JP2011232276A - Inspection device for luminescence panel and inspection method for luminescence panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection device for a luminescence panel capable of inexpensively inspecting a luminescent state of a luminescence panel with a simple configuration, and to provide an inspection method for a luminescence panel.SOLUTION: The inspection device 20 for a luminescence panel includes a luminescence signal generating unit 21, an inspection unit 22 and a comparing unit 23. The luminescence signal generating unit 21 is connected to a connecting unit of a luminescence panel as an inspection object, for example, an organic EL (electroluminescence) device (luminescence panel) and transmits a luminescence signal to allow any pixel in the organic El device to emit light. The comparing unit 23 directly receives luminescent light of each pixel, compares the light quantity to a preliminarily determined reference light quantity of luminescence of each pixel, and detects luminescence failure in each pixel.

Description

   The present invention relates to a light-emitting panel inspection device and a light-emitting panel inspection method, and more particularly to a technique for reliably inspecting the light-emitting state of a light-emitting panel with a simple configuration.

   Conventionally, as an inspection method for inspecting light emission of pixels constituting a light emitting panel, typified by a liquid crystal panel and an organic EL panel, for example, a light emitting panel placed on a stage is moved and a light emitting state is detected by a line sensor camera. It is common to detect light-emitting defects (for example, non-light-emitting pixels) by imaging the light-emitting state while moving the area sensor camera while the light-emitting panel is fixed (for example, non-light-emitting pixels) (for example, Patent Document 1).

JP 2007-121243 A

   However, for example, in the inspection method disclosed in Patent Document 1, a mechanism for moving the stage or the camera with high accuracy is essential, and there is a problem that the inspection apparatus becomes large in size and tends to be expensive. In addition, since a physical stage moving time is required, it is difficult to shorten the inspection tact time, and there is a problem that the inspection time takes a long time. Furthermore, due to the high definition of the light emitting panel, it becomes necessary to magnify images with a high-magnification and high-resolution objective lens, and the influence of microvibration during imaging also increases. There is a problem that the inspection equipment becomes complicated and expensive because it requires earthquake-proof and vibration-proof design.

   Some aspects according to the present invention have been made in view of the above circumstances, and a light-emitting panel inspection apparatus capable of inspecting a light-emitting state of a light-emitting panel with a simple configuration at low cost, and a light-emitting panel The purpose is to provide an inspection method.

In order to solve the above-described problems, some aspects of the present invention provide the following light-emitting panel inspection apparatus and light-emitting panel inspection method.
In other words, the light emitting panel inspection apparatus of the present invention includes a fixing member for fixing a light emitting panel to be inspected, a light emitting signal generator for outputting a predetermined light emitting signal toward the light emitting panel, and an emission from the light emitting panel. A light-receiving element that receives the received light, and a comparison unit that compares a light-receiving signal output from the light-receiving element with a preset reference value, the light-emitting surface of the light-emitting panel, and the light-receiving surface of the light-receiving element, Are directly facing each other at a predetermined interval, and are shielded from light between the light emitting surface and the light receiving surface.

   According to the light emitting panel inspection apparatus of the present invention, the light receiving element and the light emitting panel are directly faced in a light-shielded state, the light emission of each pixel is directly received, and the amount of light is compared with the comparison data. It is possible to reliably detect defects in the light-emitting panel such as lighting failure. It is only necessary to fix the light-emitting panel between the light-receiving element and the light-emitting panel so that they face each other, so there is no need for a highly accurate moving device that moves the light-receiving element or light-emitting panel or an expensive focusing lens. Thus, the light emission state of the light emitting panel can be inspected with a simple configuration at low cost.

The number of pixels of the light receiving element may be the same as or larger than the number of pixels of the light emitting panel.
This eliminates the need for an optical member for converging the light emitted from the light-emitting panel, and makes it possible to inspect the light-emitting state of the light-emitting panel at a low cost with a simple configuration.

It is sufficient that no light condensing means is interposed between the light emitting surface and the light receiving surface.
This eliminates the need for an expensive focusing lens and makes it possible to inspect the light emitting state of the light emitting panel with a simple configuration and at low cost.

   The light emission signal generator may be controlled so that the light emitting panel emits light in order of one pixel. Thereby, it is possible to reliably detect a light emission failure of each pixel.

