JP2012011540A - Board machining apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding die apparatus for machining a sheet like a printed circuit board.SOLUTION: The board machining apparatus includes: a die supporting a motherboard and having a first through hole; a stripper disposed above the die and having a second through hole formed at a position corresponding to the first through hole; a punch inserted into the second through hole, protruding downward via the second through hole, and inserted into the first through hole; and a collection unit disposed below the die and collecting a unit board cut from the motherboard and falling via the first through hole. The collection unit includes a transfer conveyor structure.

Description

  The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus in which substrate processing and recovery processing are automated.

  A thin plate such as a printed circuit board (PCB) is manufactured by a process of obtaining a plurality of unit circuit boards by cutting a mother board in a sheet form. Such a mother substrate cutting step is performed using a predetermined mold apparatus.

  1a to 1d are views for explaining a process of processing a thin plate using a conventional mold apparatus.

  Referring to FIG. 1a, the substrate processing apparatus 1 according to the prior art moves a die 10 having a first through hole 11, a pad 20 inserted into the first through hole 11, and the pad 20 up and down. The knockout rod 30, the stripper 50 in which the second through hole 52 is formed, and the punch 40 inserted into the second through hole 52 can be included.

  Referring to FIG. 1b, when the substrate is processed, the mother substrate 2 is placed on the stripper 50. When the mother substrate 2 and the stripper 50 are pushed while the die 10 is lowered, the buffer spring 54 is compressed and the punch 40 is moved to the first position. It protrudes to the upper part of the stripper 50 through the two through holes 52. The projected punch 40 cuts a predetermined area of the mother substrate 2, whereby the unit substrate 4 is manufactured. The unit substrate 4 is moved by being pushed by the pad 20 by the punch 40 and inserted into the first through hole 11.

  Referring to FIG. 1 c, when the die 10 is raised, the stripper 50 is returned to the original position by the buffer spring 54, and the unit substrate 4 falls downward from the first through hole 11.

  Referring to FIG. 1 d, in the process of returning the die 10 to the original state, the pad 20 is returned to the original state by the knockout bar 30, and the unit substrate 4 is detached from the first through hole 11 by such a pad 20.

  However, the substrate processing apparatus having the above-described structure has low recovery efficiency of the manufactured unit substrate 4. That is, the manufactured unit substrate 4 is dropped onto the stripper 50. At this time, the manufactured unit substrate 4 is collected manually by a human and transported to an apparatus in which a subsequent process is performed. Accordingly, a time delay occurs in the process of collecting the unit substrate 4 and moving to the subsequent process apparatus, and the process is performed manually. Therefore, problems such as loss and damage may occur in the transportation process. High nature.

Korean Published Patent No. 10-2009-0053190

The problem to be solved by the present invention is to provide a substrate processing apparatus that improves the recovery efficiency of manufactured unit substrates.
An object of the present invention is to provide a substrate processing apparatus that automates the recovery of manufactured unit substrates.

  A substrate processing apparatus according to the present invention includes a die that supports a mother substrate and has a first through hole, and a stripper that is disposed above the die and has a second through hole formed at a position corresponding to the first through hole. And a punch that is inserted into the second through hole, protrudes downward through the second through hole and is inserted into the first through hole, and is disposed at a lower portion of the die and cut from the mother substrate. And a recovery unit that recovers the unit substrate dropped through the first through hole, and the recovery unit includes a transfer conveyor structure.

  According to an embodiment of the present invention, the collection unit includes a first roller disposed at a lower portion of the die, a second roller spaced from the first roller and disposed at a place where a subsequent process is performed, A transfer belt surrounding the first roller and the second roller.

  A substrate processing apparatus according to the present invention includes a die, a stripper, and a punch configured to drop a unit substrate manufactured by cutting a mother substrate in a downward direction. A recovery unit may be further included for transporting the unit substrate to a place where a subsequent process is performed. Accordingly, the substrate processing apparatus according to the present invention automates the process of manufacturing the unit substrate and the process of transporting the manufactured unit substrate to a place where the subsequent process is performed, thereby improving the manufacturing and recovery efficiency of the unit substrate. Can be made.

