JP2011228600A - Electronic component supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To transport excellent carrier tape and cover tape.SOLUTION: The cover tape is transported by an auxiliary conveying line 23 which branches from a main conveying line just before a supply position supplying electronic components to an electronic component supply device. A tape guide part 24 projects from an inner wall surface 23b, a branch position of each conveying line, of the auxiliary conveying line positioning in a downstream side of the conveyance direction. A recessed part 25 is formed on an inner wall surface 23a of the auxiliary conveying line positioned in an upstream side of the carrier tape conveyance direction, and faces a tip of the tape guide part. A center portion of the recessed part forms a concave shape in the width direction of a tape to be transported against the inner wall surface of the auxiliary conveying line positioned in the upstream side of the conveyance line.

Description

  The present invention relates to an electronic component supply apparatus that supplies an electronic component to an electronic component mounting apparatus.

The electronic component mounting apparatus is equipped with an electronic component feeder as an electronic component supply device, and receives an electronic component from each electronic component feeder.
And this electronic component feeder is holding the reel 11 by which the carrier tape A with which the electronic component was sealed in the pocket formed in the uniform space | interval was wound by the one end part (for example, rear end part side). The carrier tape A is conveyed to the feeder tip, and the electronic component is delivered to the suction nozzle of the electronic component mounting apparatus at a predetermined supply position (see FIG. 2).
And the cover tape H for sealing the electronic component in each pocket is affixed on the upper surface of the carrier tape A of an electronic component, it peels in front of the supply position of an electronic component, and the electronic component of a pocket is attached. It is possible to be sucked by the suction nozzle. The structure of this part is shown in FIG.
As shown in the drawing, a transport path 202 for the carrier tape A is provided in the vicinity of the upper end of the electronic component feeder along a substantially horizontal direction, and in the middle of the cover tape H branched off and peeled off. A conveyance path 203 is formed. Then, the cover tape H peeled off from the carrier tape A is transported along the transport path 203 and is folded upward in the direction opposite to the transport direction of the carrier tape A. Is wound up by a reel 12 that winds up.

By the way, when the remaining amount of the carrier tape A on the reel 11 is reduced, the carrier tape A is unwound from the reel 11 before it completely disappears, and the carrier wound around the reel 11 in which the end portion of the unwound carrier tape A is newly replaced. Connect to the beginning of tape A. When the reel 11 is replaced after the carrier tape A of the reel 11 is completely used up, the electronic component mounting operation must be interrupted. However, as described above, the reel is replaced early. Therefore, the implementation work is not interrupted.
Then, as shown in FIG. 8, when connecting the terminal end of the old carrier tape A1 and the starting end of the new carrier tape A2, the splice tape S is attached to the upper and lower surfaces of the carrier tapes A1 and A2, respectively. . The cover tape H described above is pasted on the upper surface of the carrier tape A, but the splice tape S is pasted on the cover tape H.

JP2002-368484

By the way, as shown in FIG. 9, the carrier tape A after being peeled by the cover tape H peeled upward is conveyed at the branch path between the transport path 202 of the carrier tape A and the transport path 203 of the cover tape H. In order to scrape off the electronic components adhering to the cover tape H due to static electricity, the protrusion 205 is extended rearward in the transport direction so as not to be pulled to the side.
Due to the presence of the protrusions 205, the transport path 203 of the cover tape H has a narrow passage width. When the splice tape S is stuck on the cover tape H, clogging occurs in the transport path 203, and the cover tape H There is a case where H cannot be peeled off. As a result, there is a problem that electronic parts cannot be supplied.

  It is an object of the present invention to provide an electronic component supply device that performs good carrier tape conveyance.

  The invention according to claim 1 is an electronic component supply apparatus having a main frame in which a main conveyance path of the carrier tape is formed while supplying the electronic component to the electronic component mounting apparatus by conveying the carrier tape holding the electronic component. Before the supply position for supplying the electronic component to the electronic component mounting apparatus, a branch path from which the cover tape separated from the carrier tape is conveyed, and a cover tape from the carrier tape is branched. Tape guide provided at the branching position of each transport path to be peeled and protruding from the inner wall surface of the sub transport path on the downstream side in the transport direction of the carrier tape toward the upstream side in the transport direction of the carrier tape And an inner wall surface of the sub-transport path that is upstream in the transport direction of the carrier tape, wherein the tape guide section A concave portion is provided at a portion where the end portions face each other, and the cover tape passes between the tip portion and the concave portion of the tape guide portion, and the concave portion is against the inner wall surface of the sub-conveying path that is upstream in the conveying direction. In the width direction of the cover tape to be conveyed, a concave shape is formed at the center.

