JP2005229219A - Laminated filter and laminated filter array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated filter and a laminated filter array with high reliability which can properly be mounted onto an external board or the like. <P>SOLUTION: The laminated filter F1 is provided with a coil section 10 including a coil and a capacitor section 20 including a capacitor. The coil is configured by laminating a plurality of nonmagnetic body green sheets 11 to 22 to which conductor patterns 11a to 22a are respectively formed. The capacitor is configured by laminating a plurality of nonmagnetic body green sheets 31 to 33 to which capacitor electrodes 31a to 33a are respectively formed. Through-electrodes 12b, 14b, 16b, 18b are arranged at two positions in relation to the laminated direction. The through-electrodes 12b, 16b and the through-electrodes 14b, 18b are arranged along the length direction of elements 1 orthogonal to each other in the laminated direction and apart in the length direction of the elements 1 by a prescribed length. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer filter and a multilayer filter array.

  This type of multilayer filter is constructed by laminating a coil composed of a plurality of insulators formed with a spiral conductor pattern and a plurality of insulators formed with capacitor electrodes. And a pair of input / output electrodes formed on side surfaces parallel to the stacking direction of the insulator in the stack and connected to both ends of the coil, respectively. (For example, refer to Patent Document 1).

In the multilayer filter described in Patent Document 1, the inner ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by through electrodes formed in an insulator. In addition, the through electrodes that electrically connect the inner end portions are concentrated in the same place as viewed from the stacking direction.
JP 2003-69358 A

  By the way, the multilayer filter having the above-described configuration is manufactured by laminating a plurality of insulators on which conductor patterns are formed, a plurality of insulators on which capacitor electrodes are formed, and the like, followed by firing. In this case, the conductor pattern, the capacitor electrode, the through electrode, and the insulator shrink due to heating during firing. The conductor material used for the conductor pattern and the through electrode has a smaller shrinkage ratio after firing than the magnetic material and the non-magnetic material constituting the insulator, so the insulator is better than the conductor pattern and the through electrode. Shrink more. Therefore, when the through electrodes that electrically connect the inner ends of the conductor pattern are arranged in the same location as viewed from the stacking direction, on the side surface orthogonal to the stacking direction of the insulator, A protrusion is formed at a position corresponding to the through electrode.

  When the multilayer filter is mounted on an external substrate or the like, if the side surface on which the protrusion is formed is an adsorption surface by the mounter, the protrusion causes a mounter adsorption failure and the protrusion is formed. If the side surface is the mounting surface, it may cause a mounting failure on an external substrate or the like.

  Further, cracks are likely to occur around the protrusion. If a crack occurs, moisture or the like stays in the generated crack, the insulation resistance is lowered, and the reliability of the multilayer filter is significantly lowered.

  In view of the above circumstances, an object of the present invention is to provide a multilayer filter and a multilayer filter array that can be appropriately mounted on an external substrate or the like and have high reliability.

  The multilayer filter according to the present invention includes a coil constituted by laminating a plurality of insulators formed with a spiral conductor pattern and a plurality of insulators formed with capacitor electrodes. And a pair of input / output electrodes formed on side surfaces parallel to the stacking direction of the insulator in the stack and respectively connected to both ends of the coil, and adjacent to each other in the stacking direction. The inner ends of the conductor pattern are electrically connected by through electrodes formed in the insulator, and each through electrode that electrically connects the inner ends is seen at a plurality of locations when viewed from the stacking direction. It is arranged.

  In the multilayer filter according to the present invention, each through electrode that electrically connects the inner ends of the conductor pattern is disposed at a plurality of locations as viewed from the stacking direction, and therefore is disposed at the same position as viewed from the stacking direction. The number of through-electrodes to be performed is smaller than that of the conventional one. For this reason, the height of the protrusion formed in each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced. As a result, when the multilayer filter is mounted, it is possible to suppress mounting failure of the mounter or mounting failure to an external substrate or the like, and mounting to the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  Moreover, it is preferable that each penetration electrode is arrange | positioned so that it may see along the predetermined direction orthogonal to the said lamination direction seeing from the lamination direction.

  In addition, the outer ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by through electrodes formed in an insulator, and each through electrode that electrically connects the outer ends is stacked in the stacking direction. From the viewpoint, it is preferable that they are arranged at a plurality of locations. When configured in this way, each through electrode that electrically connects the outer ends of the conductor pattern is disposed at a plurality of locations as viewed from the stacking direction, and therefore is disposed at the same position as viewed from the stacking direction. The number of through electrodes is smaller than the conventional one. As a result, the height of the protrusion formed at each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately and reliability is also improved. It will be even higher.

  In addition, each through electrode that electrically connects the inner ends is disposed along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction, and the outer ends are electrically connected to each other. Each through-electrode to be arranged is arranged so as to be along a predetermined direction perpendicular to the lamination direction and intersecting the arrangement direction of each through-electrode that electrically connects the inner end portions when viewed from the lamination direction. preferable.

  The multilayer filter according to the present invention includes a coil constituted by laminating a plurality of insulators formed with a spiral conductor pattern and a plurality of insulators formed with capacitor electrodes. And a pair of input / output electrodes formed on side surfaces parallel to the stacking direction of the insulator in the stack and respectively connected to both ends of the coil, and adjacent to the stacking direction. The inner ends of the conductor pattern to be connected are electrically connected by through electrodes formed in the insulator, and the through electrodes adjacent to each other in the stacking direction are perpendicular to the stacking direction when viewed from the stacking direction. It is characterized by being separated by a predetermined length.

