JP2011253880A - Electronic component mounting board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure conduction reliably while reducing a mounting area in wire bonding packaging.SOLUTION: An aperture 17 is formed through a wiring board 10 at a predetermined position thereof, and a chip body 22 of a semiconductor chip 20 is mounted toward the wiring board 10 side so that a chip electrode 21 faces the aperture 17. An insulating substrate 12 at a position continuous to the aperture 17 of the wiring board 10 is removed to become an electrode expose part 18, and a substrate electrode 11a where a wiring layer 11 is exposed is formed. The chip electrode 21 and the substrate electrode 11a are connected in the aperture 17 and the electrode expose part 18 by being bonding with a wire 19.

Description

  The present invention relates to a mounting substrate for an electronic component such as a semiconductor chip and a method for manufacturing the same, and more particularly to an electronic component capable of reliably ensuring conduction while reducing a mounting area and a mounting height in wire bonding mounting. The present invention relates to a mounting substrate and a manufacturing method thereof.

  As a method for mounting an electronic component such as a semiconductor chip on a substrate, wire bonding mounting as disclosed in Patent Document 1 below is known. In this wire bonding mounting, for example, as shown in FIG. 9, the chip-side electrode 201 is formed on the chip body 202 at the mounting position on the substrate 100 where the substrate-side wiring and the electrode 102 are formed on the base material 101. The semiconductor chip 200 is mounted via the bonding sheet 103 so that the electrode 201 faces the side opposite to the substrate 100.

  Then, the electrode 102 of the substrate 100 and the electrode 201 of the semiconductor chip 200 are connected by bonding with a metal wire 109, and the entire mounting portion of the substrate 100 is sealed with the sealing resin 106, thereby completing the mounting.

Japanese Patent Laid-Open No. 5-102337

  However, in the above-described conventional wire bonding mounting, the electrode 201 of the semiconductor chip 200 is mounted so as to face the side opposite to the substrate 100, and the wire 109 is further extended from the electrode 201 to form a loop portion, and then the electrode 102. Need to connect with. For this reason, it is necessary to form the electrode 102 at a certain distance from the semiconductor chip 200, and it is necessary to secure the mounting height of the semiconductor chip 200 to some extent, thereby reducing the area required for mounting or suppressing the height. Had the problem of being difficult.

  Further, when the wire 109 is extended from the electrode 201, bonding is performed in a state in which the wire 109 is in contact with the edge portion of the chip body 202 of the semiconductor chip 200 due to poor formation of the loop portion as in the defective edge portion Z shown in FIG. May end up. In such a case, when the chip body 202 is made of a material having low insulation, there is a risk that a conduction failure may occur or a short circuit may occur.

  The present invention provides a mounting board for an electronic component and a method for manufacturing the same capable of reliably ensuring conduction while reducing the mounting area and the mounting height in order to solve the above-described problems caused by the prior art. For the purpose.

  In order to solve the above-described problems and achieve the object, an electronic component mounting substrate according to the present invention includes a substrate having an opening and a wiring layer formed on the substrate, and the electrode of the electronic component is the above-described electrode. It is mounted on the substrate so as to face the opening, and the electrode of the electronic component and the wiring layer of the substrate are connected by wire bonding through the opening.

  According to the electronic component mounting substrate of the present invention, the electronic component is mounted so that the electrode faces the opening of the substrate, and the electrode of the electronic component and the wiring layer of the substrate are connected by wire bonding through the opening. In addition, the wires can be connected in a state of being embedded in the opening, so that the mounting area of the electronic component can be reduced and the mounting height can be reduced. Further, since the wire does not structurally come into contact with the edge portion of the electronic component, it is possible to ensure electrical continuity between the electrode of the electronic component and the wiring layer of the substrate.

  In the electronic component mounting substrate according to one aspect of the present invention, for example, the surfaces of the electronic component electrodes and the wiring layer connected by the wire bonding are in the same direction. As a result, the electrode and the wiring layer can be connected in a state where the length of the wire is close to the shortest, so that the mounting area can be reduced and the mounting height can be reduced.

