position. Therefore, the determination unit can determine whether or not there is a trace of the electronic component being pressed against the solder based on the image of the mounting position imaged by the board camera. In general, the substrate camera is arranged in the component transfer device and moves integrally with the suction nozzle. Thereby, the board | substrate camera can grasp | ascertain efficiently the mounting position on the board | substrate requested | required to image. Therefore, since the imaging accuracy can be improved, the mounting position can be reliably imaged.

It is a perspective view of electronic component mounting apparatus 1 of an embodiment. 2 is a front view of the electronic component mounting head 10. FIG. 2 is a bottom view of the electronic component mounting head 10. FIG. 4 is a partially enlarged cross-sectional view of the electronic component mounting head 10. FIG. 3 is a block diagram showing a control device 50. FIG. It is a figure which shows the image of the printed circuit board 3 with which some electronic components P were mounted | worn.

Hereinafter, an embodiment in which an electronic component mounting apparatus of the present invention is embodied will be described with reference to the drawings.
<Configuration of Electronic Component Mounting Device 1>
The electronic component mounting apparatus 1 of the present embodiment is an apparatus for mounting a plurality of electronic components on a printed circuit board 3 in an integrated circuit manufacturing process. In this embodiment, the printed circuit board 3 is applied with solder (pattern printing) at a mounting position of an electronic component by a cream solder printing machine (not shown), and a plurality of mounting devices are sequentially conveyed to mount the electronic component. Thereafter, the printed circuit board 3 is transported to a reflow furnace and soldered to constitute an integrated circuit. In addition, the electronic component mounting device 1 determines the mounting coordinates of the electronic component on the printed circuit board 3 and is provided at two opposite corners of the printed circuit board 3 as shown in FIG. It is determined based on the substrate mark FM which is the reference position. As shown in FIG. 1, the electronic component mounting apparatus 1 mainly includes a substrate transfer device 60, a component supply device 70, a component transfer device 80, and a control device 50.

  The substrate transport device 60 is a device that transports the printed circuit board 3 along the transport direction and stops it at a specified position. The “specified position” is a reference position for positioning and holding the printed circuit board 3 in order for the electronic component mounting apparatus 1 to mount the electronic component on the printed circuit board 3. The substrate transfer device 60 is of a so-called double conveyor type in which the X-axis direction is the transfer direction and the first transfer device 61 and the second transfer device 62 are arranged in two rows. The first transport device 61 and the second transport device 62 have a pair of guide rails 64a, 64b, 65a, 65b arranged on the base 63 in parallel with each other in parallel, and these guide rails 64a, 64b. , 65a, 65b, and a pair of conveyor belts (not shown) that support and convey the printed circuit board 3 and convey them in parallel with each other. The substrate transport device 60 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board 3 transported to a predetermined position, and the printed circuit board 3 is positioned and fixed at the mounting position by the clamp device.

  The component supply device 70 is configured by arranging a plurality of cassette-type feeders 71 in parallel, and supplies a plurality of types of electronic components to be mounted on the printed circuit board 3. The plurality of cassette type feeders 71 are respectively arranged on the base frame 2 which is an installation base of the electronic component mounting apparatus 1. The cassette-type feeder 71 has a main body portion 72 that is detachably attached to the base frame 2, a supply reel 73 provided at the rear portion of the main body portion 72, and a component take-out portion 74 provided at the tip of the main body portion 72. The supply reel 73 winds and holds an elongated tape (not shown) in which electronic components are sealed at a predetermined pitch. The component supply device 70 pulls out the tape at a predetermined pitch by a sprocket (not shown), and sequentially feeds the tape to the component take-out unit 74 after releasing the sealed state of the electronic component. As a result, the component supply device 70 supplies electronic components from the component extraction unit 74 to a component transfer device 80 described later.

  The component transfer device 80 is of the XY robot type, is mounted on the base frame 2 and disposed above the substrate transfer device 60 and the component supply device 70 and is moved in the Y-axis direction by the Y-axis servomotor 11. Y-axis slider 12 is provided. As shown in FIG. 2, an X-axis slider 13 is guided by the Y-axis slider 12 so as to be movable in the X-axis direction orthogonal to the Y-axis direction. That is, the X-axis slider 13 is connected to the Y-axis slider 12 via a pair of guide rails 12 a that are fixed to the Y-axis slider 12 and extend in the X-axis direction, and a pair of guide blocks 13 a that are fixed to the X-axis slider 13. It is held movable. An X-axis servo motor (not shown) is fixed to the Y-axis slider 12, and a ball screw shaft 12b extending in the X-axis direction is connected to the output shaft of the X-axis servo motor. The ball screw shaft 12b is screwed to a ball nut 13b fixed to the X-axis slider 13 via a ball (not shown). Accordingly, when the X-axis servo motor rotates, the ball screw shaft 12b rotates, and the X-axis slider 13 is guided by the guide rail 12a via the ball nut 13b and moves in the X-axis direction.

