JP5428315B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component, and more particularly to an electronic component in which a coil and a capacitor are built in a laminate.

  As a conventional electronic component, for example, a multilayer LC composite component described in Patent Document 1 is known. The multilayer LC composite component is composed of a multilayer body including a first coil, a second coil, and a capacitor. The capacitor is disposed so as to be sandwiched between the first coil and the second coil in the stacking direction. In the multilayer LC composite component, the first coil, the second coil, and the capacitor constitute a T-type noise filter. Therefore, a necessary signal among the input signals input to the first coil is output from the second coil. On the other hand, unnecessary signals (noise) among the input signals flow from the capacitor to the ground.

However, in the multilayer LC composite component, the first coil and the capacitor are adjacent to each other, and the second coil and the capacitor are adjacent to each other. Therefore, stray capacitance is generated between the first coil and the capacitor, and the first coil and the capacitor are capacitively coupled. Similarly, stray capacitance is generated between the second coil and the capacitor, and the second coil and the capacitor are capacitively coupled. As a result, there is a problem that noise returns from the electrode on the ground side of the capacitor to the first coil and the second coil.
JP 2003-152490 A

  Accordingly, an object of the present invention is to suppress noise from returning from a capacitor to a coil in an electronic component incorporating a noise filter composed of a coil and a capacitor.

An electronic component according to an aspect of the present invention includes a first stacked body in which a plurality of insulating layers are stacked, a second stacked body stacked on the first stacked body, and the first stacked body. A capacitor that is built in the body and configured by a plurality of capacitor conductors, and a coil that is built in the second laminated body and forms a noise filter together with the capacitor. In the multilayer body, at least a part of the insulating layer sandwiched between the capacitor and the second multilayer body has a lower relative dielectric constant than the insulating layer sandwiched between the plurality of capacitor conductors. In the first laminated body, the capacitor is sandwiched from both sides in the stacking direction by the insulating layer having a lower relative dielectric constant than the insulating layer sandwiched between the capacitor conductors, plural The insulating layer interposed capacitor _{conductors, Al 2 O 3 -Ba 2 Ti} 4 O 12 -CeO 2 - made of glass, the insulating layer sandwiching said capacitor from opposite sides of the stacking direction, Al ₂ It is characterized by being made of O ₃ —CeO ₂ —glass .

  ADVANTAGE OF THE INVENTION According to this invention, in the electronic component incorporating the noise filter comprised by a coil and a capacitor | condenser, it can suppress that a noise returns from a capacitor | condenser to a coil.

  Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

(About the configuration of electronic components)
FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment. FIG. 2 is an exploded perspective view of the laminate 12 according to the embodiment. FIG. 3 is an equivalent circuit diagram of the electronic component 10. Hereinafter, the stacking direction of the electronic component 10 is defined as the z-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 10 is defined as the y-axis direction. To do.

  The electronic component 10 shown in FIG. 1 includes a laminate 12, external electrodes 18 a, 18 b, 20 and a connection electrode 22. Moreover, the laminated body 12 has a rectangular parallelepiped shape, and is configured by laminating the laminated body 14 and the laminated body 16.

  The stacked body 14 is an LTCC (Low Temperature Co-fired Ceramics) substrate. The laminate 14 will be described in detail with reference to FIG.

  The laminated body 14 has a built-in capacitor C, and is composed of insulating layers 32a to 32e, 33a to 33c, and 34a to 34d. The capacitor C is composed of capacitor conductors 50a to 50f.

Insulating layer 32a~32e (in the present _{embodiment, Al 2 O 3 -Ba 2 Ti} 4 O 12 -CeO 2 - glass) dielectric materials that are mainly composed of SiO ₂ is a rectangular layer made of, 10 It has the above dielectric constant. In addition, although the five insulating layers 32a-32e are described, five or more may be sufficient. Therefore, in FIG. 2, the insulating layer 32c and the insulating layer 32d are connected with a dotted line, and it is shown that the further insulating layer 32 may be provided between the insulating layer 32c and the insulating layer 32d. . The insulating layers 32a to 32e desirably have a thickness of 250 μm in the stacked state.

