CN111333020B - Spiral inductor with ferromagnetic core and preparation method thereof - Google Patents
Spiral inductor with ferromagnetic core and preparation method thereof Download PDFInfo
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- CN111333020B CN111333020B CN201811558628.8A CN201811558628A CN111333020B CN 111333020 B CN111333020 B CN 111333020B CN 201811558628 A CN201811558628 A CN 201811558628A CN 111333020 B CN111333020 B CN 111333020B
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- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
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- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
Abstract
The invention provides a spiral inductor with a ferromagnetic core and a preparation method thereof, wherein the preparation method of the spiral inductor with the ferromagnetic core comprises the following steps: 1) Providing a first substrate; 2) Forming a groove on the first surface of the first substrate; 3) Providing a second substrate; bonding the second substrate and the first substrate together so that a groove between the first substrate and the second substrate forms an accommodating hole; 4) Forming spiral slotted holes in the first substrate and the second substrate, wherein the spiral slotted holes are positioned on the periphery of the accommodating hole and have a distance with the accommodating hole, and the spiral slotted holes extend from one end of the accommodating hole to the other end of the accommodating hole; 5) Filling the spiral groove hole to form a spiral coil; 6) A ferromagnetic core is provided and inserted into the receiving hole. The inductance value of the spiral inductor with the ferromagnetic core prepared by the invention has better consistency, and the preparation method of the spiral inductor with the ferromagnetic core is simpler and is suitable for batch production.
Description
Technical Field
The invention belongs to the technical field of integrated circuit manufacturing, and particularly relates to a spiral inductor with a ferromagnetic core and a preparation method thereof.
Background
Spiral inductors with ferromagnetic cores have asahi applications, such as fluxgate sensors, micro-transformers, etc. At present, a spiral inductor with a ferromagnetic core is mainly formed by winding an enameled wire on the ferromagnetic core, and the consistency of the inductance value of the spiral inductor is poor.
With the development of the technology, at present, spiral inductors are also prepared on the basis of the MEMS technology, and the spiral inductors prepared on the basis of the MEMS technology are generally realized by adopting an electroplating or flip chip bonding manner, but the process is relatively complex and is not suitable for mass production.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a spiral inductor with a ferromagnetic core and a method for manufacturing the same, so as to solve the problems of poor uniformity of inductance values of the spiral inductor in the prior art, and complicated manufacturing process, which is not suitable for mass production.
In order to achieve the above objects and other related objects, the present invention provides a method for manufacturing a spiral inductor with a ferromagnetic core, the method comprising the steps of:
1) Providing a first substrate, wherein the first substrate comprises a first surface and a second surface which are opposite;
2) Forming a groove on the first surface of the first substrate;
3) Providing a second substrate, wherein the second substrate comprises a first surface and a second surface which are opposite; bonding the second substrate and the first substrate together such that a recess between the first substrate and the second substrate forms an accommodation hole; the first surface of the second substrate and the first surface of the first substrate are bonding surfaces;
4) Forming a spiral groove hole in the first substrate and the second substrate, wherein the spiral groove hole is positioned at the periphery of the accommodating hole and has a distance with the accommodating hole, and the spiral groove hole extends from one end of the accommodating hole to the other end of the accommodating hole;
5) Filling the spiral groove hole to form a spiral coil;
6) Providing a ferromagnetic core, and inserting the ferromagnetic core into the accommodating hole.
Optionally, in step 2), while the groove is formed on the first surface of the first substrate, a plurality of positioning blind holes are formed on the first surface of the first substrate, and the plurality of positioning blind holes define the length and the width of the spiral slot formed in step 4).
Optionally, in step 3), after the second substrate is bonded to the first substrate, a distance from the receiving hole to the second surface of the first substrate is the same as a distance from the receiving hole to the second surface of the second substrate.
Optionally, the first surface of the second substrate provided in step 3) is formed with a groove.
Optionally, step 4) comprises the steps of:
4-1) forming a plurality of first slotted holes which are arranged in the second substrate at intervals in parallel along the length direction of the accommodating hole, wherein the first slotted holes comprise first grooves and first through holes communicated with the first grooves; the first groove is located on the second surface of the second substrate and crosses the accommodating hole along the width direction of the accommodating hole; the first through holes are positioned at two sides of the accommodating hole, are communicated with two ends of the first groove and extend from the first groove to the first surface of the second substrate;
4-2) forming a plurality of second slotted holes which are arranged in parallel at intervals along the length direction of the accommodating hole in the first substrate, wherein the second slotted holes comprise second grooves and second through holes communicated with the second grooves; the second groove is positioned on the second surface of the first substrate and crosses the accommodating hole along the width direction of the accommodating hole; the second through holes are positioned on two sides of the accommodating hole, communicated with two ends of the second groove and extended to the first surface of the first substrate from the second groove;
the second through holes are communicated with the first through holes in a one-to-one correspondence mode, and the spiral slotted holes are formed by the first slotted holes and the second slotted holes.
