JP2012023270A - Holder for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holder for a substrate capable of effectively excluding the occurring fear of damage and breakage of a thin semiconductor wafer during transporting or carrying.SOLUTION: In a holder 1 for a substrate for detachably sticking and holding a thin semiconductor wafer W having a back-ground surface on an adhesive layer 5 having a flexibility for a holding ring, the holding ring is first and second holding rings 2, 2A, and the first and second holding rings 2, 2A, are stacked to form two-tiered holding rings, and a proximal pair of adhesive layers 5 opposing each other hold and interleave the thin semiconductor wafer W. Either the adhesive layer 5 of the first holding ring 2 or the adhesive layer 5 of the second holding ring 2A is made as a strong adhesive layer 6 and the other a weak adhesive layer 7. The strong adhesive layer 6 and the weak adhesive layer 7 hold and interleave the thin semiconductor wafer W overall, and sufficiently protect the thin semiconductor wafer W, because vibration and impact during transportation and the like can be absorbed and attenuated by interleaving the wafer W in vertical direction.

Description

  The present invention relates to a substrate holder used when holding, transporting, transporting, etc. a thin semiconductor wafer.

  From the viewpoint of adapting to a thin semiconductor package, a semiconductor wafer is ground to a thickness of 100 μm or less, and recently, 50 μm or less in a back grinding process, and is transported or transported in a shipping box. However, when semiconductor wafers are back-ground, they become very thin and bend easily, so if they are stored directly in the shipping box as they are, they may be damaged or broken by vibration during transportation or transportation. (See Patent Documents 1 and 2).

  Therefore, back-ground thin semiconductor wafers are not transported or transported as they are, but are stored in a shipping box while being held by a substrate holder such as a dicing frame for transport and transport. Provided.

JP 2006-216775 A JP 2000-208602 A

  Conventional thin semiconductor wafers are stored in the shipping box while being held by the substrate holder as described above. However, if the wafer is simply held by the adhesive tape of the substrate holder, vibration or shock However, there is a risk of damage or breakage during transportation or transportation.

  The present invention has been made in view of the above, and an object of the present invention is to provide a substrate holder that can effectively eliminate the possibility of damage or breakage of a thin semiconductor wafer during transportation or transportation.

In the present invention, in order to solve the above-mentioned problem, a holder for detachably sticking a thin semiconductor wafer on a flexible adhesive layer of a holding ring,
The holding ring is divided into first and second holding rings, and the first and second holding rings are stacked so that a thin semiconductor wafer is sandwiched between a pair of opposing adhesive layers. One of the adhesive layer and the adhesive layer of the second holding ring is a strong adhesive layer, and the other is a weak adhesive layer.

The first holding ring includes an inner ring and an outer ring that are fitted to each other, and the peripheral edge portion of the strong adhesion layer can be sandwiched between the inner ring and the outer ring.
Further, the second holding ring includes an inner ring and an outer ring that are fitted to each other, and a peripheral edge portion of the weak adhesive layer can be sandwiched between the inner ring and the outer ring.

  Here, the thin semiconductor wafer in the claims includes at least back-ground silicon wafers of φ200, 300, and 450 mm. The first and second retaining rings are not particularly limited in material as long as they are larger than the semiconductor wafer. In the case where the first holding ring is also used in the semiconductor manufacturing process, it is preferable that the strong adhesion layer is imparted with at least heat resistance. Furthermore, the substrate holder according to the present invention is mainly used in the case of transporting and transporting a thin semiconductor wafer, but is not particularly limited thereto, and a semiconductor manufacturing process (for example, a solder reflow process). Etc. can also be used.

  According to the present invention, when a thin semiconductor wafer is transported or transported, it is sandwiched between the strong adhesive layer and the weak adhesive layer of the first and second retaining rings, and these strong adhesive layer and weak adhesive layer. Since it bends and absorbs and attenuates vibrations and shocks, it is protected thicker than before.

