JP2009183962A - Pallet for laser beam machining apparatus, and laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which does not allow deterioration in laser beam machining performance by eliminating haziness of a transparent window part inside a vacuum vessel and that is miniaturized and simplified to facilitate maintenance, and also to provide a pallet for the apparatus. <P>SOLUTION: This invention relates to the apparatus for performing laser beam machining by irradiating a workpiece with a laser beam from above, and the apparatus includes a vacuum vessel 2 having a transparent window part, a machining part 22 inside the vacuum vessel, and a laser source 1 outside the vacuum vessel, wherein the laser beam is emitted, from the laser source through the transparent window part 21, to the workpiece arranged in the machining section inside the vacuum vessel. The pallet 3 for the laser beam machining apparatus positions and fixes the workpiece for the machining part in the vacuum vessel, with a plurality of pieces housed therein, wherein a transparent plate 4 having an attachable/detachable structure is installed in the upper face of the workpiece housing part of the pallet 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a pallet for a laser processing apparatus and a laser processing apparatus using the pallet.

  For example, in a laser processing apparatus such as a laser beam sealing apparatus that is hermetically sealed by irradiating a package containing an electronic component element such as a piezoelectric diaphragm with a laser beam, the internal atmosphere is maintained in a vacuum state. A container (vacuum chamber or the like) having a transparent window such as quartz glass, a processing part in the container, and a laser source outside the container; and the inside of the container from the laser source through the transparent window A laser beam is applied to the package arranged in the processed portion. In addition, quartz glass has a small coefficient of thermal expansion and high transparency, so that the distortion of the laser beam hardly occurs, and it is often used as a window member of a laser processing apparatus in recent years.

At this time, in the laser irradiation portion of the package that is the object to be processed, a part of the package material is melted to generate ejected matter and vapor, so that it is scattered in the container and the surface inside the container around the package and around the package. May adhere to. In particular, since the laser source is arranged outside the container, these scattered matters do not adhere to the laser source, but these scattered matters may adhere to the transparent window portion. In other words, during the processing of the laser beam, the transparent window portion is fogged due to adhesion of the scattered matter, thereby reducing the transmittance of the laser beam. As a result, stable laser beam irradiation cannot be performed, resulting in extreme laser processing performance. There was a problem that it was lowered. Such an adverse effect of scattered objects is more likely to appear when laser processing is performed inside a vacuum atmosphere container. In addition, the member used for the transparent window portion in a vacuum atmosphere container is thick enough to withstand the pressure difference between vacuum and atmospheric pressure, and it is not easy to remove and attach from the container, It was also unsuitable for cleaning. Moreover, since the amount of money is also expensive, it is desirable to avoid damage during removal, attachment, and cleaning from the container.
JP 59-92192 A

  Therefore, in Patent Document 1, a transparent plate having a movable structure is arranged between the window portion and the laser processing object in the vacuum container, so that the scattered matter adheres to the transparent plate before the transparent window portion adheres. A proposal has been made to maintain the laser processing performance without lowering the transmittance of the laser beam by moving the transparent plate to the portion where the scattered matter is not attached.

  However, since the laser processing apparatus of Patent Document 1 is provided with a mechanism for operating the transparent plate in the container, it is unavoidable that the laser processing apparatus becomes complicated and large as a whole, and maintenance and maintenance of the laser processing apparatus are also costly. Become high.

  In order to improve the production efficiency, when a plurality of workpieces are loaded simultaneously with a pallet or the like, if the transparent plate of the movable structure becomes clouded during laser processing, the pallet is taken out and the transparent plate in the container is washed. Since it is necessary, there is no choice but to use a work that is arranged with a small quantity of workpieces stored in the pallet. As a result, the production efficiency of laser processing has been reduced.

  Furthermore, since the transparent plate having a movable structure is disposed in the container, the distance from the transparent plate to the workpiece needs to be formed to some extent, so that the efficiency of adhering scattered objects to the transparent plate is also lowered. In particular, there was a risk that scattered matter that was not completely adhered drifted between the transparent plate and the workpiece, and reattached to the workpiece, adversely affecting the appearance and performance of the workpiece.

