JP2011238839A - Electronic component and production method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component capable of suppressing a failure in forming external electrodes formed over a top surface and a side surface of a laminate, and a method for producing the electronic component.SOLUTION: A laminate 16 is constituted by laminating insulator layers 30a through 30e. Insulator layers 30b through 30e constitute a partial laminate 13. The insulator layer 30a covers the side surface and the top surface of the partial laminate 13. An external electrode 20 is disposed over the top surface and the side surface of the laminate 16. The partial laminate 13 is constituted by the side surfaces and the top surfaces of the insulator layers 30b through 30e, and is formed as steps with the footplates facing up in the z-axis direction.

Description

  The present invention relates to an electronic component and a manufacturing method thereof, and more specifically to an electronic component in which an external electrode is provided in a laminate and a manufacturing method thereof.

  As a conventional electronic component, for example, an electronic component described in Patent Document 1 is known. FIG. 9 is a partially enlarged view of the electronic component 500 described in Patent Document 1. In the electronic component 500, a laminated body 504 is formed by laminating a resin insulating layer 501 by a photolithography process on an LTCC (Low Temperature Co-fired Ceramics) substrate 502. An external electrode 506 is provided so as to straddle the side surface and the upper surface of the multilayer body 504.

  By the way, in the electronic component described in Patent Document 1, since the insulator layer 501 is manufactured by a photolithography process, it has a relatively smooth main surface. Therefore, the adhesion between the insulator layers 501 is relatively weak, and peeling between the insulator layers 501 is likely to occur on the side surface of the stacked body 504.

  Therefore, it is known that the electronic device described in Patent Document 1 is devised as described below. FIG. 10 is a partially enlarged view of an electronic component 600 having a configuration that suppresses peeling between the insulator layers 501.

  In the electronic component 600 shown in FIG. 10, an insulator layer 501 (hereinafter referred to as an insulator layer 501a) located on the uppermost side in the stacking direction is used to provide another insulator layer 501 (hereinafter referred to as an insulator layer 501b). ). Thereby, the bonding surface of the insulator layer 501b is covered with the insulator layer 501a. As a result, peeling between the insulator layers 501b is suppressed.

  However, the electronic component 600 has a problem that the formation failure of the external electrode 506 is likely to occur as shown in FIG. More specifically, in the electronic component 600, the insulator layers 501a and 501b are formed by a photolithography process. In the photolithography process, after exposing and curing the photosensitive resin, the uncured photosensitive resin is removed with a developer. For example, when the insulator layer 501a is formed, a photosensitive resin is applied so that the upper surfaces of the stacked body 504 and the LTCC substrate 502 are covered. Then, the photosensitive resin is exposed through a mask. At this time, the insulator layer 501a is exposed to a region slightly protruding from the insulator layer 501b so that the insulator layer 501a covers the side surface of the insulator layer 501b.

  However, the side surface of the insulator layer 501a has the same height as the thickness of the insulator layer 501b in the stacking direction. Therefore, the lower part of the side surface of the insulator layer 501a may not be sufficiently exposed. Therefore, the lower part of the side surface of the insulator layer 501a is more easily removed by the developer than the upper part of the side surface of the insulator layer 501a. That is, the thickness of the upper part of the side surface of the insulator layer 501a is larger than the thickness of the lower part of the side surface of the insulator layer 501a. As a result, the side surface of the insulator layer 501a forms an acute angle with respect to the upper surface of the insulator layer 501a. When the side surface of the insulating layer 501a and the upper surface of the insulating layer 501a form an acute angle, the coverage of the external electrode 506 at the corner between the side surface of the insulating layer 501a and the upper surface of the insulating layer 501a is deteriorated. As a result, as shown in FIG. 10, it is difficult to form an external electrode 506 having a sufficient thickness at the corner between the side surface of the insulator layer 501a and the upper surface of the insulator layer 501a. That is, there is a possibility that a formation defect of the external electrode 506 occurs.

JP 2009-267079 A

  Accordingly, an object of the present invention is to provide an electronic component and a method for manufacturing the same that can suppress the formation failure of the external electrode formed across the upper surface and the side surface of the laminate.

  An electronic component according to an aspect of the present invention includes a plurality of first insulator layers that form a partial laminate by being laminated, and a second insulation that covers a side surface and an upper surface of the partial laminate. A laminated body constituted by a body layer, and an external electrode provided across an upper surface and a side surface of the laminated body, wherein the side surface of the partial laminated body includes the plurality of first insulations. It is comprised by the side surface and upper surface of a body layer, and the tread board has comprised the step shape which faces the upper direction of a lamination direction.