  In the multilayer filter according to the present invention, among the plurality of through-electrodes that electrically connect the inner ends of the conductor pattern, those adjacent in the stacking direction are perpendicular to the stacking direction when viewed from the stacking direction. Therefore, the number of through electrodes arranged at the same position when viewed from the stacking direction is smaller than that of the conventional one. For this reason, the height of the protrusion formed in each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced. As a result, when the multilayer filter is mounted, it is possible to suppress mounting failure of the mounter or mounting failure to an external substrate or the like, and mounting to the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  In addition, the outer ends of the conductor patterns adjacent in the stacking direction are electrically connected by a through electrode formed in an insulator, and stacked among the plurality of through electrodes that electrically connect the outer ends. Adjacent to each other, when viewed from the stacking direction, are separated by a predetermined length in a direction perpendicular to the stacking direction and intersecting with the direction in which the through electrodes that electrically connect the inner ends are separated from each other. Preferably it is. When configured in this manner, among the plurality of through electrodes that electrically connect the outer end portions of the conductor pattern, those adjacent in the stacking direction are orthogonal to the stacking direction and viewed from the stacking direction, and the inner end portions Since the through electrodes that electrically connect each other are separated by a predetermined length in a direction that intersects the direction in which the through electrodes are separated from each other, the number of through electrodes that are arranged at the same position when viewed from the stacking direction is Less than things. As a result, the height of the protrusion formed at each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately and reliability is also improved. It will be even higher.

  The multilayer filter array according to the present invention includes a plurality of coils formed by laminating a plurality of insulators each having a spiral conductor pattern, and a plurality of capacitor electrodes corresponding to the coils. A laminated body having a plurality of capacitors configured by laminating insulators, and a pair of input / outputs formed on side surfaces parallel to the laminating direction of the insulators in the laminated body and connected to both ends of each coil, respectively In each coil, the inner ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by a through electrode formed in the insulator, and the inner ends are electrically connected to each other. Each through electrode is arranged at a plurality of locations as viewed from the stacking direction.

  In the multilayer filter array according to the present invention, in each coil, the through electrodes that electrically connect the inner ends of the conductor pattern are arranged at a plurality of locations as viewed from the stacking direction. Thus, the number of through electrodes arranged at the same position is smaller than that of the conventional one. For this reason, the height of the protrusion formed in each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced. As a result, when the multilayer filter array is mounted, it is possible to suppress mounting failure of the mounter or mounting failure to an external substrate or the like, and mounting to the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  Moreover, in each coil, it is preferable that each penetration electrode is arrange | positioned along the predetermined direction orthogonal to the said lamination direction seeing from the lamination direction.

  Further, in each coil, the outer ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by a through electrode formed in an insulator, and each through electrode that electrically connects the outer ends is provided. Are preferably arranged at a plurality of locations as viewed from the stacking direction. When configured in this way, in each coil, each through electrode that electrically connects the outer ends of the conductor pattern is disposed at a plurality of locations as viewed from the stacking direction, so that the same position as viewed from the stacking direction is provided. The number of through-electrodes arranged in the is less than that of the conventional one. As a result, the height of the protrusion formed at each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately and reliability is also improved. It will be even higher.

  Further, in each coil, each through electrode that electrically connects the inner ends is arranged along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction, and the outer ends are connected to each other. Each electrically connected through electrode is arranged so as to be along a predetermined direction that is orthogonal to the laminated direction and intersects the arrangement direction of each through electrode that electrically connects the inner end portions when viewed from the laminated direction. It is preferable.

  The multilayer filter array according to the present invention includes a plurality of coils formed by laminating a plurality of insulators each having a spiral conductor pattern, and a plurality of capacitor electrodes corresponding to the coils. A laminated body having a plurality of capacitors configured by laminating insulators, and a pair of input / outputs formed on side surfaces parallel to the laminating direction of the insulators in the laminated body and connected to both ends of each coil, respectively In each coil, the through electrodes adjacent to each other in the stacking direction are separated from each other by a predetermined length in a direction orthogonal to the stacking direction when viewed from the stacking direction.

  In the multilayer filter array according to the present invention, in each coil, a plurality of through electrodes that electrically connect the inner ends of the conductor pattern are adjacent to each other in the laminating direction when viewed from the laminating direction. Since they are separated from each other by a predetermined length in the direction orthogonal to the direction, the number of through electrodes arranged at the same position when viewed from the stacking direction is smaller than that of the conventional one. For this reason, the height of the protrusion formed in each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced. As a result, when the multilayer filter is mounted, it is possible to suppress mounting failure of the mounter or mounting failure to an external substrate or the like, and mounting to the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  Further, in each coil, the outer ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by through electrodes formed in an insulator, and a plurality of penetrations that electrically connect the outer ends are connected. The electrodes adjacent to each other in the stacking direction have a predetermined length in a direction perpendicular to the stacking direction and intersecting with the direction in which the through electrodes that electrically connect the inner ends are separated from each other when viewed from the stacking direction. It is preferable to be far away. When configured in this way, in each coil, among the plurality of through electrodes that electrically connect the outer ends of the conductor pattern, those adjacent in the stacking direction are orthogonal to the stacking direction when viewed from the stacking direction. In addition, since the through electrodes that electrically connect the inner end portions are separated by a predetermined length in the direction intersecting with the direction in which the through electrodes are separated from each other, the number of through electrodes arranged at the same position when viewed from the stacking direction However, it is less than the conventional one. As a result, the height of the protrusion formed at each position corresponding to the through electrode on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately and reliability is also improved. It will be even higher.