The insulating layers 33 a to 33 c are provided in the multilayer body 14 so as to be sandwiched between the capacitor C and the multilayer body 16. That is, the insulating layers 33a to 33c are provided on the positive side of the insulating layer 32a in the z-axis direction. The insulating layers 33a to 33c are rectangular layers made of a dielectric material (in this embodiment, Al ₂ O ₃ —CeO ₂ —glass) whose main component is SiO ₂ , and are more than the insulating layers 32a to 32e. It has a low relative dielectric constant (in this embodiment, 10 or less). The insulating layers 33a to 33c desirably have a thickness of 25 μm in the stacked state.

The insulating layers 34 a to 34 d are provided on the negative side in the z-axis direction from the capacitor C in the stacked body 14. That is, the insulating layers 33a to 33c are provided on the negative direction side in the z-axis direction with respect to the insulating layer 32e. The insulating layers 34a to 34d are rectangular layers made of a dielectric material (in this embodiment, Al ₂ O ₃ —CeO ₂ —glass) whose main component is SiO ₂ , and are more than the insulating layers 32a to 32e. It has a low relative dielectric constant (in this embodiment, 10 or less). The insulating layers 34a to 34d desirably have a thickness of 20 μm in the stacked state.

  Capacitor conductors 50a to 50f are respectively formed on the main surfaces of the insulating layers 32a to 32e and 34a by a conductive material mainly composed of Ag or Pd, for example. Each of the capacitor conductors 50a to 50f has a rectangular shape, and has lead portions 52a to 52f. The lead-out portions 52a to 52f are alternately drawn out to the side on the positive direction side in the y-axis direction and the side on the negative direction side in the y-axis direction. The capacitor conductors 50a to 50f are stacked in this order from the positive side in the z-axis direction so that the insulating layers 32a to 32e and 34a are stacked in this order, thereby constituting the capacitor C. Thereby, the insulating layers 32a to 32e are sandwiched between the capacitor conductors 50a to 50f. Further, the capacitor C is sandwiched from both sides in the z-axis direction by insulating layers 33a to 33c and insulating layers 34a to 34d having a relative dielectric constant lower than that of the insulating layers 32a to 32e.

  The stacked body 16 is stacked on the stacked body 14 and is formed to be smaller than the stacked body 14 when viewed in plan from the z-axis direction. Below, the laminated body 16 is demonstrated in detail, referring FIG.

  The laminated body 16 incorporates the coils L1 and L2, and is composed of insulating layers 30a to 30g. The coils L1 and L2 are respectively composed of coil conductors 40a to 40d, 44a to 44d and via-hole conductors b1 to b3 and b4 to b6, and constitute a T-type LC noise filter together with the capacitor C.

  The insulating layers 30a to 30g are rectangular layers made of an insulating material such as polyimide resin, for example. The insulating layers 30a to 30g are formed smaller than the stacked body 14 when viewed in plan from the z-axis direction. Thereby, the laminated body 14 is in a state of protruding from the four sides of the insulating layers 30a to 30g.

  For example, the coil conductors 40a to 40d are formed on the main surfaces of the insulating layers 30d to 30g by using a conductive material mainly composed of Ag or Pd, for example. Similarly, the coil conductors 44a to 44d are made of, for example, a conductive material mainly composed of Ag or Pd so as to be aligned with the coil conductors 40a to 40d in the x-axis direction on the main surfaces of the insulating layers 30d to 30g. It is formed. Each of the coil conductors 40a to 40d and 44a to 44d has a spiral shape by bending the linear electrode.

  Each of the coils 40a and 44a has lead portions 42a and 46a at one end thereof. The lead-out part 42a is drawn out to the side on the negative direction side in the x-axis direction, and the lead-out part 46a is drawn out to the side on the positive direction side in the x-axis direction. A lead portion 48 is provided between the coil conductor 40d and the coil 44d. One end of the drawing portion 48 is drawn to the side on the positive direction side in the y-axis direction.