The invention described in claim 2 has the same configuration as that of the invention described in claim 1, and the concave portion is characterized in that both sides thereof are smooth in the width direction of the transported tape.
The invention described in claim 3 has the same configuration as that of the invention described in claim 1 or 2, and the width of the concave portion in the width direction of the transported tape is 3 minutes of the width of the transported tape. Or less.

According to the first aspect of the present invention, the tape guide portion is provided on the inner wall surface of the sub-transport path on the downstream side in the transport direction of the carrier tape, thereby preventing the carrier tape from being pulled into the sub-transport path and attaching the electronic component to the cover tape. It is possible to prevent them from being taken.
And since the concave portion was formed on the inner wall surface on the upstream side of the sub-transport path corresponding to the tip portion of the tape guide portion, even when the splicing tape is stuck on the cover tape, for example, the thickness is generated. Since the cover tape can be depressed according to the concave portion, the cover tape can be prevented from clogging by the tape guide portion, and the carrier tape can be prevented from being poorly conveyed by the cover tape entering the main conveyance path, etc. Supply can be performed.
In addition, since the concave portion is partially formed in the tape width direction on the upstream side wall surface of the sub-transport path, when transporting a normal cover tape, transport is performed in a state that follows a smooth inner wall surface, It is possible to smoothly carry the cover tape.

  Since the invention according to claim 2 is a smooth inner wall surface on both sides in the width direction of the tape to be conveyed with respect to the concave portion, the tape guide is formed on the smooth inner wall surface when the normal cover tape is conveyed. The smooth state can be better maintained along the cover tape, and the cover tape can be further smoothly conveyed.

  In the invention according to claim 3, since the width of the concave portion in the width direction of the carrier tape to be conveyed is equal to or less than one third of the width of the carrier tape to be conveyed, the cover tape is not in contact with the tape guide portion. Since the tape guide is not recessed by the recess and can be kept in a smooth state, the cover tape can be further smoothly conveyed.

It is a perspective view of the electronic component mounting apparatus using an electronic component feeder. It is a perspective view of an electronic component feeder. It is a side view of the periphery of the main conveyance path in the vicinity of the supply position of the electronic component and upstream of the supply position in the conveyance direction. It is a top view of the periphery of a sub conveyance path. It is a top view which shows the dimension of each part of the periphery of a sub conveyance path. FIGS. 6A and 6B are plan views in the vicinity of the sub-transport path, in which FIG. 6A shows a state in which a thin cover tape is transported, and FIG. 6B shows a state in which a thick cover tape is transported. It is a side view of the periphery of the main conveyance path in the vicinity of the supply position of the conventional electronic component supply apparatus and upstream of the supply position in the conveyance direction. It is explanatory drawing which shows the state which connected carrier tapes with the splicing tape. It is a top view of the periphery of the sub conveyance path of the conventional electronic component supply apparatus.

(Outline of Embodiment of the Invention)
An embodiment of an electronic component supply apparatus according to the present invention will be described.
An electronic component feeder 10 as an electronic component supply device is detachably provided in the electronic component mounting apparatus 100, conveys the carrier tape A in which the electronic components are sealed with the cover tape H at a uniform interval, and has a predetermined path in the conveyance path. The electronic component is supplied to the electronic component mounting apparatus 100 by being attracted to the mounting head 106 of the electronic component mounting apparatus 100 at the supply position.
Here, in the electronic component mounting apparatus 100, the horizontal direction in which the substrate P is transported from the previous process to the subsequent process is defined as the X-axis direction, which is a horizontal direction perpendicular to the X-axis direction, and is disposed in the electronic component mounting apparatus 100. A direction along the longitudinal direction of the feeder 10 to be described later is defined as a Y-axis direction, and a direction orthogonal to both the X-axis direction and the Y-axis direction is defined as a Z-axis direction.