Optionally, in step 4-1), while forming the first slot hole in the second substrate, a first electrode hole, a second electrode hole, and a first electrode connection line groove are formed on a second surface of the second substrate, where the first electrode hole is communicated with one end of the spiral slot hole through the first electrode connection line groove; in the step 4-2), while forming the second slot hole in the first substrate, forming a third electrode hole, a fourth electrode hole and a second electrode connecting line groove on the second surface of the first substrate, wherein the fourth electrode hole is communicated with the other end of the spiral slot hole through the second electrode connecting line groove; the third electrode hole is communicated with the first electrode hole, and the fourth electrode hole is communicated with the second electrode hole; in step 5), forming the spiral coil, forming a first electrode in the first electrode hole, forming a second electrode in the second electrode hole, forming a third electrode in the third electrode hole, forming a fourth electrode in the fourth electrode hole, forming a first electrode connecting line in the first electrode connecting line groove, and forming a second electrode connecting line in the second electrode connecting line groove.
Optionally, a step of forming an oxide layer on the second surface of the first substrate and the second surface of the second substrate is further included between step 3) and step 4).
Optionally, a step of forming an oxide layer on the second surface of the first substrate is further included between step 1) and step 2); a step of forming an oxide layer on the second surface of the second substrate is also included between the step 3) and the step 4).
Optionally, a step of forming an isolation oxide layer on the side wall of the spiral groove hole is further included between the step 4) and the step 5).
Optionally, in step 5), a micro-casting process is adopted to fill the spiral groove hole to form a spiral coil.
Optionally, step 5) comprises the steps of:
5-1) providing a first cover plate and a second cover plate, and respectively attaching the first cover plate and the second cover plate to the second surface of the first substrate and the second surface of the second substrate; a filling through hole communicated with the spiral groove hole is formed in the first cover plate;
5-2) pressing the hot-melted alloy into the spiral groove hole through the filling through hole, wherein the spiral groove hole is filled with the hot-melted alloy;
5-3) solidifying the hot melted alloy to form the helical coil;
5-4) removing the first cover plate and the second cover plate.
The present invention also provides a spiral inductor with a ferromagnetic core, the spiral inductor with a ferromagnetic core comprising:
a first substrate comprising opposing first and second surfaces;
a second substrate comprising opposing first and second surfaces; the second substrate is bonded to the first surface of the first substrate, and the first surface of the second substrate and the first surface of the first substrate are bonding surfaces; a receiving hole is formed between the first substrate and the second substrate;
the spiral coil is positioned in the first substrate and the second substrate, positioned at the periphery of the accommodating hole and spaced from the accommodating hole; the spiral coil extends from one end of the accommodating hole to the other end of the accommodating hole;
a ferromagnetic core inserted into the receiving hole.
Optionally, the thickness of the second substrate is smaller than that of the first substrate, and a distance from the receiving hole to the second surface of the first substrate is the same as a distance from the receiving hole to the second surface of the second substrate.
Optionally, the spiral inductor with the ferromagnetic core further includes an oxide layer and an isolation oxide layer, the oxide layer is located on the second surface of the first substrate and the second surface of the second substrate, and the isolation oxide layer is located between the spiral coil and the first substrate and the second substrate.
Optionally, the spiral inductor with the ferromagnetic core further comprises:
the first electrode is positioned on the second surface of the second substrate;
the second electrode is positioned on the second surface of the second substrate;
the third electrode is positioned on the second surface of the first substrate and is connected with the first electrode;
the fourth electrode is positioned on the second surface of the first substrate and is connected with the second electrode;
a first electrode connecting wire located on the second surface of the second substrate, one end of the first electrode connecting wire is connected with the first electrode, and the other end of the first electrode connecting wire is connected with one end of the spiral coil;
and the second electrode connecting line is positioned on the second surface of the first substrate, one end of the second electrode connecting line is connected with the fourth electrode, and the other end of the second electrode connecting line is connected with the other end of the spiral coil.
As described above, the spiral inductor with a ferromagnetic core and the manufacturing method thereof of the present invention have the following beneficial effects:
the inductance value of the spiral inductor with the ferromagnetic core prepared by the invention has better consistency, and the preparation method of the spiral inductor with the ferromagnetic core is simpler and is suitable for batch production.
