JP5407795B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component, and more particularly, to an electronic component incorporating two coils.

  As a conventional electronic component, for example, a chip type filter described in Patent Document 1 is known. In the chip type filter, two coils are incorporated. The two coils constitute a noise filter. The noise filter can be connected to an external electric circuit via a terminal electrode provided on the surface of the chip-type filter.

  By the way, when the chip type filter described in Patent Document 1 is viewed in plan from the stacking direction, the terminal electrode is arranged in a point object with respect to the center of the upper surface of the chip type filter. Therefore, it is difficult to identify the direction of the chip filter by appearance. Therefore, in general, a direction identification mark is provided on the upper surface of the chip-type filter.

  However, in the case of forming the direction identification mark, the number of manufacturing steps of the chip type filter increases.

JP-A-7-58509

  Therefore, an object of the present invention is to provide an electronic component that can identify a direction without providing a direction identification mark.

An electronic component according to an aspect of the present invention includes a laminated body in which a plurality of insulating layers are laminated, and a first coil incorporated in the laminated body, the first coil conductor having a spiral shape. And a second coil that is built in the laminated body and arranged in a direction perpendicular to the first coil and the stacking direction, and has a spiral shape. A second coil composed of a coil conductor, and the insulator layer positioned on the first direction side in the stacking direction with respect to the first coil and the second coil is made of a transparent material. by being fabricated, when viewed in plan from the lamination direction, a shape having the first coil conductor, is different from the second shape with the coil conductor located in the center of the first coil conductor And the first coil conductor is provided. Area of the first blank region not located in the center of the second coil conductor, and a being greater than the area of the second blank area where the coil conductors of the second is not provided To do.

  According to the present invention, the direction of the electronic component can be identified without providing a direction identification mark.

It is an external appearance perspective view of the electronic component which concerns on one Embodiment. It is a disassembled perspective view of the laminated body which concerns on one Embodiment. It is an equivalent circuit diagram of an electronic component. It is the perspective view which planarly viewed the electronic component from the lamination direction. It is process sectional drawing at the time of manufacture of an electronic component. It is process sectional drawing at the time of manufacture of an electronic component. It is the figure which planarly viewed the electronic component in a cutting process from the z-axis direction. It is the perspective view which planarly viewed the electronic component which is a modification from the z-axis direction.

  Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

(About the configuration of electronic components)
FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment. FIG. 2 is an exploded perspective view of the laminate 12 according to the embodiment. FIG. 3 is an equivalent circuit diagram of the electronic component 10. FIG. 4 is a perspective view of the electronic component 10 viewed in plan from the stacking direction. Hereinafter, the stacking direction of the electronic components 10 is defined as the z-axis direction. Then, when viewed in plan from the z-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 10 is defined as the y-axis direction.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a multilayer body 12, external electrodes 18a, 18b, 20, and 22, lead conductors 42a, 46a, 48, and 52a to 52f, coils L1 and L2, and a capacitor C. ing. The laminated body 12 has a rectangular parallelepiped shape, and as shown in FIG. 1, the laminated body 14 and the laminated body 16 are laminated to form a rectangular parallelepiped shape. The stacked body 14 is located on the negative direction side in the z-axis direction from the stacked body 16. The external electrode 18a is provided on the side surface (surface) located on the negative side of the laminated body 12 in the x-axis direction. The external electrode 18b is provided on the side surface (surface) located on the positive side in the x-axis direction of the multilayer body 12, and has the same shape as the external electrode 18a. Thus, the external electrodes 18a and 18b are provided on the side surfaces of the stacked body 12 facing each other. The external electrode 20 is provided on the side surface (surface) located on the negative direction side in the y-axis direction of the multilayer body 12. The external electrode 22 is provided on the side surface (surface) located on the positive side in the y-axis direction of the multilayer body 12 and has the same shape as the external electrode 20. Accordingly, the external electrodes 20 and 22 are provided on the side surfaces of the stacked body 12 facing each other.

  The multilayer body 16 includes coils L1 and L2 and lead conductors 42a, 46a, and 48. Below, the laminated body 16 is demonstrated in detail, referring FIG.