  The method of manufacturing the electronic component includes a first step of forming a partial laminate by laminating a plurality of first insulator layers, and a second insulator layer covering the side surface and the upper surface of the partial laminate. A second step of forming by a photolithography step, and a third step of forming an external electrode straddling the upper surface and the side surface of the second insulator layer. In the first step, the portion The plurality of first insulator layers are configured such that side surfaces of the multilayer body are constituted by side surfaces and main surfaces of the plurality of first insulator layers, and the step board has a step shape facing upward in the stacking direction. Are laminated.

  ADVANTAGE OF THE INVENTION According to this invention, the formation defect of the external electrode formed ranging over the upper surface and side surface of a laminated body can be suppressed.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment. It is an equivalent circuit diagram of an electronic component. It is sectional structure drawing of an electronic component. It is process sectional drawing at the time of manufacture of an electronic component. It is process sectional drawing at the time of manufacture of an electronic component. It is process sectional drawing at the time of manufacture of an electronic component. It is the figure which planarly viewed the electronic component in a cutting process from the z-axis direction. 2 is a partial enlarged view of an electronic component described in Patent Document 1. FIG. It is the elements on larger scale of the electronic component which has the structure which suppresses peeling between insulator layers.

  Hereinafter, an electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

(About the configuration of electronic components)
FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10 according to the embodiment. FIG. 3 is an equivalent circuit diagram of the electronic component 10. FIG. 4 is a cross-sectional structure diagram of the electronic component 10. Hereinafter, the stacking direction of the electronic components 10 is defined as the z-axis direction. Then, when viewed in plan from the z-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 10 is defined as the y-axis direction.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a multilayer body 12, external electrodes 18a, 18b, 20, and 22, lead conductors 42a, 46a, 48, and 52a to 52f, coils L1 and L2, and a capacitor C. ing. The laminated body 12 has a rectangular parallelepiped shape, and as shown in FIG. 1, the laminated body 14 and the laminated body 16 are laminated to form a rectangular parallelepiped shape. The stacked body 16 is provided on the stacked body 14. The external electrode 18a is provided on the side surface of the multilayer body 12 that is located on the negative direction side in the x-axis direction. The external electrode 18b is provided on the side surface of the multilayer body 12 that is located on the positive side in the x-axis direction, and has the same shape as the external electrode 18a. Thus, the external electrodes 18a and 18b are provided on the side surfaces of the stacked body 12 facing each other. The external electrode 20 is provided on the side surface of the multilayer body 12 that is located on the negative direction side in the y-axis direction. The external electrode 22 is provided on the side surface of the multilayer body 12 that is located on the positive side in the y-axis direction, and has the same shape as the external electrode 20. Accordingly, the external electrodes 20 and 22 are provided on the side surfaces of the stacked body 12 facing each other.

  The multilayer body 16 includes coils L1 and L2 and lead conductors 42a, 46a, and 48. Below, the laminated body 16 is demonstrated in detail, referring FIG.

  The stacked body 16 is configured by stacking the insulator layers 30a to 30e in this order from the positive direction side to the negative direction side in the z-axis direction. Further, the insulator layers 30c to 30e constitute the partial stacked body 13. The insulator layers 30a to 30e are rectangular layers made of a transparent insulating material such as polyimide resin, for example. The insulator layers 30a to 30e are formed smaller than the stacked body 14 when viewed in plan from the z-axis direction. Thereby, the laminated body 14 is in a state of protruding from the four sides of the insulator layers 30a to 30e.

  The coil L1 includes coil conductors 40a to 40d and via-hole conductors b1 to b3. For example, the coil conductors 40a to 40d are formed on the main surfaces of the insulator layers 30b to 30e by using a conductive material mainly composed of Ag or Pd, for example. Each of the coil conductors 40a to 40d has a spiral shape by bending a linear conductor. Specifically, the coil conductors 40a and 40c have a spiral shape that turns clockwise while turning clockwise when viewed from the positive side in the z-axis direction. The coil conductors 40b and 40d have a spiral shape that turns counterclockwise when viewed in plan from the positive side in the z-axis direction.