(Configuration of electronic component mounting device)
FIG. 1 is a perspective view of an electronic component mounting apparatus 100 using the electronic component feeder 10, and FIG. 2 is a perspective view of the feeder 10.
As shown in FIG. 1, an electronic component mounting apparatus 100 includes a base 102 on which each component member is placed, and a substrate transfer apparatus that transfers a substrate P from a pre-process to a post-process along the X-axis direction. 103, a feeder storage unit 104 in which a plurality of electronic component feeders 10 are installed side by side, a mounting head 106 for mounting the electronic component D supplied by the electronic component feeder 10 on the substrate P, and the mounting head 106 as X, Y A head moving device 107 that moves in each direction of the shaft is provided.

The substrate transport apparatus 103 includes a transport belt (not shown), and transports the substrate P from the pre-process side to the post-process side along the X-axis direction by the transport belt.
Moreover, since the board | substrate conveyance apparatus 103 mounts the electronic component D on the board | substrate P with the mounting head 106, it stops conveyance of the board | substrate P in a predetermined component mounting position, and also hold | maintains the board | substrate P.

  The feeder storage unit 104 is provided at one end of the base 102 in the Y-axis direction. In the feeder storage section 104, the individual electronic component feeders 10 are detachably attached so that the longitudinal direction thereof is directed in the Y-axis direction and the plurality of electronic component feeders 10 are arranged in parallel along the X-axis direction. ing. Although only one electronic component feeder 10 is shown in FIG. 1, a plurality of electronic component feeders 10 are actually provided side by side.

The mounting head 106 is provided on the beam member 112 and has a suction nozzle 106a that protrudes downward (Z-axis direction). The suction nozzle 106a is detachably provided so that it can be exchanged according to the size and shape of the electronic component to be sucked and held.
The suction nozzle 106a is connected to, for example, an air suction device (not shown), and can hold the electronic component by suction at the tip portion that is the lower end of the suction nozzle 106a. Further, the air suction device is provided with a solenoid valve (not shown), and the air suction state and the air release state of the air suction device are switched by the solenoid valve. That is, when the air suction state is set, the suction nozzle 106 becomes negative pressure so that the electronic component can be sucked, and when the air release state is set to the atmospheric state, the suction nozzle 106a becomes the atmospheric pressure state and releases the suction of the sucked electronic component.

The mounting head 106 includes a Z-axis moving device (not shown) that moves the suction nozzle 106a in the Z-axis direction and a nozzle rotation device (not shown) that rotates the suction nozzle 106a around the Z-axis.
The Z-axis moving device (not shown) is a moving mechanism that is provided on the mounting head 106 and moves the suction nozzle 106a in the Z-axis direction. The suction nozzle 106a is moved through the Z-axis moving device in the Z-axis direction. The mounting head 106 is provided so as to be freely movable. As the Z-axis moving device, for example, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The nozzle rotation device (not shown) is a rotation drive mechanism that is provided on the mounting head 106 and rotates the suction nozzle 106a. The suction nozzle 106a is rotatable about the Z axis through the nozzle rotation device. The mounting head 106 is provided. The Z-axis rotating device includes, for example, an angle adjustment motor and an encoder that detects the amount of rotation angle of the angle adjustment motor.
A plurality of suction nozzles 106a may be mounted on one head. In that case, the same number of Z-axis movement mechanisms and nozzle rotation mechanisms as the suction nozzles 106 a are mounted on the mounting head 106.

  The head moving device 107 includes an X-axis moving device 107a that moves the mounting head 106 in the X-axis direction, and a Y-axis moving device 107b that moves the mounting head 106 in the Y-axis direction.

  The X-axis moving device 107a is supported by guide members 111 and 111 provided on the substrate transfer path of the substrate transfer device 103 so as to straddle the direction (Y-axis direction) perpendicular to the transfer direction of the substrate P. A rail-like support member (not shown) provided on the side surface of the beam member 112 extending in the direction and a drive device (not shown) for moving the mounting head 106 supported by the support member in the X-axis direction are provided. . As this drive device, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.

The Y-axis moving device 107b is a rail-like support member (not shown) provided on the upper surface of the guide members 111 and 111 and a drive device (not shown) that moves the beam member 112 supported by the support member in the Y-axis direction. It has. As this drive device, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The beam member 112 is provided such that the upper surface of the guide members 111, 111 can be moved in the Y-axis direction by the Y-axis moving device 107 b, and the mounting head 106 can be moved in the Y-axis direction via the beam member 112.

  The mounting head 106 is moved in the X-axis direction and the Y-axis direction by the head moving device 107, and the electronic component D held by the carrier tape A supplied to the supply position 51 of the electronic component feeder 10 is transferred to the mounting head 106. Is sucked by the suction nozzle 106 a and mounted on the board P at the component mounting position in the board transport device 103.