  On the X-axis slider 13, an electronic component mounting head 10 for attaching the electronic component to the printed circuit board 3 is attached. As shown in FIG. 2, the electronic component mounting head 10 includes an R-axis motor 15, an index shaft 16, a nozzle holder 17, a reflector 31, a suction nozzle 18, a θ-axis motor 19, a Z-axis motor 20, and a first CCD camera 21. Is the main constituent. A first frame 25 and a second frame 26 extending in the horizontal direction are integrally provided on the X-axis slider 13 so as to be separated from each other in the vertical direction, and the R-axis motor 15 is fixed to the first frame 25. The output shaft of the R-axis motor 15 is connected to an index shaft 16 that is supported by the first frame 25 so as to be rotatable about the vertical axis AL (R-axis direction). A rotating body 28 having a driven gear 27 and a θ-axis gear 29 formed thereon is supported on the index shaft 16 so as to be rotatable only. A cylindrical nozzle holder 17 constituting a revolver head is fixed to the lower end portion of the index shaft 16.

  As shown in FIG. 3, the nozzle holder 17 holds a plurality of suction nozzles 18 movably in the vertical direction on a circumference 17a concentric with the vertical axis AL. As shown in FIG. 4, each suction nozzle 18 is attached to the lower end of a nozzle spindle 33 that is supported by the nozzle holder 17 so as to be slidable in the vertical direction (Z-axis direction). A large diameter portion 33 a is formed at the lower end portion of the nozzle spindle 33, and a nozzle gear 34 is fixed to the upper end portion of the nozzle spindle 33. A compression spring 35 is provided between the nozzle gear 34 and the nozzle holder 17. The compression spring 35 urges the nozzle spindle 33 and the suction nozzle 18 upward, and the large-diameter portion 33 a is the lower surface of the nozzle holder 17. The upper movement of the nozzle spindle 33 and the suction nozzle 18 is restricted. Further, a negative pressure is supplied to each suction nozzle 18 from a suction nozzle driving device (not shown) via a nozzle spindle 33. Thereby, each adsorption nozzle 18 can adsorb the electronic component P by the front-end | tip part 18a.

  Furthermore, a cylindrical reflector 31 capable of reflecting light is fixed to the center of the lower end of the nozzle holder 17. Therefore, the nozzle holder 17 and the reflector 31 are rotated around the vertical axis AL together with the index shaft 16. Thereby, when the R-axis motor 15 is rotated, the nozzle holder 17 holding the plurality of suction nozzles 18 can be rotated around the vertical axis AL (R-axis direction) via the index shaft 16. Then, by the rotation of the nozzle holder 17, the plurality of suction nozzles 18 can be similarly rotated around the vertical axis AL, and sequentially assigned to the mounting station S on which the electronic components are mounted. Further, as shown in FIG. 3, the reflector 31 is disposed inside a circumference 17a concentric with the vertical axis LA, and a mark 31a for detecting the holding position of the electronic component P at the center of the lower surface of the reflector 31. Is attached.

  A θ-axis motor 19 is fixed to the first frame 25, and a drive gear 36 is fixed to the output shaft of the θ-axis motor 19. The drive gear 36 is meshed with a driven gear 27 on a rotating body 28 that is rotatably supported by the index shaft 16. A θ-axis gear 29 is formed on the rotating body 28 over a predetermined length in the axial direction, and the θ-axis gear 29 is slidably engaged with each nozzle gear 34 fixed to the nozzle spindle 33. ing. Accordingly, when the θ-axis motor 19 is rotated, all the suction nozzles 18 can be rotated with respect to the nozzle holder 17 via the drive gear 36, the driven gear 27, the θ-axis gear 29, and the nozzle gear 34.

  A Z-axis motor 20 is fixed to the first frame 25, and a ball screw shaft 37 is connected to the output shaft of the Z-axis motor 20. The ball screw shaft 37 is supported by a bearing 38 fixed to the first frame 25 and a bearing 39 fixed to the second frame 26 so as to be rotatable around an axis parallel to the vertical axis AL. A ball nut 40 that converts the rotational motion of the Z-axis motor 20 into a linear motion is screwed onto the ball screw shaft 37 via a ball (not shown). The ball nut 40 is fixed to a nozzle lever 41 that is slidably guided in a vertical direction by a guide 42 that is fixed to the first and second frames 25 and 26 and extends in the vertical direction.

  The nozzle lever 41 is provided with a pressing portion 41a that abuts the upper end of the nozzle spindle 33 indexed to the mounting station S and presses the nozzle spindle 33 downward in the Z-axis direction. Accordingly, when the Z-axis motor 20 is rotated, the ball screw shaft 37 is rotated, and the nozzle lever 41 is guided by the guide 42 via the ball nut 40 and moves up and down. When the nozzle lever 41 moves up and down, the nozzle spindle 33 and the suction nozzle 18 corresponding to the pressing portion 41a can be moved up and down. In this way, when the electronic component is mounted by the electronic component mounting apparatus 1, the component transfer apparatus 80 lowers the suction nozzle 18 that has sucked the electronic component P to the lower end position, thereby moving the electronic component P to the printed circuit board 3. Attach to the mounting position.