  The present invention relates to a pallet for a laser processing apparatus for realizing a laser processing apparatus that is small and simplified and does not deteriorate the laser processing performance by eliminating the fogging of the transparent window in the container. And it aims at providing the laser processing apparatus using this pallet.

  Therefore, a pallet for a laser processing apparatus according to the present invention includes a container having a transparent window part, a processing part in which a work is placed in the container, and a transparent window part from outside the container. In a pallet for a laser processing apparatus for positioning and fixing in a state where a plurality of workpieces are stored in the processing section of a laser processing apparatus having a laser source for irradiating a workpiece with a laser beam, the upper surface of the work storage section of the pallet is detachably attached A transparent plate having a structure is provided.

  With the above configuration, since a transparent plate having a detachable structure is provided on the upper surface of the work storage portion of the pallet, the transparent plate can be disposed in the state of being close to the upper surface of the work, Adhesion efficiency can be increased. In particular, it is possible to increase the density of the scattered matter that adheres to the transparent plate located immediately above the workpiece, and to prevent the scattered matter from adhering to the upper surface portion of the adjacent workpiece. It is possible to suppress fogging of the transparent plate on the upper surface of the workpiece adjacent to each other by laser processing. In other words, the cloudy area of the transparent plate generated by laser processing for one workpiece is reduced, and the arrangement dimension between adjacent workpieces can be reduced, so that the storage density of workpieces in one pallet can be improved. . In addition, it is possible to further suppress the risk that scattered matter drifts between the transparent plate and the workpiece and reattaches to the workpiece. Therefore, laser processing can be performed on the workpiece in an extremely stable state without degrading the laser processing performance of the laser processing apparatus, and adverse effects due to reattachment of scattered objects can be drastically suppressed with respect to the appearance and performance of the workpiece. .

  In this way, the transparent plate integrated pallet that can effectively remove the scattered objects is the same as the completion of laser processing of all workpieces stored in the pallet without changing the operation of the laser processing apparatus while replacing the pallet. It can be taken out from the container of the laser processing apparatus. By removing only the transparent plate of the removed transparent plate-integrated pallet and washing it, it can be used again by being attached to the pallet. If the transparent plate breaks, it can be replaced very easily. Accordingly, maintenance can be facilitated, and the number of laser processing (production processing quantity) for workpieces in units of pallets can be increased, so that an extremely practical laser processing apparatus with high production efficiency and productivity can be obtained.

  Further, as the laser processing apparatus, the workpiece is an electronic component package in which a lid is disposed with respect to an opening of a base on which an electronic component element is mounted, and the laser processing apparatus is an upper part of the lid of the electronic component package. It is more desirable to use a laser beam sealing device for hermetically sealing in a predetermined atmosphere (vacuum atmosphere or inert gas atmosphere such as nitrogen) by irradiating with a laser beam. By applying the pallet of the present invention to the laser beam sealing device, the transparent plate can be arranged in the state close to the upper surface of the lid of the electronic component package, and the adhesion efficiency of the scattered matter to the transparent plate is increased. Can do. In particular, it is possible to increase the density of scattered matter that adheres to the transparent plate located directly above the lid of the electronic component package, and suppresses the scattered matter from adhering to the upper surface portion of the adjacent electronic component package. Therefore, the lid of the electronic component package in the pallet is sealed with a laser beam, so that the occurrence of fogging in the area of the transparent plate corresponding to the upper surface portion of the electronic component package adjacent to each other can be suppressed. That is, since the cloudy area of the transparent plate generated by laser beam sealing with respect to one electronic component package is reduced, and the arrangement dimension between adjacent electronic component packages can be reduced, the electronic components in one pallet The storage density of the package can be improved. There is also a risk that scattered objects may float between the transparent plate and the electronic component package, and the scattered objects may reattach to the lid of the electronic component package or may enter the unsealed electronic component package. Further suppression can be achieved. Therefore, hermetic sealing can be performed in an extremely stable state without deteriorating the sealing performance of the laser beam sealing device, appearance defects due to reattachment of scattered matter to the electronic component package, and the inside of the electronic component package Degradation and adverse effects of the electrical characteristics of the electronic component element due to the intrusion of the scattered matter can be drastically suppressed. In particular, in the vacuum atmosphere, scattering of scattered matter is more likely to occur. In electronic parts that are hermetically sealed in a vacuum atmosphere, the scattered matter remains inside the electronic component package or is scattered to the electronic component element. If it adheres, the electrical characteristics are easily deteriorated, and these adverse effects can be more effectively suppressed.