  In the electronic component mounting substrate according to one embodiment of the present invention, the opening is sealed with resin.

  In addition, the wiring layer is provided, for example, on the mounting side of the electronic component of the substrate or on the side opposite to the mounting side. However, the surface to which the wiring layer is connected faces the same direction as the electrode of the electronic component.

  Further, the electrode may be connected to the wiring layer outside the mounting area on which the electronic component is mounted on the substrate, or may be connected to the wiring layer inside the mounting area.

  The electronic component mounting substrate manufacturing method according to the present invention includes a step of forming an opening penetrating a predetermined portion of a substrate having a wiring layer, a step of exposing the wiring layer at a peripheral portion of the opening, Mounting the electronic component on the substrate such that the electrode faces the opening, and connecting the electrode of the electronic component and the exposed wiring layer by wire bonding through the opening. Features.

  According to the method for manufacturing an electronic component mounting substrate according to the present invention, the opening is formed in the substrate, the wiring layer is exposed at the peripheral portion, and the electronic component is mounted so that the electrode faces the opening. Since the electrode of the electronic component and the wiring layer of the substrate are connected through the opening by wire bonding, the wire can be connected in a state of being embedded in the opening, reducing the mounting area of the electronic component and reducing the mounting height. Can be achieved. Further, since the wire does not structurally come into contact with the edge portion of the electronic component, it is possible to ensure electrical continuity between the electrode of the electronic component and the wiring layer of the substrate.

  In the method for manufacturing a mounting substrate for an electronic component according to an aspect of the present invention, for example, the electronic component is placed on the substrate such that the electrode faces the same direction as a surface to which the exposed wiring layer is connected by the wire bonding. Implemented. As a result, the electrode and the wiring layer can be connected in a state where the length of the wire is close to the shortest, so that the mounting area can be reduced and the mounting height can be reduced.

  In the method for manufacturing an electronic component mounting substrate according to an aspect of the present invention, the method may further include a step of sealing the opening with a resin.

  According to the present invention, it is possible to reliably ensure conduction while reducing the mounting area and the mounting height.

It is sectional drawing which shows the mounting structure of the mounting substrate of the electronic component which concerns on the 1st Embodiment of this invention. It is A arrow directional view of FIG. It is a top view which shows the example of mounting of the mounting board | substrate of the same electronic component. It is a top view which shows the example of mounting of the mounting board | substrate of the same electronic component. It is a top view which shows the example of mounting of the mounting board | substrate of the same electronic component. It is a top view which shows the example of mounting of the mounting board | substrate of the same electronic component. It is a flowchart which shows the mounting process by the manufacturing method of the mounting substrate of the electronic component which concerns on the 1st Embodiment of this invention. It is process drawing for demonstrating the mounting process by the manufacturing method of the mounting substrate of the same electronic component. It is sectional drawing which shows the mounting structure of the mounting substrate of the electronic component which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the mounting structure of the mounting substrate of the electronic component which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the mounting structure of the mounting substrate of the electronic component which concerns on the 4th Embodiment of this invention. It is a figure for demonstrating the conventional wire bonding mounting.

  Exemplary embodiments of an electronic component mounting board and a method of manufacturing the same according to the present invention will be explained below in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a cross-sectional view showing a mounting structure of a mounting board for an electronic component according to a first embodiment of the present invention, and FIG. 2 is a view taken along arrow A in FIG. The electronic component mounting substrate according to the first embodiment of the present invention is applied, for example, when a semiconductor chip 20 as an electronic component is mounted on a wiring substrate 10 as shown in FIGS.

  The wiring board 10 is composed of, for example, a flexible printed board (FPC), a rigid board, or the like. The wiring substrate 10 is made of, for example, an insulating resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), epoxy resin (for example, glass epoxy resin), or liquid crystal polymer (LCP). An insulating base material 12 made of a base material, a wiring layer 11 made of a metal material such as copper (Cu) formed on one side of the insulating base material 12, and an epoxy on the insulating base material 12 and the wiring layer 11 And a coverlay 13 as a protective member attached via an adhesive 14 made of a synthetic or acrylic synthetic resin material. The coverlay 13 is made of a synthetic resin material similar to the insulating base material 12.

