JP2011251450A5 - - Google Patents

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Publication number
JP2011251450A5
JP2011251450A5 JP2010126332A JP2010126332A JP2011251450A5 JP 2011251450 A5 JP2011251450 A5 JP 2011251450A5 JP 2010126332 A JP2010126332 A JP 2010126332A JP 2010126332 A JP2010126332 A JP 2010126332A JP 2011251450 A5 JP2011251450 A5 JP 2011251450A5
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JP
Japan
Prior art keywords
laminate
circuit board
printed circuit
copper foil
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010126332A
Other languages
English (en)
Japanese (ja)
Other versions
JP5624368B2 (ja
JP2011251450A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010126332A priority Critical patent/JP5624368B2/ja
Priority claimed from JP2010126332A external-priority patent/JP5624368B2/ja
Publication of JP2011251450A publication Critical patent/JP2011251450A/ja
Publication of JP2011251450A5 publication Critical patent/JP2011251450A5/ja
Application granted granted Critical
Publication of JP5624368B2 publication Critical patent/JP5624368B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010126332A 2010-06-01 2010-06-01 積層体 Expired - Fee Related JP5624368B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010126332A JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126332A JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Publications (3)

Publication Number Publication Date
JP2011251450A JP2011251450A (ja) 2011-12-15
JP2011251450A5 true JP2011251450A5 (enExample) 2013-07-18
JP5624368B2 JP5624368B2 (ja) 2014-11-12

Family

ID=45415799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010126332A Expired - Fee Related JP5624368B2 (ja) 2010-06-01 2010-06-01 積層体

Country Status (1)

Country Link
JP (1) JP5624368B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6212570B2 (ja) * 2012-12-26 2017-10-11 アクロン ポリマー システムズ，インク． 溶剤耐性フレキシブル基板のためのポリアミドフィルムを製造するためのポリアミド溶液、およびディスプレイ用素子、光学用素子、又は照明用素子の製造方法
US20150257296A1 (en) * 2014-03-07 2015-09-10 Taiflex Scientific Co., Ltd. Cover layer with high thermal resistance and high reflectivity for a printed circuit board
EP2916628A1 (en) * 2014-03-07 2015-09-09 Taiflex Scientific Co., Ltd. Cover layer with high thermal resistance and high reflectivity for a printed circuit board
KR102109787B1 (ko) * 2016-12-27 2020-05-12 주식회사 엘지화학 플라스틱 적층 필름
JP7164945B2 (ja) 2017-11-14 2022-11-02 ニチハ株式会社 補修用シール、補修用シールの製造方法及び補修構造
TWI671571B (zh) * 2018-03-27 2019-09-11 同泰電子科技股份有限公司 用於背光模組的封裝結構
CN110845846B (zh) * 2019-11-06 2021-08-17 无锡顺铉新材料有限公司 一种白色聚酰亚胺复合薄膜及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084110A (ja) * 2000-12-14 2003-03-19 Mitsui Chemicals Inc 反射体、サイドライド型バックライト型装置および反射体基板
EP1627901B1 (en) * 2003-05-21 2020-02-19 Hitachi Chemical Co., Ltd. Primer, conductor foil with resin, laminate and process for producing the laminate
JP4704011B2 (ja) * 2004-11-04 2011-06-15 株式会社ピーアイ技術研究所 金属複合フィルム
WO2008015839A1 (en) * 2006-07-31 2008-02-07 Hitachi Chemical Co., Ltd. Heat-resistant resin paste
JP2008168439A (ja) * 2007-01-09 2008-07-24 Toyobo Co Ltd 金属白色ポリイミド積層体とその製造方法
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
JP2009263404A (ja) * 2008-04-22 2009-11-12 Toray Ind Inc ペースト組成物およびそれを用いた樹脂組成物
JP5595381B2 (ja) * 2009-03-31 2014-09-24 三井化学株式会社 低熱膨張性ブロックポリイミドおよびその前駆体ならびにその用途

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