Drawings
Fig. 1 is a flow chart illustrating a method for manufacturing a spiral inductor with a ferromagnetic core according to an embodiment of the present invention.
Fig. 2 is an end view of the structure obtained in step 1) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 3 is a side view of the structure obtained in step 1) of the method for manufacturing a spiral inductor with a ferromagnetic core according to one embodiment of the present invention.
Fig. 4 is an end view of the structure obtained in step 2) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 5 is a side view of the structure obtained in step 2) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 6 and 8 are end views showing the structure obtained in step 3) of the method for manufacturing a spiral inductor with a ferromagnetic core according to one embodiment of the present invention.
Fig. 7 and 9 are side views of the structure obtained in step 3) of the method for manufacturing the spiral inductor with the ferromagnetic core according to the first embodiment of the present invention.
Fig. 10, fig. 12 and fig. 14 are end views showing the structure obtained in step 4) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 11, 13 and 15 are side views of the structure obtained in step 4) of the method for manufacturing the spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 16 and 17 are schematic views showing an exploded structure corresponding to step 5) of a method for manufacturing a spiral inductor with a ferromagnetic core according to an embodiment of the present invention.
Fig. 18 shows an end view of the structure obtained in step 5) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 19 is a side view of the structure obtained in step 5) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 20 is an exploded view of the spiral inductor with a ferromagnetic core according to step 6).
Fig. 21 shows an end view of the structure obtained in step 6) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 22 is a side view of the structure obtained in step 6) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the first embodiment of the present invention.
Fig. 23 is an end view showing a structure obtained in step 1) of the method for manufacturing a spiral inductor with a ferromagnetic core provided in the third embodiment of the present invention.
Fig. 24 is a side view of the structure obtained in step 1) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the third embodiment of the present invention.
Fig. 25 is an end view showing a structure obtained in step 2) of the manufacturing method of the spiral inductor with a ferromagnetic core provided in the third embodiment of the present invention.
Fig. 26 is a side view of the structure obtained in step 2) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the third embodiment of the present invention.
Fig. 27 is an end view showing a structure obtained in step 3) of the manufacturing method of the spiral inductor with a ferromagnetic core provided in the fourth embodiment of the present invention.
Fig. 28 is a side view of the structure obtained in step 3) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the fourth embodiment of the present invention.
Fig. 29 is an end view showing a structure obtained in step 3) of the manufacturing method of the spiral inductor with a ferromagnetic core provided in the sixth embodiment of the present invention.
Fig. 30 is a side view of the structure obtained in step 3) of the method for manufacturing a spiral inductor with a ferromagnetic core according to the sixth embodiment of the present invention.
Description of the element reference
10. A first substrate
11. Groove
111. Receiving hole
12. Second substrate
13. Spiral slot
131. First slot
1311. First trench
1312. First through hole
132. Second slot
1321. Second trench
1322. Second through hole
14. Spiral coil
15. Ferromagnetic core
16. Blind hole
17. First electrode hole
171. A first electrode
18. Second electrode hole
181. Second electrode
19. Third electrode hole
191. Third electrode
20. Fourth electrode hole
201. A fourth electrode
21. First electrode connecting line groove
211. First electrode connecting line
22. Oxide layer
23. Isolation oxide layer
24. First cover plate
241. Filling through hole
25. Second cover plate
S1 to S6
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 26. It should be noted that the drawings provided in the present embodiment are only for schematically illustrating the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
Example one
Referring to fig. 1, the present invention provides a method for manufacturing a spiral inductor with a ferromagnetic core, which includes the following steps:
1) Providing a first substrate, wherein the first substrate comprises a first surface and a second surface which are opposite;
2) Forming a groove on the first surface of the first substrate;
3) Providing a second substrate, wherein the second substrate comprises a first surface and a second surface which are opposite; bonding the second substrate and the first substrate together such that the recess between the first substrate and the second substrate forms a receiving hole; the first surface of the second substrate and the first surface of the first substrate are bonding surfaces;
4) Forming spiral groove holes in the first substrate and the second substrate, wherein the spiral groove holes are positioned on the periphery of the accommodating hole and have a distance with the accommodating hole, and the spiral groove holes extend from one end of the accommodating hole to the other end of the accommodating hole;
5) Filling the spiral groove hole to form a spiral coil;
6) Providing a ferromagnetic core, and inserting the ferromagnetic core into the accommodating hole.
In step 1), please refer to step S1 in fig. 1 and fig. 2 to fig. 3, a first substrate 10 is provided, wherein the first substrate 10 includes a first surface and a second surface opposite to each other.