  The via-hole conductors b1 to b3 respectively penetrate the insulator layers 30b to 30d in the z-axis direction, and connect the coil conductors 40a to 40d adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b1 connects the coil conductors 40a and 40b. The via-hole conductor b2 connects the coil conductors 40b and 40c. The via-hole conductor b3 connects the coil conductors 40c and 40d. Thereby, the coil conductors 40a to 40d and the via-hole conductors b1 to b3 constitute the coil L1.

  The lead conductor 42a is formed on the main surface of the insulator layer 30b, for example, with a conductive material mainly composed of Ag or Pd. The lead conductor 42a is connected to the coil conductor 40a and is drawn to the short side located on the negative side of the insulator layer 30b in the x-axis direction. Thereby, the coil conductor 40a is electrically connected to the external electrode 18a. That is, one end of the coil L1 is electrically connected to the external electrode 18a through the lead conductor 42a.

  The coil L2 includes coil conductors 44a to 44d and via-hole conductors b4 to b6, and is aligned with the coil L1 in the x-axis direction. The coil conductors 44a to 44d are, for example, conductive mainly composed of Ag or Pd so as to be arranged on the main surface of the insulator layers 30b to 30e on the positive side in the x-axis direction of the coil conductors 40a to 40d. It is made of material. Each of the coil conductors 44a to 44d has a spiral shape by bending the linear conductor. Specifically, the coil conductors 44a and 44c have a spiral shape that turns counterclockwise when viewed in plan from the positive side in the z-axis direction. The coil conductors 44b and 44d have a spiral shape that turns clockwise while turning clockwise when viewed from the positive side in the z-axis direction.

  The via-hole conductors b4 to b6 respectively penetrate the insulator layers 30b to 30d in the z-axis direction, and connect the coil conductors 44a to 44d adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b4 connects the coil conductors 44a and 44b. The via-hole conductor b5 connects the coil conductors 44b and 44c. The via-hole conductor b6 connects the coil conductors 44c and 44d. Thereby, the coil conductors 44a to 44d and the via-hole conductors b4 to b6 constitute a coil L2.

  The lead conductor 46a is formed on the main surface of the insulator layer 30b by, for example, a conductive material mainly composed of Ag or Pd. The lead conductor 46a is connected to the coil conductor 44a and is drawn to the short side located on the positive side of the insulator layer 30b in the x-axis direction. Thereby, the coil conductor 44a is electrically connected to the external electrode 18b. That is, one end of the coil L2 is electrically connected to the external electrode 18b through the lead conductor 46a.

  The lead conductor 48 is formed of a conductive material mainly composed of Ag or Pd, for example, on the main surface of the insulator layer 30e. The lead conductor 48 is connected to the coil conductors 40d and 44d and is drawn to the long side on the positive direction side in the y-axis direction of the insulator layer 30e. Thereby, the coil conductors 40 d and 44 d are electrically connected to the external electrode 22. That is, the other ends of the coils L1 and L2 are electrically connected to the external electrode 22 via the lead conductor 48.

  The stacked body 14 is a LTCC (Low Temperature Co-fired Ceramics) substrate and has a rectangular parallelepiped shape. The stacked body 14 is formed to be larger than the stacked body 16 when viewed in plan from the z-axis direction. The multilayer body 14 includes a capacitor C and lead conductors 52a to 52f. The stacked body 14 is provided on the negative direction side in the z-axis direction with respect to the stacked body 16. Therefore, the capacitor C is provided on the negative direction side in the stacking direction with respect to the coils L1 and L2.

  The laminate 14 is configured by laminating insulator layers 32a to 32l. The insulator layers 32a to 32l are, for example, rectangular layers made of a dielectric material. In addition, although the 12 insulator layers 32a-321 are described, 12 or more may be sufficient. Therefore, in FIG. 2, the insulator layer 32f and the insulator layer 32g may be connected by a dotted line, and the further insulator layer 32 may be provided between the insulator layer 32f and the insulator layer 32g. It is shown that.

  The capacitor C is composed of capacitor conductors 50a to 50f. The capacitor conductors 50a to 50f are respectively formed on the main surfaces of the insulator layers 32d to 32i by, for example, a conductive material mainly composed of Ag or Pd. Each of the capacitor conductors 50a to 50f has a rectangular shape.

