JP2011228523A - Insulating substrate and wiring component having penetrating conductor and manufacturing method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulating substrate and a wiring component having a penetrating conductor permitting easy mass production and favorable for cost reduction.SOLUTION: An insulating substrate 20 having a penetrating conductor 25 fabricated by forming a comb tooth part 23 by partially clipping out a thin metal sheet 21, bending this comb tooth part perpendicularly, inserting the tip thereof thoroughly into an insulating substrate material 24 in a state of being softened by high temperature, and grinding both faces of the insulating substrate material after cooling the same. In addition, a wiring component having a penetrating conductor that uses the comb tooth part of the thin metal sheet as the penetrating conductor and the thin connecting part as a wiring material is also provided by forming a comb tooth part by clipping out a part of the thin metal sheet by etching and a thin connecting part linked thereto by half etching.

Description

  The present invention relates to an insulating substrate having a through conductor, a wiring component, and a manufacturing method thereof, and more particularly, to an insulating substrate with a through conductor using a cut-out and bent portion of a thin metal plate material as a through conductor and a manufacturing method thereof.

  An insulating substrate having a through conductor is known as a small and highly reliable wiring substrate on which a semiconductor chip and a small electronic component are mounted. Patent Document 1 discloses that in a ceramic wiring board having a through hole, by changing the glass through hole portion from a sintered conductor to a metal block, there is no void in the metal and glass of the through hole, and the specific resistance of the through hole portion is lower. Thus, an insulating substrate with a through electrode suitable for forming a thin film wiring with almost no dents on the polished substrate surface is disclosed. Moreover, patent document 2 discloses the manufacturing method of the glass substrate with a through-electrode by highly accurate drilling and metal thin plate material filling. In this case, after making the necessary holes by drilling in the glass plate material, after forming the anchor metal film and brazing intervening film on the inner wall of the hole, brazing the metal core material into the hole, polishing both sides, and penetrating electrode The attached glass substrate is obtained. Furthermore, Patent Document 3 presents a method of manufacturing a wiring insulating substrate and a perforated insulating substrate that can be manufactured relatively easily and with high accuracy, and has a heat-resistant member molded into a predetermined shape and a softening point lower than the heat-resistant member. Glass that has been subjected to finishing processing including surface polishing after gradually cooling the coalescing member by bringing a heat-resistant member into the insulating substrate material by applying a weight load by contacting a softened and melted insulating substrate material having a softening point A glass ceramic insulating substrate is provided.

Japanese Patent Laid-Open No. 06-120633 JP 2006-060119 A JP 2007-067387 A

  By the way, a microreactor (microreactor) is generally studied in the field of microprocess engineering together with a device such as a micro heat exchanger using a microchannel, but in a space of 1 mm or less per side. It is a device that performs chemical reactions. In such a microreactor, wiring such as through conductors and electrodes by microfabrication is required as the wiring component. In such wiring parts, regarding the wiring accuracy for embedding the conductor of the insulating substrate with the through electrode, the via position accuracy of the through hole is usually about ± 50 μm, and the via diameter is usually 250 μm. It is desired that the via pitch is usually 300 μm or less and that the via pitch is usually 300 μm or less. In order to procure such highly accurate and finely processed wiring parts, it has been difficult to obtain satisfactory results by the method for manufacturing an insulating substrate with electrodes as disclosed in the above-mentioned patent document. For example, the ceramic wiring board of Patent Document 1 has a penetrating conductor portion made of a metal block, and in its manufacturing method, a sword-like tungsten at a temperature (1100 ° C.) at which the glass can sufficiently flow into a borosilicate glass having a softening point of 600 ° C. After the block is completely submerged, the top of the sword mountain tungsten block is cut and removed by decompression and slow cooling, so the utilization rate of the sword mountain tungsten block prepared for each production becomes extremely low, and the above-mentioned miniaturization and High accuracy cannot be obtained. Also, the dicer processing work that creates a sword on a molybdenum or tungsten block increases the number of man-hours, leading to higher costs.