(Overall configuration of electronic component feeder)
As shown in FIG. 2, the electronic component feeder 10 includes a main frame 20 that supports the overall configuration. The main frame 20 is formed in a flat plate shape whose outline is long in one direction. With the flat plate surface facing the YZ plane, one end in the longitudinal direction faces the electronic component mounting apparatus 100 side. It is held by the electronic component mounting apparatus 100. In the following description, it is assumed that the end of the electronic component feeder 10 on the electronic component mounting apparatus side is “front” and the opposite end is “rear”. The front side of the electronic component feeder 10 will be described as “downstream in the carrier tape transport direction” and the rear side will be described as “upstream in the carrier tape transport direction”.

  2 and 3, the electronic component feeder 10 is detachably set at the rear end portion of the main frame 20, and the electronic components are sealed at a uniform interval with a cover tape H described later. The reel 11 around which the carrier tape A is wound, the feed mechanism 30 that conveys the carrier tape A along the main conveyance path formed on the main frame 20, and one surface of the carrier tape A (the surface that becomes the upper surface during conveyance) A take-up reel 12 that winds up the cover tape H that has been stuck and peeled off by the tape separation unit 52 in front of the supply position 51 is provided.

The main frame 20 includes a reel holding portion 21 that rotatably holds the reel 11 at a rear end portion thereof, and the carrier tape A is fed therefrom. Further, the main frame 20 heads in the front obliquely upward direction starting from the reel holding portion 21 located at the rear end thereof, and is somewhat lower than the upper surface of the main frame 20 and somewhat lower than the front end. A main conveyance path 22 is formed that passes along the front from the front position to the vicinity of the front end. The upper surface of the main frame 20 in the vicinity of the front end portion is provided with a tape separating portion 52 from which the cover tape H peeled off from the carrier tape A is drawn upward, and downstream of the tape separating portion 52 in the transport direction of the carrier tape A. A supply position 51 where the suction nozzle 106a of the mounting head 106 takes out the electronic component from the carrier tape A is provided, and the main transport path 22 described above is directed downward when passing through the electronic component supply position 51, and further to the rear. And is formed up to a tape discharge port (not shown) provided at the rear end of the frame. The empty carrier tape A from which the electronic components have been taken out is discharged from the tape discharge port.
The main transport path 22 has a structure in which the carrier tape A transported by the upper and lower wall surfaces 22a and 22b (see FIG. 3) and the left side wall surface is surrounded from three sides. Further, the right side (right hand side with the line of sight directed forward) is open, and the carrier tape A can be set in the main transport path 22 from this open side.

  The feed mechanism 30 transports the carrier tape A at a position that has passed through the supply position 51 in the main transport path 22. The carrier tape A is formed with countless engagement holes arranged along the longitudinal direction at even intervals, and the feed mechanism 30 is an engagement hole between the motor serving as a feed drive source and the carrier tape A. And a gear train for rotating the sprocket (both not shown). When the removal of the electronic component is completed, the sprocket rotates to transport the carrier tape A and the next electronic component is transferred to the supply position 51. At the same time, the cover tape H is also peeled off from the carrier tape A by a feed mechanism (not shown). It is wound on the take-up reel 12.

FIG. 3 is a side view of the periphery of the main transport path 22 in the vicinity of the electronic component supply position 51 and upstream of the supply position 51 in the transport direction.
As shown in the figure, in the main transport path 22, the section from the position slightly before the electronic component supply position 51 to the supply position 51 is along the Y-axis direction somewhat below the upper surface of the main frame 20. It is formed almost horizontally toward the front. Further, on the front side (upstream in the transport direction) of the supply position 51, a sub transport path 23 is formed that branches upward from the main transport path 22 and reaches the upper surface of the main frame 20, where the cover tape H is transported. Yes. The cover tape H is adhered with an adhesive applied to both sides of the upper surface of the carrier tape A, and the electronic components are sealed in the recesses formed in the carrier tape A and peeled to remove the electrons in the carrier tape A. It is a tape that allows parts to be removed.
The sub-transport path 23 is arranged at a branch position where the carrier tape A is peeled off from the cover tape H and discharges the peeled cover tape H upward. The main transport path 23 is orthogonal to the main transport path 22. It is formed vertically upward from the path 22 and, like the main transport path 22, three sides are surrounded by wall surfaces and only the right side is open. That is, the sub-transport path 23 includes a wall surface 23a on the upstream side in the transport direction along the XZ plane and a wall surface 23b on the downstream side that face each other on the left side wall. Then, the cover tape H is peeled from the carrier tape A at a corner portion that is a boundary position between the upstream side wall surface 23 a and the upper wall surface 22 a of the main conveyance path 22. That is, the corner portion is the tape separation portion 52 described above. Note that the tape separating portion 52 is rounded (so-called R) so that the cover tape H is not broken and cut or the like.