  The insulator is preferably formed of a nonmagnetic material. When configured in this manner, the resonance frequency determined by the capacitance of the capacitor and the inductance of the coil can be set on the high frequency side, and higher-band noise can be removed.

  The insulator on which the conductor pattern is formed is preferably formed of a magnetic material. When configured in this manner, the resonance frequency determined by the capacitance of the capacitor and the inductance of the coil can be set on the low frequency side, and noise in a lower band can be removed.

  According to the present invention, it is possible to provide a multilayer filter and a multilayer filter array that can be appropriately mounted on an external substrate or the like and have high reliability.

  A multilayer filter and a multilayer filter array according to an embodiment of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted. In the description, the terms “upper” and “lower” may be used, which correspond to the vertical direction of each figure.

(First embodiment)
FIG. 1 is a perspective view showing the multilayer filter according to the first embodiment. FIG. 2 is a schematic diagram for explaining a cross-sectional configuration of the multilayer filter according to the first embodiment. FIG. 3 is an exploded perspective view showing the multilayer filter according to the first embodiment. FIG. 4 is a view for explaining the arrangement of through electrodes in the multilayer filter according to the first embodiment. FIG. 5 is a diagram for explaining an equivalent circuit of the multilayer filter according to the first embodiment. In the first embodiment, the present invention is applied to an L-type multilayer three-terminal filter.

  As shown in FIG. 1, the multilayer filter F <b> 1 includes a pair of input / output electrodes 3 and 5 formed at both ends in the longitudinal direction of the element 1, and a ground electrode 7 that is also formed on the side surface of the element 1. I have. The bottom surface of the element 1 is a surface facing the external substrate when the multilayer filter F1 is mounted on the external substrate (not shown).

  As shown in FIGS. 2 and 3, the multilayer filter F <b> 1 includes a coil unit 10 including a coil L and a capacitor unit 30 including a capacitor C. The coil unit 10 and the capacitor unit 30 are laminated to form a rectangular parallelepiped element (laminated body) 1. The capacitor unit 30 is located below the coil unit 10.

  The coil L is configured by laminating a plurality (six layers in this embodiment) of non-magnetic green sheets (insulators) 11 to 22 on which conductor patterns 11a to 22a are formed. The side surface on which the input / output electrodes 3 and 5 are formed is parallel to the stacking direction of the nonmagnetic green sheets 11 to 22.

  The conductor pattern 11 a extends in a substantially J shape on the nonmagnetic green sheet 11. One end of the conductor pattern 11 a is drawn to the edge of the nonmagnetic green sheet 11 and is exposed on the end surface of the nonmagnetic green sheet 11. The conductor pattern 11a is located at one end of the coil L. One end (conductor pattern 11 a) of the coil L is drawn to the edge of the element 1 and is electrically connected to one input / output electrode 3.

  The conductor patterns 12a to 20a correspond to approximately one turn of the coil L, and are wound spirally on the nonmagnetic green sheets 12 to 20. The conductor pattern 21a corresponds to approximately ½ turn of the coil L, and is wound on the nonmagnetic green sheet 21 in a substantially C shape.

  The conductor pattern 22 a extends in a substantially I shape on the nonmagnetic green sheet 22. One end of the conductor pattern 22 a is drawn to the edge of the nonmagnetic green sheet 22 and is exposed on the end surface of the nonmagnetic green sheet 22. The conductor pattern 22a is located at the other end of the coil L. The other end (conductor pattern 22 a) of the coil L is drawn to the edge of the element 1 and is electrically connected to the other input / output electrode 5.

  The end portions of the conductor patterns 11a to 22a are electrically connected by through electrodes 11b to 21b formed on the nonmagnetic green sheets 11 to 21, respectively. The conductor patterns 11a to 22a constitute the coil L by being electrically connected to each other.

  The other end of the conductor pattern 11a and the outer end of the conductor pattern 12a are electrically connected by the through electrode 11b. The inner end portion of the conductor pattern 12a and the inner end portion of the conductor pattern 13a are electrically connected by the through electrode 12b. The outer end portion of the conductor pattern 13a and the outer end portion of the conductor pattern 14a are electrically connected by the through electrode 13b. The inner end portion of the conductor pattern 14a and the inner end portion of the conductor pattern 15a are electrically connected by the through electrode 14b. The outer end of the conductor pattern 15a and the outer end of the conductor pattern 16a are electrically connected by the through electrode 15b. The inner end portion of the conductor pattern 16a and the inner end portion of the conductor pattern 17a are electrically connected by the through electrode 16b. The outer end portion of the conductor pattern 17a and the outer end portion of the conductor pattern 18a are electrically connected by the through electrode 17b. The inner end of the conductor pattern 18a and the inner end of the conductor pattern 19a are electrically connected by the through electrode 18b. The outer end of the conductor pattern 19a and the outer end of the conductor pattern 20a are electrically connected by the through electrode 19b. The inner end portion of the conductor pattern 20a and one end portion of the conductor pattern 21a are electrically connected by the through electrode 20b. The other end of the conductor pattern 21a and one end of the conductor pattern 22a are electrically connected by the through electrode 21b. As described above, regarding the conductor patterns 12a to 20a, the outer end portions of the conductor patterns 13a and 14a, 15a and 16a, 17a and 18a, 19a and 20a adjacent to each other in the stacking direction correspond to the corresponding through electrodes 13b, 15b, and 17b. , 19b are electrically connected. Further, the inner ends of the conductor patterns 12a and 13a, 14a and 15a, 16a and 17a, 18a and 19a adjacent to each other in the stacking direction are electrically connected by corresponding through electrodes 12b, 14b, 16b and 18b.

