JP2012018042A - Substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate inspection device improved in the accuracy of inspection by clearly distinguishing a region that is soldered to a lead.SOLUTION: A substrate inspection device 1 that inspects the soldered state of electronic components comprises: a plurality of white LEDs 13 that are installed on a substrate side circumferential part 15 of a reflective member 11 whose inner face forms a reflective face 12 and emit white light toward the reflective face 12; a plurality of red LEDs 21 that are installed on the substrate side circumferential part 15 of the reflective member 11 and emit colored light in a direction substantially parallel to a substrate face 71; a CCD camera 30 that photographs the substrate face 71; and a CPU 51 that causes the white LEDs 13 and the red LEDs 21 to emit light at the same time to cause the CCD camera 30 to photograph the substrate face 71, sets a prescribed area in a picture photographed by the CCD camera 30, figures out a colored area contained in the set prescribed area, and judges whether or not a lead 72 is satisfactorily soldered on the basis of the colored area contained in the prescribed area.

Description

  The present invention relates to a board inspection apparatus for inspecting a soldering state of an electronic component soldered to a board surface.

  Conventionally, as a substrate inspection apparatus for joining an electronic component to a substrate by soldering and inspecting the state of the soldered portion, for example, a substrate inspection described in JP-A-2006-322951 (Patent Document 1) A device has been proposed. This board inspection apparatus is generally composed of a plurality of light sources that emit color light to the board, a camera disposed above the board, and a discrimination means that discriminates the state of the soldered portion. .

  The plurality of light sources have three annular light sources and are arranged so that the elevation angles viewed from the substrate are different. The annular light source emits light in any one of red, green, and blue, and irradiates the soldered portion of the substrate with light. When a substrate is photographed by a camera in a state where a plurality of light sources emit light, a portion corresponding to the inclined surface of the soldered portion is represented by a color corresponding to the magnitude of the gradient in the photographed image.

  That is, when the shape of the soldering part is good, the upper end of the soldering part is a steep slope, the lower end is a flat surface, and the middle part of both is a warm inclined surface, so the color on the image is from the lower end to the upper end. It changes in the order of red, green, and blue.

  On the other hand, when the shape of the soldering part is defective, the upper end of the soldering part is a flat surface, the lower end is a steep slope, and the middle part of both is a warm inclined surface. Change in the order of red, green and blue. As described above, the defective product is configured to be expressed in the color order in the opposite direction to the non-defective product.

  Then, the direction in which the hue change corresponding to the arrangement of each light source occurs is extracted on the image obtained by photographing the soldering part, and the direction in which the gradient of the inclined surface of the soldering part is changed is obtained by the discriminating means. Is compared with the registered reference direction to determine the quality of the soldered portion.

JP 2006-322951 A

  However, in the above-described board inspection apparatus, when inspecting the soldering state of the lead of the electronic component soldered to the board surface, the lead also emits a color color along with the soldered portion, so that the lead of the image is displayed. It is represented by a color corresponding to the shape and inclination. For this reason, the identification of the part soldered to the lead becomes unclear, and the lead may be determined as the soldered part, which causes a problem that the inspection accuracy is lowered.

  Therefore, the present invention has been made to solve such a conventional problem, and the object of the present invention is to improve the accuracy of inspection by clearly identifying the part soldered to the lead. It is to provide a substrate inspection apparatus.

  In order to achieve the above object, an invention according to claim 1 of the present application is a board inspection apparatus for inspecting a soldering state of an electronic component to be soldered to a board surface. A plurality of reflecting members having a dome shape which is a reflecting surface, and a plurality of reflecting members disposed around the substrate side of the reflecting member, and emitting white light to the reflecting surface side, thereby indirectly emitting white light to the substrate surface. A plurality of white light emitting means for irradiating; a plurality of colored light emitting means that are arranged around a substrate side of the reflecting member and emit colored light in a direction substantially parallel to the substrate surface; and the substrate surface An imaging control unit configured to image the substrate surface by the imaging unit, the imaging unit configured to image the substrate surface, the white light emitting unit, and the colored light emitting unit that emit light simultaneously. Photographed by the photographing means Area setting means for setting a predetermined area in the vicinity of the lead of the electronic component in the image; image processing means for obtaining a colored area included in the predetermined area set by the area setting means; And determining means for determining whether or not the soldering of the lead is good based on the colored area included in the area.

  In the invention according to claim 2 of the present application, the lead of the electronic component is fixed and soldered in a direction substantially orthogonal to the land formed on the substrate surface, and the region setting means is connected to the land. A first region that is substantially concentric and a second region that is substantially concentric with respect to the land and that is outside the first region are set, and the determination means is outside the first region. In addition, it is determined that the soldering of the lead is good when the ratio of the colored region in the determination region that is inside the second region is equal to or more than a first threshold value.

  According to a third aspect of the present invention, the area setting means sets a third area outside the second area, and the determination means has a ratio of the colored area in the determination area as the first area. If the ratio of the colored region is equal to or greater than the second threshold value within the region outside the second region and inside the third region, the lead solder It is characterized in that the attachment is determined to be bad.

  According to a fourth aspect of the present invention, the lead of the electronic component is fixed and soldered in a direction inclined at a predetermined angle with respect to the land formed on the substrate surface, and the region setting means is connected to the land. A third region having a substantially concentric shape is set, and a region set with reference to the inclination direction of the lead in the third region is set as a determination region. Thus, when the proportion of the colored region is equal to or greater than a third threshold value, it is determined that the soldering of the lead is good.

  In the invention according to claim 5 of the present application, the determination means is other than the determination region in the third region even if the ratio of the colored region in the determination region is equal to or greater than the third threshold value. When the proportion of the colored region in the region is equal to or greater than a fourth threshold value, it is determined that the soldering of the lead is defective.

  The invention according to claim 6 of the present application is characterized in that a central portion of the reflecting member is opened, and the photographing means is provided in the opening.

  According to the substrate inspection apparatus of the present invention as set forth in claim 1, the white light irradiating means for irradiating the substrate surface with white light and the colored light emission for emitting colored light in a direction substantially parallel to the substrate surface. The image is taken by the photographing means with the means simultaneously emitting light. When the lead is fixed in a direction orthogonal to the land, the image taken by the photographing means is not colored in the portion corresponding to the lead, but is colored in the portion corresponding to the soldered portion. For this reason, it is possible to clearly identify the lead and the soldering portion, and the soldering state can be inspected with high accuracy.