FIG. 4 is a plan view of the sub transport path 23 as viewed from above.
As described above, the downstream side wall surface 23b of the sub-transport path 23 is a plane parallel to the XZ plane and extending vertically, and is uniformly rearward in the Y-axis direction (mainly over the entire length of the downstream side wall surface 23b. A tape guide portion 24 that is convex toward the upstream side in the transport direction in the transport path 22 is formed. In other words, the tape guide portion 24 forms a rail-like protrusion that extends vertically along the plane of the downstream side wall surface 23b. Further, the tape guide portion 24 has a shape protruding in a tongue shape rearward in the Y-axis direction, so that the protruding tip portion is close to the upper wall surface 23 a of the sub-transport path 23.
The tape guide portion 24 protrudes from the downstream side wall surface 23a toward the upstream side wall surface 23a, so that the entrance of the sub conveyance path 23 is formed at the lower end portion of the sub conveyance path 23 (a branch point with the main conveyance path 22). The width in the Y-axis direction is narrowed so that the carrier tape A is not drawn into the sub-transport path 23 along with the cover tape H peeled off from the carrier tape A at the entrance, and the cover tape H is protected by static electricity or the like. When an electronic component is attached to the tape, the tip of the protrusion of the tape guide portion 24 plays a role of scraping off the electronic component. At the same time, since the tape guide portion 24 has a protruding shape and both sides thereof are vacant, the adhesive adhered to both sides of the cover tape does not come into contact with the tape guide portion 24.

On the other hand, as described above, the upstream side wall surface 23a of the sub-transport path 23 is parallel to the XZ plane and extends in the vertical direction, and extends over the entire length of the upstream side wall surface 23a on the plane. A recess 25 that is concave toward the rear in the Y-axis direction (upstream in the transport direction) is formed. That is, the recess 25 forms a groove extending along the top and bottom on the plane of the upstream side wall surface 23a.
The concave portion 25 is formed at a position facing the front end portion of the tape guide portion 24 in the width direction (X-axis direction) of the transported cover tape H. That is, the concave portion 25 is depressed corresponding to the tape guide portion 24 protruding so as to approach the upstream side wall surface 23a, and a constant gap is maintained between them. The peeled cover tape H passes through this gap.
Further, as shown in FIG. 5, the concave portion 25 is formed when the width of the most frequently used carrier tape A among the plural types of carrier tapes A that can be attached to the electronic component feeder 10 is c. The width d in the X-axis direction is preferably c / 3 or less.
Further, when the width of the carrier tape A is c, it is desirable that the recess 25 is provided c / 3 away from the inner wall surface in the X-axis direction.
Further, the distance e from the tip of the tape guide portion 24 to the upstream side wall surface 23a is a clearance when the thickness of the cover tape H affixed to the carrier tape A that is most frequently used in the electronic component feeder 10 is f. It is desirable to set e somewhat larger than f.
Further, the gap g from the tip of the tape guide portion 24 to the deepest portion of the recess 25 is set to f + h when the thickness of the splicing tape S that is most frequently used in the electronic component feeder 10 is h. It is desirable to set it close and somewhat larger.
Further, roundness (R) is formed at both ends 25a and 25a in the X-axis direction of the recess 25 (boundary with the upstream side wall surface 23a, see FIG. 4) so that the cover tape H does not get caught even if it contacts. ing.

