JP2012018975A - Laser equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect a cable from a laser beam.SOLUTION: The laser equipment comprises: a laser source that emits a laser beam; a chamber that defines a space in which a processing object is irradiated with the laser beam emitted from the laser source and processed; a table that is arranged in the chamber and retains the processing object; a cable that is arranged in the chamber; and cable protection means that is arranged in the chamber, is formed of metal, and is installed in a position where irradiating the cable with the laser beam emitted from the laser source is prevented.

Description

  The present invention relates to a laser device having a function of protecting a cable from a laser beam.

  In the laser annealing apparatus, an XY stage for holding and moving an object to be annealed is disposed in a process chamber. Each part of the XY stage is connected to a cable (for example, wiring and piping covered with resin) for supplying electric power, air, or the like. Cable Bear (registered trademark) is well known as a device that holds a cable and guides it according to the operation of the XY stage. For a device such as a cable bear (hereinafter referred to as a cable bear device) that holds and guides a cable, a caterpillar using a resin is usually used (see, for example, Patent Document 1).

  However, for example, in a device using a high-power excimer laser, if resin parts are used in the process chamber, outgas is generated from the resin due to direct or indirect irradiation of the excimer laser, and this outgas enters the process chamber. There is a problem that the irradiation atmosphere is destroyed and the irradiation atmosphere is broken, and the product adheres to the surface of the annealing object and leads to a product defect. In addition, the laser beam irradiation causes deterioration and breakage of the cable and the cable bearer device itself. Furthermore, in the resin cable carrier apparatus, dust is generated due to friction between sliding parts during operation, and product defects are also caused due to adhesion of the dust.

  When measures are taken such as placing resin parts outside the process chamber or wrapping the resin table bearer device in a box and evacuating it, it is inevitable to increase the size of the laser annealing device.

JP 2003-37153 A

  In the process chamber, it is necessary to avoid direct or indirect laser beam irradiation to the cable or the cable carrier device from the viewpoint of preventing the deterioration and breakage of the cable and from the viewpoint of suppressing the deterioration of the processing quality.

  An object of the present invention is to provide a laser device having a function of protecting a cable from a laser beam.

  Moreover, it is providing the laser apparatus which can suppress the fall of processing quality.

  According to one aspect of the present invention, a laser light source that emits a laser beam, a chamber that defines a space in which a workpiece is irradiated with the laser beam emitted from the laser light source and processing is performed, and the chamber is disposed in the chamber. A table for holding the workpiece, a cable disposed in the chamber, a metal disposed in the chamber, formed of metal, and preventing irradiation of the laser beam emitted from the laser light source to the cable. There is provided a laser device having cable protection means installed in position.

  ADVANTAGE OF THE INVENTION According to this invention, the laser apparatus provided with the function which protects a cable from a laser beam can be provided.

  In addition, it is possible to provide a laser device that can suppress a reduction in processing quality.

It is the schematic which shows the laser apparatus by an Example. 1 is a schematic diagram showing a cable carrier device 60. FIG. (A) And (B) is the schematic which shows the holding members 63a-63g. It is the schematic which shows the attachment part to the outer plate 61 of the cable clamp 64. FIG. It is the schematic which shows the attaching part which does not use the shim 68 for buffering, and the shim 69 for stress diffusion. It is the schematic which shows the modification of the cable bear apparatus 60. FIG. It is the schematic which shows the laser apparatus by another Example.

  FIG. 1 is a schematic diagram illustrating a laser apparatus according to an embodiment. This laser apparatus is used for laser annealing, for example.

A laser beam 80 is emitted from a laser light source 10 including an excimer laser oscillator. The laser beam 80 is propagated by the propagation optical system 20 and is incident on a semiconductor substrate 90 that is a processing object (annealing object) placed on the stage 50. The stage 50 is a table that holds the semiconductor substrate 90 so as to be movable in a two-dimensional direction, and is disposed in the process chamber 30 that defines a closed space in which the semiconductor substrate 90 is annealed. The inside of the process chamber 30 is an N ₂ atmosphere, for example. The laser beam 80 passes through the window 40 provided in the process chamber 30 and is irradiated onto the semiconductor substrate 90, and laser annealing of the semiconductor substrate 90 is performed.