  According to the present invention, there is an effect that it is possible to effectively eliminate the possibility that a thin semiconductor wafer is damaged or broken during transportation or transportation.

According to the second aspect of the present invention, the first holding ring can be easily assembled by fitting the inner ring and the outer ring through the peripheral edge of the strong adhesive layer. In addition, the strong adhesive layer can be easily replaced as necessary.
According to the invention described in claim 3, the second holding ring can be easily assembled by fitting the inner ring and the outer ring through the peripheral edge of the weak adhesive layer. In addition, the weak adhesive layer can be easily replaced.

It is a perspective explanatory view showing typically an embodiment of a substrate holder concerning the present invention. It is a section explanatory view showing typically the shipping box in the embodiment of the substrate holder according to the present invention. It is a section explanatory view showing typically the 1st and 2nd holding ring in the embodiment of the holder for substrates concerning the present invention. It is an exploded section explanatory view showing typically the 1st and 2nd holding ring in the embodiment of the holder for substrates concerning the present invention.

  Hereinafter, the embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 4, the substrate holder 1 in the present embodiment has the same first and second holding rings 2. 2A, a holder for stacking the first and second holding rings 2 and 2A in two upper and lower stages and sandwiching a thin semiconductor wafer W back-ground between a pair of opposing adhesive layers 5 After the thin semiconductor wafer W is sandwiched, it is stored in a dedicated shipping box 10.

  As shown in FIGS. 1, 3, and 4, the first holding ring 2 includes a hollow inner ring 3 and an outer ring 4 that are closely fitted to each other, and an outer peripheral surface and an outer ring of the inner ring 3. 4, a peripheral edge portion of the strong adhesive layer 6, which is the adhesive layer 5 that adheres to the thin semiconductor wafer W from below, is detachably sandwiched between the inner peripheral surface 4.

  When the inner ring 3 and the outer ring 4 are made of a metal material, it is preferable that the inner ring 3 and the outer ring 4 are made of stainless steel or a material capable of preventing the occurrence of rust by plating. On the other hand, when manufacturing with the molding material containing resin, it is preferable to shape | mold with the molding material containing polyphenylene sulfide, polyamide, a polycarbonate, a liquid crystal polymer, etc.

  The strong adhesive layer 6 is made of a flexible silicone rubber sheet that is excellent in self-adhesion, heat resistance, weather resistance, flame retardancy, electrical properties, etc., and various fillers such as conductive fillers are used as necessary. It is compounded and formed into a planar circle having a size larger than that of the thin semiconductor wafer W. The strong adhesive layer 6 has a strong adhesive property in which at least the surface adhering to the thin semiconductor wafer W is more adhesive than the weak adhesive layer 7. This strong adhesiveness is realized, for example, by selecting the material of the sheet or appropriately applying a mirror finish to the surface of the sheet.

  As shown in FIGS. 1, 3, and 4, the second holding ring 2 </ b> A includes a hollow inner ring 3 and an outer ring 4 that are closely fitted to each other. 4, a peripheral edge portion of the weak adhesive layer 7, which is an adhesive layer 5 that adheres to the thin semiconductor wafer W from above, is detachably sandwiched between the inner peripheral surface 4 and the first holding ring 2 visually. Predetermined patterns and colors are appropriately applied so that they can be distinguished. The inner ring 3 and the outer ring 4 are manufactured from the same material as the inner ring 3 and the outer ring 4 of the first holding ring 2.

  The weak adhesive layer 7 is made of, for example, a thin silicone rubber sheet similar to the strong adhesive layer 6, and is formed in a planar circular shape having a size equal to or larger than the size of the thin semiconductor wafer W. When the rings 2 and 2A are laminated, they face each other close to the strong adhesive layer 6. The weak adhesive layer 7 has a weak adhesive property in which at least the surface that adheres to the thin semiconductor wafer W is less adhesive than the strong adhesive layer 6. This weak adhesiveness is realized, for example, by selecting the material of the sheet and appropriately applying a texture or uneven process to the surface of the sheet.