  On the other hand, Patent Document 2 discloses a method of manufacturing a glass substrate with a through electrode that is filled with a thin metal plate material after drilling the glass material, but drilling the glass plate material and forming an anchor metal film on the inner wall of the through hole, In addition, when processing a large number of through-electrodes by forming a brazing intervening film, inserting / sealing / fixing a metal core material, polishing both sides, and drilling individual holes, the processing time increases significantly. . In addition, there is a limit to the diameter of the drill that can be practically used, and it is difficult to produce a through-hole electrode having an extremely fine diameter or a fine pitch with a hole diameter of approximately φ300 μm or more. In Patent Document 3, a metal pin is vertically aligned on a glass plate using a jig, and this is inserted into a softened glass heated at a high temperature, so that there remains a problem in improving the pin position accuracy. Therefore, it is difficult to obtain the pitch accuracy between pins. In addition, the jigs for aligning the metal pins vertically are disadvantageous in that the cost is high and the loss of the pin material is large.

  Therefore, the object of the present invention is to solve the above-mentioned drawbacks and was proposed in view of the demand for fine processing with a desired high definition, and eliminates the conventional cost problem and is mass-produced with high precision miniaturization. Insulating substrate and wiring component having new and improved through conductors adapted to the above and a method for manufacturing them

  Another object of the present invention is to reduce the cost by using a thin metal plate and to provide a wiring component provided with a through-conductor having a fine diameter and a small pitch and a wiring electrode integrated with the conductor, particularly cost-effective suitable for mass production. A wiring component having a through conductor is provided and can be used in various application forms.

  According to the present invention, a notch bending process in which notched and bent comb teeth are provided at a plurality of locations on a thin metal sheet material, the insulating substrate material softened at high temperature and the upright tips of the respective comb teeth are abutted. A step of inserting and inserting a comb tooth portion in the insulating substrate material, a step of separating the metal thin plate material leaving the comb tooth portion implanted in the insulating substrate material after cooling, and the insulating substrate material A method for manufacturing an insulating substrate having a through conductor including a step of exposing a comb tooth portion and polishing the surface of the through conductor is presented. By this method, a comb tooth portion formed on a thin metal plate is bent and inserted into the insulating substrate material. An insulating substrate having a through conductor is provided. Here, the comb-teeth portion obtains a through conductor exposed by polishing, but if necessary, a wiring component having a through conductor is manufactured through a processing step for obtaining an electrode or a desired electrical component. In addition, by providing a plurality of comb-tooth portions on the metal thin plate material, it becomes possible to perform batch processing of the manufacturing process, which helps to homogenize and mass-produce the finished product and reduce the cost. That is, in the first step, a metal thin plate material prepared according to the purpose is partially cut or thinned by a process such as etching to form a comb tooth portion having a desired pitch interval or wire diameter. Then, fold the comb teeth vertically and make them stand upright to make Kenzan. In the second step, a glass or resin insulating substrate material softened at a high temperature is placed on a large number of comb teeth portions of Kenzan, or conversely, the comb teeth portions are placed on a soft insulating substrate material. And after both arrangement | positioning arrangement | positioning, a comb-tooth part is pushed in into the insulating board | substrate material of a softened state, and is penetrated. In the third step, after cooling, the metal thin plate material is cut and removed, and both surfaces of the insulating substrate material are polished to expose the protrusions present on the surface and the comb teeth hidden in the insulating substrate material so that the surface is processed flush. To process. In this way, a wiring component is obtained having a through conductor in which the comb-teeth portion of the metal thin plate material is embedded in the insulating substrate and a through conductor having a conductor electrode around it if necessary.