6 is a diagram for explaining a process of processing a thin plate using a conventional mold apparatus. 6 is a diagram for explaining a process of processing a thin plate using a conventional mold apparatus. 6 is a diagram for explaining a process of processing a thin plate using a conventional mold apparatus. 6 is a diagram for explaining a process of processing a thin plate using a conventional mold apparatus. 1 is a view showing a substrate processing apparatus according to an embodiment of the present invention. 5 is a diagram for explaining a substrate processing process according to an exemplary embodiment of the present invention. 5 is a diagram for explaining a substrate processing process according to an exemplary embodiment of the present invention. 5 is a diagram for explaining a substrate processing process according to an exemplary embodiment of the present invention. 5 is a diagram for explaining a substrate processing process according to an exemplary embodiment of the present invention.

  Advantages and features of the present invention, techniques for achieving them, and the like will be apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various different forms. The embodiments can be provided to complete the disclosure of the present invention and to fully convey the scope of the invention to those who have ordinary knowledge in the technical field to which the present invention belongs. Like reference numerals refer to like elements throughout the specification.

  The terminology used herein is for describing the embodiments and is not intended to limit the present invention. In this specification, the singular forms include plural forms unless otherwise specified. As used herein, “comprise” and / or “comprising” refers to a component, stage, operation and / or element referred to is one or more other components, stages, operations and Do not exclude the presence or addition of elements.

  Hereinafter, a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 2 shows a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing apparatus 100 according to the embodiment of the present invention may include a mold unit and a recovery unit 170.

  The mold unit can perform a step of cutting the mother substrate 2. The mold unit may include a die 110, a stripper 150, and a punch 160.

  The die 110 may be a support on which the mother substrate 2 is placed when the substrate is processed. A first through hole 112 may be formed in the die 110 in a region where the mother substrate 2 is placed. The first through hole 112 may be used as a discharge port through which the unit substrate 4 cut from the mother substrate 2 is discharged.

  The stripper 150 can cut the mother substrate 2 placed on the die 110. For example, the stripper 150 may be formed to move up and down on the die 110. A second through hole 152 is formed in the stripper 150 in a region facing the first through hole 112. The second through hole 152 may have a shape substantially corresponding to the first through hole 112. The stripper 150 may be provided with a buffer spring 154. The stripper 150 is lowered by the buffer spring 154, is positioned at a strip position adjacent to the die 110, and then is initially positioned at a standby position separated from the die 110. Can do.

  The punch 160 may be formed to be inserted into the second through hole 152 of the stripper 150. The punch 160 is formed to be driven up and down through the second through hole 152 and is driven to be inserted into the first through hole 112 of the die 110 when the mother substrate 2 is cut. be able to.

  The collection unit 170 may include a transfer conveyor structure that collects the unit substrate 4 manufactured by the above-described mold unit to a place where a subsequent process is performed. For example, the recovery unit 170 may be disposed under the die 110. The collection unit 170 may include a first roller 172, a second roller 174, and a transfer belt 176 that surrounds the first roller 172 and the second roller 174. One end of the transfer belt 176 may be disposed at a position facing the first through hole 112, and the other end of the transfer belt 176 may be disposed adjacent to a place where the subsequent process is performed. . Since the transfer belt 176 has a configuration in which the unit substrate 4 is dropped and placed, it is preferable that the transfer belt 176 is formed of a material that can reduce an impact so that the unit substrate 4 is not damaged.

  The recovery unit 170 having the above-described structure may be transferred to a place where a subsequent process is performed after receiving the unit substrate 4 cut from the mother substrate 2 and dropped through the first through hole 112. it can.

  As described above, the substrate processing apparatus 100 according to the present invention includes a mold structure for manufacturing the unit substrate 4 by cutting the mother substrate 2 and a transfer conveyor structure for transferring the unit substrate 4 to a place where a subsequent process is performed. be able to. Accordingly, the substrate processing apparatus 100 according to the present invention improves the process efficiency by automating the process of manufacturing the unit substrate 4 by cutting the mother substrate 2 and the process of transporting the unit substrate 4 to the subsequent process. Thus, errors and damages due to human manual work can be prevented, and the overall process time can be shortened.

  Further, the substrate processing apparatus 100 according to the present invention includes a punch 160 on the die 110, the punch 160 cuts the mother substrate 2 placed on the die 110, and passes through the first through hole 112 of the die 110. When the unit substrate 4 is dropped below the die 110, the unit substrate 4 may be recovered by the recovery unit 170. Accordingly, the substrate processing apparatus 100 according to the present invention has a punch below the die 110 and the unit substrate 4 is removed from the die 110 as compared with a structure in which the unit substrate is placed on the top of the die 110 and collected. Since manual operation for collection is unnecessary, the collection efficiency of the unit substrate 4 can be improved.