  The thin semiconductor wafer W is not particularly limited. For example, the thin semiconductor wafer W is made of a fragile silicon wafer having a diameter of 200 mm that is ground to a thickness of 100 μm or less, particularly 50 μm or less in a back grinding process.

  As shown in FIG. 2, the shipping box 10 includes, for example, a box body 11 of a top open box and a lid body 12 that is detachably fitted to the opened upper surface of the box body 11. A plurality of substrate holders 1 are stacked between the body 12 and stored in the vertical direction. An endless seal gasket is interposed between the box body 11 and the lid body 12 as necessary from the viewpoint of improving the sealing performance.

  The box body 11 and the lid body 12 are each injection-molded with a molding material containing a predetermined resin. Examples of the predetermined resin of the molding material include thermoplastic resins such as polycarbonate, cycloolefin polymer, polyetherimide, polyether ketone, polybutylene terephthalate, polyether ether ketone, and liquid crystal polymer, and alloys thereof.

  Conductive agents such as carbon black, carbon fibers, carbon nanotubes, metal fibers, metal oxides, and conductive polymers, and various antistatic agents such as anions, cations, and nonionics are selectively added to these molding material resins. Is done. It is also possible to add benzotriazole-based, salicylate-based, cyanoacrylate-based, oxalic acid anilide-based, hindered amine-based UV absorbers, or glass fibers or carbon fibers that improve rigidity.

  On the inner bottom surface of the box body 11, a plurality of positioning pins 13 that surround the substrate holder 1 are erected at predetermined intervals. In addition, a plurality of positioning pins 14 surrounding the substrate holder 1 are selectively disposed on the inner surface of the ceiling of the lid 12 at a predetermined interval.

  In the above configuration, when the thin semiconductor wafer W back-ground is sandwiched between the substrate holders 1, the thin semiconductor wafer W is adhesively held on the strained strong adhesive layer 6 of the first holding ring 2 without gaps. If the second holding ring 2A is stacked on the first holding ring 2 and the weak adhesive layer 7 is adhered to the exposed surface of the thin semiconductor wafer W, the strength of the first and second holding rings 2 and 2A is increased. A thin semiconductor wafer W can be held between the adhesive layer 6 and the weak adhesive layer 7 in a stable posture.

  Next, when the thin semiconductor wafer W sandwiched between the substrate holders 1 is stored in the shipping box 10, the required number of substrate holders 1 are stored horizontally in the box body 11 of the shipping box 10. A plurality of thin semiconductor wafers W are placed on the shipping box 10 by stacking and positioning the substrate holder 1 with a plurality of positioning pins 13 and covering the lid 12 with the lid 12 on the open upper surface of the box body 11. Can be stored. At this time, from the viewpoint of facilitating the subsequent removal work, it is preferable to position the second holding ring 2 </ b> A of each substrate holder 1 upward.

  The thin semiconductor wafer W thus housed in the shipping box 10 is transported or transported, and is sandwiched between the strong adhesive layer 6 and the weak adhesive layer 7 over the entire surface from the top and bottom directions, and these Since the strong adhesive layer 6 and the weak adhesive layer 7 are bent in the vertical direction to exhibit a buffer function, sufficient protection can be expected. Therefore, it is possible to effectively eliminate the possibility that the thin semiconductor wafer W is damaged or broken due to vibration during transportation or transportation.

  Moreover, even if the thin semiconductor wafer W is damaged or broken, the entire surface of the thin semiconductor wafer W is already adhered to the strong adhesive layer 6 or the weak adhesive layer 7, so that there is a possibility that the damaged portion is scattered around. Absent. Therefore, the other thin semiconductor wafers W are not adversely affected.