The light emission signal generation unit may be controlled so that the light emission panel emits light in a predetermined pattern.
This makes it possible to inspect the light emission state of the light emitting panel in a short time.

   The method for inspecting a light-emitting panel according to the present invention includes a step of bringing a light-emitting surface of a light-emitting panel to be inspected into contact with a light-receiving surface of a light-receiving element that receives light emitted from the light-emitting panel; A step of receiving the light emission signal to emit light, a step of receiving light emitted from the light emitting panel and outputting a light reception signal corresponding to the amount of received light, the light reception signal, and preset comparison data, And a step of detecting the light emission state of each pixel constituting the light emitting panel.

   According to the light-emitting panel inspection method of the present invention, it is possible to reliably detect defects in the light-emitting panel, such as pixel non-lighting or lighting failure, simply by directly receiving the light emission of each pixel and comparing the amount of light with comparison data. This eliminates the need for a high-accuracy moving device that moves the light-receiving element and the light-emitting panel, an expensive focusing lens, and the like, and makes it possible to inspect the light-emitting state of the light-emitting panel at a low cost with a simple configuration.

The light emission signal is a signal for causing the light emitting panel to emit light in order of every pixel.
The comparison data may be a reference light emission amount of each pixel set in advance.
Thereby, it is possible to reliably detect a light emission failure of each pixel.

The light emission signal is a signal for causing the light emitting panel to emit light in a predetermined pattern set in advance, and the comparison data may be light emission pattern data when the predetermined pattern emits light normally.
This makes it possible to inspect the light emission state of the light emitting panel in a short time.

It is a circuit diagram of the organic electroluminescent apparatus which is an example of a light emission panel. FIG. 2 is a schematic plan view of the organic EL device shown in FIG. 1. FIG. 2 is a schematic side sectional view of a display region of the organic EL device shown in FIG. 1. It is a schematic diagram which shows the inspection apparatus of the light emission panel of this invention. It is an expanded sectional view which shows the structure of the test | inspection part of FIG. It is a schematic diagram which shows an example of the inspection method of the light emission panel of this invention. It is a schematic diagram which shows another example of the test | inspection method of the light emission panel of this invention. It is a schematic diagram which shows another example of the test | inspection method of the light emission panel of this invention.

   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of a light-emitting panel inspection apparatus and a light-emitting panel inspection method printer head according to the present invention will be described with reference to the drawings. The present embodiment is specifically described for better understanding of the gist of the invention, and does not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.

[Light-emitting panel]
Examples of the light emitting panel to be inspected by the light emitting panel inspection apparatus of the present invention include an organic EL device and a liquid crystal display panel. First, a configuration example of an organic EL device (light emitting panel) will be described as an example of an inspection target.
FIG. 1 is an explanatory diagram illustrating a wiring structure according to an example of an organic EL device (light emitting panel), FIG. 2 is a schematic plan view of the organic EL device, and FIG. 3 is a schematic side sectional view of a display region of the organic EL device. FIG.
As shown in FIG. 1, the organic EL device 1, which is an example of a light-emitting panel, includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and the signal lines 102. A plurality of power supply lines 103 extending in the parallel direction are respectively wired, and a pixel region P is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.

   Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.

   Further, in each of the pixel regions P, a switching thin film transistor 122 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal supplied from the signal line 102 via the switching thin film transistor 122. Is electrically connected to the power supply line 103 via the driving thin film transistor 123, the driving thin film transistor 123 to which the pixel signal held by the holding capacitor cap is supplied to the gate electrode, and the driving thin film transistor 123. In addition, a pixel electrode (anode) 111 into which a drive current flows from the power supply line 103 and a functional layer 110 sandwiched between the pixel electrode 111 and the cathode (counter electrode) 12 are provided. The anode (pixel electrode) 111, the cathode (counter electrode) 12, and the functional layer 110 constitute an organic E element that functions as a light emitting element.

   When the scanning line 101 is driven and the switching thin film transistor 122 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving thin film transistor 123 is turned on / off according to the state of the holding capacitor cap. The off state is determined. Then, current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 123, and further current flows to the cathode 12 through the functional layer 110. The functional layer 110 emits light according to the amount of current flowing.