  A support bracket 43 is suspended from the second frame 26, and a two-dimensional image of the electronic component P adsorbed by the tip end portion 18 a of the suction nozzle 18 indexed to the mounting station S of the nozzle holder 17 is displayed on the support bracket 43. The first CCD camera 21 to be acquired is fixed. The first CCD camera 21 acquires a two-dimensional image of the electronic component P sucked by the tip 18 a of the suction nozzle 18 by the light reflected by the reflector 31. An imaging case main body 45 to which a plurality of first irradiation bodies 44 are attached is fixed to the side of the support bracket 43 corresponding to the suction nozzle 18. The 1st irradiation body 44 is a light source which irradiates light toward the reflector 31, Comprising: It is set as LED in this embodiment. The imaging case body 45 is provided with two prisms 46. As a result, the imaging case body 45 forms an optical path for introducing the reflected light reflected by the reflector 31 incident inside into the first CCD camera 21.

  With the configuration as described above, the first irradiation body 44 emits light in a state where the suction nozzle 18 indexed to the mounting station S of the nozzle holder 17 is positioned and stopped at the rising end. The irradiation light of the first irradiation body 44 is reflected by the reflector 31 as shown by the arrow in FIG. 3, and the reflected light passes through the outer peripheral edge of the electronic component P and the incident part of the imaging case body 45, and Is incident on the first CCD camera 21 by the prism 46. In this way, the tip end portion 18 a of the suction nozzle 18 and the electronic component P are imaged by the first CCD camera 21 and image-recognized by the image recognition unit 51 of the control device 50. Further, in the present embodiment, the image captured by the first CCD camera 21 images the tip end portion 18a of the suction nozzle 18, so that the image is processed by the image recognition unit 51 and used for measuring the tip position of the suction nozzle 18. Is done. That is, the first CCD camera 21 and the image recognition unit 51 are also used as sensors for measuring the position of the tip 18a at the rising end of the suction nozzle 18, and correspond to the “nozzle tip sensor” of the present invention.

  As shown in FIG. 1, a second CCD camera 75 is provided between the component supply device 70 and the substrate transport device 60 as an imaging unit that detects the holding position of the electronic component. The second CCD camera 75 picks up an image of the electronic component sucked by the suction nozzle 18 and uses it to determine the suction state including the inclination of the electronic component with respect to the suction nozzle 18 and the presence / absence of a defect in the electronic component itself. The component transfer device 80 described above is retracted rearward in FIG. 1, but is moved above the second CCD camera 75 when the holding position of the electronic component is detected.

  Further, as shown in FIG. 2, a mark camera 76 and a second irradiation body 77 are provided at the lower end portion of the X-axis slider 13. The mark camera 76 moves integrally with the suction nozzle 18 by the component transfer device 80 and is used for recognizing a reference position as an image pickup device that recognizes the substrate mark FM that is the reference position of the printed circuit board 3 stopped at the specified position. It is a substrate camera. The mark camera 76 is capable of keeping in a visual field a range where electronic components are mounted on the printed circuit board 3 positioned at a specified position. The 2nd irradiation body 77 is a light source which irradiates light toward the printed circuit board 3, Comprising: It is set as LED in this embodiment. The image captured by the mark camera 76 is subjected to image processing by the image recognition unit 51 of the control device 50 and used for determining whether or not the electronic component is mounted on the printed circuit board 3. In the present embodiment, the mark camera 76 corresponds to the “imaging device” of the present invention.

  Here, when the printed circuit board 3 is mounted by the electronic component mounting apparatus 1, the printed circuit board 3 may be warped on the upper surface side or the lower surface side due to individual differences of the printed circuit board 3, holding force by the substrate transport device 60, or the like. In such a case, the image of the printed circuit board 3 captured by the mark camera 76 is different in the height of the formed image compared to the image captured at the reference height. Therefore, in the present embodiment, the image captured by the mark camera 76 is subjected to image processing by the image recognition unit 51 of the control device 50, and based on the image of the printed circuit board 3 captured at the reference height, the substrate transport device 60. Is used to measure the height of the upper surface of the printed circuit board 3 held by the That is, the mark camera 76 and the image recognition unit 51 are also used as sensors for measuring the height of the substrate, and correspond to the “substrate height sensor” of the present invention.

  The control device 50 is composed of a CPU, a memory, and the like, and each axis is configured so that electronic components are appropriately mounted on the printed circuit board 3 based on input command values and information output from a plurality of cameras and sensors. It is a device that controls the motor and each device. As illustrated in FIG. 5, the control device 50 includes an image recognition unit 51, a take-out detection unit 52, a solder state determination unit 53, a process execution unit 54, and a control unit 55. The image recognition unit 51 captures data captured by the first and second CCD cameras 21 and 75 and the mark camera 76 and recognizes it as two-dimensional image data for image processing.

  The take-out detection unit 52 detects the take-out of the electronic component by the suction nozzle 18 when the electronic component mounting apparatus 1 mounts the electronic component. Therefore, the take-out detection unit 52 inputs image data captured by the first CCD camera 21 from the image recognition unit 51 in a state where the suction nozzle 18 is positioned and stopped at the rising end. Then, the take-out detection unit 52 detects that the electronic component sucked by the suction nozzle 18 has been brought home without being mounted at the mounting position of the printed circuit board 3 based on the state of the tip 18a of the suction nozzle 18 in the image data. . As described above, the first CCD camera 21, the image recognition unit 51, and the take-out detection unit 52 detect the presence / absence of take-out of electronic components as described above, and correspond to the “take-out detection device” of the present invention.

