JP2012004154A - Component embedding multi-layer wiring board and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component embedding multi-layer wiring board in which electronic components to be mounted on the surface and the rear face of the wiring board can be manufactured in a one-time connection process, and a manufacturing method therefor.SOLUTION: The component embedding multi-layer wiring board includes: a first printed wiring board; a second printed wiring board having an identical size to the first printed wiring board; a first electronic component to be mounted on the surface layer of the first printed wiring board; and a second electronic component to be embedded between the first printed wiring board and the second printed wiring board and to be mounted on the rear layer of the first printed wiring board opposite to the first electronic component. By use of through holes provided on both ends of the first electronic component and the second electronic component on the first printed wiring board, the connection of the first printed wiring board to the second electronic component is simultaneously made at the time of the connection of the first printed wiring board to the first electronic component.

Description

  The present invention relates to a component built-in multilayer wiring board and a method for manufacturing the same.

  A component built-in multilayer wiring board that promotes miniaturization of a module by arranging electronic parts (passive parts such as chip-type resistors and capacitors) inside and outside the wiring board has been developed.

  When an electronic component is built in a wiring board, soldering is often used as a method of connecting the electrode terminal of the electronic component and the wiring board pattern. Conventionally, the electronic component on the surface layer and the built-in electronic component are connected separately, so the adhesive material (solder, etc.) at the connection part of the built-in electronic component is remelted when connecting the electronic component on the surface layer. There is a risk that the part will be deformed and the connection will be insufficient. For this reason, the solder temperature is limited, and a mounting method at a temperature below the solder melting point (about 230 ° C. for Pb-free solder) is required for mounting the wiring board.

  Further, as electronic components are mounted on both sides of the circuit board, the first electronic component is mounted on the front surface of the circuit board, the second electronic component 3 is mounted on the back surface of the circuit board, and the circuit board is sandwiched between them. Double-sided mounting in which at least one pair of electrode parts of the first electronic component and electrode parts of the second electronic component facing each other are connected by a conductor member integrally formed in a through hole formed in the circuit board 1 A circuit board has been invented (see, for example, Patent Document 1).

  However, in the manufacturing process of the double-sided mounting circuit board disclosed in Patent Document 1, the first electronic component is obtained by melting the electrode pads on the surface of the circuit board and the spherical electrode terminals (bumps) formed on the through-hole electrode pads. Connect and fix, then reverse the circuit board, melt the spherical electrode terminal (bump) formed on the electrode pad on the back of the circuit board and the electrode pad for the through hole, and connect and fix the second electronic component It is a process to do. For this reason, in order to connect and fix the first electronic component and the second electronic component, two melting operations are required, and there is a problem that workability is poor.

JP 2008-277691 A

  The problem to be solved by the present invention is to provide a multilayer wiring board with a built-in component that can manufacture electronic components mounted on the front and back surfaces of the wiring board in a single connection step, and a method for manufacturing the same.

  In order to achieve the above object, a component built-in multilayer wiring board according to an embodiment includes a first printed wiring board, a second printed wiring board having the same size as the first printed wiring board, and the first printed wiring board. A first electronic component mounted on a surface layer of the printed wiring board; and the first printed wiring board that is built in between the first printed wiring board and the second printed wiring board and faces the first electronic component. A second electronic component mounted on a back layer; provided at both ends of the first electronic component and the second electronic component of the first printed wiring board; and the first printed wiring board and the first electronic component; And a through hole on at least both sides that contributes to the connection between the first printed wiring board and the second electronic component.

  The multilayer wiring board with built-in components according to another embodiment includes a first printed wiring board, a second printed wiring board and a third printed wiring board having the same size as the first printed wiring board, Built in a first electronic component mounted on the surface layer of the first printed wiring board, a notch formed between the first printed wiring board and the third printed wiring board and in the second printed wiring board A second electronic component mounted on a back layer of the first printed wiring board facing the first electronic component, and both ends of the first electronic component and the second electronic component of the first printed wiring board Through holes on at least both sides that contribute to the connection between the first printed wiring board and the second electronic component when the first printed wiring board and the first electronic component are connected to each other. It is characterized by having.