  When the thin semiconductor wafer W taken out from the shipping box 10 is to be subjected to various types of processing and processing after the transportation and transportation are finished, first pay attention to the weakly adhesive layer 7 that is easy to peel off, and move upward from the thin semiconductor wafer W. The second adhesive ring 7 is peeled off, the second holding ring 2A is removed, the thin semiconductor wafer W is vacuum-sucked on the surface of a chuck table (not shown), and then the strong adhesive layer 6 is peeled off from the thin semiconductor wafer W. If one holding ring 2 is removed, various processes and treatments can be performed on the thin semiconductor wafer W.

  When the thin semiconductor wafer W taken out from the shipping box 10 is subjected to a solder reflow process, sufficient heat resistance may be given in advance to the strong adhesive layer 6 of the first holding ring 2 to be removed later. In this case, the thin semiconductor wafer W can be used as it is without being separated from the first holding ring 2 in the solder reflow process, which is very convenient.

  According to the above configuration, the strong adhesive layer 6 and the weak adhesive layer 7 sandwich the thin semiconductor wafer W over the entire surface and bend in the vertical direction to absorb or attenuate vibrations and shocks during transportation. The thin semiconductor wafer W can be sufficiently protected, and there is no possibility that the thin semiconductor wafer W is damaged or broken during transportation or transportation.

  In addition, since the strong adhesive layer 6 and the weak adhesive layer 7 are used instead of simply using the pair of strong adhesive layers 6, the adhesiveness to the thin and brittle semiconductor wafer W becomes excessive. Can be suppressed. Accordingly, when the adhesive layer 5 is peeled from the thin and fragile semiconductor wafer W, it is possible to suppress and prevent the thin semiconductor wafer W from being damaged near the center in the thickness direction.

  In the above embodiment, the strong adhesive layer 6 is sandwiched between the first retaining ring 2 and the weak adhesive layer 7 is sandwiched between the second retaining ring 2A. However, the weak adhesive layer 7 is disposed on the first retaining ring 2. The strong adhesion layer 6 may be sandwiched between the second holding ring 2A. The first and second holding rings 2 and 2A are preferably planar ring shapes corresponding to the semiconductor wafer W, but may be frame shapes or the like. Further, a concave portion is formed on one of the outer peripheral surface of the inner ring 3 and the inner peripheral surface of the outer ring 4, and a convex portion is formed on the other. The separation of the ring 4 may be prevented.

  In the above embodiment, the strong adhesive layer 6 and the weak adhesive layer 7 are made of silicone rubber, but the present invention is not limited to this. For example, the strong adhesive layer 6 and the weak adhesive layer 7 are laminated with a fluorine-based rubber, polyolefin-based, polyester-based, urethane-based elastomer film, or a polyester-based acrylic or silicone-based adhesive layer 5 that can be removed again. It may be formed by processing a laminated film. Further, instead of the positioning pins 13 of the box body 11, positioning guide pieces can be arranged at predetermined intervals, or the positioning pins 14 of the lid 12 can be omitted.

DESCRIPTION OF SYMBOLS 1 Board | substrate holder 2 1st holding ring 2A 2nd holding ring 3 Inner ring 4 Outer ring 5 Adhesive layer 6 Strong adhesive layer 7 Weak adhesive layer 10 Shipping box 11 Box main body 12 Cover body W Semiconductor wafer

Claims (3)

A holder for a substrate for detachably sticking and holding a thin semiconductor wafer on a flexible adhesive layer of a holding ring,
The holding ring is divided into first and second holding rings, and the first and second holding rings are stacked so that a thin semiconductor wafer is sandwiched between a pair of opposing adhesive layers. One of the adhesive layer and the adhesive layer of the second holding ring is a strong adhesive layer, and the other is a weak adhesive layer.   2. The substrate holder according to claim 1, wherein the first holding ring includes an inner ring and an outer ring that are fitted to each other, and a peripheral edge portion of the strong adhesion layer is sandwiched between the inner ring and the outer ring. .   3. The substrate according to claim 1, wherein the second holding ring includes an inner ring and an outer ring that are fitted to each other, and a peripheral edge portion of the weak adhesive layer is sandwiched between the inner ring and the outer ring. Retaining tool.

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