  The solder state determination unit 53 determines whether the solder at the mounting position where the electronic component should have been mounted is in the state when the take-out detection unit 52 detects the take-out of the electronic component. Means. In the determination, the solder state determination unit 53 inputs, from the image recognition unit 51, image data obtained by imaging the mounting position where the electronic component should have been mounted. The input image data may be image data captured by the mark camera 76 when the electronic component is mounted. Then, the solder state determination unit 53 compares the shape of the solder applied to the printed circuit board 3 in the input image data with the shape of the properly applied solder stored in advance in the memory of the control device 50. Thereby, the solder state determination part 53 determines the presence or absence of the trace by which the electronic component brought home on the solder apply | coated to the mounting position was pressed.

  The process execution unit 54 is a process execution unit that performs an electronic component mounting interruption process or a mounting correction process based on the determination result of the solder state determination unit 53. For example, when the process execution unit 54 determines that the trace pressed by the solder state determination unit 53 is nothing (hereinafter simply referred to as “no trace”), the lower end position that corrects the lower end position of the suction nozzle 18. Perform correction processing. On the other hand, when the processing execution unit 54 determines that the trace pressed by the solder state determination unit 53 is present (hereinafter simply referred to as “there is trace”), the process execution unit 54 corrects the state of the solder applied to the mounting position. A solder state correction process is performed. Further, the processing execution unit 54 may stop the electronic component mounting apparatus 1 to interrupt the mounting of the electronic component based on the state of the tip end portion 18a of the suction nozzle 18 and the determination result by the solder state determination unit 53. .

  Further, the process execution unit 54 includes a nozzle tip part dirt check unit 54a that checks the dirt of the tip part 18a of the suction nozzle 18. It is considered that the electronic component P is brought home by the suction nozzle 18 because solder or the like adheres to the tip 18a of the suction nozzle 18 and becomes dirty. Therefore, the nozzle tip portion dirt check unit 54a checks the presence or absence of deposits on the tip portion 18a, and if necessary, cleans or replaces the suction nozzle 18 and appropriately outputs an alarm to the operator to prompt them. To do. Details will be described later.

  The controller 55 controls each axis motor, the suction nozzle driving device, and the like based on the input command value. Thereby, the suction nozzle 18 can be moved, and supply or stop of negative pressure to the suction nozzle 18 can be controlled. In addition, the control unit 55 operates each axis motor, each device, and the like based on a command value input from the process execution unit 54 so that the process execution unit 54 performs a correction process for mounting the electronic component P. .

<Operation of Electronic Component Mounting Device 1>
Next, the operation of mounting the electronic component P on the printed circuit board 3 in the electronic component mounting apparatus 1 of the present embodiment will be described. First, based on a command from the control device 50, the conveyor belt of the substrate transport device 60 is driven, and the printed circuit board 3 is guided to the guide rails 64a and 64b (65a and 65b) and transported to a specified position. The printed circuit board 3 is pushed up and clamped by a clamp device, and is positioned and fixed at a specified position. Here, the fixed printed circuit board 3 is imaged by the mark camera 76. At this time, as shown in FIG. 6, the mark camera 76 captures an image in the visual field of a range SA including the mounting position of the electronic component P on the printed board 3. The range SA is determined based on the board mark FM of the printed circuit board 3 with the mounting coordinates determined by the electronic component mounting apparatus 1 based on a program input to the electronic component mounting apparatus 1. Next, when the Y-axis servo motor 11 and the X-axis servo motor (not shown) are driven, the Y-axis slider 12 and the X-axis slider 13 are moved, and the electronic component mounting head 10 is moved to the component take-out unit 74 of the component supply device 70. Moved to.

  Thereafter, when the R-axis motor 15 is rotated by the control device 50, the nozzle holder 17 is rotated, and the nozzle spindle 33 on which the predetermined suction nozzle 18 is mounted is indexed below the pressing portion 41a of the nozzle lever 41. . Further, when the Z-axis motor 20 is rotated forward by the control device 50, the nozzle lever 41 is pushed downward against the urging force of the compression spring 35, and the tip of the suction nozzle 18 is passed through the nozzle spindle 33. The part 18a is pushed down to a position where the part 18a approaches the electronic component P conveyed to the component extraction unit 74. In this state, negative pressure is supplied to the suction nozzle 18 from an unillustrated suction nozzle driving device, and the electronic component P is sucked and held at the tip 18a of the suction nozzle 18. Thereafter, when the Z-axis motor 20 is reversed, the nozzle lever 41 is moved upward, and the suction nozzle 18 is pushed up to the rising end position by the urging force of the compression spring 35. By repeating such an operation, the electronic components P are sucked and held by the plurality of suction nozzles 18 respectively.