  According to a second aspect of the present invention, the laser processing apparatus uses the laser processing apparatus pallet having the above-described configuration.

  In such a laser processing apparatus using a pallet for a laser processing apparatus, it is not necessary to provide a mechanism for operating a transparent plate in a container as in the prior art, so that the entire laser processing apparatus can be simplified and miniaturized. Therefore, maintenance of the laser processing apparatus becomes necessary, and a cheaper and more practical one can be provided.

  According to the present invention, a pallet for a laser processing apparatus for realizing a laser processing apparatus that is small and simplified and that does not deteriorate the laser processing performance by eliminating fogging of the transparent window portion in the container and that is easy to maintain. Can be provided.

  In an embodiment of a laser processing apparatus according to the present invention, an electronic component package including a base and a lid in which an electronic component element such as a piezoelectric diaphragm is accommodated is taken as an example of a workpiece to be laser processed, and the electronic component package is a laser. A laser beam sealing device that is hermetically sealed by beam welding and a pallet that is used in the laser beam sealing device and that stores a plurality of electronic component packages will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view of a laser beam sealing device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a pallet for a laser beam sealing device of the present invention. FIG. 3 is a diagram showing a process using the pallet for a laser beam sealing device of the present invention.

  As shown in FIG. 1, the laser beam sealing apparatus (laser processing apparatus) according to the present invention hermetically seals a laser source 1 serving as a laser beam emitting portion and an electronic component package P using a laser beam in a vacuum atmosphere. It comprises a vacuum chamber (container) 2 to be performed and a pallet 3 that is positioned and fixed in the vacuum chamber 2 while housing a package for electronic components.

  As a laser source 1 of a laser beam sealing device used for an electronic component package, a laser source using a fiber laser capable of continuous oscillation output has recently been used. Therefore, for example, a fiber laser is used as the laser source 1. This is a suitable example as a sealing device, and an appropriate one can be selected according to other laser processing. For example, a YAG laser, a carbon dioxide laser, or an excimer laser may be used.

  The vacuum chamber 2 includes a transparent window portion 21 through which a laser beam is incident from the outside, and a processing table 22 (processing portion) in the vacuum chamber. A vacuum pump (not shown) is connected to the vacuum chamber 2, and the vacuum pump is driven before the sealing process (laser processing) by the laser beam is performed, so that the internal space of the vacuum chamber 2 is evacuated. It has come to be. The transparent window portion 21 is thick enough to withstand a pressure difference between vacuum and atmospheric pressure, and preferably has a low thermal expansion coefficient and high transparency. A pallet 3 (to be described later) containing a plurality of electronic component packages P made up of a base B and a lid L in which an electronic component element S as a workpiece is accommodated is disposed on the processing table 22, and each package is irradiated with a laser beam. Thus, the region where the hermetic sealing is performed.

  The pallet 3 is made of a material such as stainless steel and is positioned and fixed on the processing table 22 in the vacuum chamber 2 while positioning and storing a plurality of electronic component packages P in a matrix. The electronic component package P accommodated in the pallet 3 is composed of a base B made of an insulating material such as ceramic in which the electronic component element S is accommodated and a metallic lid L, and a seal (not shown) is interposed between the base B and the lid L. It has a configuration in which a brazing filler metal is interposed. As shown in FIG. 2, the specific configuration of the pallet 3 is a pallet guide in which a flat pallet base plate 31 and a plurality of storage portions 322 for storing electronic components are arranged in a matrix. Plate 32. In addition, a transparent plate 4 having the same shape and the same area as the guide plate of the pallet is disposed on the top of the pallet 3 so as to be close to the upper surface portion of the package via the support portion 33. It is comprised so that only can be easily attached or detached from the support part 33. The material of the transparent plate 4 is preferably a material having a low coefficient of thermal expansion and high transparency, such as quartz glass. It is not limited to these materials as long as the laser beam can be transmitted, such as other glass materials, resin materials, and quartz. In addition, you may form the transparent adhesive film etc. which can catch a scattered material in the main surface by the side of the pallet of the transparent plate 4. FIG.