  According to the present invention, a metal thin plate material having a thickness of 500 μm or less is prepared, and a comb-teeth portion that becomes a through conductor is formed by a predetermined notch and bending, and is inserted into and attached to a softened insulating substrate material. The positioning accuracy of the through holes is about ± 20 μm, the via diameter is 100 μm or less, and the via pitch is 150 μm or less. In this penetration mounting, the comb-tooth portion is integrated with the metal thin plate material, and accurate positioning and holding can be performed in a self-supporting state. Here, the metal thin plate material can be formed into an electrical wiring component by forming a flat pad or wiring on one side of the insulating substrate by two-step etching of the flat portion at the time of drawing and bending. For example, in addition to an insulating substrate with a connection pad, a wiring component such as a coil or a heater is provided, and a wiring component in which an electrode portion and a lead portion for electric wiring are formed simultaneously with a through conductor is provided. Moreover, a microreactor can be provided using such wiring components. The insulating substrate having a through conductor is selected in consideration of airtightness, heat resistance, and weather resistance required according to the application. For example, the insulating substrate member may be made of glass having a property of softening at high temperature or Resin is selected as the insulating material.

  According to another aspect of the present invention, an insulating substrate material is formed on the upper or lower portion of the frame so that the comb-teeth portion is bent from the thin metal plate frame formed in a stencil shape and the upright tip is brought into contact with the insulating substrate material. The comb-teeth portion is inserted into the insulating substrate material in a softened state at a high temperature, and then the unnecessary portion of the frame is cut off and polished to form an insulating substrate with a through conductor. Here, the frame has a thickness of 500 μm or less and is combined with a metal material having a thermal expansion coefficient close to that of the insulating substrate material to be used. In addition, any of the processing methods of etching, punching, sand blasting, laser cutting, and electric discharge machining is applied to the drilling of the metal thin plate material, but depending on the processing method at that time, the desired cross-sectional shape of the through conductor Is determined. Among these, when it is a substantially hexagonal shape in which four sides are recessed inward, and when it is a substantially trapezoidal shape in which two sides are recessed inwardly, two adjacent apex angles are rounded and the other two apex angles are It is preferable that the shape is either a substantially square shape having burr-like protrusions, or a substantially trapezoidal shape or a substantially square shape having rounded corners. As for these preferable cross-sectional shapes, it has been found that rounding of the cross-sectional shape of the through conductors and smooth curves can be obtained by etching or sandblast processing.

  On the other hand, in the wiring component according to the present invention, in addition to setting the thickness of the thin metal plate material to 500 μm or less, the comb tooth diameter is set to 100 μm or less and the center line when the comb tooth portion is used as a through conductor of the insulating substrate. The application field can be expanded by setting the pitch interval to 150 μm or less and the accuracy of the mounting position to about ± 20 μm. For example, it can be used for hermetic sealing of MEMS (Micro Electro Mechanical Systems) devices, and can be used without using an underfill resin for an interposer of a CSP (Chip Size Package) semiconductor device. In addition, the microreactor apparatus to which the insulating substrate with through conductor of the present invention is applied can be applied to a microreaction element, a bioelement, and the like, and any manufacturing method can be selected according to each use. Furthermore, when cutting a comb tooth portion bent at a right angle from a metal thin plate material, a part of the metal thin plate material is used as a flat portion in the comb tooth portion, and this wiring portion is used as a connection pad, Wiring parts such as coils and heaters.

  The insulating substrate having a through conductor according to the present invention is formed by penetrating and inserting into a soft insulating substrate material using a comb tooth portion formed by cutting and bending a thin metal plate material. Supporting each other, facilitating fine processing and miniaturization and improving accuracy. Further, by including a bending process in which a margin for cutting out is generated by cutting out the thin metal plate material and standing at a right angle, the miniaturization process is realized with high accuracy. In particular, by using a thin metal plate for electrical wiring at the same time as embedding the through conductor, it can be used for a circuit component and can be used as a wiring component. Furthermore, by utilizing the sub-part of the thin metal plate material for the holding function of the through conductor, the conductor can be miniaturized and the positioning accuracy can be improved, and the cost can be reduced by improving the workability. In addition, since a thin metal plate is used as the through conductor, an insulating substrate having a through conductor with a low resistance value and a small amount of material can be manufactured at a relatively low manufacturing cost. Further, by performing pattern etching using photolithography to form a comb blade portion on a thin metal plate, it is possible to facilitate fine processing of a conductor of 100 μm or less at a pitch of 150 μm or less.