  Subsequently, by driving the Y-axis servo motor 11 and the X-axis servo motor, the Y-axis slider 12 and the X-axis slider 13 are moved, and the electronic component mounting head 10 is moved to above the mounting position of the printed circuit board 3. The Next, by rotation of the θ-axis motor 19, the electronic component P sucked and held at the tip 18 a of the suction nozzle 18 indexed to the mounting station S of the nozzle holder 17 is controlled to a predetermined posture. Then, when the Z-axis motor 20 is rotated forward, the nozzle lever 41 is pushed downward against the urging force of the compression spring 35, and the tip end portion 18a of the suction nozzle 18 is pushed down to the lower end position. Then, the electronic component P sucked by the suction nozzle 18 is pressed against the solder applied to the printed circuit board 3. At this time, the negative pressure supplied from the suction nozzle driving device to the suction nozzle 18 is stopped. As a result, the electronic component P is mounted on the printed circuit board 3 with an adhesive force due to the adhesiveness of the solder at the mounting position.

  After the electronic component P is mounted on the printed circuit board 3, the Z-axis motor 20 is reversed to move the nozzle lever 41 upward, and the suction nozzle 18 moves to the rising end by the urging force of the compression spring 35. Pushed up. In this state, the control device 50 irradiates light from the first irradiation body 44 and acquires an image of the suction nozzle 18 captured by the first CCD camera 21. The take-out detection unit 52 inputs image data of the tip end portion 18 a of the suction nozzle 18 that has been subjected to image processing by the image recognition unit 51. Then, the take-out detection unit 52 confirms whether or not the electronic component P has been taken home.

  Here, when the take-out detection unit 52 detects that the electronic component P is not taken home and the normal mounting is performed, the control device 50 proceeds to the next step in order to mount the next electronic component P. As described above, the electronic component mounting apparatus 1 is operated in such a manner that the control device 50 operates the substrate transfer device 60, the component supply device 70, and the component transfer device 80 in cooperation as appropriate, and repeats the lifting and lowering operation of the suction nozzle 18. Various types of electronic components P are mounted on the printed circuit board 3. Then, when all the electronic components P are mounted, the electronic component mounting apparatus 1 releases the clamp of the printed circuit board 3 and unloads the printed circuit board 3 by the circuit board transport device 60 and ends the mounting operation.

  Next, an operation when take-out is detected in the confirmation of whether or not the electronic component P has been taken away by the take-out detection unit 52 will be described. In such a case, the control device 50 first determines the state of the solder at the mounting position by the solder state determination unit 53. Therefore, the solder state determination unit 53 inputs image data picked up by the mark camera 76, and acquires the solder shape of the mounted position of the electronic component P brought back in the range SA. Here, for example, if the shape of the solder is not deformed and remains applied by the cream solder printer, it is considered that the electronic component P is not pressed against the solder. Therefore, the solder state determination unit 53 determines whether there is a trace of the electronic component P being pressed in the acquired image data of the mounting position. In this determination, the determination may be made by comparing the presence or absence of unevenness or spread of the solder, or the shape of the solder in the image data and the shape of the properly applied solder stored in advance.

  Next, an operation when the solder state determination unit 53 determines that there is no evidence of the electronic component P on the solder at the mounting position will be described. Here, in the above state, in the mounting operation, the electronic component P is brought back without pressing the electronic component P against the solder even though the suction nozzle 18 is lowered to the lower end position. In such a case, as a cause of the electronic component P being taken home, for example, the position error of the suction nozzle 18 at the upper surface and the lower end position of the printed circuit board 3 at the mounting position can be considered. That is, due to stacking of the suction nozzles 18 (defective expansion / contraction state), deformation of the printed circuit board 3, and the like, the upper surface of the printed circuit board 3 and the tip end portion 18a of the suction nozzle 18 become larger than the assumed distance, and the position as described above It is considered that an error has occurred. When such a position error occurs, the electronic component P does not reach the solder at the lowered end position, and the suction nozzle 18 may be brought home without pressing the electronic component P against the solder.

  Therefore, the process execution unit 54 determines whether the tip 18a of the suction nozzle 18 has been lowered to a height based on the command value. Specifically, the process execution unit 54 measures the position of the tip 18 a at the rising end of the suction nozzle 18 by the first CCD camera 21 and the image recognition unit 51. And the process execution part 54 compares the front-end | tip position of the suction nozzle 18 in the rising end previously memorize | stored in the memory of the control apparatus 50, and the position of the measured front-end | tip part 18a. If there is an error in the tip position due to this comparison, for example, the suction nozzle 18 may be insufficiently stretched by the stack of the suction nozzles 18. Therefore, the process execution unit 54 calculates a correction amount for the descending end position based on the difference between the compared tip positions. Then, the control unit 55 corrects the descending end position based on the correction amount input from the processing execution unit 54, and lowers the suction nozzle 18 to the corrected descending end position. Then, the electronic component P is properly pressed against the solder at the mounting position, and the electronic component P can be remounted. As described above, the process execution unit 54 performs the descent position correction process using the correction amount calculated based on the actually measured position of the tip 18a of the suction nozzle 18.