  Hereinafter, a substrate processing process of the substrate processing apparatus according to the above-described embodiment of the present invention will be described in detail. Here, the overlapping contents of the substrate processing apparatus 100 described above can be omitted or simplified.

  3 to 6 are views for explaining a substrate processing process according to an embodiment of the present invention. First, referring to FIG. 3, the mother substrate 2 can be positioned on the die 110 of the substrate processing apparatus 100 described above with reference to FIG. The mother board 2 may be an insulating sheet for manufacturing a printed circuit board. At this time, the mother substrate 2 may be disposed on the first through hole 112 of the die 110. That is, the region to be cut of the mother substrate 2 and the position of the first through hole 112 may be aligned with each other.

  The die 110 can then be raised. Accordingly, both the mother substrate 2 and the stripper 150 can be raised while the mother substrate 2 disposed on the die 110 is raised and brought into contact with the stripper 150. When the stripper 150 is raised by the mother board 2, the mother board 2 is fixed by the die 110 and the stripper 150, and is prevented from being detached. In this state, when the die 110 is further raised and the buffer spring 154 of the stripper 150 is further compressed, the punch 160 protrudes downward through the second through hole 152 of the stripper 150 by the compressed force. Can be done. The unit substrate 4 can be manufactured by cutting a part of the mother substrate 2 by the protruded punch 160.

  Referring to FIG. 4, after the unit substrate 4 is manufactured, the die 110 is lowered, and the stripper 150 pushed up by the mother substrate 2 can be returned to the standby position by the elasticity of the compressed buffer spring 154. Accordingly, the end of the punch 160 protruding through the second through hole 152 can be positioned inside the second through hole 152. Further, when the die 110 is further lowered, the mother substrate 2 and the stripper 150 which are in contact with each other can be separated from each other.

  Referring to FIGS. 5 and 6, the unit substrate 4 cut from the mother substrate 2 can be dropped onto the transfer belt 176 of the recovery unit 170 through the first through hole 112 of the die 110. Accordingly, the unit substrate 4 can be placed on one side of the transfer belt 176 of the recovery unit 170. Then, by rotating the first roller 172 and the second roller 174 of the recovery unit 170, the unit substrate 4 placed on the transfer belt 176 can be transported to a place where a subsequent process is performed.

  The manufacturing process of the unit substrate 4 and the transporting process of the unit substrate 4 described above can be performed repeatedly. Accordingly, in the process of transporting the unit substrate 4, another mother substrate is further carried into the mold structure, and another unit substrate can be manufactured. Through this process, the substrate processing apparatus 100 according to the present invention can automate the production and recovery of the unit substrate 4 and increase the production speed. The collection efficiency of the substrate 4 can be improved.

  The above detailed description illustrates the invention. Also, the foregoing is merely illustrative and illustrative of the preferred embodiment of the present invention and the present invention can be used in a variety of other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in the present specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge of the industry. The embodiments described above are for explaining the best state in carrying out the present invention, in other states known in the art in using other inventions such as the present invention, and for the invention. Various modifications required in specific application fields and applications are possible. Accordingly, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other implementations.

2 Mother substrate 4 Unit substrate 100 Substrate processing device 110 Die 112 First through hole 150 Stripper 152 Second through hole 154 Buffer spring 160 Punch 170 Recovery unit 172 First roller 174 Second roller 176 Transfer belt

Claims (2)

A die that supports the mother substrate and has a first through hole;
A stripper disposed on the die and having a second through hole formed at a position corresponding to the first through hole;
A punch that is inserted into the second through hole, protrudes downward through the second through hole, and is inserted into the first through hole;
A recovery unit disposed under the die and recovering a unit substrate that is cut from the mother substrate and dropped through the first through hole;
Including
The recovery unit is a substrate processing apparatus including a transfer conveyor structure. The collection unit is
A first roller disposed under the die;
A second roller spaced from the first roller and disposed at a location where a subsequent process is performed;
A transfer belt surrounding the first roller and the second roller;
The board | substrate processing apparatus of Claim 1 containing this.

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