As an example, the first substrate 10 may be a silicon wafer (a general silicon wafer or a high resistance silicon wafer), a glass wafer or a ceramic wafer, or the like; preferably, in this embodiment, the first substrate 10 is a silicon wafer.
In step 2), please refer to step S2 in fig. 1 and fig. 4 to 5, a groove 11 is formed on the first surface of the first substrate 10.
As an example, the groove 11 may be formed on the first surface of the first substrate 10 by using a photolithography process.
As an example, while the groove 11 is formed on the first surface of the first substrate 10, a plurality of positioning blind holes 16 are formed on the first surface of the first substrate 10, and the plurality of positioning blind holes 16 define the length and the width of the spiral slot formed in step 4).
It should be noted that, in the present invention, a plurality of spiral inductors with ferromagnetic cores may be simultaneously processed in the first substrate 10, and after the processing, the scribing may be separately inserted into the ferromagnetic cores, in this case, a plurality of grooves 11 may be simultaneously processed in the first substrate 10, and fig. 4 to 5 only illustrate one groove 11, in this case, after the spiral coil is manufactured, the scribing needs to be completed between the ferromagnetic cores, and after the scribing, one end of the groove 11 needs to be exposed, so that the ferromagnetic core is inserted into the groove 11 through one end of the groove 11. Of course, only one groove 11 may be machined at a time on the first substrate 10, in this case, one end of the groove 11 may be directly exposed, or one end of the groove 11 may be exposed by slicing, so that the ferromagnetic core may be inserted into the groove 11 from one end of the groove 11.
In step 3), please refer to step S3 in fig. 1 and fig. 6 to 7, providing a second substrate 12, wherein the second substrate 12 includes a first surface and a second surface opposite to each other; bonding the second substrate 12 and the first substrate 10 together such that the groove 11 between the first substrate 10 and the second substrate 12 forms a receiving hole 111; the first surface of the second substrate 12 and the first surface of the first substrate 10 are bonding surfaces.
For example, the first surface of the second substrate 12 is a plane, and after the second substrate 12 is bonded to the first substrate 10, the receiving hole 111 is formed in the groove 11 on the surface of the first substrate 10.
As an example, the thickness of the second substrate 12 is smaller than that of the first substrate 10, so as to ensure that after the second substrate 12 is bonded to the first substrate 10, the distance from the accommodating hole 111 to the second surface of the first substrate 10 is the same as the distance from the accommodating hole 111 to the second surface of the second substrate 12, that is, the accommodating hole 111 is located at the middle of a bonded structure after the first substrate 10 and the second substrate 12 are bonded. In one example, the first substrate 10 may have a thickness of 425 microns, and the second substrate 12 may have a thickness of 300 microns; but in practical examples it is not limited thereto.
As an example, the second substrate 12 may be a silicon wafer (a common silicon wafer or a high resistance silicon wafer), a glass wafer or a ceramic wafer, or the like; preferably, in this embodiment, the second substrate 12 is a silicon wafer.
The specific method for bonding the second substrate 12 to the first substrate 10 is known to those skilled in the art, and will not be described herein again.
As an example, as shown in fig. 8 and 9, the step 3) further includes a step of forming an oxide layer 22 on the second surface of the first substrate 10 and the second surface of the second substrate 12. The oxide layer 22 may be used as an etching barrier layer for subsequent etching of the first substrate 10 and etching of the second substrate 12.
In step 4), please refer to step S4 in fig. 1 and fig. 10 to fig. 15, a spiral slot 13 is formed in the first substrate 10 and the second substrate 12, the spiral slot 13 is located at the periphery of the accommodating hole 111 and has a distance from the accommodating hole 111, and the spiral slot 13 extends from one end of the accommodating hole 111 to the other end of the accommodating hole 111.
As an example, step 4) comprises the following steps:
4-1) forming a plurality of first slots 131 arranged in parallel at intervals along the length direction of the accommodating hole 111 in the second substrate 12, wherein the first slots 131 include a first groove 1311 and a first through hole 1312 communicated with the first groove 1311; wherein the first groove 1311 is located on the second surface of the second substrate 12 and crosses the receiving hole 111 along the width direction of the receiving hole 111; the first through holes 1312 are located at two sides of the accommodating hole 111, communicate with two ends of the first trench 1311, and extend from the first trench 1311 to the first surface of the second substrate 12, as shown in fig. 10 and 11;
4-2) forming a plurality of second slots 132 in the first substrate 10, the second slots 132 being arranged in parallel along the length direction of the accommodating hole 111 at intervals, wherein each second slot 132 includes a second groove 1321 and a second through hole 1322 communicated with the second groove 1321; wherein the second groove 1321 is located on the second surface of the first substrate 10 and crosses the receiving hole 111 along the width direction of the receiving hole 111; the second through holes 1322 are located at two sides of the accommodating hole 111, communicate with two ends of the second groove 1321, and extend from the second groove 1321 to the first surface of the first substrate 10, as shown in fig. 12 and 13;
the second through holes 1322 and the first through holes 1312 are in one-to-one correspondence, and the plurality of first slots 131 and the plurality of second slots 132 together form the spiral slot 13.