When the concave portion 25 is formed, as shown in FIG. 6A, when the cover tape H has a thickness equal to or smaller than the gap e, the cover tape H is kept flat following the wall surface 23a. Thus, smooth conveyance is performed.
On the other hand, as shown in FIG. 6B, when the cover tape H has a thickness exceeding the gap e because the splicing tape S is adhered, the cover tape H is arranged in the width direction (X-axis). (Direction) Almost the entire surface except the central portion becomes flat following the wall surface 23a, but only the portion where the concave portion 25 is formed is conveyed in a state of being depressed according to the concave portion 25. Therefore, it is possible to avoid the occurrence of conveyance failure caused by the tape guide portion 24 being caught and to perform smooth conveyance.
If the width of the concave portion 25 in the X-axis direction is larger than one third of the width of the cover tape H, the concave portion 25 is always conveyed in a depressed state regardless of the thickness of the cover tape H. 25, the width in the X-axis direction is set to one third or less of the cover tape H. Therefore, in the case of a normal thickness, the cover tape H is transported in a flat state according to the recess 25, and is always smooth. Can be performed smoothly.

(Operation of electronic component feeder)
In the electronic component feeder 10 configured as described above, the carrier tape A fed out from the reel 11 is transported along the main transport path 22, and the cover tape H is moved upward at the tape separation section 52 at a branch position with the sub transport path 23. And is transported to the sub-transport path 23 side.
At this time, the carrier tape A after the cover tape H is peeled off is not drawn into the sub-transport path 23 side by the tape guide portion 24, and the electronic component is not carried by the cover tape H. The electronic component is conveyed to the downstream side, and the electronic component is attracted to the suction nozzle 106 a of the electronic component mounting apparatus 100 by the electronic component supply position 51. Then, the carrier tape A is transported along the main transport path 22 that is folded back and discharged from the rear end side of the electronic component feeder 10.
Further, the electronic component sucked by the suction nozzle 106a is transported to a predetermined mounting position of the substrate P and mounted.
On the other hand, the peeled cover tape H is transported in contact with the wall surface 23 a in the sub transport path 23 by winding the take-up reel 12. At this time, when a portion having a thickness passes through the sub-transport path 23 due to adhesion of the splicing tape S or the like, and the overall thickness of the tape is larger than the gap distance e described above, One side of the tape comes into contact with the tape guide portion 24, but the cover tape H can be bent in the direction of escaping from the tape guide portion 24 by the recess 25 corresponding to the portion in contact with the tape guide portion 24. That is, it is smoothly transported without causing any problems. Accordingly, it is possible to avoid a situation in which the cover tape H is clogged in the sub-transport path 23 and enters the downstream side of the tape separation portion 52 of the main transport path 22 to hinder component adsorption.

(Other)
The tape guide portion 24 is formed across the entire length of the downstream side wall surface 23b of the sub-transport path 23, but the lower end portion of the downstream side wall surface 23b (position facing the tape separation section 52, that is, the sub-transport path 23). May be formed only at the inlet). In that case, the recess 25 may be formed only in a range corresponding to the tape guide portion 24 (for example, only around the lower end portion of the upstream side wall surface 23a).

10 Electronic component feeder (Electronic component feeder)
20 Main frame 22 Main conveyance path 23 Sub conveyance path 23a, 23b Inner wall surface 24 Tape guide part 25 Recess 51 Supply position 52 Tape separation part 100 Electronic component mounting apparatus A Carrier tape H Cover tape

Claims (3)

In an electronic component supply apparatus having a main frame in which a main conveyance path of the carrier tape is formed while supplying an electronic component to an electronic component mounting apparatus by conveying a carrier tape holding an electronic component.
A sub-transport path for branching from the main transport path before the supply position for supplying electronic components to the electronic component mounting apparatus, and for transporting the cover tape peeled off from the carrier tape,
From the inner wall surface of the sub-transport path, which is the downstream position in the transport direction of the carrier tape, toward the upstream side in the transport direction of the carrier tape, at the branch position of each transport path where the cover tape is peeled from the carrier tape A tape guide provided to protrude,
The inner wall surface of the sub-transport path on the upstream side in the transport direction of the carrier tape, wherein a concave portion is provided at a portion facing the tip portion of the tape guide portion,
The cover tape passes between the front end of the tape guide portion and the recess, and the recess is centered in the width direction of the cover tape that is transported with respect to the inner wall surface of the sub transport path on the upstream side in the transport direction. An electronic component supply device, wherein the portion is concave.   2. The electronic component supply apparatus according to claim 1, wherein both sides of the concave portion are smooth in the width direction of the transported tape.   3. The electronic component supply apparatus according to claim 1, wherein the width of the concave portion in the width direction of the carrier tape to be conveyed is equal to or less than one third of the width of the carrier tape to be conveyed.

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