The perspective view of the insulated substrate which has a penetration conductor of the example concerning the present invention is shown. FIG. 2 (a) is a plan view in which a portion of a metal sheet is formed by a notch to provide a comb-tooth portion in a manufacturing process of a thin metal plate material in a manufacturing process of an insulating substrate having a through conductor according to an embodiment of the present invention. FIG. 2 and FIG. 2 (b) show a plan view in which the comb-teeth portion is bent upright. 2 is a partial cross-sectional view of the manufacturing process shown in FIG. 2, in which FIG. 3 (a) is an etching process for a metal thin plate material, FIG. 3 (b) is a bending process in which a comb tooth portion is upright, and FIG. 3 (c) is a comb tooth portion. FIG. 3 (d) shows an insertion step of penetrating a comb-tooth portion into a softened insulating substrate material, and FIG. 3 (e) shows a state after cutting and removing a thin metal plate material. The completed state of the insulated substrate which has a penetration conductor in the surface polishing process of this insulated substrate is shown. Similarly, FIG. 4A shows an enlarged cross-sectional view of the through conductor of the insulating substrate of FIG. 3, FIG. 4A shows a case where the comb-teeth portion of the thin metal plate material is processed by different processing methods, and FIG. This is the case after the substrate is completed. FIG. 5A is a partial cross-sectional view of a manufacturing process of an insulating substrate having an electrical wiring and a through conductor according to another embodiment of the present invention, FIG. 5A is an etching process of a metal thin plate material, and FIG. 5 (c) is an assembling process for placing an insulating substrate material on the tip of the comb tooth portion, and FIG. 5 (d) is an inserting process for penetrating the comb tooth portion into the softened insulating substrate material. 5E is a photoresist process for forming an electrical wiring portion, FIG. 5F is a resist removal process, and FIG. 5G is a surface polishing process for an insulating substrate after electrode pad formation. FIG. 6A to FIG. 6D show the respective steps in a partial perspective view and a partial cross-sectional view of an insulating substrate having a connection pad for electric wiring and a through conductor as a modification of FIG. Similarly, the fragmentary sectional view of the principal part process of the insulated substrate which has a cavity and a penetration conductor is shown as a modification of FIG. Similarly, the fragmentary sectional view of the principal part process of the insulated substrate which has a coil and a penetration conductor as a modification of Drawing 5 is shown. Similarly, the fragmentary perspective view of the principal part process of the insulated substrate which has a coil and a penetration conductor as a modification of FIG. Similarly, the fragmentary sectional view of the principal part process of the insulated substrate which has a heater and a penetration conductor as a modification of Drawing 5 is shown. Similarly, it is another modification of FIG. 5 and shows a partial cross-sectional view and a perspective view showing a main part of an insulating substrate having a hermetically sealed heater and a through conductor. The principal part of the microreactor apparatus which has the hermetic heater of FIG. 11 which is another Example which concerns on this invention is shown, Fig.12 (a) is sectional drawing, FIG.12 (b) shows a perspective view.

  In the first embodiment of the present invention, as shown in FIG. 1, a comb tooth portion is formed by partially cutting a thin metal plate material, the comb tooth portion is bent to stand upright, and the upstanding tip is softened at high temperature. This is an insulating substrate having a through conductor formed by abutting and penetrating the insulating substrate material, removing the metal thin plate material leaving the comb teeth and polishing the surface of the insulating substrate material. As shown in FIGS. 2 and 3, first, the comb-teeth portion 12 is formed in a stencil shape by cutting or punching a part of the thin metal plate materials 11 and 21. Next, the teeth 13 and 23 of the comb tooth portion 12 are bent vertically. Next, as shown in FIG. 3C, the insulating substrate material 24 is placed on the thin metal plates 11 and 21. In this case, conversely, a thin metal plate material may be placed on the insulating substrate material. In this assembled state, high-temperature heating is performed in a furnace such as an electric furnace, and the teeth 13 and 23 of the thin metal plate materials 11 and 21 are inserted into the soft insulating substrate material as shown in FIG. . At that time, force for penetration is applied by a weight or the like as necessary. Next, after cooling both members from a high temperature state to room temperature, the upper and lower surfaces are polished, and comb-tooth portions are cut out from the metal thin plate material, and part of them are made through conductors 15 and 25. The insulating substrates 10 and 20 having through conductors are manufactured by such a series of processes.