  The stacked body 16 is configured by stacking the insulator layers 30a to 30g in this order from the positive direction side to the negative direction side in the z-axis direction. The insulator layers 30a to 30g are rectangular layers made of a transparent insulating material such as polyimide resin, for example. The insulator layers 30a to 30g are formed smaller than the stacked body 14 when viewed in plan from the z-axis direction. Thereby, the laminated body 14 is in a state of protruding from the four sides of the insulator layers 30a to 30g.

  The coil L1 includes coil conductors 40a to 40d and via-hole conductors b1 to b3. For example, the coil conductors 40a to 40d are formed on the main surfaces of the insulator layers 30d to 30g by using a conductive material mainly composed of Ag or Pd, for example. Each of the coil conductors 40a to 40d has a spiral shape by bending a linear conductor. Specifically, the coil conductors 40a and 40c have a spiral shape that turns clockwise while turning clockwise when viewed from the positive side in the z-axis direction. The coil conductors 40b and 40d have a spiral shape that turns counterclockwise when viewed in plan from the positive side in the z-axis direction.

  The via-hole conductors b1 to b3 respectively penetrate the insulator layers 30d to 30f in the z-axis direction, and connect the coil conductors 40a to 40d adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b1 connects the coil conductors 40a and 40b. The via-hole conductor b2 connects the coil conductors 40b and 40c. The via-hole conductor b3 connects the coil conductors 40c and 40d. Thereby, the coil conductors 40a to 40d and the via-hole conductors b1 to b3 constitute the coil L1.

  The lead conductor 42a is formed on the main surface of the insulator layer 30d by, for example, a conductive material mainly composed of Ag or Pd. The lead conductor 42a is connected to the coil conductor 40a and is drawn to the short side located on the negative side of the insulator layer 30d in the x-axis direction. Thereby, the coil conductor 40a is electrically connected to the external electrode 18a. That is, one end of the coil L1 is electrically connected to the external electrode 18a through the lead conductor 42a.

  The coil L2 includes coil conductors 44a to 44d and via-hole conductors b4 to b6, and is aligned with the coil L1 in the x-axis direction orthogonal to the z-axis direction. The coil conductors 44a to 44d are, for example, conductive mainly composed of Ag or Pd so as to be arranged on the main surface of the insulator layers 30d to 30g on the positive side in the x-axis direction of the coil conductors 40a to 40d. It is made of material. Each of the coil conductors 44a to 44d has a spiral shape by bending the linear conductor. Specifically, the coil conductors 44a and 44c have a spiral shape that turns counterclockwise when viewed in plan from the positive side in the z-axis direction. The coil conductors 44b and 44d have a spiral shape that turns clockwise while turning clockwise when viewed from the positive side in the z-axis direction.

  The via-hole conductors b4 to b6 respectively penetrate the insulator layers 30d to 30f in the z-axis direction and connect the coil conductors 44a to 44d adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b4 connects the coil conductors 44a and 44b. The via-hole conductor b5 connects the coil conductors 44b and 44c. The via-hole conductor b6 connects the coil conductors 44c and 44d. Thereby, the coil conductors 44a to 44d and the via-hole conductors b4 to b6 constitute a coil L2.

  The lead conductor 46a is formed on the main surface of the insulator layer 30d by, for example, a conductive material mainly composed of Ag or Pd. The lead conductor 46a is connected to the coil conductor 44a and is drawn to the short side located on the positive side of the insulator layer 30d in the x-axis direction. Thereby, the coil conductor 44a is electrically connected to the external electrode 18b. That is, one end of the coil L2 is electrically connected to the external electrode 18b through the lead conductor 46a.

  The lead conductor 48 is formed of, for example, a conductive material mainly composed of Ag or Pd on the main surface of the insulator layer 30g. The lead conductor 48 is connected to the coil conductors 40d and 44d and is drawn to the long side on the positive direction side in the y-axis direction of the insulator layer 30g. Thereby, the coil conductors 40 d and 44 d are electrically connected to the external electrode 22. That is, the other ends of the coils L1 and L2 are electrically connected to the external electrode 22 via the lead conductor 48.