  The via-hole conductors b1 to b3 are formed so as to penetrate the insulating layers 30d to 30f in the z-axis direction, respectively. Similarly, the via-hole conductors b4 to b6 are also formed so as to penetrate the insulating layers 30d to 30f in the z-axis direction, respectively.

  The coil conductors 40a to 40d are laminated in this order from the positive side in the z-axis direction in the insulating layers 30a to 30g, so that adjacent ones are connected by via-hole conductors b1 to b3 to form the coil L1. Yes. Similarly, the coil conductors 44a to 44d are laminated in this order from the positive side in the z-axis direction in the insulating layers 30a to 30g, so that the adjacent ones are connected by the via-hole conductors b4 to b6, and the coil L2 is connected. It is composed. And the coil L1 and the coil L2 are connected in series via the drawer | drawing-out part 48 as shown in FIG.

  As shown in FIG. 1, the external electrodes 18a and 18b are respectively formed on the side surfaces at both ends in the x-axis direction of the multilayer body 12, and are electrically connected to the lead portions 42a and 44a shown in FIG. As shown in FIG. 1, the external electrode 20 is formed on the side surface on the negative side in the y-axis direction of the multilayer body 12, and is electrically connected to the lead portions 52a, 52c, and 52e shown in FIG. As shown in FIG. 1, the connection electrode 22 is formed on the side surface on the positive side in the y-axis direction of the multilayer body 12, and is electrically connected to the lead portions 48, 52b, 52d, and 52f shown in FIG. . Thereby, the capacitor C is connected between the coil L1 and the coil L2 by the connection electrode 22. As a result, the electronic component 10 forms a T-type LC noise filter as shown in FIG.

  When the electronic component 10 operates as a T-type LC noise filter, the external electrodes 18a and 18b function as signal electrodes, and the external electrode 20 functions as a ground electrode. That is, a relatively high potential is applied to the external electrodes 18a and 18b, and a relatively low potential (ground potential) is applied to the external electrode 20.

(effect)
According to the electronic component 10 configured as described above, noise can be prevented from returning from the capacitor C to the coils L1 and L2, as described below. More specifically, as shown in FIG. 2, the insulating layers 33a to 33c provided between the coil conductors 40d and 44d and the capacitor conductor 50a are insulating layers provided between the capacitor conductors 50a to 50f. It has a relative dielectric constant lower than 32a to 32e. Therefore, in the electronic component 10, the stray capacitance generated between the capacitor C and the coils L1 and L2 is larger than that in the case where the relative dielectric constants of the insulating layers 33a to 33c are equal to the relative dielectric constant of the insulating layers 32a to 32e. Get smaller. As a result, noise is suppressed from returning from the capacitor conductors 50a, 50c, and 50e to the coils L1 and L2.

  Moreover, in the electronic component 10, since the insulating layers 33a to 33c and 34a to 34d do not contain Ba that easily elutes into the plating solution during plating, the insulating layers 33a to 33c and 34a to 34d have better plating resistance than the insulating layers 32a to 32e. Therefore, it is prevented that the insulating layers 33a to 33c and 34a to 34d are melted during plating and the capacitor conductor 50 is exposed.

  The inventor of the present application performed a computer simulation described below in order to clarify the effect of the electronic component 10. Specifically, in the model of the specification described below, the relative permittivity of the insulating layers 32a to 32e, 33a to 33c, and 34a to 34d was changed, and the relationship between the frequency and the insertion loss was examined.

Model specifications Number of coil conductors 40a to 40d, 44a to 44d: 4
Coil conductors 40a to 40d, 44a to 44d line width: 16 μm
Width between lines of the coil conductors 40a to 40d and 44a to 44d: 15 μm
Side gap of laminate 16: 65 μm
Distance between coils L1 and L2: 50 μm
Number of capacitor conductors 50a to 50f: 20
Side gap of laminate 14: 125 μm

  In the model with the above specifications, the first to eighth models were obtained by combining the relative dielectric constants as shown in Table 1 below.