  The planar shape of the metal thin plate material or insulating substrate material is selected arbitrarily. In the case of an insulating substrate with through conductors used to overlap with the silicon wafer, the planar shape of the metal thin plate or insulating material plate is circular or orientation flat (orientation flat) or notch is added. A round shape. Of these, the metal sheet material is selected from materials that can withstand high-temperature processing and have a desired electrical resistivity and thermal expansion coefficient. Copper, copper alloy, iron, iron alloy, iron nickel alloy, aluminum, aluminum alloy , Tungsten, a tungsten alloy, molybdenum, a molybdenum alloy, a stainless alloy, gold, a gold alloy, platinum, a platinum alloy, or the like is used. If necessary, a material obtained by plating a specific metal plate with another metal can also be used. The plating process in this case may be performed either before or after the metal sheet cutting process. However, the thickness of the thin metal plate material is practically selected to be 500 μm or less in order to enable vertical bending after the cutting. Further, the comb teeth of the comb teeth portion are set to have a diameter of 100 μm or less, a pitch interval between the center lines thereof is 150 μm or less, and the accuracy of the mounting position is set to about ± 20 μm.

  For the cutting and punching of the metal thin plate material, etching, punching, sand blasting, laser cutting, and electric discharge machining are used to form a metal stencil-shaped hole. At that time, depending on the employed processing method, the cross-sectional shape of the electrode after fabrication of the through conductor becomes a shape showing the characteristics of the metal frame processing method. For example, as shown in FIG. 4A, in etching, a substantially hexagonal shape with four sides recessed inward 30 or a substantially trapezoidal shape with two sides recessed inward 31, with punching, a substantially rectangular apex angle A shape 32 with a pair of rounds and a burr-like protrusion at the remaining apex angle, a substantially trapezoidal shape 33 for sandblasting, a substantially rectangular shape for laser cutting and electric discharge machining, and a rounded shape 34 with rounded corners. ing. Here, as shown in FIG. 4 (b), the angular portion of the cross-sectional shape of each electrode shown in FIG. 4 (a) may be rounded by etching or sand blasting to form an electrode member that is adjusted to a smooth curved shape. it can. This etching is performed after the metal thin plate is cut out or bent. In this way, by eliminating the pointed parts such as burrs during drilling, it is possible to prevent bubbles when the electrodes are penetrated into the soft insulating substrate material and to improve the withstand voltage between the electrodes.

  As shown in FIG. 5, a portion of the thin metal plate that is not bent is removed by photoetching, and the remaining portion is used as an electrical wiring or connection pad as shown in FIG. 5 (g). can do. More specifically, after the comb-teeth portion 43 of the thin metal plate material 41 is inserted into the insulating substrate material 44 as shown in FIG. 5D, the exposed surface of the thin metal plate material 41 as shown in FIG. Photoresist 47 is applied to 46 or pasted with a resist film, and cut into a required pattern by photolithography, and then the exposed portion of thin metal plate material 41 is etched to leave necessary electrical wiring and connection pads 48. FIG. An insulating substrate with a through conductor having the structure shown in (f) is obtained. Thereafter, the insulating material plate 44 is polished to obtain an insulating substrate having a through conductor having a desired thickness shown in FIG.