  Laser beam sealing apparatus configured as described above and a laser beam sealing process (laser processing) using the pallet 3 used in the laser beam sealing apparatus and containing a plurality of the electronic component packages P. Will be described with reference to FIG.

  An electronic component element S such as a piezoelectric diaphragm is electromechanically bonded to the base B via a conductive bonding material (not shown), and a sealing brazing material (not shown) is formed on the sealing surface of the lid L. ing. A plurality of bases B on which the electronic component elements S are mounted are stored in the storage portions 322 formed in a matrix on the pallet 3, and the lid L is placed on a tray (not shown) on each storage portion of the pallet. Correspondingly, a plurality is arranged in a matrix. By arranging the electronic component package P on the pallet 3 and the lid L on the tray so as to face each other individually, the joint portion of the base B is in contact with the sealing material of the lid L, and FIG. As shown in a), the electronic component package P in which the lid L and the base B are opposed to each other is arranged in a matrix in the storage portion 322 of the pallet 3. Further, as shown in FIG. 3B, the transparent plate 4 that has been washed and is not fogged is attached to the support portion 33 at the upper portion of the storage portion 322 of the pallet 3 in this state.

  Next, the pallet 3 in which the electronic component package is housed in this manner is carried into the working table 22 of the vacuum chamber 2 and positioned and fixed. When the pallet 3 is carried into the processing table 22, the vacuum pump is driven to evacuate the internal atmosphere of the vacuum chamber 2, and the lid of each electronic component package stored in the pallet 3 above the processing table 22. L is irradiated with a laser beam through the transparent plate 4. As a result, the sealing brazing material formed on the lid is melted and joined to the base, and the inside of the electronic component package is hermetically sealed in a vacuum atmosphere. On the other hand, as shown in FIG. 3C, scattered material such as a lid material melted by laser beam irradiation at the time of sealing can be attached to the transparent plate 4 of the pallet.

  When all the electronic component packages housed in the pallet 3 have been hermetically sealed as described above, the vacuum pump is driven to return the atmosphere inside the vacuum chamber 2 to the atmospheric state, and the pallet 3 is placed outside the vacuum chamber 2. It is carried out to. Further, as shown in FIG. 3 (d), the transparent plate 4 is removed from the support portion 33 at the top of the pallet 3 for cleaning, and airtight sealing is performed from each storage portion 322 of the pallet 3 as shown in FIG. 3 (e). The completed electronic component package P is also taken out. Thereafter, in the same manner as in the above process, the unsealed electronic component package P as shown in FIG. 3A is stored in the storage portion of the pallet and the cleaning is completed as shown in FIG. 3B. The plate 4 is attached to the support portion 33 of the pallet 3, and the following steps are similarly repeated. In the apparatus for sealing a laser beam in a vacuum atmosphere as described above, the pallet 3 is carried into the vacuum chamber 2 by using a conveying means such as a conveyor belt, and the outside of the vacuum chamber 2 by using the same conveying means. Or may be configured to be carried out. That is, the vacuum chamber 2 is provided with a main chamber and a rear chamber in which a front chamber and a processing table are arranged, and from the outside of the vacuum chamber 2 to the front chamber, from the front chamber to the main chamber, from the main chamber to the rear chamber, Are carried into or out of the vacuum chamber 2 while being moved by a conveying means.