   The organic EL device illustrated here is a so-called top emission type organic EL device, and includes a substrate 2 and organic EL elements (light emitting elements) arranged in a matrix as shown in FIG. And a cathode 12 formed on the light emitting element portion 11. Here, the display element 10 is configured by the light emitting element portion 11 and the cathode 12.

   As the substrate 2, glass, resin, or the like is preferably used. In particular, the organic EL device of the present invention is a top emission type, and does not emit light from the substrate 2 side, so that an opaque one can also be used. Therefore, opaque resin, ceramics, metal, etc. can be used. As shown in FIG. 2, the substrate 2 is divided into a display region 2 a located at the center of the substrate 2 and a non-display region located around the periphery of the substrate 2 and surrounding the display region 2 a. The display area 2a is an area formed by organic EL elements arranged in a matrix.

   Further, power supply lines 103 (103R, 103G, 103B) are wired in the non-display area, and scanning side drive circuits 105, 105 are arranged on both sides of the display area 2a. Further, on both sides of the scanning side driving circuits 105 and 105, a driving circuit control signal wiring 105a and a driving circuit power wiring 105b connected to the scanning side driving circuits 105 and 105 are provided. On the upper side of the display area 2a in the figure, an inspection circuit 106 for connecting a light emitting panel inspection device 20 of the present invention to be described later is formed.

   In the side sectional configuration diagram of FIG. 3, three pixel regions (pixels) A (R), A (G), and A (B) are shown. In the organic EL device according to the present embodiment, a circuit element unit 14 in which a circuit such as a TFT is formed, a light emitting element unit 11 in which a functional layer 110 is formed, and a cathode 12 are sequentially stacked on the substrate 2. Is provided with a transparent sealing layer (not shown).

   The anode (pixel electrode) 111 is provided with a reflective surface, and the cathode 12 has a semi-transmissive reflective layer. An optical resonator is provided between the reflective surface of the anode 111 and the semi-transmissive reflective layer of the cathode 12. Is formed. The light emitted from the functional layer 110 is resonated by the optical resonator and then emitted from the cathode 12 side, that is, the transparent sealing layer side, so that the observer can visually recognize it.

   In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 2, and an island-shaped semiconductor film 141 made of polycrystalline silicon is formed on the base protective film 2c. A source region 141a and a drain region 141b are formed in the semiconductor film 141 by, for example, high concentration phosphorus ion implantation. A portion where the phosphorus ions are not introduced is a channel region 141c.

   Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed, and a gate electrode 143 (scanning line 101) made of Al, Mo, Ta, Ti, W or the like is formed on the gate insulating film 142. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. Further, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

   A pixel electrode (anode) 111 is patterned and formed in a predetermined shape on the second interlayer insulating film 144 b, and one contact hole 145 is connected to the pixel electrode 111. The other contact hole 146 is connected to the power supply line 103.

   In this way, the driving thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element unit 14. In FIG. 3, the driving thin film transistor 123 is disposed directly below the partition wall portion 112, avoiding directly below the pixel electrode 111. However, since the organic EL device 1 shown here is a top emission type, the thin film transistor 123 may be disposed immediately below the pixel electrode 111.

   The light emitting element unit 11 includes a functional layer 110 stacked on each of a plurality of pixel electrodes (anodes) 111, and a partition unit 112 provided between each pixel electrode 111 and the functional layer 110 to partition each functional layer 110. And the main constituent. Further, the cathode 12 is disposed on the functional layer 110 and the partition wall 112. The pixel electrode 111, the functional layer 110, and the cathode 12 constitute an organic EL element as described above.

   The pixel electrode (anode) 111 is formed by laminating a reflective film 111a made of an alloy of, for example, Al (aluminum) and Nd (neodymium) and a transparent conductive film 111b made of ITO, and is patterned in a substantially rectangular shape in plan view. Is formed. Here, the pixel electrode 111 reflects light emitted from the functional layer 110 by the reflective film 111a, and the reflective film 111a serves as a reflective surface.

   That is, the reflective film 111a is a thin film formed to a thickness of about several nm to several tens of nm. Therefore, since the reflective film 111a itself transmits a little light, the light from the functional layer 110 is reflected by the reflective film. Not only the interface between 111a and the transparent conductive film 111b functions as a reflection surface, but also the reflection film 111a and further the interface between the reflection film 111a and the second interlayer insulating film 144b functions as a reflection surface. Yes. In addition to the alloy film of Al and Nd, for example, a single Al film or a metal film such as Ni or Cr can be used as the reflective film 111a.