  The lead conductors 52a to 52f are formed of, for example, a conductive material mainly composed of Ag or Pd on the main surfaces of the insulator layers 32d to 32i. The lead conductors 52a, 52c, and 52e are connected to the capacitor conductors 50a, 50c, and 50e, respectively, and are drawn to the long sides on the negative direction side in the y-axis direction of the insulator layers 32d, 32f, and 32h. Thereby, the capacitor conductors 50a, 50c, and 50e are electrically connected to the external electrode 20. The lead conductors 52b, 52d, and 52f are connected to the capacitor conductors 50b, 50d, and 50f, respectively, and are drawn to the long sides on the positive side in the y-axis direction of the insulator layers 32e, 32g, and 32i. Thereby, the capacitor conductors 50b, 50d, and 50f are electrically connected to the external electrode 22.

  The capacitor conductors 50a to 50f and the lead conductors 52a to 52f have the above configuration, so that the capacitor conductors 50a to 50f constitute the capacitor C. More specifically, the capacitor conductors 50a to 50f are opposed to each other in the z-axis direction by laminating the insulator layers 32a to 32l so as to be arranged in this order from the positive direction side to the negative direction side in the z-axis direction. A capacitor C is composed of the two. The lead conductors 52 a, 52 c, 52 e are connected to the external electrode 20, and the lead conductors 52 b, 52 d, 52 f are connected to the external electrode 22.

  Here, the capacitor conductors 50b, 50d, and 50f are electrically connected to the external electrode 22, and the other ends of the coils L1 and L2 are also electrically connected to the external electrode 22. As a result, the capacitor C and the coils L1 and L2 constitute a T-type LC noise filter as shown in FIG.

  By the way, the electronic component 10 has a structure for suppressing formation defects of the external electrodes 18a, 18b, 20, 22 as described below. FIG. 4 is a cross-sectional structure diagram of the laminates 14 and 16 and the external electrode 20 of the electronic component 10.

  As shown in FIG. 4, the insulator layers 30 b to 30 e are stacked so as to be arranged in this order from the positive direction side in the z-axis direction to the negative direction side, thereby forming a partial stacked body 13. The side surface of the partial laminate 13 is constituted by the side surfaces and the upper surface of the insulator layers 30b to 30e, and has a stepped shape with the tread plate facing the positive direction side in the z-axis direction. More specifically, in FIG. 4, the negative side surface in the y-axis direction of the insulator layers 30b to 30e has a negative direction in the y-axis direction as it goes from the positive direction side in the z-axis direction to the negative direction side. Protrudes to the side. Thereby, a part of upper surface of the insulator layers 30c and 30e is exposed. Therefore, the side surfaces of the insulator layers 30b to 30e have a stepped shape having an acute angle gradient with respect to the lower surface of the insulator layer 30e (that is, the upper surface of the stacked body 14). As a result, the side surfaces of the insulator layers 30b to 30e form an obtuse angle with respect to the upper surface of the insulator layer 30b.

  As shown in FIG. 4, the insulator layer 30 a is laminated on the insulator layer 30 b positioned at the uppermost layer among the insulator layers 30 b to 30 e and covers the side surface and the upper surface of the partial laminate 13. . And the side surface of the insulator layer 30a covering the side surface of the partial laminate 13 forms a slope facing the positive direction side in the z-axis direction.

  As shown in FIG. 4, the external electrode 20 is provided across the upper surface and the side surface of the multilayer body 16. The external electrode 20 has a shape that follows the top and side surfaces of the insulator layer 30a. That is, the side surface of the external electrode 20 covering the side surface of the insulator layer 30a forms a slope facing the positive direction side in the z-axis direction.

  In the present embodiment, the external electrode 20 has been described as an example. However, the external electrodes 18 a, 18 b, and 22 have the same structure as the external electrode 20. However, the external electrodes 18a, 18b, and 22 are directly connected to the coils L1 and L2 built in the multilayer body 16, whereas the external electrode 20 is a coil L1 built in the multilayer body 16. , L2 are not directly connected.

(About manufacturing method)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. 5 to 7 are process cross-sectional views when the electronic component 10 is manufactured. FIG. 8 is a plan view of the electronic component 10 in the cutting process from the z-axis direction. 5 to 7 show a manufacturing process of one electronic component 10, but actually, a plurality of electronic components 10 are manufactured collectively in a state of being arranged in a matrix.