  In another embodiment of the method of manufacturing a component built-in multilayer wiring board, the second electronic component is temporarily fixed to the back layer of the first printed wiring board, and the first printed wiring of the temporarily fixed layer is provided. A second printed wiring board having a notch for housing the second electronic component on the board and a third printed wiring board that is a layer on the opposite side of the first printed wiring board are stacked. A step of rotating the laminated multilayer wiring board by 180 °, a step of placing a first electronic component on a surface layer of the first printed wiring board of the rotated multilayer wiring board, and the first The first printed wiring simultaneously with the connection between the first printed wiring board and the first electronic component using through holes provided at both ends of the first electronic component and the second electronic component of the printed wiring board And a step of connecting the plate and the second electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounted in the surface and back surface of a multilayer wiring board can be manufactured in one connection process, and the structure of a component built-in multilayer wiring board with good workability and its manufacturing method can be provided. . In addition, by arranging electronic components (chip-type resistors, capacitor passive components, etc.) inside the wiring board, it is possible to promote downsizing of the module and improve the reliability of the connection of the internal electronic components. it can.

The block diagram which shows the structure of the component built-in multilayer wiring board which concerns on this embodiment. The figure which shows the 1st manufacturing process of the component built-in multilayer wiring board which concerns on this embodiment. The figure which shows the 2nd manufacturing process of the component built-in multilayer wiring board which concerns on this embodiment. The figure which shows the shape rotated 180 degrees after the 2nd manufacturing process of the component built-in multilayer wiring board which concerns on this embodiment. The figure which shows the 3rd manufacturing process of the component built-in multilayer wiring board which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Example)
FIG. 1 is a diagram showing a configuration of a component built-in multilayer wiring board according to an embodiment of the present invention. FIG. 1 shows a six-layer wiring board (substrate) in which three double-sided printed wiring boards 100, 200, 300 are stacked. In addition, you may design the number of lamination | stacking of a printed wiring board arbitrarily according to a use.

  First and second electronic components 10a and 10b (for example, chip-type resistors and passive components of capacitors) are provided on both surfaces of the first printed wiring board 100 on which the first and second wiring patterns are formed. Is connected. The first electronic component 10 a is a component mounted on the surface layer (first layer) of the first printed wiring board 100. The second electronic component 10b is mounted on the back layer (second layer) at a position facing the first electronic component 10a and has the same size / shape as the first electronic component 10a. The second electronic component 10b is a component built in the multilayer wiring board.

  Through holes 20 and 22 are provided at both ends of the position where the first electronic component 10a and the second electronic component 10b of the first printed wiring board 100 are connected. Electrode patterns 30 a and 30 b are formed on the surface layer (first layer) and the back layer (second layer) of the through-hole 20. Similarly, electrode patterns 40 a and 40 b are formed on the surface layer (first layer) and the back layer (second layer) of the through hole 22. Further, the inner walls of the through holes 20 and 22 are plated.

  The electrode portions of the first electronic component 10a are placed and connected to the electrode patterns 30a and 40a on the surface layer (first layer). Further, the electrode parts of the second electronic component 10b are placed and connected to the electrode patterns 30b and 40b of the back layer (second layer).

  In the process of manufacturing the component built-in multilayer wiring board of the present embodiment, an adhesive 50 is applied between the second electronic component 10b and the first printed wiring board 100, and the second electronic component 10b is replaced with the first printed wiring board. When the first electronic component 10a is solder-connected to the surface layer (first layer) of the first printed wiring board 100 in a state of being temporarily fixed to the back layer (second layer) of 100, the through-holes 20 and 22 are interposed. Then, the second electronic component 10b is simultaneously solder-connected to the back layer (second layer) of the first printed wiring board 100. Thus, the first electronic component 10a and the second electronic component 10b are opposed to each other and fixed to the first printed wiring board 100. Details of the manufacturing method will be described later. The wiring patterns 60 and 70 in the back layer (second layer) indicate the wiring board pattern of the second electronic component 10b.