  The stacked body 14 is a LTCC (Low Temperature Co-fired Ceramics) substrate and has a rectangular parallelepiped shape. The stacked body 14 is formed to be larger than the stacked body 16 when viewed in plan from the z-axis direction. The multilayer body 14 includes a capacitor C and lead conductors 52a to 52f. The stacked body 14 is provided on the negative direction side in the z-axis direction with respect to the stacked body 16. Therefore, the capacitor C is provided on the negative direction side in the stacking direction with respect to the coils L1 and L2.

  The laminate 14 is configured by laminating insulator layers 32a to 32l. The insulator layers 32a to 32l are, for example, rectangular layers made of a dielectric material. In addition, although the 12 insulator layers 32a-321 are described, 12 or more may be sufficient. Therefore, in FIG. 2, the insulator layer 32f and the insulator layer 32g may be connected by a dotted line, and the further insulator layer 32 may be provided between the insulator layer 32f and the insulator layer 32g. It is shown that.

  The capacitor C is composed of capacitor conductors 50a to 50f. The capacitor conductors 50a to 50f are respectively formed on the main surfaces of the insulator layers 32d to 32i by, for example, a conductive material mainly composed of Ag or Pd. Each of the capacitor conductors 50a to 50f has a rectangular shape.

  The lead conductors 52a to 52f are formed of, for example, a conductive material mainly composed of Ag or Pd on the main surfaces of the insulator layers 32d to 32i. The lead conductors 52a, 52c, and 52e are connected to the capacitor conductors 50a, 50c, and 50e, respectively, and are drawn to the long sides on the negative direction side in the y-axis direction of the insulator layers 32d, 32f, and 32h. Thereby, the capacitor conductors 50a, 50c, and 50e are electrically connected to the external electrode 20. The lead conductors 52b, 52d, and 52f are connected to the capacitor conductors 50b, 50d, and 50f, respectively, and are drawn to the long sides on the positive side in the y-axis direction of the insulator layers 32e, 32g, and 32i. Thereby, the capacitor conductors 50b, 50d, and 50f are electrically connected to the external electrode 22.

  The capacitor conductors 50a to 50f and the lead conductors 52a to 52f have the above configuration, so that the capacitor conductors 50a to 50f constitute the capacitor C. More specifically, the capacitor conductors 50a to 50f are formed by stacking the insulator layers 32a to 32l in this order from the positive direction side to the negative direction side in the z-axis direction, so that the capacitor conductors 50a to 50f are opposite to each other in the z-axis direction. C is constituted. The lead conductors 52 a, 52 c, 52 e are connected to the external electrode 20, and the lead conductors 52 b, 52 d, 52 f are connected to the external electrode 22. As a result, the capacitor conductors 50b, 50d, and 50f constitute the second electrode of the capacitor C, and the capacitor conductors 50a, 50c, and 50e constitute the first electrode of the capacitor C.

  Here, the first electrodes (capacitor conductors 50b, 50d, 50f) of the capacitor C are electrically connected to the external electrode 22, and the other ends of the coils L1, L2 are also electrically connected to the external electrode 22. Has been. As a result, the capacitor C and the coils L1 and L2 constitute a T-type LC noise filter as shown in FIG.

  By the way, the electronic component 10 has a configuration described below so that the direction can be identified without providing a direction recognition mark. Specifically, as shown in FIGS. 2 and 4, when viewed in plan from the z-axis direction, the coil conductor 40 constituting the coil L1 is located on the most positive side in the z-axis direction. The shape of the coil conductor 40a is different from the shape of the coil conductor 44a located on the most positive side in the z-axis direction among the coil conductors 44 constituting the coil L2. Specifically, when viewed in plan from the z-axis direction, the shape of the region surrounded by the outermost portion of the coil conductor 40a and the outermost portion of the coil conductor 44a are surrounded. It is different from the shape of the region. In the present embodiment, when viewed in plan from the z-axis direction, the region surrounded by the portion that wraps around the outermost side of the coil conductor 40a and the region surrounded by the portion that wraps around the outermost side of the coil conductor 44a are: Both are rectangular. The rectangle formed by the region surrounded by the outermost portion of the coil conductor 40a is more than the rectangle formed by the region surrounded by the outermost portion of the coil conductor 44a. , Long in the x-axis direction. Thus, the rectangular area formed by the region surrounded by the outermost portion of the coil conductor 40a is formed by the region surrounded by the outermost portion of the coil conductor 44a. It is larger than the rectangular area.