  As shown in FIG. 4, the through electrodes 12 b, 14 b, 16 b, and 18 b are arranged at a plurality of locations (two locations in the present embodiment) when viewed from the stacking direction. The through electrodes 12b and 16b and the through electrodes 14b and 18b are disposed along the longitudinal direction of the element 1 orthogonal to the stacking direction, and have a predetermined length in the longitudinal direction of the element 1 (in this embodiment, The distance between the through electrodes 13b, 15b, 17b, 19b and the through electrode 21b in the longitudinal direction of the element 1 is approximately 1/3 of the distance between the through electrodes 21b.

  As shown in FIG. 4, the through electrodes 13b, 15b, 17b, and 19b are arranged at a plurality of locations (two locations in the present embodiment) when viewed from the stacking direction. The through electrodes 13b and 17b and the through electrodes 15b and 19b are in a direction intersecting (orthogonal in the present embodiment) with the longitudinal direction of the element 1 (the arrangement direction of the through electrodes 12b and 16b and the through electrodes 14b and 18b). The elements 1 are arranged so as to extend along the longitudinal direction of the element 1.

  The capacitor C is configured by laminating a plurality (three layers in this embodiment) of non-magnetic green sheets (insulators) 31 to 33 on which capacitor electrodes 31a to 33a are formed. Capacitor electrodes 31a and 33a include a pair of lead-out portions 31b and 33b exposed at the end faces of the nonmagnetic green sheets 31 and 33 constituting the side surfaces of the element 1, respectively, on the nonmagnetic green sheets 31 and 33. It is formed in a substantially rectangular shape. One end of the capacitor electrode 32 a is exposed at the end face of the nonmagnetic green sheet 32, and is formed in a substantially rectangular shape on the nonmagnetic green sheet 32. The capacitor electrodes 31a to 33a, the nonmagnetic green sheets 31 and 32 positioned therebetween, and the nonmagnetic green sheet 33 constitute the capacitor C.

  The lead-out portions 31 b and 33 b of the capacitor electrodes 31 a and 33 a are electrically connected to the ground electrode 7. One end of the capacitor electrode 32 a is electrically connected to one input / output electrode 3. As a result, the capacitor electrode 32a is electrically connected to one end (conductor pattern 11a) of the coil L. In the present embodiment, the capacitor electrode 32a is a signal electrode, and the capacitor electrodes 31a and 33a are grounding electrodes.

  A non-magnetic green for adjusting the distance between the conductor pattern 22a and the capacitor electrode 31a between the coil part 10 (non-magnetic green sheet 22) and the capacitor part 30 (non-magnetic green sheet 31). Sheets 41 are laminated. A nonmagnetic green sheet 42 serving as a base layer for protecting the conductor pattern 11a is laminated on the upper portion of the coil portion 10 (nonmagnetic green sheet 11). The nonmagnetic green sheets 41 and 42 also have electrical insulation.

As the non-magnetic green sheets 11 to 22, 41, 42, for example, those formed by applying slurry using a mixed powder of Fe ₂ O ₃ , ZnO and CuO as a raw material on a film by a doctor blade method can be used. . As the non-magnetic green sheets 31 to 33, for example, a slurry formed by applying a slurry using a mixed powder of TiO ₂ , CuO and NiO as a raw material by a doctor blade method can be used. The thickness of the nonmagnetic green sheets 11 to 22, 31 to 33, 41 and 42 is, for example, about 18 μm.

  The conductor patterns 11a to 22a and the capacitor electrodes 31a to 33a are formed, for example, by screen-printing a conductor paste mainly composed of silver and then drying.

  The element 1 includes nonmagnetic green sheets 11 to 22 on which conductor patterns 11a to 22a are formed, nonmagnetic green sheets 31 to 33 on which capacitor electrodes 31a to 33a are formed, and nonmagnetic green sheets 41 and 42. 3 are laminated and pressure-bonded as shown in FIG. 3 and cut into chips, and then fired at a predetermined temperature (for example, 800 to 900 ° C.). The element 1 has, for example, a length in the longitudinal direction after firing of about 2.0 mm, a width of about 1.25 mm, and a height of about 0.8 mm.

  The input / output electrodes 3 and 5 and the ground electrode 7 are baked at a predetermined temperature (for example, about 700 ° C.) after transferring an electrode paste mainly composed of silver to the outer surface of the element 1 obtained as described above. It is formed by applying electroplating. For electroplating, Cu and Ni and Sn, Ni and Sn, Ni and Au, Ni and Pd and Au, Ni and Pd and Ag, Ni and Ag, or the like can be used.

  The width of the conductor patterns 11a to 22a after firing is set to about 70 μm, for example. The thickness of the conductor patterns 11a to 22a after firing is set to about 12 μm, for example. The thickness of the capacitor electrodes 31a to 33a after firing is set to, for example, about 6 μm.

  In the multilayer filter F1 having the above-described configuration, an L-type circuit is configured by the coil L and the capacitor C as shown in FIG.

