JP2011510577A - 微小機械式共振器 - Google Patents
微小機械式共振器 Download PDFInfo
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- JP2011510577A JP2011510577A JP2010543534A JP2010543534A JP2011510577A JP 2011510577 A JP2011510577 A JP 2011510577A JP 2010543534 A JP2010543534 A JP 2010543534A JP 2010543534 A JP2010543534 A JP 2010543534A JP 2011510577 A JP2011510577 A JP 2011510577A
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- micromechanical resonator
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- resonance frequency
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
- 230000035945 sensitivity Effects 0.000 claims abstract description 12
- 238000013459 approach Methods 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
- H02N1/008—Laterally driven motors, e.g. of the comb-drive type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
- H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
- H03H9/02275—Comb electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
- H03H9/2484—Single-Ended Tuning Fork resonators with two fork tines, e.g. Y-beam cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02299—Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
Abstract
【選択図】 図4
Description
m=NwfhLfρ
であり、ここでNは電極フィンガ5〜9の数、wfは電極フィンガ幅、hは高さ、Lfは電極フィンガ長さ、ρは密度である。
を寸法変化δの関数として示している。図5では、w=3はばねの幅であって、W=1は質量フィンガの幅である。
はδ=0においてゼロであって、製造変動は1次については補償されていることがわかる。勾配
は、製造寸法変動に対する周波数感度として定義される。共振器の寸法を適切に設定することによって、周波数感度
はゼロに近づき、製造変動は1次については補償される。
が変化する。これによって、製造変動に対する周波数の感度を減少させる自由度が増す。
についても見られる。したがって、勾配
がゼロになって、製造変動が2次まで補償される点が2つ存在する。パラメータaの値を増加させると、極大値が減少し、パラメータaの十分に大きな値によって、寸法変化への周波数変化の局所依存は単調になる。これによって、図7に示しているように、製造変動に対する周波数の感度を減少させる自由度が増す。
d=d0−δ
ここで、d0は理想的な電極間隔、δは電極の寸法変化である。電極の大きさが増加すると、電極間の間隔は減少する。前述の2つの式からわかるように、以下の式が得られる。
を寸法変化δの関数として示している。図示しているグラフ19〜22は、全ての前述の3つのアプローチの組み合わせの効果を示しており、広範囲な変動に対して寸法変化への感度をどのようにして最小にするかを示している。前述の3つの方法の組み合わせを周波数変化を最小にするために使用している。これらの曲線において、共振器の寸法は変化し、間隔も変化している。
2、12、13 質量
3 ばね構造
4 可動質量構造
5〜9、25、26、31〜34 電極フィンガ
11、14 ばね
Claims (12)
- 可動質量構造(4)とばね構造(3)、(23〜24)、(27〜30)とを有する微小機械式共振器であって、前記可動質量構造(4)は1つに接続されている少なくとも2つの電極フィンガ(5〜9)、(25〜26)、(31〜34)からなり、前記ばね構造(3)、(23〜24)、(27〜30)は、一方の端部から固定されており、他方の端部で前記質量に接続されている少なくとも1つのばね要素(3)、(23〜24)、(27〜30)からなる微小機械式共振器において、前記少なくとも1つのばね要素(3)、(23〜24)、(27〜30)の幅は、前記少なくとも2つの電極フィンガ(5〜9)、(25〜26)、(31〜34)の幅よりも広く、前記幅は、寸法製造変動d(Δω0/ω0)/dδに対する共振周波数の感度がゼロに近づくように特に寸法が設定されていることを特徴とする、微小機械式共振器。
- 該微小機械式共振器は、前記ばね要素(3)、(23〜24)、(27〜30)の幅が、前記電極フィンガ(5〜9)、(25〜26)、(31〜34)の幅の2〜5倍であることを特徴とする、請求項1に記載の微小機械式共振器。