  By using the pallet 3 in which the transparent plate 4 as in the above embodiment is formed on the upper surface of the housing part 322 of the electronic component package P, the transparent plate 4 is in the state of being close to the upper surface of the lid L of the electronic component package P. Can be arranged, and the adhesion efficiency of the scattered matter to the transparent plate 4 can be increased. In particular, scattered matter such as a lid material generated when the lid L of the electronic component package P is irradiated with the laser beam can be adhered to the transparent plate 4 positioned immediately above the lid L at a high density. For this reason, as shown in FIG. 3C, the scattered matter is suppressed from adhering to the upper surface portion of the adjacent electronic component package P, so that the lid L of the electronic component package P in the pallet 3 is attached to the laser beam. By sealing, it is possible to suppress the occurrence of fogging in the region of the transparent plate 4 corresponding to the upper surface portion of the electronic component package P adjacent to each other. That is, the cloudy region of the transparent plate 4 generated by laser beam sealing with respect to one electronic component package P is reduced, and the arrangement dimension between adjacent electronic component packages P can also be reduced. The storage density of the electronic component package P in 3 can be improved. In addition, the scattered matter drifts between the transparent plate 4 and the electronic component package P, and the scattered matter reattaches to the lid L of the electronic component package P, or the scattered matter is inside the unsealed electronic component package P. It is possible to further suppress the risk of the intrusion and the scattered matter adhering to the electronic component element S. Accordingly, hermetic sealing (laser processing) can be performed in an extremely stable state without deteriorating the sealing performance (processing performance) of the laser beam sealing device (laser processing device), and the scattered matter on the electronic component package P can be reduced. It is possible to drastically suppress the deterioration and adverse effects of the electrical characteristics of the electronic component element S due to the appearance failure due to reattachment and the intrusion of scattered matter inside the electronic component package P. In particular, when laser beam sealing is performed in a vacuum atmosphere as in this embodiment, scattering of scattered matters is more likely to occur inside the vacuum vessel, and in electronic components that are hermetically sealed in a vacuum atmosphere, the scattered matters are electronic components. If the scattered matter remains inside the package for the electronic component or the scattered matter adheres to the electronic component element, the electrical characteristics tend to be significantly deteriorated, so that these adverse effects can be more effectively suppressed.

  Thus, the transparent plate integrated pallet 3 that can effectively remove the scattered matter is used without changing the operation of the laser beam sealing device (laser processing device) while replacing the pallet 3 as shown in FIG. All the electronic component packages P accommodated in the pallet 3 can be removed from the vacuum chamber (vacuum container) 2 of the laser beam sealing device (laser processing device) at the same time as the laser beam sealing of all the electronic component packages P is completed. Remove only the transparent plate 4 of the transparent plate-integrated pallet 3 taken out as shown in FIG. 3 (d) and clean it, and then attach it to the pallet 3 again as shown in FIG. 3 (b). Can do. If the transparent plate 4 is damaged, the transparent plate 4 can be replaced very easily. Accordingly, the maintenance can be facilitated, and the number of laser beam sealing processing (production processing quantity) for the electronic component package P in units of three pallets can be increased, so that the production efficiency and productivity are extremely practical. A laser beam sealing device (laser processing device) is obtained.

  In this embodiment, a piezoelectric diaphragm is applied as the electronic component element. However, the present invention is not limited to this, and the base and the lid are joined via a sealing material and arranged in the internal space. Other forms may be employed as long as the electronic component element (mounted) is hermetically sealed. Further, the pallet of the present invention can be applied not only to a laser beam sealing device for a package for electronic components in a vacuum atmosphere but also to a laser beam sealing device in another inert gas atmosphere such as nitrogen. In addition to laser beam sealing devices for electronic component packages, laser processing devices that use laser beams to heat, melt, cut, and weld electronic components packages or other workpieces other than electronic component packages Is also applicable.

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit or main features thereof. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

1 is a schematic cross-sectional view of a laser beam sealing device according to an embodiment of the present invention. Sectional drawing which showed the pallet for laser beam sealing apparatuses of this invention. The figure which shows the process using the pallet for laser beam sealing apparatuses of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser source 2 Vacuum chamber 3 Pallet 4 Transparent plate P Electronic component package (workpiece)

Claims (2)

In the processing section of the laser processing apparatus, comprising: a container having a transparent window portion; a processing portion for disposing the workpiece in the container; and a laser source for irradiating the workpiece with a laser beam from outside the container through the transparent window portion. In the pallet for laser processing equipment that positions and fixes multiple workpieces in a stored state,
A pallet for a laser processing apparatus, wherein a transparent plate having a detachable structure is provided on an upper surface of a work storage portion of the pallet. A laser processing apparatus using the pallet for a laser processing apparatus according to claim 1.

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