  On the other hand, in the comparison of the tip position of the suction nozzle 18 described above, there may be no error in the tip position. In such a case, for example, it is conceivable that the printed circuit board 3 is deformed so as to warp downward. Therefore, the process execution unit 54 determines whether the printed circuit board 3 has undergone deformation such as downward warping. Specifically, the process execution unit 54 measures the height of the upper surface at the mounting position based on the image on the printed circuit board 3 captured by the mark camera 76 and the image recognition unit 51. Then, the process execution unit 54 compares the height at which the upper surface of the printed circuit board 3, which is stored in advance in the memory of the control device 50, with the upper surface height at the actually measured mounting position. If there is an error in the upper surface height due to this comparison, it is conceivable that the printed circuit board 3 is deformed due to the pressure applied to the printed circuit board 3 by the clamp or the heat in the machine.

  Therefore, the process execution unit 54 calculates the correction amount for the descending end position based on the compared difference in the upper surface height. Then, the control unit 55 corrects the descending end position based on the correction amount input from the processing execution unit 54, and lowers the suction nozzle 18 to the corrected descending end position. Then, the electronic component P is properly pressed against the solder at the mounting position, and the electronic component P can be remounted. As described above, the process execution unit 54 performs the lower end position correction process using the correction amount calculated based on the actually measured upper surface height of the printed circuit board 3.

  Also, it is assumed that there is no error in the comparison of the height of the upper surface of the printed circuit board 3 or that the take-out of the electronic component P is detected again even if the electronic component P is remounted by the descending end position correction process. The In such a case, the applied solder may be solidified or insufficient, dried, or mixed with foreign matter at the mounting position. Therefore, the process execution unit 54 may stop the electronic component mounting apparatus 1 and output an alarm so as to prompt the operator to confirm.

  Next, an operation when the solder state determination unit 53 determines that there is evidence of the electronic component P on the solder at the mounting position will be described. Here, in the above-described state, in the mounting operation, the electronic component P is brought home despite the suction nozzle 18 being lowered to the lower end position and pressing the electronic component against the solder. In such a case, the cause of the electronic component P being taken home may be, for example, insufficient or dry solder applied to the printed circuit board 3, or poor contact between the electrode part of the electronic component P and the solder. In such a solder state, the adhesive force due to the adhesiveness of the solder decreases, and the electronic component P pressed by the suction nozzle 18 may be brought home without being mounted on the printed circuit board 3.

  Therefore, the processing execution unit 54 partially corrects the solder applied to the mounting position on the upper surface of the printed circuit board 3. More specifically, the process execution unit 54 first acquires image data of the printed circuit board 3 captured by the mark camera 76. When the solder at the mounting position of the electronic component P is insufficient from the image data, for example, the solder state correction device capable of partially supplementing the printed circuit board 3 compensates for the shortage of solder. Also good. Thus, the electronic component P can be remounted by correcting the solder state. If the processing execution unit 54 determines that the solder state cannot be corrected, for example, solder is applied to a very narrow range at the mounting position, the process execution unit 54 stops the electronic component mounting apparatus 1 and An alarm may be output to prompt confirmation.

  As described above, the correction processing and the like that differ depending on the determination (no trace / present) of the solder state determination unit 53 is exemplified. Further, it is considered that the take-back of the electronic component P by the suction nozzle 18 is due to the fact that solder or the like adheres to the tip portion 18a of the suction nozzle 18 and is dirty. That is, when the solder adheres to the tip 18a, the electronic component P adheres to the suction nozzle 18 if the adhesive force due to the adhesiveness of the solder is larger than the adhesive force of the solder applied to the printed circuit board 3. Will do. Therefore, the nozzle tip dirt check unit 54a of the processing execution unit 54 is configured to check whether the suction nozzle 18 is in a proper state without dirt.

  Specifically, the control device 50 first discards the electronic component brought back by the suction nozzle 18. Next, the suction nozzle 18 is imaged by the first CCD camera 21 and the second CCD camera 75. Then, the process execution unit 54 acquires the captured image data of the suction nozzle 18 from the image recognition unit 51. The nozzle tip portion dirt check unit 54a checks whether there is any deposit on the tip portion 18a of the suction nozzle 18 based on the acquired image data. In addition, the process execution unit 54 inputs the confirmation result, and appropriately executes the replacement or cleaning of the suction nozzle 18 as necessary, and the output of an alarm to the operator to prompt them.

<Effects of the electronic component mounting apparatus 1>
According to the electronic component mounting apparatus 1 of the present invention, when the electronic component mounting apparatus 1 detects that the electronic component P is taken home, the electronic component mounting apparatus 1 determines whether or not there is a trace of the electronic component P being pressed on the solder applied to the mounting position. Determination is performed, and mounting interruption processing or correction processing is performed based on the determination result. In other words, in order to obtain the solder state of the mounting position from the image of the mounting position imaged by the mark camera 76, the electronic component P was brought home without being pressed against the solder, or it was brought back despite being pressed. Can be determined. Therefore, it can be determined whether the electronic component P is brought back due to the positional error between the upper surface of the printed circuit board 3 and the suction nozzle 18 at the mounting position or the solder applied to the mounting position. By performing the interruption process or the correction process based on the determination result, more appropriate recovery can be performed as compared with the conventional case, so that the occurrence of defective mounting can be reduced and the cycle time can be shortened.