  In addition to the protective member constituted by the combination of the cover lay 13 and the adhesive 14, although not shown in the drawings, in the wiring board 10, for example, a solder made of a photosensitive or thermosetting insulating resin material. A resist may be used as a protective member. In the case of forming a photosensitive solder resist, for example, after applying an insulating resin material constituting the solder resist on the insulating base material 12 and the wiring layer 11 by screen printing, the solder resist is applied to a necessary portion by a normal photolithography technique. Should be formed.

  Further, when forming a thermosetting solder resist, for example, by applying an insulating resin material constituting the solder resist only to necessary portions on the insulating base material 12 and the wiring layer 11 by screen printing, the resin is cured by heat. A solder resist may be formed. As described above, the protective member can be provided on the wiring board 10 also by the solder resist. As the insulating resin material constituting the solder resist, the same material as the insulating base material 12 can be used.

  The semiconductor chip 20 is various integrated circuits, packages, memories, and the like, and includes a chip main body 22 and a chip electrode 21 formed on the mounting surface 22a side of the chip main body 22 on the wiring substrate 10. The semiconductor chip 20 is mounted via a bonding sheet 15 on a mounting portion formed so that only the insulating base material 12 is exposed, for example, with the chip electrode 21 facing the wiring substrate 10 side.

  An opening 17 penetrating in the thickness direction of the substrate is formed at a predetermined position of the wiring substrate 10 by, for example, punching with a mold or drilling with a drill. The predetermined location refers to a location including a region facing the chip electrode 21 of the semiconductor chip 20 at the mounting location, for example, and the semiconductor chip 20 is mounted so that the chip electrode 21 faces the opening 17.

  Further, on the side opposite to the mounting side of the semiconductor chip 20 of the wiring substrate 10, the insulating base 12 is removed by laser processing using a carbon dioxide gas laser, a UV-YAG laser, or the like, and an electrode exposed portion continuous with the opening 17. In this electrode exposed portion 18, in this example, the insulating base material 12 is removed so that one surface of the wiring layer 11 is exposed to face the same direction as the electrode surface of the chip electrode 21. A substrate electrode 11a of the wiring substrate 10 is formed.

  The substrate electrode 11a and the chip electrode 21 are formed so that the wire 19 made of a metal material such as gold (Au) or copper is placed in the opening 17 and the electrode exposed portion 18 so that the length of the wire 19 is close to the shortest. By being bonded to each other, they are electrically connected through the opening 17. The surface of the substrate electrode 11a is preferably plated with a metal material such as gold similar to the wire 19.

  Further, the opening 17 and the electrode exposed portion 18 are filled with a sealing resin 16 made of a thermosetting resin or an ultraviolet curable resin so as to cover the chip electrode 21, the substrate electrode 11 a, and the wire 19. 10 and the semiconductor chip 20 are sealed. By sealing the opening 17 and the electrode exposed portion 18 with the sealing resin 16 in this way, it is possible to reduce the mounting area of the semiconductor chip 20 and the mounting height.

  The semiconductor chip 20 is specifically mounted as follows and supported by the wiring board 10. 3A to 3D are plan views showing examples of mounting the semiconductor chip 20 on the wiring board 10. For example, as shown in FIG. 3A, a semiconductor chip 20 formed in a rectangular shape and having chip electrodes 21 formed on a pair of opposing two sides excluding corners is mounted on the periphery of the mounting portion so that these chip electrodes 21 face each other. Mounted on the wiring substrate 10 exposed so that the electrode surface of the substrate electrode 11a faces in the same direction as the electrode surface of the chip electrode 21 by the opening 17 formed in a pair in the part and the electrode exposed part 18 continuous with the opening 17 To do.

  In this case, since the mounting location of the semiconductor chip 20 is continuous with the insulating base material 12 (not shown) of the wiring substrate 10 on the other two opposite sides of the pair including the corners, the openings 17 and Even if the electrode exposed portion 18 is provided, the semiconductor chip 20 is mounted on the wiring substrate 10 while being securely supported.