  Furthermore, the area of the blank region that is located at the center of the coil conductor 40a and is not provided with the coil conductor 40a is the area of the blank region that is located at the center of the coil conductor 44a and is not provided with the coil conductor 44a. Bigger than. In the present embodiment, as shown in FIGS. 2 and 4, a blank area B1 where the coil conductor 40a is not provided is provided at the center of the coil conductor 40a. On the other hand, as shown in FIG. 2, a blank area where the coil conductor 44a is not provided is not provided at the center of the coil conductor 44a.

  The insulator layers 30a to 30c positioned on the positive side in the z-axis direction from the coil conductors 40a and 40b are made of a transparent material. In the present embodiment, as described above, the insulator layers 30a to 30g are made of a transparent material.

(effect)
According to the electronic component 10 according to the present embodiment, the direction of the electronic component 10 can be identified without providing a direction identification mark. More specifically, in the electronic component 10, a ground potential is applied to the external electrode 20, and no potential is applied to the external electrode 22. Therefore, it is necessary to mount the electronic component 10 on the circuit board without changing the direction of the electronic component 10. However, since the external electrodes 20 and 22 have the same shape, the direction of the electronic component 10 cannot be identified only by looking at the shape of the external electrodes 20 and 22.

  Therefore, in the electronic component 10, the insulator layers 30a to 30c located further on the positive side in the z-axis direction than the coil conductors 40a and 44a are made of a transparent material. Furthermore, the coil conductors 40a and 44a located on the most positive side in the z-axis direction have different shapes. Thereby, the coil conductors 40a and 44a can be imaged by imaging the upper surface of the electronic component 10 on the positive side in the z-axis direction with the camera. And the direction of the electronic component 10 can be identified by confirming the shape of the coil conductors 40a and 44a.

  In the electronic component 10, the shape of the region surrounded by the outermost part of the coil conductors 40 a and 44 a is different. The shape of the region surrounded by the outermost part of the coil conductors 40a and 44a is easier to identify than the detailed shape such as the shape of the linear conductors of the coil conductors 40a and 44a. Therefore, in the electronic component 10, the direction of the electronic component 10 can be identified even when the resolution of the camera is low.

  Moreover, in the electronic component 10, the blank area | region B1 in which the coil conductor 40a is not provided is provided. On the other hand, as shown in FIG. 4, a blank area where the coil conductor 44a is not provided is not provided at the center of the coil conductor 44a. Therefore, in the electronic component 10, the direction of the electronic component 10 can be identified also by confirming the presence or absence of the blank area B1. When a blank area is provided at the center of the coil conductor 44a, the direction of the electronic component 10 is determined by comparing the size of the blank area B1 of the coil conductor 40a with the size of the blank area of the coil conductor 44a. Can be identified.

  Further, the inductance values of the coils L1 and L2 can be made substantially the same by adjusting the size of the area surrounded by the outermost part of the coil conductors 40a and 44a and the size of the blank area. .

(About manufacturing method)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. 5 and 6 are process cross-sectional views when the electronic component 10 is manufactured. FIG. 7 is a plan view of the electronic component 10 in the cutting process from the z-axis direction. 5 and 6 show a manufacturing process of one electronic component 10, but actually, a plurality of electronic components 10 are manufactured collectively in a state of being arranged in a matrix.

  First, the laminated body 14 as shown in FIG. 2 is produced. More specifically, a predetermined material is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersant are added to the ceramic powder, and the mixture is mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet by a doctor blade method and dried to obtain ceramic green sheets to be the insulator layers 32a to 32l.

