JP2012021826A5 - - Google Patents

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Publication number
JP2012021826A5
JP2012021826A5 JP2010158498A JP2010158498A JP2012021826A5 JP 2012021826 A5 JP2012021826 A5 JP 2012021826A5 JP 2010158498 A JP2010158498 A JP 2010158498A JP 2010158498 A JP2010158498 A JP 2010158498A JP 2012021826 A5 JP2012021826 A5 JP 2012021826A5
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JP
Japan
Prior art keywords
probe
contact
substrate
electrode
contact probe
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Application number
JP2010158498A
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English (en)
Japanese (ja)
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JP5700761B2 (ja
JP2012021826A (ja
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Priority to JP2010158498A priority Critical patent/JP5700761B2/ja
Priority claimed from JP2010158498A external-priority patent/JP5700761B2/ja
Publication of JP2012021826A publication Critical patent/JP2012021826A/ja
Publication of JP2012021826A5 publication Critical patent/JP2012021826A5/ja
Application granted granted Critical
Publication of JP5700761B2 publication Critical patent/JP5700761B2/ja
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JP2010158498A 2010-07-13 2010-07-13 電気的接続装置 Active JP5700761B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010158498A JP5700761B2 (ja) 2010-07-13 2010-07-13 電気的接続装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010158498A JP5700761B2 (ja) 2010-07-13 2010-07-13 電気的接続装置

Publications (3)

Publication Number Publication Date
JP2012021826A JP2012021826A (ja) 2012-02-02
JP2012021826A5 true JP2012021826A5 (zh) 2013-08-22
JP5700761B2 JP5700761B2 (ja) 2015-04-15

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ID=45776229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010158498A Active JP5700761B2 (ja) 2010-07-13 2010-07-13 電気的接続装置

Country Status (1)

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JP (1) JP5700761B2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022208708A1 (ja) * 2021-03-31 2022-10-06 日本電子材料株式会社 プローブカード

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915507Y2 (ja) * 1979-10-26 1984-05-08 三洋電機株式会社 半導体取着構造
JPH0785482B2 (ja) * 1986-02-03 1995-09-13 ミノルタ株式会社 フレキシブルプリント配線基板
JP4341380B2 (ja) * 2003-11-19 2009-10-07 セイコーエプソン株式会社 可撓性配線基板、可撓性配線基板の製造方法、電子デバイスおよび電子機器
JP5015671B2 (ja) * 2007-06-21 2012-08-29 日本電子材料株式会社 プローブカード
JP5021519B2 (ja) * 2008-02-22 2012-09-12 日本電子材料株式会社 プローブカード
JP2009098153A (ja) * 2008-12-08 2009-05-07 Hitachi Ltd 薄膜プローブの製造方法

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