  FIG. 6 shows another embodiment of the present invention, in which a thin metal plate 51 is etched to form a partially cut comb tooth portion and a partially thinned connection portion, and the comb tooth portion 53 is bent. The tip is abutted and penetrated into the insulating substrate material 54 in a softened state at a high temperature, and the metal thin plate material is separated leaving the comb tooth portion and the connecting portion, and the surface of the insulating substrate material is polished to remove the comb tooth portion. This is a wiring component having a through conductor having a connecting portion made of a wiring material 58 in the through conductor 55. Here, the comb-teeth portion of the thin metal plate material is a through conductor 55, and the connection portion is a half-etched wiring member 58 connected to the comb-teeth portion. The wiring member 58 is an electric pad, coil, heater, or other electrical device. Adapted to circuit components. That is, with respect to the connecting portion where the metal thin plate material is not bent, the thickness of the portion is reduced by etching or the like, and only the portion whose thickness is reduced in the subsequent polishing step is removed and the remaining portion is shown in FIG. As shown in d), it can be used as electrical wiring or connection pads. Further, as shown in FIG. 7, the through conductor 63 is formed up to the middle of the thickness of the insulating substrate material 64, a part of the insulating material is removed by etching, sandblasting, etc., and the insulation having the through conductor provided with the cavity 69 is provided. The substrate 60 can also be used.

  On the other hand, glass, ceramic, resin, etc. are selected as the insulating substrate material, and the insulating substrate material is selected so that the difference in thermal expansion coefficient from the metal thin plate material becomes small. Glass is used when airtightness and heat resistance are required, and the thickness of the glass is more than the thickness required for the final insulating substrate plus the thickness of the thin metal plate. It is also possible to provide an electronic wiring component in which a silicon functional device is bonded to the through conductor and a metal or an insulating cap is sealed to form an airtight sealed package.

  As shown in FIGS. 8 and 9, the insulating substrate having the through conductor according to the present invention has the electrical wiring portions as the coil portions 78 and 88, and the both end portions 73 and 83 are bent, so that the insulating material is in a high temperature softened state. 74 and 84 are brought into contact with and penetrated, and only the portion where the thickness of the metal thin plate material is reduced is removed by the polishing process, and the insulating substrate material 79 is newly adhered or fused to the remaining portion to thereby form the coil portion 78. An encapsulated coil part 70 with a through conductor is obtained. Further, as shown in FIG. 10, the heater part 98 is formed by making the electric wiring part a heat-resistant metal, and both end parts 93 are bent to form a heater part 90 with a through conductor. Further, as shown in FIG. 11, a heater component 100 with a through conductor that seals the heater portion 108 of the electric wiring by bonding or fusing a new insulating substrate material 109 to the electric wiring side of the insulating substrate with a through conductor is provided. can get. A new insulating substrate material 119 provided with a cavity portion is further bonded or fused to the heater side of the heater component 100 with the through conductor to form a heater container 110 with a through conductor as shown in FIG. This heater container 110 with a through conductor can be applied to a microreactor device.

  Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 3 regarding a method of manufacturing an insulating substrate with through conductors. First, a part of a thin metal plate 11 made of 42 alloy having a thickness of 100 μm and an average coefficient of thermal expansion of 5.0 × 10 −6 / K is subjected to photoetching to obtain a process shown in FIGS. 2 (a) and 3 (a). The indicated comb-shaped holes 12 were formed. The dimension of one comb-like portion is about 0.1 mm in width and about 1.0 mm in length. Next, the above comb-shaped portion was bent vertically as shown in FIGS. 2B and 3B using a mold (not shown). Further, as shown in FIG. 3 (c), a borosilicate glass 24 having a thickness of 1.1 mm, a softening point of 557 ° C., and an average thermal expansion coefficient of 7.2 × 10 −6 / K is placed on the thin metal plate material 21. The comb-tooth portion 23 of the thin metal plate material 21 was penetrated into the borosilicate glass 24 which had been heated to a high temperature in an electric furnace as shown in FIG. At this time, a force for penetration was applied by a weight (not shown). Finally, the member is cooled from a high temperature state, taken out, the upper and lower surfaces are polished, and the comb-tooth portion 23 of the thin metal plate material 21 is used as a through conductor as shown in FIGS. 3 (c) and 3 (e). An insulating substrate 20 with a through conductor was produced. At this time, the cross-sectional shape of the comb-tooth portion 23 of the thin metal plate material 21 was a shape indicated by 31 in FIG.