  In the process chamber 30, cable bearers 60 and 70 are arranged. The cable carrier devices 60 and 70 are connected to each part of the stage 50 and have a function of holding cables (wiring and piping) for supplying electric power, air, and the like and guiding them according to the operation of the stage 50. Both cable carrier devices 60 and 70 are made of metal and have the same configuration.

  FIG. 2 is a schematic diagram showing the cable carrier device 60. The cable carrier device 60 includes an outer plate 61, an inner plate 62, and holding members 63a to 63g.

  The outer plate 61 and the inner plate 62 are thin plates made of metal, such as SUS, that are long in one direction, and have flexibility in the thickness direction. The thickness of the outer plate 61 is, for example, 0.4 mm, and the thickness of the inner plate 62 is, for example, 0.3 mm. The widths of the outer plate 61 and the inner plate 62 are equal, for example. The outer plate 61 and the inner plate 62 are arranged to face each other substantially in parallel so that, for example, an interval of 30 mm is provided and the positions in the width direction are aligned. The distance between both plates 61 and 62 is held by holding members 63a to 63g.

  The width direction of the outer plate 61 and the inner plate 62 is parallel to the X-axis direction. The length direction of both plates 61 and 62 is parallel to the Y-axis direction when viewed from the Z-axis direction. The outer plate 61 is fixed to the floor surface of the process chamber 30 by a holding member 63a. Further, the holding member 63g fixes the stage 50 to the movable surface in the Y-axis direction. The outer plate 61 and the inner plate 62 are curved in a U shape between the floor surface of the process chamber 30 and the Y axis direction movable surface of the stage 50 in the length direction. Therefore, the surface fixed in contact with the floor surface of the process chamber 30 and the surface fixed in contact with the movable surface in the Y-axis direction of the stage 50 are the same surface of the outer plate 61. Further, the surface facing the floor surface of the process chamber 30 and the surface facing the movable surface in the Y-axis direction of the stage 50 are the same surface of the inner plate 62.

  In this figure, the U-shaped portions of the outer plate 61 and the inner plate 62 are indicated as curved portions. The curvature radius of the outer plate 61 at the curved portion is, for example, 100 mm, and that of the inner plate 62 is, for example, 70 mm.

  Along with the movement of the stage 50 movable surface in the Y-axis direction in the Y-axis direction, the outer plate 61 and the inner plate 62 are deformed so that the curved positions move along the Y-axis direction (length direction). When the Y axis direction movable surface of the stage 50 moves in the Y axis positive direction, the outer plate 61 and the inner plate 62 are deformed so that the curved position moves in the Y axis positive direction. For this reason, the amount of arrangement of the both plates 61 and 62 at the stage 50 side portion increases, and the amount of arrangement of the process chamber 30 floor side portion decreases. When the Y axis direction movable surface of the stage 50 moves in the Y axis negative direction, the two plates 61 and 62 are deformed so that the curved position moves in the Y axis negative direction. As a result, the arrangement amount of the stage 50 side portion decreases. The arrangement amount of the floor side portion of the process chamber 30 increases.

  3A and 3B are schematic views showing the holding members 63a to 63g. The holding members 63 a to 63 g include a cable clamp 64 and a cam follower (bearing) 65.

  Reference is made to FIG. The cable clamp 64 is fixed to the outer plate 61 with a bolt. A cam follower 65 is attached to the cable clamp 64. The outer ring of the cam follower 65 is in contact with the inner plate 62.

  Reference is made to FIG. In the figure, the cable clamp 64 defines a cable holding portion between the outer plate 61 and the X-axis direction (the width direction of the outer plate 61 and the inner plate 62). For example, the cable connected to the movable portion in the Y-axis direction of the stage 50 is accommodated in the cable holding portion defined between the cable clamp 64 of the holding members 63a to 63g and the outer plate 61, so that the operation of the stage 50 is performed. Regardless, it is held and guided smoothly and reliably. The cable extends in the length direction of the outer plate 61 and the inner plate 62 through a cable holding portion defined by the holding members 63a to 63g.