  Further, as shown in FIG. 3B, two pairs of semiconductor chips 20 each having chip electrodes 21 formed on two opposite sides excluding corners are arranged on the periphery of the mounting portion so that these chip electrodes 21 face each other. The substrate is mounted on the wiring substrate 10 that is exposed so that the electrode surface of the substrate electrode 11 a faces the same direction as the electrode surface of the chip electrode 21 by the paired opening 17 and the electrode exposed portion 18 that is continuous with the opening 17.

  In this case, the mounting portion of the semiconductor chip 20 is continuous with the insulating base material 12 of the wiring board 10 at the four corners excluding two pairs of two opposite sides, so that the opening 17 and the electrode exposed portion 18 are formed. Even if it is provided, the semiconductor chip 20 is mounted on the wiring substrate 10 in a sufficiently supported state. If the opening 17 and the electrode exposed portion 18 are sealed with the sealing resin 16, the sealing resin 16 also functions as a support member (member) of the semiconductor chip 20, so that there is no problem in strength.

  Further, as shown in FIG. 3C, the semiconductor chip 20 in which the chip electrodes 21 are respectively formed on the portions excluding the intermediate portion and the corner portion of the two pairs of two opposing sides, the intermediate portion is arranged so that the chip electrodes 21 face each other. The openings 17 are formed in two sets of peripheral edges composed of two continuous sides of a dogleg shape opposite to each other on the diagonal including the corners of the mounting portions except for the portions corresponding to. The electrode exposed portion 18 is mounted on the wiring substrate 10 exposed so that the electrode surface of the substrate electrode 11 a faces the same direction as the electrode surface of the chip electrode 21.

  In this case, since the mounting location of the semiconductor chip 20 is continuous with the insulating base material 12 of the wiring board 10 at the intermediate portion between two pairs of two sides facing each other, the opening 17 is provided in most of the peripheral portion of the mounting location. Even in the state where the electrode exposed portion 18 is provided, the semiconductor chip 20 is mounted in a state of being sufficiently supported on the wiring substrate 10. Also in this case, if the opening 17 and the electrode exposed part 18 are sealed with the sealing resin 16, no problem in strength occurs.

  Further, as shown in FIG. 3D, the semiconductor chip 20 having the chip electrodes 21 formed on the two sides of the set including the corners is arranged at the corners of the peripheral portion of the mounting portion so that the chip electrodes 21 face each other. The electrode surface of the substrate electrode 11a is directed in the same direction as the electrode surface of the chip electrode 21 by the opening 17 formed on the two continuous sides of the cross-shaped and the electrode exposed portion 18 continuous with the opening 17. It mounts on the wiring board 10 exposed to (1).

  In this case, since the mounting location of the semiconductor chip 20 is continuous with the insulating base material 12 of the wiring board 10 on the other two sides of the other set including the corner, the opening 17 and the electrode exposed portion 18 are provided. Even if the semiconductor chip 20 is mounted in a sufficiently supported state on the wiring substrate 10 and the opening 17 and the electrode exposed portion 18 are sealed with the sealing resin 16, the problem of strength does not occur. . If a member other than the wiring board 10 can be used as a support member of the semiconductor chip 20, the semiconductor chip 20 may be supported by that.

  According to the electronic component mounting substrate according to the first embodiment that realizes such a mounting structure, the semiconductor chip 20 is mounted on the same surface when the wiring layer 11 and the insulating base 12 are used as a reference. The electrode 21 is connected to the substrate electrode 11 a having an electrode surface formed so as to face the same direction as the electrode surface of the chip electrode 21 outside the mounting region of the semiconductor chip 20. Therefore, the substrate electrode 11a of the wiring substrate 10 is formed at a position adjacent to the semiconductor chip 20 so that the length of the wire is made shortest by the chip electrode 21 and the wire 19 through the opening 17 and the electrode exposed portion 18. Therefore, the mounting area of the semiconductor chip 20 and the mounting height can be reduced as compared with the conventional wire bonding mounting.