  Further, it is determined whether or not the soldering of the lead is good based on a colored region included in a predetermined region set in the vicinity of the lead. Therefore, by changing the setting area, not only when the lead is fixed in the direction orthogonal to the land, but also when the lead is fixed in the direction inclined by a predetermined angle with respect to the land. The soldering state can be inspected.

  Therefore, it is possible to provide a board inspection apparatus with improved inspection accuracy by clearly identifying the lead and the soldered portion.

  According to the substrate inspection apparatus of the present invention as set forth in claim 2, when the lead is fixed in a direction orthogonal to the land, outside the first region which is substantially concentric with the land, and The lead soldering is determined to be good when the ratio of the colored region is equal to or more than the first threshold in the determination region that is set inside the second region that is set outside the first region. For this reason, it can be determined whether the amount of solder at the soldering site is good or the amount of solder is too small.

  Also, in order to determine the quality of the soldered part of the lead within the judgment area excluding the lead of the electronic component, the lead is not judged as a soldered part, and the soldered state can be inspected with high accuracy. it can.

  According to the substrate inspection apparatus of the present invention described in claim 3, when the coloring area is equal to or larger than the second threshold in the third area set outside the second area, coloring is performed in the determination area. Even if the proportion of the area is equal to or greater than the first threshold, it is determined that the soldering of the lead is defective. For this reason, it can be determined whether the amount of solder at the soldering site is good or the amount of solder is excessive.

  According to the substrate inspection apparatus of the present invention as set forth in claim 4, when the lead is fixed in a direction inclined at a predetermined angle with respect to the land, the lead is substantially concentric with respect to the land. If the ratio of the colored region in the determination region set with reference to the inclination direction is equal to or greater than the third threshold value, it is determined that the soldering of the lead is good. For this reason, even if the lead is fixed in a direction inclined at a predetermined angle with respect to the land, it is determined whether the amount of solder at the soldering site is good or the amount of solder is too small. Can do.

  Also, in order to determine the quality of the soldered part of the lead within the judgment area excluding the lead of the electronic component, the lead is not judged as a soldered part, and the soldered state can be inspected with high accuracy. it can.

  According to the substrate inspection apparatus of the present invention described in claim 5, when the proportion of the colored region in the region other than the determination region in the fourth region is equal to or more than the fourth threshold value, the colored region in the determination region. Even if the ratio occupied by is greater than or equal to the third threshold, it is determined that lead soldering is defective. For this reason, even when the lead is fixed in a direction inclined at a predetermined angle with respect to the land, it is determined whether the amount of solder at the soldering portion is good or the amount of solder is excessive. Can do.

  According to the substrate inspection apparatus of the present invention as set forth in claim 6, the imaging means is provided in the opening portion in which the central portion of the reflecting member is opened. For this reason, it is possible to inspect the soldering state with high accuracy by photographing the colored light applied to the soldering site from a position facing the substrate surface.

It is the figure which showed typically the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the case where the board | substrate inspection apparatus which concerns on embodiment of this invention irradiates white light and red light to a substrate surface. It is a block diagram which shows the circuit structure of the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the flowchart of the control processing of the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the screen which displayed the determination result by the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the flowchart of the 1st determination process of the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the case where the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being favorable. It is a figure which shows the case where the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being too small. It is a figure which shows when the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being excessive. It is a figure which shows the flowchart of the 2nd determination process by the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a figure which shows the case where the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being favorable. It is a figure which shows the case where the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being too small. It is a figure which shows when the board | substrate inspection apparatus which concerns on embodiment of this invention determines with the amount of soldering of a lead being excessive.

  Embodiments of the present invention will be described below with reference to the drawings. First, a substrate inspection apparatus according to an embodiment of the present invention will be described with reference to FIG. A board inspection apparatus according to an embodiment of the present invention is an apparatus for inspecting a soldering state of an electronic component to be soldered to a board surface. FIG. 1 is a diagram schematically showing a substrate inspection apparatus according to an embodiment of the present invention.

  As shown in FIG. 1, the substrate inspection apparatus 1 includes a dome illumination 10 that emits light perpendicular to the substrate surface 71, a low-angle illumination 20 that emits light parallel to the substrate surface 71, and a substrate surface. A CCD (Charge Coupled Device) camera (photographing means) 30 for photographing 71, a base 40 on which the substrate 70 is placed, and a rail 45 that moves the base 40 on which the substrate 70 is placed are roughly constituted.

  The dome illumination 10 is disposed so as to face the substrate surface 71. The dome illumination 10 includes a reflecting member 11 having a curved shape (dome shape, goniform shape) with an inner surface as a reflecting surface 12, and a plurality of white LEDs (arranged on the substrate side peripheral portion 15 of the reflecting member 11). White light emitting means) 13.

  The reflecting member 11 has an opening at the center, and a CCD camera 30 is provided in the opening 16. The white LED 13 is arranged with the lens facing the CCD camera 30 side, and emits white light to the reflecting surface 12 side to indirectly irradiate the substrate surface 71 with white light.

  The low-angle illumination 20 has a shape that can surround the periphery of the substrate 70 (for example, a circular shape that is substantially concentric with the dome illumination 10 when viewed from above, or a rectangle that has the same center line as the dome illumination 10). And a plurality of red LEDs 21 (colored light emitting means) arranged in the substrate-side peripheral portion 15 of the reflecting member 11. The red LED 21 is arranged with the lens facing the center line of the dome illumination 10, and emits colored light (red) in a direction substantially parallel to the substrate surface 71. Further, the red LED 21 is emitted to a position (see an arrow A in FIG. 7A) above a lowermost part of a soldering portion 74 (see FIG. 7A) described later. That is, the red LED 21 is disposed at a position where the red colored light is not emitted within a predetermined interval from the substrate surface 71 (the lowermost portion of the soldering portion 74).

  In the embodiment of the present invention, the colored light emitting means is described with respect to the red LED 21, but may be an LED of another color as long as it is a light source that emits colored light (for example, a blue LED, a green LED). LED etc.).