In addition, the embodiment regarding this invention is specified as follows. That is, (1) a step of forming a comb tooth part by partially cutting out the metal thin plate material, and then bending the comb tooth part to stand upright, and stacking the upright tip of the comb tooth part on the insulating substrate material in a high temperature softened state Inserting the comb-tooth portion into the insulating substrate material, separating the comb-tooth portion from the thin metal plate material after cooling to room temperature, and implanting the insulating substrate material as a through conductor, and penetrating the insulating substrate material. A method of manufacturing an insulating substrate having a through conductor including a double-side polishing step in which end faces of the conductor are flush with each other;
(2) The through-conductor is characterized in that the method of forming the comb-teeth portion applied to the metal sheet material is any one of hole forming methods selected from the group of etching, punching, sandblasting, laser cutting, and electric discharge machining. (3) After forming the comb-tooth portion by punching, sandblasting, laser cutting, and electric discharge machining, and further rounding the angular portion of the comb-tooth portion by etching or sandblasting, and passing through the conductor (4) After inserting the comb-tooth part of the said metal thin plate material in the said insulating board | substrate material, the cross-sectional shape of this is made into a smooth curve shape, The part of the sheet material that is not bent is partially removed by photoetching, and the remaining part is electrically wired. (5) forming the through-conductor to the middle of the thickness of the insulating substrate material, removing a part of the insulating substrate material, and forming a cavity; (6) The metal thin plate material has a thickness of 500 μm or less, the insulating substrate material is made of glass or resin, and the metal thin plate material is characterized in that An insulating substrate having a through conductor manufactured by a method characterized in that the thermal expansion coefficients of the plate material and the insulating substrate material are close combinations, and (7) the through conductor has a substantially hexagonal cross-sectional shape therein. Four sides are recessed inward, or a trapezoidal shape with two sides recessed inward. The two adjacent apex angles are rounded, and the other two apex angles are rounded. There is a shape, a substantially trapezoidal shape or An insulating substrate having a through conductor manufactured by a method having a substantially quadrangular shape and rounded corners; and (8) the cross-sectional shape of the through conductor is a smooth curved shape. An insulating substrate having a through conductor manufactured by the method described above, (9) an insulating substrate having a through conductor provided by the electrical wiring and the connection pad manufactured by the method described above, and (10) the above described (11) A package for hermetic sealing of electrical and electronic parts using the insulating substrate having the above-mentioned through conductor, characterized by comprising a cavity manufactured by the method of (12) A coil component having a through conductor in which the electric wiring portion is formed in a coil shape and bent through conductors are arranged at both ends thereof; and (13) the electric wiring portion is made of a heat-resistant metal. A heater member produced and used as a heater member, and having a through conductor in which through conductors are bent at both ends thereof. (14) An insulating member is further bonded or fused to the electric wiring side of the insulating substrate having the above-described through conductor. An insulating substrate having a through conductor in which electrical wiring is sealed, and (15) a through conductor in which the heater is sealed by further bonding or fusing an insulating member to the heater side of the heater member having the above-described through conductor. And (16) a microreactor device using the above-described heater member.

    The insulating substrate with a through conductor of the present invention can be used as an airtight seal member for various electronic device packages. It can be used without using an underfill resin for hermetic sealing of MEMS devices and interposers of CSP semiconductor devices. Moreover, the microreactor apparatus to which the insulating substrate with through conductor of the present invention is applied can be applied to a microreaction element, a bioelement, and the like.