  As described above, in the first embodiment, the through electrodes 12b, 14b, 16b, 18b that electrically connect the inner ends of the conductor patterns 12a, 14a, 16a, 18a are non-magnetic green sheets. 11 to 22, 31 to 33, 41 and 42 are disposed at a plurality of positions when viewed from the stacking direction, and the through electrodes 12 b and 16 b and the through electrodes 14 b and 18 b have a predetermined length in the longitudinal direction of the element 1. Have been separated. For this reason, the number of through electrodes arranged at the same position when viewed from the stacking direction is smaller than that of the conventional one, and at each position corresponding to the through electrodes 12b, 14b, 16b, and 18b on the side surface orthogonal to the stacking direction. The height of the formed protrusion will be reduced. As a result, when the multilayer filter F1 is mounted, mounting failure on the mounter or mounting failure on an external substrate or the like is suppressed, and mounting on the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  In the first embodiment, the through electrodes 13b, 15b, 17b, and 19b that electrically connect the outer ends of the conductor patterns 13a, 15a, 17a, and 19a are provided at a plurality of locations as viewed from the stacking direction. Has been placed. Thereby, since each penetration electrode 13b, 15b, 17b, 19b is arrange | positioned in multiple places seeing from the lamination direction, the number of penetration electrodes arrange | positioned in the same position seeing from the lamination direction is different from the conventional one. Less. As a result, the height of the protrusion formed at each position corresponding to the through electrodes 13b, 15b, 17b, and 19b on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately. As well as increased reliability.

  In the first embodiment, nonmagnetic green sheets 11 to 22 and 31 to 33 are used as insulators. Thereby, the resonance frequency determined by the capacitance of the capacitor C and the inductance of the coil L can be set on the high frequency side, and noise in a higher band (for example, 1 to 3 GHz) can be removed.

  In the first embodiment, the insulator of the coil unit 10 may be formed of a magnetic material. In this case, the resonance frequency determined by the capacitance of the capacitor C and the inductance of the coil L can be set on the low frequency side, and noise in a lower band (for example, 400 to 800 MHz) can be removed. As the insulator of the coil unit 10, a magnetic green sheet can be used instead of the non-magnetic green sheets 11-22. The magnetic green sheet is made of, for example, ferrite (for example, Ni—Cu—Zn ferrite, Ni—Cu—Zn—Mg ferrite, Cu—Zn ferrite, or Ni—Cu ferrite) powder. A sheet formed by binding with a binder is used.

(Second Embodiment)
FIG. 6 is a perspective view showing the multilayer filter array according to the second embodiment. FIG. 7 is an exploded perspective view showing the multilayer filter array according to the second embodiment. 8 and 9 are exploded perspective views showing coil portions included in the multilayer filter array according to the second embodiment. FIG. 10 is a diagram for explaining an equivalent circuit of the multilayer filter array according to the second embodiment. In the second embodiment, the present invention is applied to an L-type multilayer three-terminal filter array.

  As shown in FIG. 6, the multilayer filter array F <b> 2 includes a plurality of (four in the present embodiment) input / output electrodes 3 formed on one side surface of the element 51, and the other side surface of the element 51. A plurality of (in the present embodiment, four) input / output electrodes 5 formed and a pair of ground electrodes 7 formed at both ends in the longitudinal direction of the element 51 are provided.

  As shown in FIG. 7, the multilayer filter array F <b> 2 includes a coil unit 10 including a plurality of coils L and a capacitor unit 30 including a plurality of capacitors C. The coil part 10 and the capacitor part 30 are laminated to form a rectangular parallelepiped element (laminated body) 51. The side surface on which the input / output electrodes 3 and 5 are formed is parallel to the stacking direction of the nonmagnetic green sheets 11 to 22.

  As shown in FIG. 8, the conductor patterns 11 a are provided side by side in the longitudinal direction of the element 51 with a predetermined distance from each other. The conductor patterns 11a are electrically insulated from each other. As shown in FIGS. 8 and 9, each of the conductor patterns 12 a to 21 a is provided side by side in the longitudinal direction of the element 51 with a predetermined distance from each other, like the conductor pattern 11 a. The conductor patterns 12a to 21a are electrically insulated. As shown in FIG. 9, each conductor pattern 22a is provided side by side in the longitudinal direction of the element 51 in a state having a predetermined distance from each other like the conductor patterns 11a to 21a. The conductor patterns 22a are electrically insulated. Each conductor pattern 11a-22a comprises each coil L by being electrically connected mutually. In the present embodiment, four coils L are provided in the coil unit 10.

  In each coil L, the outer end portions of conductor patterns 13a and 14a, 15a and 16a, 17a and 18a, 19a and 20a adjacent in the stacking direction are electrically connected by corresponding through electrodes 13b, 15b, 17b and 19b. Is done. In each coil L, the inner ends of the conductor patterns 12a and 13a, 14a and 15a, 16a and 17a, 18a and 19a adjacent to each other in the laminating direction are electrically connected by corresponding through electrodes 12b, 14b, 16b and 18b. Connected to.

  In each coil L, the through electrodes 12b, 14b, 16b, and 18b are arranged at a plurality of locations (two locations in the present embodiment) when viewed from the stacking direction. The through electrodes 12b, 16b and the through electrodes 14b, 18b are arranged along the direction perpendicular to the stacking direction and the longitudinal direction of the element 51, and are separated by a predetermined length in the direction. In each coil L, the through electrodes 13b, 15b, 17b, and 19b are arranged at a plurality of locations (two locations in the present embodiment) when viewed from the stacking direction. The through electrodes 13 b and 17 b and the through electrodes 15 b and 19 b are arranged along the longitudinal direction of the element 51 and are separated by a predetermined length in the longitudinal direction of the element 1.