  Next, on the ceramic green sheets to be the insulator layers 32d to 32i, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied by a method such as a screen printing method or a photolithography method. As a result, the capacitor conductors 50a to 50f and the lead conductors 52a to 52f are formed.

  Next, each ceramic green sheet is laminated. Specifically, the insulator layers 32a to 32l are stacked in order from the top, and pressure bonding is performed by a hydrostatic press or the like. Thereafter, firing is performed to obtain a mother laminated body of the laminated body 14.

  Next, as shown in FIG. 5A, an insulator layer 30g made of polyimide resin is formed on the laminate 14 by photolithography. Next, as shown in FIG. 5B, conductive layers 40dA and 44dA made of a conductive material mainly composed of Ag or Pd are formed on the insulating layer 30g by a dry plating method such as sputtering or vapor deposition. .

  Next, after applying and drying a photosensitive resist on the conductive layers 40dA and 44dA, a desired film is exposed by applying a mask film to the photosensitive resist. Next, the photosensitive resist is developed to form a resist pattern 70a having a shape in which unnecessary portions of the conductive layers 40dA and 44dA are exposed as shown in FIG.

  Next, the exposed portions of the conductive layers 40dA and 44dA are removed by etching, and then the resist pattern 70a is removed, whereby the coil conductors 40d and 44d and the lead conductor 48 (see FIG. 6A) are obtained. 6 (a) is formed.

  Next, as shown in FIG. 6B, an insulator layer 30f made of polyimide resin is formed on the insulator layer 30g, the coil conductors 40d and 44d, and the lead conductor 48 by photolithography. At this time, the via hole h is formed at a position where the via hole conductors b3 and b6 of the insulator layer 30f are to be formed.

  Next, as shown in FIG. 6C, conductive layers 40cA and 44cA are formed on the insulating layer 30f by dry plating. At this time, the via hole h is filled with a conductive material, and the via hole conductors b3 and b6 are formed. Thereafter, the processing described with reference to FIGS. 5C to 6C is performed on the conductive layers 40cA and 44cA. Thereby, the coil conductors 40c and 44c and the insulator layer 30e are formed on the insulator layer 30f. Further, the processing described with reference to FIGS. 5C to 6C is repeated to form the coil conductors 40a, 40b, 44a, 44b, the lead conductors 42a, 46a, and the insulator layer 30d. Thereafter, insulator layers 30a to 30c made of polyimide resin are formed on the coil conductors 40a and 44a, the lead conductors 42a and 46a, and the insulator layer 30d.

  Thereafter, the mother laminated body of the laminated body 12 is cut by a dicer and separated into individual laminated bodies 12. At this time, as shown by a dotted line portion in FIG. 7, the mother laminated body is cut so that the dicer passes through a portion where the insulator layers 30 a to 30 f are not formed. Further, a barrel is applied to the cut laminate 12. Thereby, the corners of the laminate 12 are chamfered.

  Finally, external electrodes 18a, 18b, 20, and 22 are formed. Specifically, a conductive paste made of Ag and resin is applied and cured to form a silver electrode. Next, Ni plating and Sn plating are performed on the silver electrode to form the external electrodes 18a, 18b, 20, and 22. The electronic component 10 is completed through the above steps.

(Modification)
Below, the modification of the electronic component 10 is demonstrated, referring drawings. FIG. 8 is a perspective view of an electronic component 10a, which is a modification of the electronic component 10, viewed in plan from the z-axis direction. Note that the same reference numerals are assigned to the same components as those of the electronic component 10 in FIG.

  In the electronic component 10a, the external electrodes 20 and 22 are provided so as to be folded back from the side surface of the multilayer body 12 to the upper surface. As shown in FIG. 8, in the electronic component 10a, the coil conductors 40'a and 44'a provided on the most positive side in the z-axis direction are external electrodes when viewed in plan from the z-axis direction. 20 and 22 do not overlap. Thereby, it is suppressed that the insulation state between coil conductor 40'a, 44'a and the external electrodes 20 and 22 collapse | crumbles by generating a defect in the insulator layers 30a-30c.