  FIG. 4 is a graph showing the relationship between frequency and insertion loss in the first model and the second model. FIG. 5 is a graph showing the relationship between frequency and insertion loss in the third model and the fourth model. FIG. 6 is a graph showing the relationship between frequency and insertion loss in the fifth model and the sixth model. FIG. 7 is a graph showing the relationship between frequency and insertion loss in the seventh model and the eighth model. 4 to 7, the vertical axis indicates insertion loss, and the horizontal axis indicates frequency.

  According to the graphs of FIGS. 6 and 7, it can be seen that the insertion loss is increased by making the dielectric constant of the insulating layers 33 and 34 smaller than the dielectric constant of the insulating layer 32. That is, it can be seen that noise is efficiently removed by making the dielectric constants of the insulating layers 33 and 34 smaller than the dielectric constant of the insulating layer 32. This means that noise is prevented from returning from the capacitor conductors 50a, 50c, and 50e to the coils L1 and L2.

  4 to 7, when the relative dielectric constant of the insulating layers 33 and 34 is 8, if the relative dielectric constant of the insulating layer 32 is 60 or more, noise is more effectively removed. I understand that Therefore, when the dielectric constant of the insulating layers 33 and 34 is 8, the dielectric constant of the insulating layer 32 is desirably 60 or more.

(Production method)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. In the following, the manufacturing process of one electronic component 10 will be described, but actually, a plurality of electronic components 10 are manufactured collectively in a state of being arranged in a matrix. FIG. 8 is a plan view of a mother laminate of electronic components from the z-axis direction.

First, the laminated body 14 shown in FIG. 2 is produced. More specifically, Al ₂ O ₃ , CeO ₃ and Ca—Al—B—Si glass powder are used as raw materials in a ball mill, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersant are added to the ceramic powder, and the mixture is mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet by the doctor blade method and dried to obtain ceramic green sheets to be the insulating layers 32a to 32e.

Next, Al ₂ O ₃ , CeO ₃ and Ca—Al—B—Si glass powder are used as raw materials in a ball mill, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersant are added to the ceramic powder, and the mixture is mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape by a doctor blade method and dried to obtain ceramic green sheets to be the insulating layers 33a to 33c and 34a to 34d.

  Next, a conductive paste mainly composed of Ag, Pd, Cu, Au or an alloy thereof is applied to the ceramic green sheets to be the insulating layers 32a to 32e, 34a by a method such as a screen printing method or a photolithography method. The capacitor conductors 50a to 50f are formed by coating with the above.

  Next, each ceramic green sheet is laminated. Specifically, the insulating layers 33a to 33c, 32a to 32e, and 34a to 34d are sequentially stacked from the positive direction side in the z-axis direction, and pressure bonding is performed by a hydrostatic press or the like. Thereafter, firing is performed to obtain a mother laminated body of the laminated body 14.

  Next, an insulating layer 30g made of polyimide resin is formed on the laminate 14 by photolithography. Next, the coil conductors 40d and 44d are formed on the insulating layer 30g. Specifically, a conductive layer made of a conductive material mainly composed of Ag or Pd is formed on the insulating layer 30g by a dry plating method such as sputtering or vapor deposition. Next, after applying and drying a photosensitive resist on the conductive layer, a desired film is exposed by applying a mask film to the photosensitive resist. Next, the photosensitive resist is developed to form a resist pattern having a shape in which unnecessary portions of the conductive layer are exposed. Finally, after removing the exposed conductive layer by etching, the resist pattern is removed to form coil conductors 40d and 44d as shown in FIG.

  Next, as shown in FIG. 2, an insulating layer 30f made of polyimide resin is formed on the insulating layer 30g and the coil conductors 40d and 44d by photolithography. At this time, via holes are formed at positions where the via hole conductors b3 and b6 of the insulating layer 30f are to be formed.