  As shown in FIG. 7, each capacitor C includes a plurality (8 layers in this embodiment) of non-magnetic green sheets (insulators) 61 in which capacitor electrodes 61 a to 68 a corresponding to the coils L are formed. ˜68 are stacked. Each capacitor electrode 61a, 63a, 65a, 67a includes a pair of lead-out portions 61b, 63b, 65b, 67b exposed at the end faces of the nonmagnetic green sheets 61, 63, 65, 67, respectively. The green sheets 61, 63, 65 and 67 are formed in a substantially rectangular shape. Each capacitor electrode 62a, 64a, 66a, 68a includes lead-out portions 62b, 64b, 66b, 68b exposed on the end faces of the nonmagnetic green sheets 62, 64, 66, 68 constituting the side surface of the element 51, On each nonmagnetic green sheet 62, 64, 66, 68, it is formed in a substantially rectangular shape. Each lead-out portion 62 b, 64 b, 66 b, 68 b is arranged so as to be shifted in the longitudinal direction of the element 51.

  The capacitor electrodes 61a and 62a and the non-magnetic green sheet 61 positioned between them constitute one capacitor C. The capacitor electrodes 63a and 64a and the non-magnetic green sheet 63 positioned between them constitute one capacitor C. The capacitor electrodes 65a and 66a and the nonmagnetic green sheet 65 positioned between them constitute one capacitor C. The capacitor electrodes 67a and 68a and the nonmagnetic green sheet 67 positioned between them constitute one capacitor C. In this embodiment, four capacitors C are provided in the capacitor unit 30 in the stacking direction.

  The lead-out portions 61b, 63b, 65b, 67b of the capacitor electrodes 61a, 63a, 65a, 67a are electrically connected to the ground electrode 7. The lead-out portions 62b, 64b, 66b, 68b of the capacitor electrodes 62a, 64a, 66a, 68a are electrically connected to one input / output electrode 3. As a result, the capacitor electrodes 62a, 64a, 66a, 68a are electrically connected to one end (conductor pattern 11a) of the corresponding coil L. In the present embodiment, the capacitor electrodes 62b, 64b, 66b, and 68b are signal electrodes, and the capacitor electrodes 61a, 63a, 65a, and 67a are ground electrodes.

The non-magnetic green sheets 61 to 68 are formed by applying a slurry using, for example, a mixed powder of TiO ₂ , CuO and NiO on the film by a doctor blade method, like the non-magnetic green sheets 31 to 33. Can be used. The thickness of the nonmagnetic green sheets 61 to 68 is, for example, about 18 μm.

  The capacitor electrodes 61a to 68a are formed by, for example, screen-printing a conductor paste mainly composed of silver and then drying the same as the capacitor electrodes 31a to 33a.

  The element 51 includes nonmagnetic green sheets 11 to 22 on which conductor patterns 11a to 22a are formed, nonmagnetic green sheets 61 to 68 on which capacitor electrodes 61a to 68a are formed, and nonmagnetic green sheets 41 and 42. Are stacked and pressure-bonded as shown in FIG. 7, cut into chips, and then fired at a predetermined temperature (for example, 800 to 900 ° C.). The element 51 has, for example, a length in the longitudinal direction after firing of about 2.0 mm, a width of about 1.0 mm, and a height of about 0.7 mm.

  In the multilayer filter array F2 having the above-described configuration, as shown in FIG. 10, each coil L and each capacitor C corresponding to each coil L constitute an L-type circuit.

  As described above, in the second embodiment, in each coil L, the through electrodes 12b, 14b, 16b, and 18b that electrically connect the inner ends of the conductor patterns 12a, 14a, 16a, and 18a, The non-magnetic green sheets 11 to 22, 61 to 68, 41 and 42 are arranged at a plurality of locations when viewed from the stacking direction, and the through electrodes 12 b and 16 b and the through electrodes 14 b and 18 b are arranged in the longitudinal direction of the element 1. Separated by a predetermined length. For this reason, the number of through electrodes arranged at the same position when viewed from the stacking direction is smaller than that of the conventional one, and at each position corresponding to the through electrodes 12b, 14b, 16b, and 18b on the side surface orthogonal to the stacking direction. The height of the formed protrusion will be reduced. As a result, when the multilayer filter array F2 is mounted, the mounting failure of the mounter or the mounting failure to the external substrate or the like is suppressed, and the mounting to the external substrate or the like can be performed appropriately. In addition, the occurrence of cracks around the protrusion is suppressed, and the reliability is improved.

  In the second embodiment, in each coil L, the through electrodes 13b, 15b, 17b, and 19b that electrically connect the outer ends of the conductor patterns 13a, 15a, 17a, and 19a are viewed from the stacking direction. Are arranged at a plurality of locations. Thereby, in each coil L, since each penetration electrode 13b, 15b, 17b, 19b is arrange | positioned in multiple places seeing from a lamination direction, the number of the penetration electrodes arrange | positioned in the same position seeing from a lamination direction is the same. , Less than the conventional one. As a result, the height of the protrusion formed at each position corresponding to the through electrodes 13b, 15b, 17b, and 19b on the side surface orthogonal to the stacking direction is reduced, and mounting on an external substrate or the like can be performed more appropriately. As well as increased reliability.