  In addition, when the solder state determination unit 53 determines that there is no evidence, the cause of the electronic component P being taken home may be, for example, the positional error of the suction nozzle 18 at the mounting position and at the lower end position of the printed circuit board 3. Therefore, the processing execution unit 54 is configured to perform a descending end position correction process for correcting the descending end position of the suction nozzle 18. As the descending end position correction process, the process execution unit 54 uses the first CCD camera 21 and the image recognition unit 51 as a nozzle tip sensor, and corrects the descending end position of the suction nozzle 18 according to the measurement result. This is because, for example, the suction nozzle 18 is not sufficiently stretched due to the stack of the suction nozzles 18 and the electronic component P is not sufficiently pressed against the solder at the lowered end position. Therefore, the processing execution unit 54 corrects the descending end position as described above, and determines the descending end position based on the difference between the leading end position where the leading end 18a of the suction nozzle 18 should be located at the rising end and the measured leading end position. The amount of correction is calculated. Then, the control unit 55 corrects the descending end position based on the correction amount, so that the electronic component P is pressed against the solder applied to the mounting position of the printed circuit board 3. As a result, the electronic component P can be reliably mounted and recovered.

  Further, as the descent end position correction process, the process execution unit 54 uses the mark camera 76 and the image recognition unit 51 as the substrate height sensor, and corrects the descent end position of the suction nozzle 18 according to the measurement result. This is because, when there is no evidence of the electronic component P being pressed against the solder, for example, the printed circuit board 3 is deformed so as to be bent down as a cause of the electronic component P being taken home. This is because the pressing is considered insufficient. Therefore, the process execution unit 54 corrects the descending end position from the difference between the height at which the upper surface of the printed circuit board 3 should be located and the measured upper surface height of the printed circuit board 3 by correcting the descending end position as described above. Calculate the amount. Then, the control unit 55 corrects the descending end position based on the correction amount, so that the electronic component P is pressed against the solder applied to the mounting position of the printed circuit board 3. Thereby, the electronic component P can be reliably mounted on the printed circuit board 3 for recovery.

  The processing execution unit 54 is configured to perform a solder state correction process for correcting the state of the solder applied to the mounting position. The component transfer device 80 mounts the electronic component P by pressing the suction nozzle 18 that has sucked the electronic component P down to the lower end position, thereby pressing the solder nozzle applied to the mounting position of the printed circuit board 3. However, when the solder state determination unit 53 determines that there is a trace of the electronic component P being pressed against the solder, as a cause of the electronic component P being taken home, for example, the solder applied to the printed circuit board 3 is insufficient or dry, Or the contact failure of the electrode part of the electronic component P and solder | pewter etc. can be considered. Therefore, with the configuration as described above, the process execution unit 54 corrects the state so as to replenish solder, for example. By such a solder state correction process, the component transfer device 80 can mount the electronic component P again at the mounting position to perform appropriate recovery.

  The processing execution unit 54 includes a nozzle tip portion dirt check unit 54a that checks the tip of the suction nozzle 18 for dirt. One possible reason is that when the take-out detection unit 52 detects the take-out of the electronic component P, solder or the like adheres to the tip of the suction nozzle 18 and becomes dirty. Therefore, the nozzle tip portion dirt check unit 54a checks the nozzle tip portion for dirt after, for example, discarding the electronic component P brought back. Thereby, it is possible to determine whether the cause of the electronic component P being taken home is due to the dirt of the suction nozzle 18 or other reasons such as the positional error between the upper surface of the printed circuit board 3 and the suction nozzle 18 at the mounting position. Then, when the suction nozzle 18 is contaminated, the process execution unit 54 appropriately executes the replacement or cleaning of the suction nozzle 18 as necessary, and the output of an alarm to the operator to prompt them. Thereby, the favorable mounting | wearing operation | movement of the suction nozzle 18 can be maintained.

  The imaging device that images the mounting position of the printed circuit board 3 is a mark camera 76 (substrate camera). Therefore, the solder state determination unit 5 can determine the presence or absence of the evidence that the electronic component P is pressed against the solder from the image of the mounting position imaged by the mark camera 76. In general, the mark camera 76 is arranged in the component transfer device 80 as in the present embodiment and moves integrally with the suction nozzle 18. Thereby, the mark camera 76 can efficiently capture the mounting position on the substrate that is required to be imaged. Therefore, since the imaging accuracy can be improved, the mounting position can be reliably imaged.

<Modification of Embodiment>
In the present embodiment, the mark camera 76, which is a substrate camera, is also used as an imaging device. However, a dedicated imaging device may be provided as long as the solder state at the mounting position can be imaged. However, it is preferable to use the mark camera 76 also as an imaging device from the viewpoint of the installation cost of the dedicated camera and the reliable imaging of the mounting position.
In addition, the control device 50 may statistically aggregate the detection result by the take-out detection unit 52, the determination result by the solder state determination unit 53, the correction processing by the processing execution unit 54, and the like. Thereby, in the mounting by the electronic component mounting apparatus 1, it is possible to analyze the tendency of the cause of the electronic component P to be taken home. Then, by adjusting each part of the electronic component mounting apparatus 1 based on the analyzed result, it is possible to maintain and improve the quality of the entire apparatus and the mounted product.