  The CCD camera 30 is, for example, a 5 million pixel color CCD camera, and is disposed in the opening 16 so as to face the substrate surface 71, and images the substrate surface 71 when the white LED 13 and the red LED 21 emit light simultaneously. Thus, by providing the CCD camera 30 in the opening 16, the colored light applied to the soldering portion 74 (see FIG. 7A) to be described later can be photographed from a position facing the substrate surface 71. The soldering state can be inspected with high accuracy.

  Since the light emitted from the white LED 13 is emitted in a direction perpendicular to the substrate surface 71 and the light emitted from the red LED 21 is emitted in a direction parallel to the substrate surface 71, the image taken by the CCD camera 30 is the substrate surface. Images with different red densities (images with different color differences) are taken according to the inclination angle with respect to 71. That is, the portion parallel to the substrate surface 71 is photographed white by the light emitted by the white LED 12, but the light emitted from the red LED 21 can easily enter the CCD camera 30 depending on the inclination angle with respect to the substrate surface 71. Photographs are made so that the red color has different intensities according to the inclination angle with respect to the surface 71.

  The base 40 is fitted with a fitting portion (not shown) of the rail 45 and moves on the rail 45 while holding the substrate 70. The rail 45 has an X-axis direction rail 46 that moves in the left-right direction (X-axis direction) when the substrate 70 is viewed from above, and a vertical direction (a direction orthogonal to the left-right direction when viewed from above, the Y-axis direction). ) To move in the Y-axis direction rail 47.

  Next, with reference to FIG. 2, the light emitted by the white LED 13 of the dome illumination 10, the red LED 21 of the low-angle illumination 20, and the image taken by the CCD camera 30 will be described. FIG. 2 is a diagram illustrating a case where the substrate inspection apparatus according to the embodiment of the present invention irradiates the substrate surface with white light and red light.

  As shown in FIG. 2A, the white LED 13 of the dome illumination 10 indirectly irradiates the substrate surface 71 with white light. That is, the white LED 13 emits white light toward the reflecting member 11, and the light reflected by the reflecting member 11 irradiates the substrate surface 71 in the vertical direction. Further, the red LED 22 of the low-angle illumination 20 emits red colored light in a direction parallel to the substrate surface 71. That is, the white LED 13 irradiates in a direction perpendicular to the substrate surface 71, while the red LED irradiates in a direction parallel to the substrate surface 71.

  As shown in FIG. 2B, the light emitted by the red LED 21 to the portion inclined to the substrate surface 71, such as the lead 72 fixed in the direction inclined by a predetermined angle with respect to the substrate surface 71, Depending on the inclination angle with respect to the substrate surface 71, the light is reflected toward the dome illumination 10 (see arrow L in FIG. 2B), so that red light easily enters the CCD camera 30 (see FIG. 1). Further, the light irradiated by the white LED 13 on the portion parallel to the substrate surface 71 is reflected to the dome illumination 10 side, so that the white light easily enters the CCD camera 30. However, when the tilt angle with respect to the substrate surface 71 is small, red light hardly enters the CCD camera 30.

  That is, when the white LED 13 is emitted simultaneously with the red LED 21 and the substrate surface 71 is photographed by the CCD camera 30 (see FIG. 1), a portion parallel to the substrate surface 71 is inclined with respect to the white image, the substrate surface 71. In the portion, images having different red densities (white densities) (images having different color differences) are taken according to the inclination angle with respect to the substrate surface 71.

  Next, with reference to FIG. 3, the structure of the circuit with which the board | substrate inspection apparatus 1 which concerns on embodiment of this invention is provided is demonstrated. FIG. 3 is a block diagram showing a circuit configuration of the substrate inspection apparatus according to the embodiment of the present invention.

  As shown in FIG. 3, the substrate inspection apparatus 1 controls the entire substrate inspection apparatus 1 and also performs the imaging control for imaging the substrate surface 71 (see FIG. 1) with the CCD camera 30 (see FIG. 1). Region setting for setting a predetermined region in the image taken in step 1, image processing for obtaining a colored region included in the set region, and determination of whether soldering of the lead 72 (see FIG. 2) of the electronic component is good A CPU (Central Processing Unit) 51 is provided.

  The CPU 51 (shooting control means, area setting means, image processing means, determination means) includes a ROM (Read Only Memory) 52, a RAM (Random Access Memory) 53, a CCD camera 30, a display 35, and a light emission control unit. 54, the movement control part 55, the warning light 36, and the speaker 37 are connected.

  The ROM 52 stores a control program executed by the CPU 51, image data to be displayed on the display 35, and the like. The RAM 53 stores various data determined by executing a control program.

  The CCD camera 30 images the substrate surface 71 (see FIG. 1) a plurality of times based on a signal output from the CPU 51. For example, when the substrate surface 71 is viewed from the top, the substrate surface 71 is divided into four frames and six frames horizontally, and the CCD camera 30 shoots for each divided shooting region. An image of the substrate surface 71 photographed by the CCD camera 30 is output to the CPU 51.

  The display 35 displays an image of the substrate surface 71 photographed by the CCD camera 30. Further, an information image such as whether or not the soldering of the lead 72 determined by the CPU 51 is satisfactory is displayed.

  The light emission control unit 54 controls the light emission of the white LED 13 (see FIG. 1) of the dome illumination 10 and the red LED 21 (see FIG. 1) of the low-angle illumination 20 based on the signal output from the CPU 51.

  The movement control unit 55 moves the base 40 based on the signal output from the CPU 51, thereby controlling all the imaging areas set on the substrate surface 71 so that the CCD camera 30 can shoot.

  When the CPU 51 determines that the soldering state of the lead 72 is defective, the warning lamp 36 is turned on based on a signal output from the CPU 51 to notify the worker or the like that the soldering is defective. .

  When the CPU 51 determines that the lead 72 is in a poor soldering state, the speaker 37 outputs a warning sound based on a signal output from the CPU 51 to indicate that the soldering state is poor for an operator or the like. Is notified.

  Next, with reference to FIG.4 and FIG.5, operation | movement of the board | substrate inspection apparatus 1 which concerns on embodiment of this invention is demonstrated. FIG. 4 is a diagram showing a flowchart of the control processing according to the embodiment of the present invention. FIG. 5 is a diagram showing a screen on which the determination result by the substrate inspection apparatus according to the embodiment of the present invention is displayed.