  Here, the embodiment and the comparative example will specifically show that according to the present embodiment, mounting on an external substrate or the like can be appropriately performed and the reliability is improved.

  In the example, a multilayer filter having the same configuration as that of the multilayer filter F1 of the first embodiment was used. In the comparative example, as shown in FIG. 11, each through electrode 105 that electrically connects the inner ends of a pair of conductor patterns 101 and 103 adjacent in the stacking direction and a pair of adjacent adjacent patterns in the stacking direction. As each through electrode 107 that electrically connects the outer end portions of the conductor patterns 101 and 103, a multilayer filter that is concentrated in the same position as viewed from the lamination direction is used. The multilayer filter according to the comparative example has the same configuration as the multilayer filter F1 described above except for the arrangement of the through electrodes 105 and 107.

  In the multilayer filter according to the embodiment, as shown in FIG. 12, the number of through electrodes 12b, 14b, 16b, 18b, and 20b arranged at the same position when viewed from the stacking direction is three or two. It is. The height H1 of the protrusion formed at a position corresponding to the through electrodes 12b, 16b, and 20b is about 3 to 4 μm. The height H2 of the protrusion formed at a position corresponding to the through electrodes 14b and 18b is about 2 to 3 μm. The height H3 of the protrusion formed at the position corresponding to the through electrode 21b is about 1 to 2 μm.

  When the multilayer filter according to the example was manufactured and a sampling inspection (the number of sampling samples: 20,000) was performed from the manufactured multilayer filter, no crack was observed around the protrusion, and the crack generation rate Was 0%. Further, when the manufactured multilayer filter was picked up by the mounter, the pickup rate (ratio of the number of samples that could be properly picked up with respect to the number of samples picked up) was 99.98%.

  On the other hand, in the multilayer filter according to the comparative example, as shown in FIG. 13, the number of through-electrodes 105 and 107 arranged at the same position when viewed from the stacking direction is five. The heights H4 and H5 of the protrusions formed at positions corresponding to the through electrodes 105 and 107 are about 9 to 14 μm.

  When a multilayer filter according to the comparative example is manufactured and a sampling inspection (the number of sampling samples: 20,000) is performed from the manufactured multilayer filter, cracks K are observed around the protrusions, and cracks are generated. The rate was 0.68%. Further, when the manufactured multilayer filter was picked up by a mounter, the pickup rate was 99.76%.

  From the above, the effectiveness of the present embodiment was confirmed. The reference value for determining whether the pickup rate is good is generally 99.9%.

  The present invention is not limited to the embodiment described above. For example, the multilayer filter array F2 of the second embodiment is configured to include four sets of filters including the coil L and the capacitor C, but is not limited thereto, and may be configured to include three or less sets of filters. Moreover, it is good also as a structure provided with 5 or more sets of filters.

  Further, the inductance of the coil L in the multilayer filter F1 and the multilayer filter array F2 can be adjusted by the width and the number of layers of the conductor patterns 11a to 22a, and is not limited to the above-described embodiment. Further, the capacitance of the capacitor C in the multilayer filter F1 and the multilayer filter array F2 can be adjusted by the area and the number of layers of the capacitor electrodes 31a to 33a, 61a to 68a, and is not limited to the above-described embodiment. .

  In the first and second embodiments, the elements 1 and 51 are configured by laminating green sheets (green sheet laminating method). However, the present invention is not limited to this, and a nonmagnetic slurry is used. The elements 1 and 51 may be configured by printing and laminating the non-magnetic slurry, the conductor patterns 11a to 22a and the capacitor electrodes 31a to 33a and 61a to 68a (print lamination method).

  In the first embodiment, the present invention is applied to the L-type multilayer three-terminal filter. However, the present invention is not limited to this, and the present invention is not limited to this. The T-type, π-type, or double π-type multilayer three-terminal filter. It may be applied to a filter. In the second embodiment, the present invention is applied to each of the L-type stacked three-terminal filter arrays. However, the present invention is not limited to this, and the present invention is not limited to this. You may apply to a lamination type 3 terminal filter array.

1 is a perspective view showing a multilayer filter according to a first embodiment. It is the schematic for demonstrating the cross-sectional structure of the multilayer filter which concerns on 1st Embodiment. 1 is an exploded perspective view showing a multilayer filter according to a first embodiment. It is a figure for demonstrating arrangement | positioning of the penetration electrode in the multilayer filter which concerns on 1st Embodiment. It is a figure for demonstrating the equivalent circuit of the multilayer filter which concerns on 1st Embodiment. It is a perspective view which shows the multilayer filter array which concerns on 2nd Embodiment. It is a disassembled perspective view which shows the multilayer filter array which concerns on 2nd Embodiment. It is a disassembled perspective view which shows the coil part contained in the multilayer filter array which concerns on 2nd Embodiment. It is a disassembled perspective view which shows the coil part contained in the multilayer filter array which concerns on 2nd Embodiment. It is a figure for demonstrating the equivalent circuit of the multilayer filter array which concerns on 2nd Embodiment. It is a figure for demonstrating arrangement | positioning of the penetration electrode in a comparative example. It is the schematic for demonstrating the cross-sectional structure of the laminated filter which concerns on an Example. It is the schematic for demonstrating the cross-sectional structure of the laminated filter which concerns on a comparative example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,51 ... Element, 3, 5 ... Input / output electrode, 7 ... Ground electrode, 10 ... Coil part, 11-22, 31-33, 41, 42, 61-68 ... Nonmagnetic green sheet (insulator), 11a to 22a ... conductive pattern, 11b to 21b ... through electrode, 30 ... capacitor part, 31a-33a, 61a-68a ... capacitor electrode, C ... capacitor, F1 ... multilayer filter, F2 ... multilayer filter array, L ... coil .