  Next, coil conductors 40c and 44c are formed on the insulating layer 30f. Specifically, a conductive layer is formed on the insulating layer 30f by a dry plating method. At this time, the via hole is filled with a conductive material, and via hole conductors b3 and b6 are formed. Thereafter, the conductive layer is subjected to resist pattern formation, etching, resist pattern removal, and photolithography. Since these processes are the same as those already described, description thereof will be omitted. Thereby, the coil conductors 40c and 44c and the insulating layer 30e are formed on the insulating layer 30f. Further, the same processing is repeated to form the coil conductors 40a, 40b, 44a, 44b and the insulating layer 30d. Thereafter, insulating layers 30a to 30c made of polyimide resin are formed on the coil conductors 40a and 44a and the insulating layer 30d.

  Thereafter, the mother laminated body of the laminated body 12 is cut by a dicer and separated into individual laminated bodies 12. At this time, as shown by a dotted line portion in FIG. 8, the mother laminated body is cut so that the dicer passes through a portion where the insulating layers 30 a to 30 g are not formed. Further, a barrel is applied to the cut laminate 12. Thereby, the corners of the laminate 12 are chamfered.

  Finally, the external electrodes 18a, 18b, 20 and the connection electrode 22 are formed. Specifically, a conductive paste made of Ag and resin is applied and cured to form a silver electrode. Next, Ni plating and Sn plating are performed on the silver electrode to form the external electrodes 18a, 18b, 20 and the connection electrode 22. The electronic component 10 is completed through the above steps.

  As described above, the coil conductors 40a to 40d and 44a to 44d of the electronic component 10 are produced by photolithography. By using photolithography, coil conductors 40a to 40d and 44a to 44d having a narrow line width can be formed. As a result, the number of turns of the coil conductors 40a to 40d and 44a to 44d can be increased, and the number of stacked electronic components 10 can be suppressed.

  Further, since the laminated body 12 is barreled and the corners of the laminated body 12 are chamfered, the external electrodes 18a, 18b, 20 and the connection electrodes 22 are prevented from being peeled off at the corners of the laminated body 12. The

  In addition, the insulating layers 30a to 30g are formed smaller than the stacked body 14 when viewed from the z-axis direction. Thereby, it can suppress effectively that external electrode 18a, 18b, 20 and the connection electrode 22 peel from the laminated body 12. FIG. This will be described below with reference to FIGS. FIG. 9 is an enlarged view of the vicinity of the corner of the multilayer body 12 of the electronic component 10.

  When the insulating layers 30a to 30g are formed on the entire surface of the laminate 12 and cut with a dicer, a polyimide whisker is generated on the cut surfaces of the insulating layers 30a to 30g. When such polyimide whiskers occur, it is difficult to form the external electrodes 18a, 18b, 20 and the connection electrode 22 with high accuracy.

  On the other hand, in the electronic component 10, as shown in FIG.8 and FIG.9, the insulating layers 30a-30g are not formed in the part which a dicer passes. Therefore, when the electronic component 10 is carved, the polyimide beard as described above does not occur. Thereby, the external electrodes 18a, 18b, 20 and the connection electrode 22 can be formed with high accuracy. As a result, in the electronic component 10, the external electrodes 18a, 18b, 20 and the connection electrode 22 are suppressed from peeling off.

  In the electronic component 10, the external electrodes 18a, 18b, 20 and the connection electrode 22 are formed using a conductive paste containing resin. Since the external electrodes 18a, 18b, 20 and the connection electrode 22 are also formed on the insulating layers 30a to 30g made of resin (polyimide), the adhesion with the insulating layers 30a to 30g is good. Therefore, in the electronic component 10, the external electrodes 18a, 18b, 20 and the connection electrode 22 are suppressed from peeling off.

