JP2011525698A5 - - Google Patents

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Publication number
JP2011525698A5
JP2011525698A5 JP2011510606A JP2011510606A JP2011525698A5 JP 2011525698 A5 JP2011525698 A5 JP 2011525698A5 JP 2011510606 A JP2011510606 A JP 2011510606A JP 2011510606 A JP2011510606 A JP 2011510606A JP 2011525698 A5 JP2011525698 A5 JP 2011525698A5
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JP
Japan
Prior art keywords
less
polyimide film
filler
polyimide
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011510606A
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English (en)
Japanese (ja)
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JP2011525698A (ja
Filing date
Publication date
Priority claimed from PCT/US2009/043441 external-priority patent/WO2009142940A1/en
Application filed filed Critical
Publication of JP2011525698A publication Critical patent/JP2011525698A/ja
Publication of JP2011525698A5 publication Critical patent/JP2011525698A5/ja
Pending legal-status Critical Current

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JP2011510606A 2008-05-20 2009-05-18 熱および寸法安定性ポリイミドフィルム、電極および吸光体層を備えるアセンブリ、ならびに、これに関する方法 Pending JP2011525698A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5450908P 2008-05-20 2008-05-20
US61/054,509 2008-05-20
PCT/US2009/043441 WO2009142940A1 (en) 2008-05-20 2009-05-11 Assemblies comprising a thermally and dimensionally stable polyimide film, an electrode and an absorber layer, and methods relating thereto
USPCT/US2009/043441 2009-05-11
PCT/US2009/044285 WO2009143034A1 (en) 2008-05-20 2009-05-18 Assemblies comprising a thermally and dimensionally stable polyimide film, an electrode and an absorber layer, and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2011525698A JP2011525698A (ja) 2011-09-22
JP2011525698A5 true JP2011525698A5 (cg-RX-API-DMAC7.html) 2012-05-17

Family

ID=40786468

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011510570A Expired - Fee Related JP5346078B2 (ja) 2008-05-20 2009-05-11 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法
JP2011510606A Pending JP2011525698A (ja) 2008-05-20 2009-05-18 熱および寸法安定性ポリイミドフィルム、電極および吸光体層を備えるアセンブリ、ならびに、これに関する方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2011510570A Expired - Fee Related JP5346078B2 (ja) 2008-05-20 2009-05-11 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法

Country Status (4)

Country Link
US (2) US20120009406A1 (cg-RX-API-DMAC7.html)
JP (2) JP5346078B2 (cg-RX-API-DMAC7.html)
DE (2) DE112009001229B4 (cg-RX-API-DMAC7.html)
WO (3) WO2009142938A1 (cg-RX-API-DMAC7.html)

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CN103154139B (zh) * 2010-09-29 2016-09-07 纳幕尔杜邦公司 用于高温应用的聚酰亚胺树脂
CN102532521B (zh) * 2010-12-15 2014-03-12 慧濠光电科技股份有限公司 含光吸收功能的纳米晶粒的高分子复合材料的制作方法
CN103137239B (zh) * 2011-11-25 2015-11-25 比亚迪股份有限公司 一种太阳能电池正面电极银浆及其制备方法、以及一种太阳能电池片
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JP6661552B2 (ja) * 2015-01-22 2020-03-11 ユニチカ株式会社 積層体およびその製造方法および使用方法ならびにガラス基板積層用ポリイミド前駆体溶液
CN112920601A (zh) * 2016-05-12 2021-06-08 纳幕尔杜邦公司 聚酰亚胺组合物以及聚酰亚胺测试插座壳体
DE102020108932A1 (de) 2020-03-31 2021-09-30 Kerafol Holding Gmbh Folienbauteil sowie Verfahren zu dessen Herstellung

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