Claims (16)

A laminate having a coil constituted by laminating a plurality of insulators formed with a spiral conductor pattern and a capacitor constituted by laminating a plurality of insulators formed with capacitor electrodes. When,
A pair of input / output electrodes formed on side surfaces parallel to the stacking direction of the insulator in the stacked body and connected to both ends of the coil;
Inner ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by a through electrode formed in the insulator,
Each of the through electrodes that electrically connect the inner end portions is disposed at a plurality of locations when viewed from the stacking direction.   2. The multilayer filter according to claim 1, wherein each of the through electrodes is disposed along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction. Outer ends of the conductor patterns adjacent in the laminating direction are electrically connected by a through electrode formed in the insulator,
2. The multilayer filter according to claim 1, wherein each of the through electrodes that electrically connect the outer end portions is disposed at a plurality of locations when viewed from the laminating direction. Each through electrode that electrically connects the inner end portions is disposed along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction,
The through electrodes that electrically connect the outer ends are arranged in the direction in which the through electrodes are orthogonal to the stacking direction and electrically connect the inner ends as viewed from the stacking direction. The multilayer filter according to claim 3, wherein the multilayer filter is disposed along a predetermined direction that intersects. A laminate having a coil constituted by laminating a plurality of insulators formed with a spiral conductor pattern and a capacitor constituted by laminating a plurality of insulators formed with capacitor electrodes. When,
A pair of input / output electrodes formed on side surfaces parallel to the stacking direction of the insulator in the stacked body and connected to both ends of the coil;
Inner ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by a through electrode formed in the insulator,
The multilayer filter, wherein the through electrodes adjacent to each other in the stacking direction are separated from each other by a predetermined length in a direction orthogonal to the stacking direction when viewed from the stacking direction. Outer ends of the conductor patterns adjacent in the laminating direction are electrically connected by a through electrode formed in the insulator,
Among the plurality of through electrodes that electrically connect the outer end portions, those adjacent in the stacking direction are perpendicular to the stacking direction and viewed from the stacking direction, and the inner end portions are electrically connected to each other. The multilayer filter according to claim 5, wherein the through-electrodes connected to each other are separated by a predetermined length in a direction intersecting with a direction in which the through electrodes are separated from each other.   The multilayer filter according to any one of claims 1 to 6, wherein the insulator is made of a non-magnetic material.   The multilayer filter according to claim 1, wherein the insulator on which the conductor pattern is formed is made of a magnetic material. Constructed by laminating a plurality of coils formed by laminating a plurality of insulators formed with spiral conductor patterns and a plurality of insulators formed with capacitor electrodes corresponding to the coils. A laminate having a plurality of capacitors to be
A pair of input / output electrodes formed on a side surface of the laminate that is parallel to the lamination direction of the insulator, and connected to both ends of each coil; and
In each of the coils,
Inner ends of the conductor patterns adjacent to each other in the stacking direction are electrically connected by a through electrode formed in the insulator,
Each of the through electrodes that electrically connect the inner end portions is disposed at a plurality of locations when viewed from the stacking direction.   10. The multilayer filter array according to claim 9, wherein, in each of the coils, each through electrode is disposed along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction. . In each of the coils,
Outer ends of the conductor patterns adjacent in the laminating direction are electrically connected by a through electrode formed in the insulator,
The multilayer filter array according to claim 9, wherein each of the through electrodes that electrically connect the outer end portions is disposed at a plurality of locations when viewed from the stacking direction. In each of the coils,
Each through electrode that electrically connects the inner end portions is disposed along a predetermined direction orthogonal to the stacking direction when viewed from the stacking direction,
The through electrodes that electrically connect the outer ends are arranged in the direction in which the through electrodes are orthogonal to the stacking direction and electrically connect the inner ends as viewed from the stacking direction. The multilayer filter array according to claim 11, wherein the multilayer filter array is arranged along a predetermined direction that intersects. Constructed by laminating a plurality of coils formed by laminating a plurality of insulators formed with spiral conductor patterns and a plurality of insulators formed with capacitor electrodes corresponding to the coils. A laminate having a plurality of capacitors to be
A pair of input / output electrodes formed on a side surface of the laminate that is parallel to the lamination direction of the insulator, and connected to both ends of each coil; and
In each coil, the through-electrodes adjacent in the stacking direction are separated from each other by a predetermined length in a direction orthogonal to the stacking direction when viewed from the stacking direction. In each of the coils,
Outer ends of the conductor patterns adjacent in the laminating direction are electrically connected by a through electrode formed in the insulator,
Among the plurality of through electrodes that electrically connect the outer end portions, those adjacent in the stacking direction are perpendicular to the stacking direction and viewed from the stacking direction, and the inner end portions are electrically connected to each other. The multilayer filter array according to claim 13, wherein the through-electrodes connected to each other are separated by a predetermined length in a direction intersecting with a direction in which the through electrodes are separated from each other.   The multilayer filter array according to any one of claims 9 to 14, wherein the insulator is made of a non-magnetic material. The multilayer filter array according to claim 9, wherein the insulator on which the conductor pattern is formed is formed of a magnetic material.

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