  As shown in FIG. 4, first, the CPU 51 places the substrate 70 (see FIG. 1) on the base 40 (see FIG. 1) (step S1). That is, the CPU 51 moves the substrate 70 to be inspected from the predetermined position to the base 40. The movement of the substrate 70 may be supported and moved by sandwiching one end and the other end of the substrate 70 with a pair of long metal plates or the substrate surface 71 with a pair of long metal plates or the like. It may be supported and moved from below (see FIG. 1).

  Next, the CPU 51 moves the substrate 70 to a predetermined photographing position (step S2). The photographing position is a position where the substrate 70 can be photographed by the CCD camera 30 (see FIG. 1). For example, when the substrate surface 71 is viewed from the top, the photographing position is divided into four photographing frames and six photographing frames. Of the plurality of shooting areas, the substrate 70 is moved to a position where the CCD camera 30 can take an arbitrary shooting area (for example, the upper left shooting area for the first shooting, the next shooting area for the second shooting, etc.). Moving.

  Next, CPU51 light-emits white LED13 and red LED21 simultaneously (step S3). That is, a plurality of white LEDs 13 (see FIG. 1) arranged in the dome illumination 10 and a plurality of red LEDs 21 (see FIG. 1) arranged in the low-angle illumination 20 emit light simultaneously. Light emitted from the white LED 13 and the red LED 21 enters the substrate surface 71.

  Next, the CPU 51 photographs the substrate surface 71 with the CCD camera 30 (step S4). That is, in step S <b> 2, an arbitrary shooting area set on the substrate 70 moved to a predetermined position is shot by the CCD camera 30.

  Next, the CPU 51 performs a determination process which will be described later with reference to FIG. 6 (step S5). In this process, a predetermined area is set in the vicinity of the lead 72 of the electronic component in the image photographed by the CCD camera 30 (see FIGS. 7 to 9 and FIGS. 11 to 13), and the predetermined area is set. The first determination process and the second determination process for determining whether the soldering of the lead 72 is good or not are performed based on the colored region included in the.

  Next, the CPU 51 displays the determination result on the display 35 (step S6). Specifically, as shown in FIG. 5, an image of the substrate surface 71 captured by the CCD camera 30 (see FIG. 1) is displayed in the substrate determination image area 35 a of the display 35. In addition to the substrate determination image region 35a, the display 35 includes a comprehensive determination region 35b for displaying comprehensive determination, an inspection substrate information region 35c for displaying information on the inspection substrate 70, and defect information for displaying defect information for the substrate. It has a display area 35d and the like.

  Next, the CPU 51 determines whether or not shooting has been performed a predetermined number of times (step S7). That is, it is determined whether or not all the imaging regions of the substrate surface 71 divided into a plurality of imaging regions have been imaged by imaging the substrate surface 71 with the CCD camera 30 a predetermined number of times. When the CPU 51 determines that the image has not been shot a predetermined number of times (step S7: NO), the CPU 51 moves to the process of step S2 and takes an image of any shooting area (shooting area that has not been shot yet) among the plurality of shooting areas. To do.

  On the other hand, when the CPU 51 determines that the image has been shot a predetermined number of times (step S7: YES), it displays the final determination result on the display 35 (step S8). That is, the result of imaging all the imaging areas of the substrate surface 71 divided into a plurality of imaging areas is displayed in the comprehensive judgment area 35b, the inspection board information area 35c, the defect information display area 35d, etc. of the display 35 shown in FIG. .

  Next, CPU51 determines whether it is a pass determination (step S9). That is, as a result of determining whether or not the soldering of the lead 72 is good based on an image obtained by photographing each imaging region, there is no portion in which the soldering state is poor in each imaging region, and the soldering state of all the imaging regions is It is determined whether or not it is good. When the CPU 51 determines that it is a pass determination (step S9: YES), it moves the substrate 70 to a predetermined position (step S10). That is, the CPU 51 moves the board 70 to be inspected from the base 40 to a predetermined position (a place where only the board 70 that has passed the determination is placed). The movement of the substrate 70 may be supported and moved by sandwiching one end and the other end of the substrate 70 with a pair of long metal plates, or the substrate surface 71 (see FIG. 1)) and may be supported and moved from below. When this process ends, the CPU 51 ends the control process.

  On the other hand, when the CPU 51 determines that it is not a pass determination (step S9: NO), it moves the substrate 70 to another position (step S11). That is, the CPU 51 moves the board 70 to be inspected from the base 40 to a predetermined position (a place where only the board 70 that is determined to be rejected is placed). In addition, the CPU 51 outputs a signal to the warning lamp 36 and the speaker 37 (see FIG. 3) to notify the worker or the like that the soldering is bad. When this process ends, the CPU 51 ends the control process.

  In this way, the CPU 51 simultaneously emits the white LED 13 that irradiates the substrate surface 71 with white light and the red LED 21 that emits colored light in a direction substantially parallel to the substrate surface 71 and shoots with the CCD camera. To do. As will be described later, when the lead 72 is fixed in a direction orthogonal to the land 73 (see FIG. 7A), the image taken by the CCD camera 30 is colored in a portion corresponding to the lead 72. Instead, the portion corresponding to the soldered portion 74 (see FIG. 7A) is colored. For this reason, the lead 72 and the soldering part 74 can be clearly identified, and the soldering state can be inspected with high accuracy.

  Further, in a predetermined region set in the vicinity of the lead 72 (a first determination region 81, a second determination region 82, a third determination region 83, and a fourth determination region 84 described later) Based on this, it is determined whether or not the soldering of the lead 72 is good. Therefore, by changing the set region, not only when the lead 72 is fixed in a direction orthogonal to the land 73 (see FIG. 7A described later), the lead 72 is also fixed with respect to the land 73. Even when the head is fixed in a direction inclined at a predetermined angle (see 11 (a) described later), the soldering state can be inspected.

  Therefore, the board inspection apparatus 1 with improved inspection accuracy can be provided by clearly identifying the lead 72 and the soldering portion 74.

  Next, with reference to FIG. 6 to FIG. 13, determination of pass / fail of the soldered state of the lead 72 soldered to the substrate surface 71 will be described. Whether the soldering is good or bad is determined by setting a predetermined area in the vicinity of the lead 72 of the electronic component in the image taken by the CCD camera 30 (see FIG. 1) and based on the colored area included in the predetermined area. Do.

