JP2011515865A - 重複映像を用いたｆｐｄ基板及び半導体ウエハ検査システム - Google Patents

重複映像を用いたｆｐｄ基板及び半導体ウエハ検査システム Download PDF

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Publication number
JP2011515865A
JP2011515865A JP2011501713A JP2011501713A JP2011515865A JP 2011515865 A JP2011515865 A JP 2011515865A JP 2011501713 A JP2011501713 A JP 2011501713A JP 2011501713 A JP2011501713 A JP 2011501713A JP 2011515865 A JP2011515865 A JP 2011515865A
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JP
Japan
Prior art keywords
image
unit
camera
scan
semiconductor wafer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011501713A
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English (en)
Japanese (ja)
Inventor
ホン，キ−ヒョン
ナ，サン−チャン
キム，テ−ホン
Original Assignee
ワイズプラネット カンパニー，リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ワイズプラネット カンパニー，リミテッド filed Critical ワイズプラネット カンパニー，リミテッド
Publication of JP2011515865A publication Critical patent/JP2011515865A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
JP2011501713A 2008-03-28 2009-03-12 重複映像を用いたｆｐｄ基板及び半導体ウエハ検査システム Pending JP2011515865A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020080029120A KR100863341B1 (ko) 2008-03-28 2008-03-28 중복 영상을 이용한 에프피디 기판 및 반도체 웨이퍼검사시스템
KR10-2008-0029120 2008-03-28
PCT/KR2009/001234 WO2009119983A2 (ko) 2008-03-28 2009-03-12 중복 영상을 이용한 에프피디 기판 및 반도체 웨이퍼 검사시스템

Publications (1)

Publication Number Publication Date
JP2011515865A true JP2011515865A (ja) 2011-05-19

Family

ID=40153333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011501713A Pending JP2011515865A (ja) 2008-03-28 2009-03-12 重複映像を用いたｆｐｄ基板及び半導体ウエハ検査システム

Country Status (4)

Country Link
JP (1) JP2011515865A (ko)
KR (1) KR100863341B1 (ko)
CN (1) CN101681862B (ko)
WO (1) WO2009119983A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465722B2 (ja) * 2015-04-06 2019-02-06 株式会社ディスコ 加工装置
KR101972517B1 (ko) * 2017-09-05 2019-05-02 주식회사 에이치비테크놀러지 검사대상체 표면 검사를 위한 듀얼 라인 광학 검사 시스템
JP7102271B2 (ja) * 2018-07-17 2022-07-19 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN111142315A (zh) * 2020-02-25 2020-05-12 北京工业大学 近地激光照明装置
CN113013048A (zh) * 2021-02-24 2021-06-22 上海华力集成电路制造有限公司 晶圆缺陷检测方法
KR102539964B1 (ko) 2021-04-30 2023-06-05 주식회사 바이텍시스템 정전척 및 이를 이용한 기판 검사장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100269448B1 (ko) * 1997-11-10 2000-10-16 윤종용 납땜검사장치및이에적합한검사방법
KR100345001B1 (ko) * 1998-08-27 2002-07-19 삼성전자 주식회사 기판 납땜 검사용 조명 및 광학 장치
JP4190636B2 (ja) * 1998-11-24 2008-12-03 日本エレクトロセンサリデバイス株式会社 表面検査装置
JP3686329B2 (ja) * 2000-08-22 2005-08-24 シーシーエス株式会社 表面検査用照明装置及び表面検査装置

Also Published As

Publication number Publication date
CN101681862A (zh) 2010-03-24
CN101681862B (zh) 2011-08-31
WO2009119983A3 (ko) 2009-11-26
WO2009119983A2 (ko) 2009-10-01
KR100863341B1 (ko) 2008-10-15

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