  The coil conductors 40a to 40d and 44a to 44d are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. However, the coil conductors 40a to 40d and 44a to 44d may be arranged in this order from the negative direction side to the positive direction side in the z-axis direction. In this case, the coil conductors 40d and 44d are located on the most positive side in the z-axis direction. Further, the coil conductors 40 d and 44 d are connected to the external electrode 22 via the lead conductor 48. Therefore, the coil conductors 40d and 44d overlap the external electrode 22 when viewed in plan from the z-axis direction. Therefore, in this case, the coil conductors 40d and 44d need not overlap with the external electrode 20 when viewed in plan from the z-axis direction.

  Moreover, in the electronic components 10 and 10a, circuit elements including the coils L1 and L2 and the capacitor C may be formed in an array.

  The present invention is useful for electronic components, and is particularly excellent in that the direction of the electronic component can be identified without providing a direction identification mark.

B1 Blank area C Capacitor L1, L2 Coil b1-b6 Via-hole conductor 10, 10a Electronic component 12, 14, 16 Laminated body 18a, 18b, 20, 22 External electrode 30a-30g, 32a-32l Insulator layer 40a-40d, 44a ˜44d Coil conductor 50a˜50f Capacitor conductor 42a, 46a, 48, 52a˜52f Lead conductor

Claims (8)

A laminate formed by laminating a plurality of insulator layers;
A first coil built in the laminated body, wherein the first coil is constituted by a spiral first coil conductor;
A second coil that is built in the laminated body and that is arranged in a direction orthogonal to the first coil and in a direction perpendicular to the lamination direction, and is configured by a second coil conductor that forms a spiral shape. Coils,
With
The insulator layer positioned on the first direction side in the stacking direction from the first coil and the second coil is made of a transparent material,
When viewed in plan from the lamination direction, a shape having the first coil conductor is different from that of the shape in which the second coil conductor have,
The area of the first blank region located in the center of the first coil conductor and not provided with the first coil conductor is located in the center of the second coil conductor, and Greater than the area of the second blank area where no coil conductor is provided,
Electronic parts characterized by When viewed in plan from the stacking direction, it is surrounded by the shape of the region surrounded by the outermost part of the first coil conductor and the outermost part of the second coil conductor. Different from the shape of the region,
The electronic component according to claim 1. When viewed in plan from the stacking direction, the area of the region surrounded by the outermost portion of the first coil conductor is surrounded by the outermost portion of the second coil conductor. Larger than the area of the region,
The electronic component according to claim 2. A capacitor built in the laminated body so as to be located on the second direction side of the laminating direction than the first coil and the second coil;
A first external electrode provided on the surface of the multilayer body and connected to the first electrode of the capacitor, the first end of the first coil, and the first end of the second coil When,
A second external electrode provided on the surface of the laminate and connected to the second electrode of the capacitor;
Further comprising
The first coil, the second coil and the capacitor constitute a noise filter;
The electronic component according to any one of claims 1 to 3 , wherein: The first external electrode and the second external electrode are provided on side surfaces facing each other of the multilayer body and have the same shape,
The electronic component according to claim 4 . A third external electrode provided on the surface of the laminate and connected to the second end of the first coil;
A fourth external electrode provided on the surface of the laminate and connected to a second end of the second coil;
Further comprising
Electronic component according to claim 4 or claim 5, characterized in. The first external electrode and the second external electrode are provided on a side surface and an upper side of the laminate,
The first coil conductor and the second coil conductor provided on the most side in the laminating direction are the first external electrode and the second external electrode when viewed in plan from the laminating direction. No overlap with the electrodes,
Electronic component according to any one of claims 4 to 6, characterized in. The first coil conductor and the second coil conductor provided in the first direction in the stacking direction are connected to the first external electrode and when viewed in plan from the stacking direction , Not overlapping the second external electrode,
Electronic component according to any one of claims 4 to 6, characterized in.

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