  FIG. 4 is a schematic view showing an attachment portion of the cable clamp 64 to the outer plate 61. The cable clamp 64 is attached to the outer plate 61 using bolts 66. An attachment hole is formed in the outer plate 61 for attachment. A shim is disposed at the joint between the cable clamp 64 and the outer plate 61.

  Between the outer plate 61 and the head of the bolt 66 and between the outer plate 61 and the cable clamp 64, a buffering shim 68 and a stress diffusion shim 69 are disposed from the outer plate 61 side, respectively. A spring washer 67 is disposed between the head of the bolt 66 and the stress diffusion shim 69.

  Both the buffer shim 68 and the stress diffusion shim 69 are made of metal. The buffer shim 68 is made of a metal material that is softer than the outer plate 61 and easily damaged, such as Cu. By placing the buffer shim 68 in contact with the outer plate 61, it is possible to prevent the outer plate 61 around the mounting hole from being damaged. The stress diffusion shim 69 is formed of a metal material that does not deform, for example, SUS. The stress diffusion shim 69 can diffuse the stress generated around the mounting hole. By arranging the buffer shim 68 and the stress diffusion shim 69 on both the front and back surfaces of the mounting hole forming position of the outer plate 61, the outer plate 61 is subjected to repeated loads applied to the outer plate 61 formed of a thin metal. It is possible to prevent cracks generated around the mounting holes.

  The buffer shim 68 and the stress diffusion shim 69 can be used for all or part of the holding members 63a to 63g. When used for a part, both the shims 68 and 69 are applied only to the holding members 63c to 63e that are frequently located in the curved portion, for example. This is because cracks are likely to occur around the mounting hole that tends to be a curved portion.

  FIG. 5 is a schematic view showing an attachment portion that does not use the buffering shim 68 and the stress diffusion shim 69. The cable clamp 64 is attached to the outer plate 61 using bolts 66. Between the outer plate 61 and the head of the bolt 66, only the spring washer 67a and the washer 67b are disposed.

  The cable carrier device 60 includes a metal outer plate 61 and an inner plate 62, and the cable is stored so as to be sandwiched between the plates 61 and 62. The outer plate 61 and the inner plate 62 having the property of UV resistance (excimer light resistance) prevent the laser beam from being directly or indirectly irradiated onto the cable. For this reason, the cable carrier device 60 also serves as a cable protection means that can protect the cable from the laser beam.

  Moreover, since the outer plate 61 and the inner plate 62 are made of metal instead of resin, generation of outgas can be prevented and deterioration of processing quality can be suppressed.

  Furthermore, since the cable bear device 60 performs the cable bear operation using the shape change of the thin metal plate, for example, unlike the cable bear device having a resin caterpillar structure, there is no sliding portion. Therefore, dust generation due to sliding between the components can be prevented. Also, periodic replacement of sliding parts is not necessary.

  In designing the cable carrier device 60, for example, there is no restriction due to the standard of shape and dimensions as in the cable bearer device having a resin caterpillar structure, so the movement amount in the cable operation, the size and quantity of the installed cable, Flexible design is possible according to requirements.

  Further, in the cable carrier device 60, a buffering shim 68 and a stress diffusion shim 69 made of different metal materials are disposed at positions where the cable clamp 64 is attached to the outer plate 61. Both the shims 68 and 69 prevent cracks around the mounting holes provided in the outer plate 61. For this reason, the cable carrier device 60 can withstand long-term use.

    Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto.

For example, in the embodiments, a laser apparatus using an excimer laser oscillator has been described. However, a solid-state laser such as an Nd: YAG laser, a laser apparatus using a CO ₂ laser, or the like may be used.

  In the embodiments, a laser apparatus that performs laser annealing has been described. However, a laser apparatus that performs processing such as substrate drilling may be used.