  First, the laminated body 14 shown in FIG. 2 is produced. More specifically, a predetermined material is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersing agent are added to the ceramic powder, and the mixture is mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet by a doctor blade method and dried to obtain ceramic green sheets to be the insulator layers 32a to 32l.

  Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheets to be the insulator layers 32d to 32i by a method such as a screen printing method or a photolithography method. By applying, capacitor conductors 50a to 50f and lead conductors 52a to 52f are formed.

  Next, each ceramic green sheet is laminated. Specifically, the insulator layers 32a to 32l are stacked in order from the top, and pressure bonding is performed by a hydrostatic press or the like. Thereafter, firing is performed to obtain a mother laminated body of the laminated body 14.

  Next, as shown in FIG. 5A, an insulator layer 30e made of polyimide resin is formed on the laminate 14 by photolithography. Next, as shown in FIG. 5B, conductive layers 40dA and 44dA made of a conductive material mainly composed of Ag or Pd are formed on the insulating layer 30e by a dry plating method such as sputtering or vapor deposition. .

  Next, after applying and drying a photosensitive resist on the conductive layers 40dA and 44dA, a desired film is exposed by applying a mask film to the photosensitive resist. Next, the photosensitive resist is developed to form a resist pattern 70a having a shape in which unnecessary portions of the conductive layers 40dA and 44dA are exposed as shown in FIG.

  Next, the exposed portions of the conductive layers 40dA and 44dA are removed by etching, and then the resist pattern 70a is removed, whereby the coil conductors 40d and 44d and the lead conductor 48 (see FIG. 6A) are obtained. 6 (a) is formed.

  Next, as shown in FIG. 6B, an insulator layer 30d made of polyimide resin is formed on the insulator layer 30e, the coil conductors 40d and 44d, and the lead conductor 48 by photolithography. At this time, the insulator layer 30d is formed so that the side surface of the insulator layer 30e protrudes from the side surface of the insulator layer 30d. Thereby, a step is formed between the insulator layer 30d and the insulator layer 30e. Further, a via hole h1 is formed at a position where the via hole conductors b3 and b6 of the insulator layer 30d are to be formed.

  Next, as shown in FIG. 6C, conductive layers 40cA and 44cA are formed on the insulator layer 30d by dry plating. At this time, the via hole h1 is filled with a conductive material to form via hole conductors b3 and b6. Thereafter, the processing described with reference to FIGS. 5C to 6B is performed on the conductive layers 40cA and 44cA. Thereby, the coil conductors 40c and 44c and the insulator layer 30c are formed on the insulator layer 30d. Further, the processes described with reference to FIGS. 5C to 6B are repeated to form the coil conductors 40a, 40b, 44a, 44b, the lead conductors 42a, 46a, and the insulator layer 30b. At this time, the insulator layer 30b is formed so that the outer edge of the insulator layer 30c protrudes from the outer edge of the insulator layer 30b. Thereby, a step is formed between the insulator layer 30c and the insulator layer 30b. As described above, when the insulator layers 30b to 30e are formed, the insulator layers 30b to 30e are formed so that the treads are stacked so as to have stepped side surfaces facing the positive side in the z-axis direction. . The partial laminated body 13 is produced by the above process.

  Next, as shown in FIG. 7A, a resin layer 30aA made of polyimide resin is formed so as to cover the side surface and the upper surface of the partial laminate 13. Then, the resin layer 30aA is cured by performing an exposure process through a predetermined mask. Thereafter, the cured resin layer 30aA is developed. By the above exposure process and development process, as shown in FIG. 7B, the insulator layer 30a covering the side surface and the upper surface of the partial laminate 13 is formed by a photolithography process.

  Thereafter, the mother laminated body of the laminated body 12 is cut by a dicer and separated into individual laminated bodies 12. At this time, as shown by a dotted line portion in FIG. 8, the mother laminated body is cut so that the dicer passes through a portion where the insulator layers 30 a to 30 e are not formed. Further, a barrel is applied to the cut laminate 12. Thereby, the corners of the laminate 12 are chamfered.

  Finally, external electrodes 18a, 18b, 20, and 22 are formed. Specifically, a conductive paste made of NiCr, NiCu and resin is applied and cured to form an electrode. Next, Ni plating and Sn plating are performed on the electrodes to form external electrodes 18a, 18b, 20, and 22. The electronic component 10 is completed through the above steps.