  Further, as shown in FIG. 1, the loop portion of the wire 19 is not in contact with the edge portion of the semiconductor chip 20 due to its structure, and even if the loop portion contacts, the contact portion is the edge portion of the substrate electrode 11a. Therefore, it is possible to reliably connect the substrate electrode 11a and the chip electrode 21 to ensure conduction.

  Furthermore, although illustration is omitted, since the chip electrode 21 and the substrate electrode 11a can be connected by the wire 19 through the opening 17 and the electrode exposed portion 18, the vicinity of the mounting location of the semiconductor chip 20 on the wiring substrate 10 is possible. Since other electronic components can be arranged on both the front and back surfaces, the mounting space can be reduced and the components using the wiring board 10 can be downsized.

  Here, the mounting process by the manufacturing method of the mounting board of the electronic component according to the first embodiment of the present invention will be described with reference to FIG. 5 while referring to the flowchart of FIG. First, as shown in FIG. 5A, the wiring layer 11 is formed on the insulating base 12 excluding the mounting location of the semiconductor chip 20 by a separate processing step, and the cover lay 13 is further formed via the adhesive 14. The prepared wiring board 10 is prepared (step S100).

  Then, as shown in FIG. 5B, the opening 17 penetrating the wiring board 10 is formed by performing the punching process or the drilling process as described above at a predetermined location (step S102). Further, as shown in FIG. 5 (c), the insulating base material 12 in a portion continuous with the opening 17 on the side opposite to the mounting side of the semiconductor chip 20 is removed by the laser processing as described above to remove the electrode exposed portion 18. Then, the substrate electrode 11a with the wiring layer 11 exposed is formed so as to face the same direction as the electrode surface of the chip electrode 21 on which the electrode surface is mounted (step S104). Note that the order of step S102 and step S104 may be interchanged.

  After the substrate electrode 11a is formed, the chip body 22 of the semiconductor chip 20 is bonded to the bonding sheet so that the chip electrode 21 of the semiconductor chip 20 faces the wiring substrate 10 and faces the opening 17 as shown in FIG. 15 is mounted on the mounting location of the wiring board 10 via die bonding (step S106).

  Then, as shown in FIG. 5E, the chip electrode 21 in the opening 17 and the substrate electrode 11a formed by the electrode exposed portion 18 are bonded and connected by the wire 19 in the opening 17 (step S108). Finally, the sealing resin 16 is filled so as to fill the opening 17 and the electrode exposed portion 18, and the wiring substrate 10 and the semiconductor chip 20 are resin-sealed (step S110), and a series of mounting steps according to this flowchart. Ends. As a result, as shown in FIG. 1, the semiconductor chip 20 is mounted on the wiring substrate 10 after the substrate electrode 11 a and the chip electrode 21 are connected by the wire 19 in the opening 17 and the electrode exposed portion 18. .

[Second Embodiment]
FIG. 6 is a cross-sectional view showing the mounting structure of the electronic component mounting board according to the second embodiment of the present invention. In the following description, the same reference numerals are assigned to portions that overlap with the portions that have already been described, and description thereof is omitted, and portions that are not particularly relevant to the present invention may not be specified.

  In the second embodiment, the semiconductor chip 20 is mounted on the same surface when the wiring layer 11 and the insulating base 12 are used as a reference. However, the electrode surfaces of the electrode exposed portion 18 and the substrate electrode 11a are the semiconductor chip 20. This is different from the previous first embodiment in that it is formed in the mounting region of the mounting location so as to face the same direction as the electrode surface of the chip electrode 21. Accordingly, the chip body 22 of the semiconductor chip 20 is mounted on the insulating base 12 including the wiring layer 11 via the bonding sheet 15. Even if the semiconductor chip 20 is mounted on the wiring substrate 10 in this manner, the same effects as those of the first embodiment can be obtained.