The partition 112 is provided to partition each pixel electrode 111, and includes an inorganic partition 112a formed on the substrate 2 side, and an organic partition 112b formed on the inorganic partition 112a. is there. The inorganic partition 112a is formed of SiO ₂ or the like, and the organic partition 112b is formed of acrylic resin or the like.

   The inorganic partition 112 a is formed with an opening 112 c that exposes the pixel electrode 111, and is formed by partially riding on the peripheral edge of the pixel electrode 111. The organic partition 112b is formed with an opening 112d that communicates with the opening 112c, and is disposed so as to partially overlap the peripheral edge of the pixel electrode 111 in a planar manner. The inorganic partition 112a is formed to extend to the center side of the pixel electrode 111 from the edge of the organic partition 112b. Therefore, the opening 112d of the organic partition 112b is formed to be slightly wider than the opening 112c of the inorganic partition 112a. Has been.

   In the partition 112 formed of the inorganic partition 112a and the organic partition 112b, a region showing lyophilicity and a region showing liquid repellency are formed. The region showing lyophilicity is an exposed surface of the inorganic partition 112a and the pixel electrode 111 (surface exposed in the opening 112b), and these regions are subjected to lyophilic processing by plasma processing using oxygen as a processing gas. Yes. The regions exhibiting liquid repellency are the wall surface of the opening 112d and the top surface of the organic partition 112. These regions are fluorinated by plasma treatment using tetrafluoromethane (carbon tetrafluoride) as a processing gas, for example. Treatment (liquid repellency treatment) is performed.

Next, the inspection apparatus for the light emitting panel of the present invention for inspecting the light emitting panel to be inspected as described above will be described.
FIG. 4 is a schematic configuration diagram showing an example of a light-emitting panel inspection apparatus according to the present invention.
A light emitting panel inspection device (hereinafter simply referred to as an inspection device) 20 includes a light emission signal generation unit 21, an inspection unit 22, and a comparison unit 23. The light emission signal generator 21 is connected to a light emitting panel to be inspected, for example, an inspection circuit 106 (see FIG. 2) of the organic EL device (light emitting panel) 1, and emits light that causes any pixel A of the organic EL device 1 to emit light. Any test signal circuit device that transmits signals may be used.

   The comparison unit 23 includes an electronic circuit such as a CPU and a memory, such as a PC (personal computer), and receives a light reception signal output from a light receiving element 32 (see FIG. 5) constituting the inspection unit 22 and is stored in advance. The comparison data and the light reception signal are compared to determine whether the light emission state of the organic EL device 1 is good or bad.

   FIG. 5 is an enlarged cross-sectional view showing the configuration of the inspection unit. The inspection unit 22 includes a fixing member 31 that fixes the organic EL device (light emitting panel) 1 to be inspected and a light receiving unit 33 including a light receiving element 32. The fixing member 31 includes a main body portion 31 a where the organic EL device 1 is fixed at a predetermined position on the bottom surface side, and a close contact portion 31 b that is detachably attached to the light receiving unit 33. The main body 31a may be formed from, for example, a light-shielding metal or resin. Further, the close contact portion 31b only needs to be formed of a flexible and light-shielding member such as rubber or foamed resin.

   The light receiving unit 33 is in close contact with the contact portion 31b at the end, and is held by the fixing member 31 so that the light receiving surface 32a of the light receiving element 32 faces the light emitting surface 1a of the organic EL device 1 with a predetermined interval Δt. Is done. When the fixing member 31 and the light receiving unit 33 are brought into close contact with each other, there is no external light between the light emitting surface 1a of the organic EL device (light emitting panel) 1 fixed inside the fixing member 31 and the light receiving surface 32a of the light receiving element 32. The light is shielded from entering.

   As the light receiving element 32, a solid-state imaging element, for example, a CCD image sensor or a CMOS image sensor may be used. The light receiving element 32 preferably has the same number of pixels as the organic EL device 1 to be inspected or more than that. The size of one pixel of the light receiving element 32 is preferably the same as or approximate to the one pixel size of the organic EL device 1. As a result, the light receiving surface 32a of the light receiving element 32 and the light emitting surface 1a of the organic EL device 1 need only be opposed to each other with a minute gap Δt without interposing a light collecting means such as a lens. .