- 該微小機械式共振器は、前記ばね要素(3)、(23〜24)、(27〜30)の幅が、前記電極フィンガ(5〜9)、(25〜26)、(31〜34)の幅の約3倍であることを特徴とする、請求項1に記載の微小機械式共振器。
- 前記電極フィンガ(5〜9)、(25〜26)、(31〜34)の共振周波数は、該共振器の共振周波数よりも2〜5倍高いことを特徴とする、請求項1〜3のいずれか1項に記載の微小機械式共振器。
- 前記幅の寸法の設定において、前記寸法製造変動に対する共振周波数の変化の傾斜が2つ以上の位置でゼロに近づくように前記幅は寸法が設定されることを特徴とする、請求項1〜4のいずれか1項に記載の微小機械式共振器。
- 前記ばね要素(23〜24)は音叉構造を形成するように1つに固定されている2つのばね要素(23〜24)からなることを特徴とする、請求項1〜5のいずれか1項に記載の微小機械式共振器。
- 前記幅の寸法の設定において、前記電極フィンガ(5〜9)、(25〜26)、(31〜34)の曲げの効果が考慮されることを特徴とする、請求項1〜7のいずれか1項に記載の微小機械式共振器。
- 前記寸法製造変動に対する共振器共振周波数の変化の極大値が発生するように、電極フィンガ共振周波数が共振器共振周波数に影響するように前記電極フィンガの長さも寸法が設定されていることを特徴とする、請求項1〜8のいずれか1項に記載の微小機械式共振器。
- 該微小機械式共振器は、前記電極フィンガ(5〜9)、(25〜26)、(31〜34)の長さが、前記ばね要素(3)、(23〜24)、(27〜30)の長さの1/6〜1/2倍であることを特徴とする、請求項9に記載の微小機械式共振器。
- 該微小機械式共振器は該共振器を静電気的に作動させる手段をさらに有することを特徴とする、請求項1〜10のいずれか1項に記載の微小機械式共振器。
- 該微小機械式共振器は500nmから5μmの電極間隔の幅を有することを特徴とする、請求項1〜11のいずれか1項に記載の微小機械式共振器。
Applications Claiming Priority (3)
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US2341408P | 2008-01-24 | 2008-01-24 | |
US61/023,414 | 2008-01-24 | ||
PCT/FI2009/000020 WO2009092846A1 (en) | 2008-01-24 | 2009-01-23 | A micromechanical resonator |
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JP2011510577A true JP2011510577A (ja) | 2011-03-31 |
JP5662160B2 JP5662160B2 (ja) | 2015-01-28 |
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JP2010543534A Active JP5662160B2 (ja) | 2008-01-24 | 2009-01-23 | 微小機械式共振器 |
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US (2) | US8102224B2 (ja) |
EP (1) | EP2245738B1 (ja) |
JP (1) | JP5662160B2 (ja) |
KR (1) | KR101694133B1 (ja) |
CN (1) | CN101919159B (ja) |
WO (1) | WO2009092846A1 (ja) |
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- 2009-01-23 EP EP09703126.4A patent/EP2245738B1/en active Active
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- 2009-01-23 WO PCT/FI2009/000020 patent/WO2009092846A1/en active Application Filing
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US20120091854A1 (en) | 2012-04-19 |
CN101919159A (zh) | 2010-12-15 |
KR20100111724A (ko) | 2010-10-15 |
EP2245738B1 (en) | 2015-06-17 |
EP2245738A4 (en) | 2014-03-12 |
WO2009092846A1 (en) | 2009-07-30 |
CN101919159B (zh) | 2014-01-08 |
US8102224B2 (en) | 2012-01-24 |
EP2245738A1 (en) | 2010-11-03 |
WO2009092846A8 (en) | 2009-09-17 |
US20090189481A1 (en) | 2009-07-30 |
JP5662160B2 (ja) | 2015-01-28 |
US8334736B2 (en) | 2012-12-18 |
KR101694133B1 (ko) | 2017-01-09 |
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