  First, referring to FIG. 6 to FIG. 9, determination of the quality of soldering when the lead 72 of the electronic component is fixed and soldered in a direction orthogonal to the land 73 formed on the substrate surface. explain. FIG. 6 is a diagram showing a flowchart of the first determination process by the substrate inspection apparatus according to the embodiment of the present invention. FIG. 7A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that lead soldering is good. FIG. 7B is a top view of a soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the soldering of the lead is good. FIG. 8A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that the lead soldering amount is too small. FIG. 8B is a top view of a soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the amount of soldering of the lead is too small. FIG. 9A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that the lead soldering amount is excessive. FIG. 9B is a top view of the soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the lead soldering amount is excessive.

  As shown in FIG. 6, first, the CPU 51 sets a first area (step S21). Specifically, as shown in FIG. 7, the CPU 51 performs soldering in the case where the lead 72 of the electronic component is fixed and soldered in a direction orthogonal to the land 73 formed on the substrate surface 71. ), A first region 75 that is substantially concentric with respect to the land 73 is set.

  Next, the CPU 51 sets a second area (step S22). Specifically, as shown in FIG. 7B, the CPU 51 sets a second area 76 that is substantially concentric with the land 73 and that is outside the first area 75. In addition, the first region 75 and the second region 76 are set inside the circumference of the round 73.

  Next, the CPU 51 extracts a colored area (step S23). Specifically, as illustrated in FIG. 7B, the CPU 51 determines that the coloring area (the area photographed in red) is within the determination area 81 that is outside the first area 75 and inside the second area 75. ). That is, the proportion of the colored area in the first determination area 81 is obtained.

  Next, the CPU 51 determines whether or not the coloring area is equal to or greater than the first threshold (step S24). That is, the proportion of the colored region in the first determination region 81 shown in FIG. 7B is equal to or higher than the first threshold (for example, the proportion of the colored region in the first determination region 81 is 60% or more). It is determined whether or not. When the CPU 51 determines that the colored region is not equal to or greater than the first threshold (step S24: NO), the CPU 51 determines that the solder amount of the soldered portion 74 is too small (step S25).

  For example, as shown in FIG. 8A, the lead 72 of the electronic component is fixed and soldered in a direction perpendicular to the land 73 formed on the substrate surface 71. When the amount of solder is too small, the light emitted from the red LED 21 (see FIG. 1) is less likely to enter the CCD camera 30 (see arrow A in FIG. 8A). For this reason, in the 1st determination area | region 81 in the image | photographed image shown in FIG.8 (b), the ratio for which a colored area accounts is small. Therefore, in the case shown in FIG. 8A, since the colored region does not exceed the first threshold value (below the first threshold value), the CPU 51 determines that the amount of solder at the soldering portion 74 is too small. To do. When this process ends, the CPU 51 ends the first determination process.

  As described above, when the lead 72 is fixed in a direction orthogonal to the land 73, the lead 72 is outside the first region 75 which is substantially concentric with the land 73 and outside the first region 75. When the proportion of the colored region in the first determination region 81 that is inside the second region 76 that is set to is not equal to or greater than the first threshold value (when it is equal to or less than the first threshold value), the soldered portion of the lead 72 It is determined that the amount of solder 74 is too small. For this reason, it can be determined whether the amount of solder in the soldering portion 74 is good or the amount of solder is too small.

  In addition, since the quality of the soldered portion 74 of the lead 72 is judged within the first determination area 81 excluding the lead 72 of the electronic component, the lead 72 is not judged as the soldered portion 74, and the accuracy is high. The soldering state can be inspected.

  On the other hand, when the CPU 51 determines that the colored area is equal to or greater than the first threshold (step S24: YES), the CPU 51 sets the third area (step S26). Specifically, the CPU 51 sets a third area 77 outside the second area 76 as shown in FIG. Further, the third region 77 is set outside the circumference of the round 73.

  Next, the CPU 51 extracts another colored area (step S27). Specifically, as shown in FIG. 7B, the CPU 51, as shown in FIG. 7B, is a colored area (photographed in red) within a second determination area 82 that is outside the second area 76 and inside the third area 77. Region). That is, the proportion of the colored area in the second determination area 82 is obtained.

  Next, the CPU 51 determines whether or not the coloring area is equal to or smaller than the second threshold (step S28). That is, the proportion of the colored region in the second determination region 82 shown in FIG. 7B is equal to or less than the second threshold (for example, the proportion of the colored region in the second determination region 82 is 50% or less). It is determined whether or not. When the CPU 51 determines that the colored region is not less than or equal to the second threshold (step S28: NO), the CPU 51 determines that the solder amount of the soldered portion 74 is excessive (step S29).

  For example, as shown in FIG. 9A, the lead 72 of the electronic component is fixed and soldered in a direction perpendicular to the land 73 formed on the substrate surface 71. When the amount of solder is excessive, the light emitted from the red LED 21 (see FIG. 1) is likely to enter the CCD camera 30 (see arrow A in FIG. 9A). For this reason, in the 2nd determination area | region 82 in the image | photographed image shown in FIG.9 (b), the ratio for which a coloring area accounts increases. Therefore, in the case shown in FIG. 9A, the CPU 51 has an excessive amount of solder in the soldering portion 74 because the coloring region does not become the second threshold value or less (because it becomes the second threshold value or more). judge. When this process ends, the CPU 51 ends the first determination process.

  On the other hand, when the CPU 51 determines that the coloring area is equal to or smaller than the second threshold (step S28: YES), the CPU 51 determines that the soldered portion 74 is good (step S30). That is, soldering is performed when the proportion of the colored region in the first determination region 81 is equal to or greater than the first threshold and the proportion of the colored region in the second determination region 82 is equal to or less than the second threshold. The region 74 is determined to be good.

  For example, as shown in FIG. 7A, a soldered portion (fillet) 74 in which the lead 72 of the electronic component is fixed and soldered in a direction perpendicular to the land 73 formed on the substrate surface 71 is provided. In the case of a flared shape like a mountain, the light emitted from the red LED 21 (see FIG. 1) is incident on the CCD camera 30 (see arrow A in FIG. 7A), and the soldering portion 74 is on the substrate surface. It is colored red according to the elevation angle seen from 71. Therefore, the ratio of the colored area in the first determination area 81 in the photographed image shown in FIG. 7B is equal to or more than the first threshold, and the colored area occupies in the second determination area 82. The ratio is equal to or less than the second threshold value. Therefore, in the case shown in FIG. 7A, the CPU 51 determines that the soldered portion 74 is good. CPU51 complete | finishes a 1st determination process, after complete | finishing this process.