(effect)
According to the electronic component 10 according to the present embodiment, formation defects of the external electrodes 18a, 18b, 20, 22 can be suppressed. More specifically, the side surface of the partial laminate 13 has a stepped shape with the tread plate facing the positive direction side in the z-axis direction. Thereby, the side surface of the partial laminated body 13 forms an obtuse angle with respect to the upper surface of the partial laminated body 13. And the insulator layer 30a has covered the side surface and upper surface of the partial laminated body 13, as shown in FIG. Therefore, the side surface of the insulator layer 30a covering the side surface of the partial stacked body 13 forms a slope that faces the positive direction side in the z-axis direction. Thereby, the upper surface and side surface of the insulator layer 30a form an obtuse angle.

  Here, as shown in FIG. 4, the external electrode 20 is provided across the upper surface and the side surface of the multilayer body 16 (insulator layer 30a). The upper surface and the side surface of the insulator layer 30a form an obtuse angle. Therefore, the external electrode 20 is easily formed so as to cover the corner between the upper surface and the side surface of the insulator layer 30a. As a result, in the electronic component 10, the formation failure of the external electrode 20 is suppressed.

  The electronic component 10 is particularly suitable for suppressing the formation failure of the external electrode 20. More specifically, the external electrodes 18a, 18b, and 22 are directly connected to the coils L1 and L2 built in the multilayer body 16. Therefore, the external electrodes 18a, 18b, and 22 are supplied with power to the external electrodes 18a, 18b, and 22 through the other external electrodes 18a, 18b, and 22 and the coils L1 and L2 when the surface is plated. Is done. Therefore, formation defects are relatively unlikely to occur in the external electrodes 18a, 18b, and 22.

  On the other hand, the external electrode 20 is not directly connected to the coils L1 and L2 built in the laminate 16. Therefore, when the surface of the external electrode 20 is plated, power is not supplied to the external electrode 20 via the external electrodes 18a, 18b, 22 and the coils L1, L2. Therefore, the external electrode 20 is more likely to have a formation defect than the external electrodes 18a, 18b, and 22. Therefore, the electronic component 10 is particularly suitable for suppressing the formation failure of the external electrode 20.

(Other embodiments)
The electronic component 10 configured as described above is not limited to that shown in the embodiment. Therefore, the electronic component 10 can be changed within the scope of the gist.

  In the electronic component 10, as shown in FIG. 4, the insulator layers 30c and 30d form one stage with two layers. However, each of the insulator layers 30b to 30e may constitute one stage.

  As described above, the present invention is useful for an electronic component and a method for manufacturing the electronic component, and is particularly excellent in that a formation defect of an external electrode formed across the upper surface and side surfaces of the laminate can be suppressed.

L1, L2 Coil b1-b6 Via-hole conductor 10 Electronic component 12, 14, 16 Laminated body 13 Partial laminated body 18a, 18b, 20, 22 External electrode 30a-30e, 32a-32l Insulator layer

Claims (7)

A laminated body constituted by a plurality of first insulator layers constituting a partial laminated body by being laminated, and a second insulating layer covering the side surface and the upper surface of the partial laminated body; ,
External electrodes provided across the top and side surfaces of the laminate,
With
The side surface of the partial laminate is constituted by the side surfaces and the upper surface of the plurality of first insulator layers, and the step board has a stepped shape facing the upper side in the stacking direction,
Electronic parts characterized by The side surface of the second insulator layer covering the side surface of the partial laminate has an inclined surface facing upward in the stacking direction;
The electronic component according to claim 1. The electronic component is
The circuit element built in the laminate is
In addition,
The external electrode is not directly connected to the circuit element;
The electronic component according to claim 1, wherein: The external electrode is plated.
The electronic component according to any one of claims 1 to 3, wherein: The first insulator layer and the second insulator layer are formed by a photolithography process;
The electronic component according to claim 1, wherein: The electronic component is
Board
In addition,
The laminate is provided on the substrate;
The electronic component according to claim 1, wherein: A first step of laminating a plurality of first insulator layers to form a partial laminate;
A second step of forming a second insulator layer covering a side surface and an upper surface of the partial laminate by a photolithography step;
A third step of forming an external electrode straddling the upper surface and the side surface of the second insulator layer;
With
In the first step, the side surface of the partial laminate is configured by the side surfaces and the main surface of the plurality of first insulator layers, and the step board has a step shape facing the upper side in the stacking direction. Laminating the plurality of first insulator layers;
A method of manufacturing an electronic component characterized by

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