  Further, by setting the unevenness of the surface of the laminate 14 to 15 μm or less, the insulating layer 30 and the coil conductors 40 and 44 can be formed with high accuracy by photolithography.

(Other embodiments)
By the way, when the electronic component 10 operates as a T-type LC noise filter, the external electrodes 18a and 18b function as signal electrodes, and the external electrode 20 functions as a ground electrode. That is, a relatively high potential is applied to the external electrodes 18a and 18b, and a relatively low potential (ground potential) is applied to the external electrode 20. And since the coil conductors 40a-40d and 44a-44d which comprise the coils L1, L2 and the external electrode 20 are insulated by the insulating layers 30d-30g, they are in the state which is not electrically connected. Therefore, the potentials of the coil conductors 40 a to 40 d and 44 a to 44 d are higher than the potential of the external electrode 20.

  As described above, when the potentials of the coil conductors 40a to 40d and 44a to 44d are higher than the potential of the external electrode 20, the coil conductors 40a to 40d, 44a to 44d and the external electrode 20 are short-circuited by electromigration. There is a problem. In more detail, the metal which comprises the coil conductors 40a-40d and 44a-44d changes to a cation with a water | moisture content, an electric current, etc. When a voltage is applied to the external electrodes 18 a, 18 b, and 20 of the electronic component 10, such a cation is generated in the insulating layer by an electric field generated between the coil conductors 40 a to 40 d and 44 a to 44 d and the external electrode 20. It moves to the external electrode 20 side with a low electric potential through the boundary surface of 30c-30g. If such a state lasts for a long time, a current path is formed between the coil conductors 40a to 40d, 44a to 44d and the external electrode 20, and the coil conductors 40a to 40d, 44a to 44d and the external electrode 20 are short-circuited. There is a risk that.

  Therefore, in the electronic component 10, an insulator may be provided in the stacked body 16 so that a short circuit due to electromigration does not occur. Below, the electronic component 10 which concerns on other embodiment provided with the insulator is demonstrated, referring FIG. FIG. 10A is a perspective view of the electronic component 10 according to another embodiment viewed in plan from the z-axis direction, and FIG. 10B is a perspective view of the electronic component 10 according to the other embodiment from the x-axis direction. FIG. In FIG. 10A, only the coil conductors 40a and 44a are shown. Moreover, in FIG.10 (b), about the laminated body 14, only one part was described.

  In the electronic component 10 according to another embodiment, a portion where a short circuit due to electromigration is most likely to occur is a region A illustrated in FIG. The region A is a position where the external electrode 20 and the coil conductors 40a to 40d and 44a to 44d are closest to each other when viewed in plan from the z-axis direction. In the region A, the distance between the external electrode 20 and the coil conductors 40a to 40d and 44a to 44d is the shortest, so that the electric field is strongest in the electronic component 10. Therefore, in the region A, metal cations easily move from the coil conductors 40 a to 40 d and 44 a to 44 d to the external electrode 20 by an electric field. That is, a short circuit due to electromigration is likely to occur.

  Therefore, in the electronic component 10, as shown in FIG. 10, in the region A, the boundary between the insulating layers 30 c to 30 g adjacent to each other extends in the z-axis direction so as to prevent the movement of the metal cation. An insulator 60 is provided. In the electronic component 10 according to the present embodiment, the insulator 60 is, as shown in FIG. 10 (b), from the positive direction side in the z-axis direction from the coil conductor 40a located on the most positive direction side in the z-axis direction. It extends continuously from the coil conductor 40d located on the most negative side in the z-axis direction to the negative direction side in the z-axis direction. Further, as shown in FIG. 10A, the insulator 60 continuously extends in the x-axis direction from the vicinity of the side surface on the positive direction side in the x-axis direction to the vicinity of the side surface on the negative direction side in the x-axis direction. ing. Thereby, the insulator 60 stands like a wall between the coil conductors 40a to 40d, 44a to 44d and the external electrode 20.