[Third Embodiment]
FIG. 7 is a cross-sectional view showing the mounting structure of the electronic component mounting board according to the third embodiment of the present invention. In the third embodiment, the semiconductor chip 20 is mounted on the side opposite to the wiring layer 11 (the back side of the insulating base 12), and the electrode exposed portion 18 and the electrode surface of the substrate electrode 11 a are the surface of the wiring substrate 10. It differs from the previous embodiment in that it is formed on the side so as to face the same direction as the electrode surface of the chip electrode 21 and is formed outside the mounting area of the mounting location of the semiconductor chip 20.

  That is, the chip body 22 of the semiconductor chip 20 is mounted on the back surface of the insulating base 12 via the bonding sheet 15 so that the chip electrode 21 faces the opening 17, and the electrode exposed portion 18 is interposed via the adhesive 14. It is formed by processing the coverlay 13 to be attached in advance. Even if the semiconductor chip 20 is mounted on the wiring board in this way, the mounting area can be reduced to ensure conduction, and the cover lay 13 is removed to form the electrode exposed portion 18 to form the substrate electrode 11a. Since the forming process can be omitted, the mounting process can be further simplified.

[Fourth Embodiment]
FIG. 8: is sectional drawing which shows the mounting structure of the mounting substrate of the electronic component which concerns on the 4th Embodiment of this invention. In the fourth embodiment, the semiconductor chip 20 is mounted on the surface opposite to the wiring layer 11, but the electrode exposed portion 18 and the electrode surface of the substrate electrode 11 a are on the surface side of the wiring substrate 10 and the electrode surface of the chip electrode 21. Is different from the third embodiment in that the semiconductor chip 20 is formed in the mounting region of the mounting portion. Other configurations, operational effects, and the like are the same as those of the third embodiment.

  The mounting structure according to the first embodiment described above and the mounting structure according to the second embodiment are combined, or the mounting structure according to the third embodiment and the mounting structure according to the fourth embodiment are combined. Alternatively, the semiconductor chip 20 may be mounted on the wiring board 10. In this way, the degree of freedom of the mounting mode of the semiconductor chip 20 can be further expanded.

DESCRIPTION OF SYMBOLS 10 Wiring board 11 Wiring 12 Insulating board 13 Coverlay 14 Adhesive 15 Bonding sheet 16 Sealing resin 17 Through-hole 18 Opening part 20 Semiconductor chip 21 Chip electrode 22 Chip body

Claims (10)

A substrate having an opening and a wiring layer formed on the substrate,
Mounted on the substrate so that the electrode of the electronic component faces the opening,
The electronic component mounting substrate, wherein the electrode of the electronic component and the wiring layer of the substrate are connected through the opening through wire bonding.   2. The electronic component mounting substrate according to claim 1, wherein the electrodes of the electronic component and the surface of the wiring layer connected by the wire bonding face in the same direction.   3. The electronic component mounting board according to claim 1, wherein the opening is sealed with a resin.   The electronic component mounting substrate according to claim 1, wherein the wiring layer is provided on a side of the substrate on which the electronic component is mounted.   4. The electronic component mounting board according to claim 1, wherein the wiring layer is provided on a side of the substrate opposite to the electronic component mounting side. 5.   The electronic component mounting substrate according to claim 1, wherein the electrode is connected to the wiring layer outside the mounting area on which the electronic component is mounted on the substrate.   6. The electronic component mounting substrate according to claim 1, wherein the electrode is connected to the wiring layer in a mounting region on the substrate where the electronic component is mounted. Forming an opening penetrating a predetermined portion of the substrate having a wiring layer;
Exposing the wiring layer at the periphery of the opening;
Mounting the electronic component on the substrate such that the electrode faces the opening;
And a step of connecting the electrode of the electronic component and the exposed wiring layer by wire bonding through the opening.   9. The electronic component mounting substrate according to claim 8, wherein the electronic component is mounted on the substrate such that the electrode faces the same direction as a surface of the exposed wiring layer connected by the wire bonding. Manufacturing method. The method for manufacturing a mounting substrate for an electronic component according to claim 8 or 9, further comprising a step of sealing the opening with a resin.

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