  Furthermore, in the embodiment, the outer plate 61 and the inner plate 62 of the cable bearer device 60 are formed of SUS, but may be formed of a metal such as Al or brass.

  Further, in the cable carrier device 60 shown in the embodiment, the outer plate 61 and the inner plate 62 are disposed so as to sandwich the cable from the vertical direction (Z-axis direction). The structure provided with the light-shielding plate which covers this in the edge part in the width direction can also be employ | adopted.

  FIG. 6 is a schematic diagram illustrating a modification of the cable carrier device 60. The cable bearer shown in FIG. 6 has light shielding plates 71 a to 71 t that are installed in a scale shape at the widthwise end of the outer plate 61 and cover between the outer plate 61 and the inner plate 62. The light shielding plates 71a to 71t are made of a metal such as SUS. In the configuration shown in this figure, not only the upper and lower surfaces formed by the outer plate 61 and the inner plate 62 but also the both side surfaces between both plates 61 and 62 are shielded by the light shielding plates 71a to 71t, thereby ensuring cable protection. It is possible to increase the sex.

  Further, in the laser apparatus according to the embodiment, the function of the cable bearer device protecting the cable from the laser beam is realized. However, for example, the light shielding means arranged in the process chamber 30 may protect the cable from the laser beam. Good.

  FIG. 7 is a schematic view showing a laser apparatus (laser annealing apparatus) according to another embodiment. The laser apparatus shown in FIG. The light shielding plate 74 is formed of a metal, for example, SUS, and is installed at a position that prevents direct or indirect irradiation of the laser light 80 to a cable connected to the stage 50 in the process chamber 30. The light shielding means disposed in the process chamber 30 is not limited to the light shielding plate 74 but may be a metal that covers the range in which the cable bearer devices 72 and 73 move, for example.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  The present invention can be widely used as a laser device that can protect not only the cable connected to the stage but also the cable arranged in the chamber.

DESCRIPTION OF SYMBOLS 10 Laser light source 20 Propagation optical system 30 Process chamber 40 Window 50 Stage 60, 70 Cable bearer device 61 Outer plate 62 Inner plate 63a-63g Holding member 64 Cable clamp 65 Cam follower 66 Bolt 67, 67a Spring washer 67b Washer 68 Buffer shim 69 Stress diffusion shims 71a to 71t Light shielding plates 72, 73 Cable bearer device 74 Light shielding plate 80 Laser beam 90 Semiconductor substrate

Claims (4)

A laser light source for emitting a laser beam;
A chamber that demarcates a space in which a laser beam emitted from the laser light source is irradiated onto a workpiece and processing is performed;
A table disposed in the chamber and holding the workpiece;
A cable disposed in the chamber;
A laser apparatus, comprising: a cable protection unit disposed in the chamber, made of metal, and installed at a position to prevent irradiation of the laser beam emitted from the laser light source to the cable. The table holds the workpiece to be movable,
The cable is connected to the table;
2. The laser device according to claim 1, wherein the cable protection unit is a cable carrier device that holds the cable connected to the table and guides the cable according to the operation of the table. The cable protection means, which is a cable carrier device,
A first plate-like member and a second plate-like member which are made of metal and are arranged opposite to each other so as to have a curved portion which is long in one direction and curved in the length direction;
Holding the cable so as to be sandwiched between the first plate-like member and the second plate-like member;
3. The laser device according to claim 2, wherein the first plate-like member and the second plate-like member are deformed so that the bending portion moves along the length direction according to the operation of the table. . The cable protection means that is a cable carrier device further includes a holding member that holds the cable between the first plate-like member and the second plate-like member,
The first plate-like member is formed with an attachment hole for attaching the holding member,
The holding member is attached to the first plate-like member via a first shim and a second shim, which are arranged in order from the attachment hole side,
The first shim is formed of a metal material that is more easily damaged than the first plate-like member,
The laser device according to claim 3, wherein the second shim is formed of a metal material that does not deform.

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