  In addition, when the take-out detection unit 52 detects that the electronic component P has been taken home, the control device 50 uses the solder state determination unit 53 to determine what state the solder at the mounting position is in. On the other hand, the control device 50 may be configured to further determine the presence / absence of solder adhesion to the electronic component P brought back. Therefore, the control device 50 first picks up the electronic component P by moving the suction nozzle above the second CCD camera 75 by the component transfer device 80 with the electronic component P being brought home. Then, the control device 50 inputs the image data of the electronic component P that has been subjected to image processing by the image recognition unit 51, and determines whether solder is attached to the electronic component P. Here, for example, when solder is attached to the electronic component P, it can be determined that the electronic component P is pressed against the solder. On the other hand, when the solder is not attached to the electronic component P, the position error between the mounting position and the suction nozzle, or the lack of solder or dryness may be considered as causes of take-out. As described above, the control device 50 may be configured to determine the cause of take-out based on the image data of the electronic component P itself that has been taken home. Alternatively, the control device 50 may be configured to determine the cause of take-away based on the determination result of the presence or absence of solder adhesion to the electronic component P in addition to the solder state of the mounting position by the solder state determination unit 53. As a result, more appropriate recovery can be performed, so that the occurrence of defective mounting can be reduced and the cycle time can be shortened.

DESCRIPTION OF SYMBOLS 1: Electronic component mounting apparatus 2: Base frame 3: Printed circuit board 10: Electronic component mounting head 11: Y-axis servo motor 12: Y-axis slider 12a: Guide rail 12b: Ball screw shaft 13: X-axis slider 13a: guide block, 13b: ball nut 15: R-axis motor, 16: index shaft, 17: nozzle holder, 17a: circumference 18: suction nozzle, 18a: tip, 19: θ-axis motor 20: Z-axis motor 21: First CCD camera 25: First frame 26: Second frame 27: Driven gear 28: Rotating body 29: θ axis gear 31: Reflector 31a: Mark 33: Nozzle spindle 33a: Large Diameter part 34: Nozzle gear 35: Compression spring 38, 39: Bearing 40: Ball nut 41: Nozzle lever 41a: Pressing part 42: Guide 43: Support bracket 44: First irradiator 45: Imaging case body 46: Prism 50: Control device 51: Image recognition unit 52: Take-out detection unit 53: Solder state determination unit 54: Processing Execution part,
54a: Nozzle tip dirt check section 55: Control section 60: Substrate transport apparatus 61: First transport apparatus 62: Second transport apparatus 63: Base 64a, 64b, 65a, 65b: Guide rail 70: Parts 71: cassette type feeder, 72: main body unit 73: supply reel, 74: component take-out unit, 75: second CCD camera 76: mark camera, 77: second irradiation body S: mounting station, P: electronic component , AL: Vertical axis

Claims (7)

A substrate transport device that transports a substrate in the transport direction along the transport path and stops at a specified position, a component supply device that supplies a plurality of types of electronic components to be mounted on the substrate, and a suction nozzle that is supplied from the component supply device A component transfer device that picks up the electronic component picked up and places it on the mounting position of the substrate stopped at the specified position, and attaches the electronic component picked up by the suction nozzle to the mounting position of the substrate. In an electronic component mounting apparatus comprising a take-out detection device that detects that it has been brought home without
An imaging device capable of imaging the mounting position of the substrate;
When the take-out detection device detects that the electronic component is taken home by the suction nozzle, the mounting position where the electronic component was supposed to be mounted is imaged by the imaging device and applied to the imaged mounting position. Determining means for determining the presence or absence of evidence of the electronic component brought back on the solder;
Based on the determination result by the determination unit, a process execution unit that performs a mounting interruption process or a mounting correction process;
An electronic component mounting apparatus comprising: In claim 1,
The component transfer device mounts the electronic component at the mounting position of the substrate by lowering the suction nozzle to a lower end position,
The electronic component mounting apparatus, wherein the processing execution unit performs a lowering end position correction process for correcting the lowering end position of the suction nozzle when the determination unit determines that the pressed trace is absent. . In claim 2,
The processing execution means includes a nozzle tip sensor that measures a tip position of the suction nozzle at a predetermined position, and corrects the descending end position of the suction nozzle in accordance with a measurement result of the nozzle tip sensor. An electronic component mounting apparatus that performs an end position correction process. In claim 2 or 3,
The processing execution means includes a substrate height sensor that measures the height of the upper surface of the substrate, and corrects the descending end position of the suction nozzle according to the measurement result of the substrate height sensor, thereby reducing the descending end. An electronic component mounting apparatus that performs position correction processing. In any one of Claims 1-4,
The processing execution means performs a solder state correction process for correcting the state of the solder applied to the mounting position when the determination means determines that the pressed trace is present. apparatus. In any one of Claims 1-5,
The electronic component mounting apparatus according to claim 1, wherein the processing execution unit includes a nozzle tip portion contamination check unit that checks the contamination of the suction nozzle tip portion when the suction nozzle brings back the electronic component. In any one of Claims 1-6,
The electronic component mounting apparatus, wherein the imaging device is a substrate camera that moves integrally with the suction nozzle by the component transfer device and recognizes a reference position of the substrate.

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