   As the organic EL device (light emitting panel) 1 accommodated in the fixing member 31, for example, a small organic EL device of about several inches used for a finder of a digital camera can be cited as a suitable inspection target. Such a small organic EL device 1 may be formed in a large number on, for example, a flexible substrate and may be continuously supplied to the fixing member 31 at the time of inspection.

A method for inspecting a light-emitting panel according to the present invention using the inspection apparatus having the above configuration will be described.
When inspecting the light emitting state of the light emitting panel, for example, the organic EL device 1 using the inspection device 20 described above, first, the organic EL device 1 to be inspected is fixed to the fixing member 31 and the light receiving element 32 receives light. The light emitting surface 1a of the organic EL device 1 is opposed to the surface 32a with a predetermined distance Δt (step of making the light emitting surface of the light emitting panel and the light receiving surface of the light receiving element face each other). Then, the inspection circuit 106 (see FIG. 2) of the organic EL device 1 and the light emission signal generator 21 are electrically connected.

Next, a predetermined light emission signal (control signal) is input from the light emission signal generation unit 21 to the organic EL device 1 via the connection unit 106. FIG. 6 is a schematic diagram schematically showing how the organic EL device 1 is controlled to emit light by this light emission signal.
According to FIG. 6, the light emission signal input from the light emission signal generation unit 21 to the organic EL device 1 is sequentially from the pixel A1 at the upper left in the figure to the pixel A2, the pixel An,. All the pixels are turned on one by one in sequence (step of inputting a predetermined light emission signal to the light emitting panel to emit light).

   Then, the light receiving element 32 receives each light that is sequentially turned on for each pixel incident on the light receiving surface 32a, and outputs the received light to the comparison unit 23 as a light receiving signal. Each time a light reception signal is input in order for each pixel, the comparison unit 23 compares whether the light emission amount of the pixel is within a preset reference light emission amount range of each pixel (a light reception signal and a preset value). A step of comparing with the comparison data obtained). The light reception signal may be data representing the light amount of each pixel incident on the light receiving element 32, for example. Further, the comparison data may be data indicating an appropriate, that is, a normal light amount value range in an organic EL device in which pixels emit light normally.

The comparison unit 23 compares the total amount of light received by the entire light receiving surface 32a of the light receiving element 32 for each pixel with the comparison data, and if the total amount of received light for each pixel is less than the comparison data, The pixel is not lit or indicates that the amount of emitted light is insufficient, and it is determined that the inspected organic EL device 1 has a pixel with poor light emission.
On the other hand, even if the total received light amount for each pixel obtained is compared with the comparison data and the received light amount exceeds the comparison data, the pixel may be abnormally lit. It is determined that the inspected organic EL device 1 has a pixel with defective emission.
Then, for all pixels, the total amount of received light for each pixel obtained is compared with the comparison data. If the received light amount is within a predetermined range set as comparison data, the organic The EL device 1 is determined to be non-defective (normal).

   According to the inspection apparatus and inspection method as described above, the light receiving element 32 and the organic EL device (light emitting panel) 1 are directly faced in a light-shielded state, the light emitted from each pixel is directly received, and the amount of light is compared with the comparison data. By simply doing this, it is possible to reliably detect defects in the organic EL device (light emitting panel) 1 such as pixel non-lighting or lighting failure. Between the light receiving element 32 and the organic EL device (light emitting panel) 1, there is no condensing means such as a lens, and the organic EL device 1 is simply fixed and faced with a small distance Δt. Therefore, a highly accurate moving device for moving the light receiving element 32 and the organic EL device 1, an expensive focusing lens, and the like are unnecessary, and the light emitting state of the organic EL device (light emitting panel) 1 can be reduced at a low cost with a simple configuration. It becomes possible to inspect.