  In this way, in the second determination area 82 that is in the third area 77 set outside the second area 76, and in the first determination area 81 when the coloring area is equal to or greater than the second threshold value. Even if the ratio occupied by the colored region is equal to or higher than the first threshold value, it is determined that the soldering of the lead 72 is defective. For this reason, it can be determined whether the solder amount of the soldering part 74 is good or the amount of solder is excessive.

  Next, referring to FIG. 10 to FIG. 13, whether or not the soldering of the electronic component is soldered when the lead of the electronic component is fixed and soldered in a direction inclined by a predetermined angle with respect to the land formed on the board surface is determined. Will be described. FIG. 10 is a view illustrating a flowchart of the second determination process by the substrate inspection apparatus according to the embodiment of the present invention. FIG. 11A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that the soldering is good. FIG. 11B is a top view of a soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the soldering is good. FIG. 12A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that the amount of soldering is too small. FIG. 12B is a top view of a soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the amount of soldering is too small. FIG. 13A is a diagram illustrating a case where the board inspection apparatus according to the embodiment of the present invention determines that the amount of soldering is excessive. FIG. 13B is a top view of the soldering part when the board inspection apparatus according to the embodiment of the present invention determines that the amount of soldering is excessive.

  As shown in FIG. 10, first, the CPU 51 sets the fourth area (step S41). Specifically, the CPU 51 has the electronic component lead 72 formed on the substrate surface 71 as shown in FIG. When fixed and soldered in a direction inclined by a predetermined angle with respect to the land 73, a fourth region 78 that is substantially concentric with respect to the land 73 is set as shown in FIG. .

  Next, the CPU 51 extracts a colored area (step S42). Specifically, as shown in FIG. 11B, the CPU 51 sets a region in the fourth region 78 set based on the inclination direction of the lead 72 as the third determination region 83, and the third determination region 83. The colored area (area photographed in red) is extracted. That is, the proportion of the colored area in the third determination area 83 is obtained.

  Next, the CPU 51 determines whether or not the coloring area is equal to or greater than a third threshold value (step S43). That is, is the proportion of the colored region in the third determination region shown in FIG. 11B equal to or higher than the third threshold (for example, the proportion of the colored region in the third determination region 83 is 80% or more)? Determine whether or not. When the CPU 51 determines that the colored region is not equal to or greater than the third threshold (step S43: NO), the CPU 51 determines that the amount of solder in the soldered portion 74 is too small (step S44).

  For example, as shown in FIG. 12A, a soldered portion (fillet) in which a lead 72 of an electronic component is fixed and soldered in a direction inclined at a predetermined angle with respect to a land 73 formed on a substrate surface 71. When the amount of solder 74 is too small, the light emitted from the red LED 21 (see FIG. 1) is less likely to enter the CCD camera 30 (see arrow B in FIG. 12A). For this reason, in the 3rd determination area | region 83 in the image | photographed image shown in FIG.12 (b), the ratio for which a colored area accounts is small. Accordingly, in the case shown in FIG. 12A, since the colored region does not exceed the third threshold value (below the third threshold value), the CPU 51 determines that the amount of solder at the soldering portion 74 is too small. When this process ends, the CPU 51 ends the second determination process.

  As described above, when the lead 72 is fixed in a direction inclined by a predetermined angle with respect to the land 73, the fourth region 78 which is substantially concentric with respect to the land 73 is set with reference to the inclination direction of the lead. In the third determination area 83, when the proportion of the colored area is not equal to or greater than the third threshold value, it is determined that the solder amount of the soldered portion 74 of the lead 72 is too small. For this reason, even when the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73, it is determined whether the amount of solder at the soldering portion 74 is good or the amount of solder is too small. Can be determined.

  In addition, since the quality of the soldered portion of the lead 72 is judged in the third judgment region 83 excluding the lead 72 of the electronic component, the lead 72 is not judged as the soldered portion 74, and the accuracy is high. The soldering state can be inspected.

  On the other hand, if the CPU 51 determines that the colored area is equal to or greater than the third threshold (step S43: YES), the CPU 51 extracts another colored area (step S45). Specifically, as illustrated in FIG. 11B, the CPU 51 includes a colored region (a region photographed in red) within the fourth determination region 84 other than the third determination region 83 in the fourth region 78. ). That is, the proportion of the colored area in the fourth determination area 84 is obtained.

  Next, the CPU 51 determines whether or not the coloring area is equal to or less than a fourth threshold value (step S46). That is, in the fourth area shown in FIG. 11B and in the fourth determination area 84 other than the third determination area 83, the proportion of the colored area is equal to or lower than the fourth threshold (for example, the first It is determined whether or not the ratio of the colored region in the determination region 84 of 4 is 40% or less. When the CPU 51 determines that the colored region is not equal to or less than the fourth threshold (step S46: NO), the CPU 51 determines that the solder amount of the soldered portion 74 is excessive (step S47).

  For example, as shown in FIG. 13A, the lead 72 of the electronic component is fixed and soldered in a direction inclined at a predetermined angle with respect to a land 73 formed on the substrate surface 71 (see FIG. 11B). When the solder amount of the soldering portion (fillet) 74 is excessive, the light emitted from the red LED 21 (see FIG. 1) is likely to enter the CCD camera 30 (see arrow B in FIG. 13A). . For this reason, in the 4th determination area | region 84 in the image | photographed image shown in FIG.13 (b), the ratio for which a coloring area accounts increases. Therefore, in the case shown in FIG. 13A, the CPU 51 determines that the amount of solder in the soldering portion 74 is excessive because the colored region does not become the fourth threshold value or less (because it becomes the fourth threshold value or more). When this process ends, the CPU 51 ends the first determination process.

  On the other hand, when the CPU 51 determines that the coloring area is equal to or smaller than the fourth threshold (step S46: YES), the CPU 51 determines that the soldered portion 74 is good (step S48). That is, soldering is performed when the proportion of the colored region in the third determination region 83 is equal to or greater than the third threshold and the proportion of the colored region in the fourth determination region 84 is equal to or less than the fourth threshold. The region 74 is determined to be good.