  In the electronic component 10 according to another embodiment, by providing the insulator 60, the metal atoms constituting the coil conductors 40a to 40d and 44a to 44d are changed to cations, and the cations are converted into external electrodes 20 by an electric field. Even if it moves to the side, the movement is blocked by the insulator 60. As a result, a current path is not formed between the coil conductors 40a to 40d and 44a to 44d and the external electrode 20, and a short circuit between the coil conductors 40a to 40d and 44a to 44d and the external electrode 20 due to electromigration. Occurrence is prevented.

(Modification)
In the electronic component 10 illustrated in FIG. 2, both the insulating layers 33 a to 33 c and the insulating layers 34 a to 34 d are assumed to have a relative dielectric constant smaller than that of the insulating layers 32 a to 32 e. However, at least the insulating layers 33a to 33c need to have a relative dielectric constant smaller than that of the insulating layers 32a to 32e. Therefore, the insulating layers 34a to 34d may have the same relative dielectric constant as the insulating layers 32a to 32e, or may have a larger relative dielectric constant than the insulating layers 32a to 32e. Further, all of the insulating layers 33a to 33c may not have a relative dielectric constant smaller than that of the insulating layers 32a to 32e. That is, it is only necessary that at least a part of the insulating layers 33a to 33c has a relative dielectric constant smaller than that of the insulating layers 32a to 32e.

  In FIG. 1, the external electrode 20 is formed across both surfaces of the stacked bodies 14 and 16, but may be formed only on the surface of the stacked body 14, for example.

  In addition, only one of the insulating layers 33a and 33b may be provided.

  In the electronic component 10, circuit elements including the coil L and the capacitor C may be formed in an array.

It is an external appearance perspective view of the electronic component which concerns on one Embodiment. It is a disassembled perspective view of the laminated body which concerns on one Embodiment. It is an equivalent circuit schematic of the electronic component which concerns on one Embodiment. It is the graph which showed the relationship between a frequency and insertion loss in the 1st model and the 2nd model. It is the graph which showed the relationship between a frequency and insertion loss in a 3rd model and a 4th model. It is the graph which showed the relationship between a frequency and insertion loss in a 5th model and a 6th model. It is the graph which showed the relationship between a frequency and insertion loss in the 7th model and the 8th model. It is the figure which planarly viewed the mother laminated body of the electronic component from the z-axis direction. It is an enlarged view of the corner vicinity of the laminated body of an electronic component. FIG. 10A is a perspective view of an electronic component according to another embodiment viewed in plan from the z-axis direction, and FIG. 10B is a plan view of the electronic component according to other embodiment from the x-axis direction. FIG.

Explanation of symbols

C capacitor L1, L2 coil b1-b6 via-hole conductor 10 electronic component 12, 14, 16 laminated body 18a, 18b, 20 external electrode 30a-30g, 32a-32e, 33a-33c, 34a-34d insulating layer 40a-40d, 44a ~ 44d Coil conductor 50a ~ 50f Capacitor conductor

Claims (1)

A first stacked body in which a plurality of insulating layers are stacked;
A second laminate overlaid on the first laminate;
A capacitor that is built in the first laminated body and is composed of a plurality of capacitor conductors;
A coil that is built in the second laminate and that forms a noise filter together with the capacitor;
With
In the first multilayer body, at least a part of the insulating layer sandwiched between the capacitor and the second multilayer body has a lower dielectric constant than the insulating layer sandwiched between the plurality of capacitor conductors. Have a rate,
In the first laminated body, the capacitor is sandwiched from both sides in the stacking direction by the insulating layer having a lower relative dielectric constant than the insulating layer sandwiched between the capacitor conductors,
The insulating layer sandwiched between the plurality of capacitor conductors is made of Al ₂ O ₃ —Ba ₂ Ti ₄ O ₁₂ —CeO ₂ —glass ,
The insulating layer sandwiching said capacitor from opposite sides of the stacking direction, Al ₂ O ₃ -CeO ₂ - that are made of glass,
Electronic parts characterized by

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