  With this configuration, the second electronic component 10b is built in the multilayer wiring board (substrate), and the first electronic component 10a is soldered to the surface layer (first layer) of the first printed wiring board 100. At the same time, the second electronic component 10b is simultaneously semi-connected to the back layer (second layer) of the first printed wiring board 100 by flowing solder from the surface layer (first layer) through the through holes 20 and 22. Since the first electronic component 10a and the second electronic component 10b are connected to the first printed wiring board 100 at the same time, it is possible to stably connect to the first printed wiring board 100.

  The second printed wiring board 200 on which the third and fourth wiring patterns are formed is provided between the first printed wiring board 100 and the third printed wiring board 300. The second printed wiring board 200 is positioned between the first printed wiring board 100 and the third printed wiring board 300 by interlayer adhesives 210 and 220. And the notch part is formed in a part of wiring board in the position where the 2nd electronic component 10b of the 2nd printed wiring board 200 is arrange | positioned. Accordingly, a space 230 for housing the second electronic component 10b is formed.

  Further, the third layer and the fourth layer of the second printed wiring board 200 are electrically connected by the through hole 240 formed in the second printed wiring board 200. A wiring pattern 250 indicates a wiring board pattern formed on the surface of the second printed wiring board 200.

  The third printed wiring board 300 on which the fifth and sixth wiring patterns are formed is a wiring board that forms the opposite surface of the first printed wiring board 100. Here, the through hole 310 formed in the third printed wiring board 300, the electrode pattern 320 on the fifth layer side of the through hole 310, the electrode pattern 330 on the sixth layer side, and the wiring pattern on the fifth layer side 340, the wiring patterns 350, 360, etc. on the sixth layer side are shown.

  According to the configuration of the component built-in multilayer wiring board described above, the second electronic component 10b of the back layer (second layer) temporarily fixed to the first printed wiring board 100 and the surface layer (first layer) opposite to the second electronic component 10b. The first electronic component 10a can be simultaneously connected by the same material (solder or the like) through the through holes 20 and 22 provided at both ends thereof.

Next, a manufacturing method of the component built-in multilayer wiring board shown in FIG. 1 will be described.
2 to 5 show the manufacturing process of the component built-in multilayer wiring board according to this embodiment.
First, FIG. 2 shows a first manufacturing process. Here, it is assumed that through holes 20 and 22 are formed at electrode positions where the second electronic component 10b of the first printed wiring board 100 is mounted. It is assumed that electrode patterns 30a, 40a and 30b, 40b are formed on both sides of the through holes 20, 22. Furthermore, it is assumed that wiring patterns 60 and 70 of the second electronic component 10b are also formed on the first printed wiring board 100.

  In this first step, an adhesive 50 is applied between the electrode pattern 30 b of the through hole 20 of the first printed wiring board 100 and the electrode pattern 40 b of the through hole 22. Then, the electrode part of the second electronic component 10 b is placed on the electrode pattern 30 b of the through hole 20 and the electrode pattern 40 b of the through hole 22, and the second electronic component 10 b is attached to the first printed wiring board 100 by the adhesive 50. Temporarily fix to. As a result, the configuration is as shown in FIG.

  FIG. 3 shows a second manufacturing process. In the second manufacturing process, the second printed wiring board 200 and the third printed wiring board 300 in which a notch for housing the second electronic component 10b is formed are fixed with interlayer adhesives 210 and 220. In the state, it is laminated on the first printed wiring board 100 as a base. Accordingly, the first printed wiring board 100, the second printed wiring board 200, and the third printed wiring board 300 are connected and fixed by the interlayer adhesives 210 and 220. At this time, the second electronic component 10b on the built-in side is disposed in the space 230 by the notch.

  Next, the laminated wiring boards as shown in FIG. 3B are rotated by 180 ° so that the first layer of the first printed wiring board 100 is positioned on the upper surface as shown in FIG.