  For example, as shown in FIG. 11A, a soldered portion (fillet) in which a lead 72 of an electronic component is fixed and soldered in a direction inclined at a predetermined angle with respect to a land 73 formed on a substrate surface 71. When 74 has a flared shape like a mountain, the light emitted from the red LED 21 (see FIG. 1) is incident on the CCD camera 30 (see arrow B in FIG. 11A), and the soldering portion 74 is It is colored red according to the elevation angle viewed from the substrate surface 71. For this reason, the proportion of the colored region in the third determination region 83 in the captured image shown in FIG. 11B is equal to or greater than the third threshold value, and the fourth threshold value in the fourth determination determination region 84. It becomes as follows. Therefore, in the case shown in FIG. 11A, the CPU 51 determines that the soldered portion 74 is good. CPU51 complete | finishes a 2nd determination process, after complete | finishing this process.

  As described above, in the fourth determination region 84 other than the third determination region 83 in the fourth region 78, when the proportion of the colored region is equal to or more than the fourth threshold value, the third determination region 83 Even if the ratio occupied by the colored region is equal to or greater than the third threshold value, it is determined that the soldering of the lead 72 is defective. For this reason, even when the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73, it is determined whether the solder amount of the soldering portion 74 is good or the amount of solder is excessive. Can be determined.

  In this way, the substrate inspection apparatus 1 according to the embodiment of the present invention is arranged so as to face the substrate surface 71 and has a reflecting member 11 having a dome shape in which the inner surface is the reflecting surface 12 and the substrate of the reflecting member 11. A plurality of white LEDs 13 that are disposed on the side peripheral portion 15 and indirectly emit white light onto the substrate surface 71 by emitting white light to the reflective surface 12 side, and a plurality of the substrate side peripheral portion 15 of the reflective member 11. The red LED 21 that is installed individually and emits colored light in a direction substantially parallel to the substrate surface 71, the CCD camera 30 that is disposed to face the substrate surface 71 and photographs the substrate surface 71, the white LED 13, and The red LED 21 is caused to emit light simultaneously, the substrate surface 71 is photographed by the CCD camera 30, and a predetermined area is set in the vicinity of the lead 72 of the electronic component in the image photographed by the CCD camera 30. Obtains a colored area included in the predetermined region, based on the colored area included in the predetermined region has a CPU51 determines whether the soldering is good lead 72.

  Further, in the board inspection apparatus 1 according to the embodiment of the present invention, when the lead 72 of the electronic component is fixed and soldered in a direction substantially orthogonal to the land 73 formed on the board surface 71, the CPU 51. The first region 75 which is substantially concentric with respect to the land 73 and the second region 76 which is substantially concentric with respect to the land 73 and which is outside the first region 75 are set. It is determined that the soldering of the lead 72 is good when the proportion of the colored region is equal to or larger than the first threshold in the first determination region 81 outside 75 and inside the second region 76. To do.

  Furthermore, in the board inspection apparatus 1 according to the embodiment of the present invention, when the lead 72 of the electronic component is fixed and soldered in a direction substantially orthogonal to the land 73 formed on the board surface 71, the CPU 51. Sets the third region 77 outside the second region 76, and even if the proportion of the colored region in the first determination region 81 is equal to or greater than the first threshold value, the third region 77 is outside the second region 76. In the second determination area 82 inside the third area 77, when the proportion of the colored area is equal to or greater than the second threshold, it is determined that the soldering of the lead 72 is defective.

  In the board inspection apparatus 1 according to the embodiment of the present invention, when the lead 72 of the electronic component is fixed and soldered in a direction inclined by a predetermined angle with respect to the land 73 formed on the board surface 71, The CPU 51 sets a fourth area 78 that is substantially concentric with respect to the land 73, and further, sets an area that is set based on the inclination direction of the lead 72 in the fourth area 78 as a third determination area. 83, it is determined that the soldering of the lead 72 is good when the proportion of the colored region in the third determination region 83 is equal to or greater than the third threshold value.

  Furthermore, in the board inspection apparatus 1 according to the embodiment of the present invention, when the lead 72 of the electronic component is fixed and soldered in a direction inclined by a predetermined angle with respect to the land 73 formed on the board surface 71, In the fourth determination area 84 other than the third determination area 83 in the fourth area 78, the CPU 51, even if the proportion of the colored area in the third determination area 83 is equal to or greater than the third threshold. Thus, when the proportion of the colored region is equal to or greater than the fourth threshold value, it is determined that the lead 72 is poorly soldered.

  In the substrate inspection apparatus 1 according to the embodiment of the present invention, the reflection member 11 has an opening at the center, and the CCD camera 30 is provided at the opening 16.

  And according to the board | substrate inspection apparatus 1 which concerns on embodiment of this invention, white LED13 which irradiates white light to the board | substrate surface 71, and red LED21 which radiate | emits colored light toward a direction substantially parallel with respect to the board | substrate surface 71. Are simultaneously emitted and photographed by the CCD camera 30. When the lead 72 is fixed in a direction orthogonal to the land 73, the image taken by the CCD camera 30 is not colored in the portion corresponding to the lead 72, and the portion corresponding to the soldered portion 74 is not colored. Colored. For this reason, the lead 72 and the soldering part 74 can be clearly identified, and the soldering state can be inspected with high accuracy.

  Further, based on the colored region included in the predetermined region (first determination region 81, second determination region 82, third determination region 83, fourth determination region 84) set in the vicinity of the lead 72. Then, it is determined whether or not the soldering of the lead 72 is good. For this reason, by changing the area to be set, not only when the lead 72 is fixed in a direction orthogonal to the land 73 but also the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73. Even in such a case, the soldering state can be inspected.

  Therefore, the board inspection apparatus 1 with improved inspection accuracy can be provided by clearly identifying the lead 72 and the soldering portion 74.

  Further, according to the board inspection apparatus 1 of the present invention, when the lead 72 is fixed in a direction orthogonal to the land 73, outside the first region 75 that is substantially concentric with the land 73, In addition, in the first determination region 81 that is substantially concentric with respect to the land 73 and that is inside the second region 76 that is outside the first region 75, the ratio of the colored region is equal to or greater than the first threshold value. In this case, it is determined that the soldering of the lead 72 is good. For this reason, it can be determined whether the amount of solder in the soldering portion 74 is good or the amount of solder is too small.