10, 20, 40 ... Insulating substrate having through conductors,
11, 21, 41 ... thin metal plate material,
12, 52, 62, 72, 92 ... comb teeth (notch),
13, 23, 43, 53, 63 ... comb tooth part (tooth part),
73, 83, 93 ... comb teeth (both ends),
14, 24, 44, 54, 64, 74, 84, 94, 104 ... insulating substrate material,
15, 25, 45, 55, 65, 75, 85, 95, 105, 115 ... penetrating conductors (comb teeth), 30 to 39 ... cross-sectional shapes of various comb teeth,
58 ... wiring material, 69 ... cavity,
70 ... Coil parts, 78, 88 ... Coil part,
90, 100 ... heater parts, 98, 108, 118 ... heater parts,
79, 109, 119 ... New insulating substrate material,
110 ... heater vessel with through conductor (microreactor),
111 ... reaction vessel, 112 ... opening.

Claims (10)

  A comb-teeth portion is formed by partially cutting a thin metal plate material, and the comb-teeth portion is bent and upright, and the upright tip is brought into contact with and penetrates the insulating substrate material in a high temperature softened state. An insulating substrate having a through conductor formed by removing the thin metal plate material and polishing the surface of the insulating substrate material.   The metal sheet material has a thickness of 500 μm or less, the comb teeth of the comb teeth portion have a diameter of 100 μm or less, a pitch interval between center lines thereof is 150 μm or less, and the accuracy of the mounting position is about ± 20 μm. An insulating substrate having a through conductor according to claim 1.   An insulating substrate material in which a comb-teeth portion partially cut away and a partially-thinned connection portion are formed by etching a metal thin plate material, the comb-teeth portion is bent upright and the tip thereof is softened at a high temperature The metal thin plate material is separated leaving the comb-tooth portion and the connection portion, and the surface of the insulating substrate material is polished to make the comb-tooth portion as a through conductor and the connection portion as a wiring material. Wiring components with through conductors.   The comb-teeth portion of the metal thin plate material is a through conductor, and the connection portion is a half-etched wiring member connected to the comb-teeth portion, and the wiring member is an electric circuit component such as an electrode pad, a coil, and a heater. A wiring component having a through conductor according to claim 3.   A notch bending process in which notched and bent comb teeth are provided at a plurality of locations on a thin metal plate material, an insulating substrate material softened at a high temperature and an upstanding tip of each comb tooth are disposed in contact with each other and an insulating base A step of inserting and inserting a comb tooth portion on the plate material, a step of separating the metal thin plate material after leaving the comb tooth portion implanted in the insulating substrate material after cooling, and exposing the comb tooth portion to the insulating substrate material A method for manufacturing an insulating substrate having a through conductor including a step of polishing the surface of the through conductor.   6. The method of manufacturing an insulating substrate having a through conductor according to claim 5, wherein the notch of the metal thin plate material is any one selected from the group consisting of etching, punching, sandblasting, laser cutting, and electric discharge machining.   The cross-sectional shape of the comb-teeth part is a substantially hexagonal shape with four sides recessed inside, a substantially trapezoidal shape with two sides recessed inside, and two apex angles adjacent to each other in a substantially square shape are A shape having a burr-like protrusion at the other two apex angles and a shape having a substantially trapezoidal shape or a substantially quadrangular shape with rounded corners. An insulating substrate having the through conductor according to Item 1.   8. The insulating substrate having a through conductor according to claim 7, wherein a square portion of the cross-sectional shape of the comb tooth portion is rounded by etching or sand blasting to obtain a smooth curved shape.   A first step of providing a thin connecting portion and a notched comb tooth portion on a metal thin plate material, a second step of bending the comb tooth portion to stand upright, and a standing tip of the comb tooth portion softened at a high temperature A third step of pushing in and placing the comb tooth portion in contact with the insulating substrate material; and a fourth step of separating the thin metal plate material leaving the comb tooth portion and the connecting portion planted after cooling; A method of manufacturing a wiring component having a through conductor, including a fifth step of polishing the surface of the insulating substrate material that exposes the end face of the comb tooth portion to expose the through conductor and the connection portion as a predetermined wiring material. After the comb-teeth portion of the metal thin plate material is penetrated into the insulating substrate material, a portion that is not bent at the connection portion of the metal thin plate material is partially removed by photoetching, and the remaining portion is used as a wiring material. A method of manufacturing a wiring component having a through conductor according to claim 9.

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