  FIG. 5 shows a third manufacturing process. In the third manufacturing process, the electrode pattern 30a of the through hole 20 and the electrode pattern 40a of the through hole 22 are formed with the surface layer (first layer) of the first printed wiring board 100 positioned on the upper surface as shown in FIG. An adhesive material 400 such as solder is put on the top. Then, the first electronic component 10 a is placed on the adhesive material 400. Then, the adhesive material 400 is melted to connect the electrode patterns 30a, 40a of the first printed wiring board 100 and the electrode portions of the first electronic component 10a.

  The molten adhesive material 400 flows into both sides of the second electronic component 10b of the second layer through the through holes 20 and 22, and the electrode patterns 30b and 40b of the first printed wiring board 100 and the electrodes of the second electronic component 10b. Connect the parts. As a result, the component built-in multilayer wiring board shown in FIG. 5B can be manufactured.

  According to the present embodiment, the first electronic component 10a mounted on the surface layer of the first printed wiring board 100 and the second electronic component 10b mounted on the inner side are simultaneously bonded with the same material. A highly reliable connection can be made without the shape of the connecting portion of the electronic component 10b being deformed. Further, in this embodiment, since the bonding work (soldering work) of the first electronic component 10a on the surface layer and the built-in second electronic component 10b can be performed in a lump, the manufacturing process can be simplified.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed in design without departing from the gist of the present invention. For example, the configuration may be such that the second printed wiring board is eliminated and the first printed wiring board and the second printed wiring board are connected by an interlayer adhesive.

DESCRIPTION OF SYMBOLS 100 ... 1st printed wiring board 200 ... 2nd printed wiring board 300 ... 3rd printed wiring board 10a ... 1st electronic component 10b ... 1st electronic component 20, 22, 240, 310 ... Through-hole 30a, 30b, 40a, 40b, 320, 330 ... electrode pattern 50 ... temporary fixing adhesive 60, 70, 250, 340, 350, 360 ... wiring pattern 210, 220 ... interlayer adhesive 230 ... space 400 ... adhesive material

Claims (3)

A first printed wiring board;
A second printed wiring board having the same size as the first printed wiring board;
A first electronic component mounted on a surface layer of the first printed wiring board;
A second electronic component built between the first printed wiring board and the second printed wiring board and mounted on the back layer of the first printed wiring board facing the first electronic component;
The first printed wiring board is provided at both ends of the first electronic component and the second electronic component of the first printed wiring board, and when the first printed wiring board and the first electronic component are connected, Through holes on at least both sides contributing to connection with the second electronic component;
A multilayer wiring board with a built-in component, comprising: A first printed wiring board;
A second printed wiring board and a third printed wiring board having the same size as the first printed wiring board;
A first electronic component mounted on a surface layer of the first printed wiring board;
The first printed wiring board that is built in between the first printed wiring board and the third printed wiring board and in a notch formed in the second printed wiring board and that faces the first electronic component. A second electronic component mounted on the back layer;
The first printed wiring board is provided at both ends of the first electronic component and the second electronic component of the first printed wiring board, and when the first printed wiring board and the first electronic component are connected, Through holes on at least both sides contributing to connection with the second electronic component;
A multilayer wiring board with a built-in component, comprising: Temporarily fixing the second electronic component to the back layer of the first printed wiring board;
A second printed wiring board having a notch for housing the second electronic component on the first printed wiring board of the temporarily fixed layer, and a layer opposite to the first printed wiring board Laminating a third printed wiring board to be
Rotating the laminated multilayer wiring board by 180 °;
Placing a first electronic component on a surface layer of the first printed wiring board of the rotated multilayer wiring board;
Using the through holes provided at both ends of the first electronic component and the second electronic component of the first printed wiring board, the first printed wiring board and the first electronic component are connected simultaneously with the first electronic component. Connecting the printed wiring board and the second electronic component;
A method of manufacturing a component built-in multilayer wiring board, comprising:

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