FIG. 7 is a schematic diagram showing an example in which the organic EL device 1 is inspected by another light emission signal (control signal) using the inspection device 20 described above.
In this embodiment, one organic EL device (light-emitting panel) 1 is divided into four areas E1 to E4, and each area E1, E2, E3, E4 is, for example, the upper left in the figure (FIG. 7A). Are turned on one pixel at a time from the bottom to the lower right (FIG. 7B). Then, it is only necessary to compare whether or not the light emission amounts for the four pixels in the respective areas E1 to E4 are within a preset reference light emission amount range for the four pixels.
According to such an inspection method, the time for scanning for sequentially lighting the pixels is reduced to a quarter compared to the embodiment shown in FIG. 6, and the inspection time is greatly reduced. it can.

FIG. 8 is a schematic view showing an example in which the organic EL device 1 is inspected by another light emission signal (control signal) using the inspection device 20 described above.
In this embodiment, a light emission signal (control signal) for displaying, for example, a stripe pattern is input to the organic EL device (light emitting panel) 1. In the example shown in FIG. 8, first, even-numbered pixels are turned on in a vertical stripe pattern (FIG. 7A). Next, the odd-numbered pixels are turned on in a vertical stripe shape (FIG. 7B). On the other hand, the comparison unit 23 includes a comparison pattern (comparison data) D1 in which even-numbered pixels are lit when all the pixels are normally lit, and a comparison pattern (comparison data) D2 in which odd-numbered pixels are lit. Remember me.

Then, even-numbered pixels are turned on in a vertical stripe shape and compared with a comparison pattern (comparison data) D1 that is a normal light emission pattern. For example, if there is a pixel Ax whose pattern does not match, the organic EL device (light-emitting panel) 1 is determined to be defective in light emission. Similarly, even-numbered pixels are turned on in a vertical stripe pattern and compared with a comparison pattern (comparison data) D2 that is a normal light emission pattern.
According to such comparison of the predetermined lighting patterns, the inspection time can be further shortened.
In addition, as the pattern for causing the organic EL device (light emitting panel) 1 to emit light, an arbitrary lighting pattern such as zigzag lighting can be adopted other than the above-described stripe pattern.

DESCRIPTION OF SYMBOLS 1 ... Image forming apparatus (optical printer), 2K, 2C, 2M, 2Y ... Exposure head (printer head), 3K, 3C, 3M, 3Y ... Photosensitive drum (photoconductor), 22a ... First light emitting element array (first Light source), 22b ... second light emitting element array (second light source), 22c ... third light emitting element array (third light source), 23 ... optical member 23, 31 ... first optical surface, 32 ... second. Optical surface.

Claims (8)

A fixing member for fixing a light emitting panel to be inspected;
A light emission signal generator for outputting a predetermined light emission signal toward the light emission panel;
A light receiving element that receives light emitted from the light emitting panel;
A comparison unit that compares the received light signal output from the light receiving element with a preset reference value;
A light-emitting panel inspection, wherein the light-emitting surface of the light-emitting panel and the light-receiving surface of the light-receiving element directly face each other at a predetermined interval, and the light-emitting surface and the light-receiving surface are shielded from light. apparatus.    2. The light emitting panel inspection device according to claim 1, wherein the number of pixels of the light receiving element is equal to or greater than the number of pixels of the light emitting panel.    The light-emitting panel inspection apparatus according to claim 1, wherein a condensing unit is not interposed between the light-emitting surface and the light-receiving surface.    4. The light-emitting panel inspection apparatus according to claim 1, wherein the light-emitting signal generator controls the light-emitting panel to emit light one pixel at a time.    4. The light emitting panel inspection apparatus according to claim 1, wherein the light emission signal generator controls the light emitting panel to emit light in a predetermined pattern set in advance. A step of facing a light emitting surface of a light emitting panel to be inspected and a light receiving surface of a light receiving element that receives light emitted from the light emitting panel;
Inputting a predetermined light emission signal to the light emitting panel to emit light;
Receiving light emitted from the light emitting panel, and outputting a light reception signal corresponding to the received light amount;
A method for inspecting a light-emitting panel, comprising at least a step of comparing the light reception signal with preset comparison data and detecting a light emission state of each pixel constituting the light-emitting panel. The light emission signal is a signal for causing the light emitting panel to emit light in order of every pixel.
The light emitting panel inspection method according to claim 6, wherein the comparison data is a preset reference light emission amount of each pixel. The light emission signal is a signal for causing the light emitting panel to emit light in a predetermined pattern,
The light emitting panel inspection method according to claim 6, wherein the comparison data is light emission pattern data when the predetermined pattern emits light normally.

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