  In addition, since the quality of the soldered portion 74 of the lead 72 is judged within the first determination area 81 excluding the lead 72 of the electronic component, the lead 72 is not judged as the soldered portion 74, and the accuracy is high. The soldering state can be inspected.

  Furthermore, according to the substrate inspection apparatus 1 of the present invention, when the coloring area is equal to or larger than the second threshold in the second determination area 82 in the third area 77 set outside the second area 76. Even if the ratio of the colored region in the first determination region 81 is equal to or greater than the first threshold value, it is determined that the soldering of the lead 72 is defective. For this reason, it can be determined whether the solder amount of the soldering part 74 is good or the amount of solder is excessive.

  Further, according to the substrate inspection apparatus 1 of the present invention, when the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73, the fourth region 78 is substantially concentric with the land 73. In the third determination area 83 set with reference to the lead inclination direction, if the proportion of the colored area is equal to or greater than the third threshold value, it is determined that the lead 72 is soldered well. For this reason, even when the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73, it is determined whether the amount of solder at the soldering portion 74 is good or the amount of solder is too small. Can be determined.

  In addition, since the quality of the soldered portion of the lead 72 is judged in the third judgment region 83 excluding the lead 72 of the electronic component, the lead 72 is not judged as the soldered portion 74, and the accuracy is high. The soldering state can be inspected.

  Furthermore, according to the substrate inspection apparatus 1 of the present invention, in the fourth region 78 other than the third determination region 83 in the fourth region 78, the proportion of the colored region is equal to or greater than the fourth threshold value. Even if the proportion of the colored region in the third determination region 83 is equal to or more than the third threshold value, it is determined that the soldering of the lead 72 is defective. For this reason, even when the lead 72 is fixed in a direction inclined at a predetermined angle with respect to the land 73, it is determined whether the solder amount of the soldering portion 74 is good or the amount of solder is excessive. Can be determined.

  Further, according to the substrate inspection apparatus of the present invention, the CCD camera 30 is provided in the opening 16 in which the central portion of the reflecting member 11 is opened. For this reason, it is possible to inspect the soldering state with high accuracy by photographing the colored light applied to the soldering portion 74 from a position facing the substrate surface 71.

  As mentioned above, although the board | substrate inspection apparatus of this invention was demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part is replaced with the thing of the arbitrary structures which have the same function. Can do.

  For example, in the above-described embodiment, the case where the CCD camera 30 is provided in the opening 16 of the reflecting member 11 has been described. However, the CCD camera 30 is provided inside the dome illumination 10 so as to face the substrate surface 71. It may be configured. Further, the opening 16 of the reflecting member 11 may be covered with glass or the like, and the CCD camera 20 may be provided on the upper side of the glass or the like so as to face the substrate surface 71.

  For example, in the above-described embodiment, the case where the colored light is emitted by the red LED 21 has been described. However, if the light source emits the colored light, the colored light is emitted by a blue LED, a green LED, a yellow LED, or the like. You may comprise as follows.

  The present invention is extremely useful for clearly identifying a portion soldered to a lead and improving the accuracy of inspection.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 10 Dome illumination 11 Reflective member 12 Reflective surface 13 White LED
15 Substrate side periphery 16 Opening 20 Low angle illumination 21 Red LED
30 CCD camera 35 Display 36 Warning light 37 Speaker 40 Base 45 Rail 46 X-axis direction rail 47 Y-axis direction rail 51 CPU
52 ROM
53 RAM
70 Substrate 71 Substrate surface 72 Lead 73 Land 74 Soldering site 75 First region 76 Second region 77 Third region 78 Fourth region 81 First determination region 82 Second determination region 83 Third determination Area 84 Fourth determination area

Claims (6)

In a board inspection device that inspects the soldering state of electronic components to be soldered to the board surface,
A reflective member having a dome shape which is disposed to face the substrate surface and whose inner surface is a reflective surface;
A plurality of white light emitting means for indirectly irradiating white light on the substrate surface by emitting a white light on the reflective surface side, a plurality of being installed on the substrate side peripheral portion of the reflective member;
A plurality of colored light emitting means that are installed at a plurality of peripheral portions on the substrate side of the reflecting member and emit colored light in a direction substantially parallel to the substrate surface;
An imaging means arranged to face the substrate surface and image the substrate surface;
An imaging control unit that causes the white light emitting unit and the colored light emitting unit to emit light at the same time and shoots the substrate surface by the imaging unit;
An area setting means for setting a predetermined area in the vicinity of the lead of the electronic component in the image photographed by the photographing means;
Image processing means for obtaining a colored area included in the predetermined area set by the area setting means;
And a determining unit that determines whether the soldering of the lead is good based on the colored region included in the predetermined region. The lead of the electronic component is fixed and soldered in a direction substantially orthogonal to the land formed on the substrate surface,
The region setting means sets a first region that is substantially concentric with the land and a second region that is substantially concentric with the land and is outside the first region,
The determination means solders the lead when the ratio of the coloring area is equal to or more than a first threshold value in the determination area outside the first area and inside the second area. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus is determined to be good. The area setting means sets a third area outside the second area;
The determination unit includes the coloring region within a region outside the second region and inside the third region, even if a ratio of the coloring region in the determination region is equal to or greater than a first threshold value. 3. The board inspection apparatus according to claim 2, wherein if the proportion of the lead is equal to or greater than a second threshold value, it is determined that the soldering of the lead is defective. The lead of the electronic component is fixed and soldered in a direction inclined at a predetermined angle with respect to the land formed on the substrate surface,
The area setting means sets a fourth area that is substantially concentric with respect to the land, and further, an area that is set based on the inclination direction of the lead in the fourth area is set as a determination area. ,
The said determination means determines that the soldering of the said lead is favorable when the ratio for which the said coloring area accounts within the said determination area is 3rd threshold value or more. Board inspection equipment.   The determination means includes a ratio of the colored region in a region other than the determination region in the fourth region even if the ratio of the colored region in the determination region is equal to or greater than the third threshold. 5. The board inspection apparatus according to claim 4, wherein the lead soldering is determined to be defective when the value is equal to or greater than a fourth threshold value.   6. The substrate inspection apparatus according to claim 1, wherein a central portion of the reflecting member is opened, and the imaging unit is provided in the opening.

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