As an example, referring to fig. 16, in step 4-1), while the first slot 131 is formed in the second substrate 12, a first electrode hole 17, a second electrode hole 18 and a first electrode connecting trench 21 are formed on the second surface of the second substrate 12, and the first electrode hole 17 is communicated with one end of the spiral slot 13 through the first electrode connecting trench 21; in step 4-2), while the second slot 132 is formed in the first substrate 10, a third electrode hole 19, a fourth electrode hole 20 and a second electrode connecting line groove (not shown) are formed on the second surface of the first substrate 10, and the fourth electrode hole 20 is communicated with the other end of the spiral slot 13 through the second electrode connecting line groove; the third electrode hole 19 is communicated with the first electrode hole 17, and the fourth electrode hole 20 is communicated with the second electrode hole 18. Note that in fig. 16, the direction of arrow a is the direction of the end view of the resulting structure, and the direction of arrow B is the direction of the side view of the resulting structure.
As an example, as shown in fig. 14 to fig. 15, the step 4) further includes a step of forming an isolation oxide layer 23 on the sidewall of the spiral slot 13. Specifically, when the first substrate 10 and the second substrate 12 are both silicon wafers, the isolation oxide layer 23 may be formed by, but not limited to, a thermal oxidation process.
In step 5), please refer to step S5 in fig. 1 and fig. 16 to fig. 19, the spiral slot 13 is filled with a spiral coil 14.
As an example, a micro-casting process may be used to fill the spiral slot 13 to form the spiral coil 14.
Specifically, the step 5) comprises the following steps:
5-1) providing a first cover plate 24 and a second cover plate 25, and respectively attaching the first cover plate 24 and the second cover plate 25 to the second surface of the first substrate 10 and the second surface of the second substrate 12; a filling through hole 241 communicated with the spiral slot hole 13 is formed in the first cover plate 24, and an explosion diagram of a corresponding structure is shown in fig. 16;
5-2) pressing the hot-melt alloy into the spiral groove hole 13 through the filling through hole 241, wherein the spiral groove hole 13 is filled with the hot-melt alloy; specifically, the filling through hole 241 corresponds to the first electrode hole 17, and the thermally melted alloy flows through the first electrode hole 17, the first electrode connecting line groove 21, the second electrode connecting line groove, and the fourth electrode hole 20 from one end to the other end of the spiral slot 13 in sequence through the filling through hole 241 to fill up the spiral slot 13;
5-3) solidifying the hot-melted alloy to form the spiral coil 14, as shown in fig. 17, an upper surface of the spiral coil 14 may be formed to be higher than the second surface of the first substrate 10 and the second surface of the second substrate 12;
5-4) removing the first cover plate 24 and the second cover plate 25.
As an example, in step 5), the spiral coil 14 is formed while forming the first electrode 171 in the first electrode hole 17, forming the second electrode 181 in the second electrode hole 18, forming the third electrode 191 in the third electrode hole 19, forming the fourth electrode 201 in the fourth electrode hole 20, forming the first electrode connecting line 211 in the first electrode connecting line groove 21, and forming the second electrode connecting line (not shown) in the second electrode connecting line groove.
In step 6), referring to step S6 in fig. 1 and fig. 20 to 22, a ferromagnetic core 15 is provided, and the ferromagnetic core 15 is inserted into the receiving hole 111.
As described above, if the receiving hole 111 is formed in the first substrate 10, it is necessary to slice to expose one end of the receiving hole 111, and in this step, the ferromagnetic core 15 is inserted into the receiving hole 111 through the exposed end of the receiving hole 111.
Example two
With continuing reference to fig. 20-22 in conjunction with fig. 2-19, the present invention further provides a spiral inductor with a ferromagnetic core, the spiral inductor with a ferromagnetic core comprising:
a first substrate 10, the first substrate 10 including a first surface and a second surface opposite to each other;
a second substrate 12, the second substrate 12 comprising opposing first and second surfaces; the second substrate 12 is bonded to the first surface of the first substrate 10, and the first surface of the second substrate 12 and the first surface of the first substrate 10 are bonding surfaces; a receiving hole 111 is formed between the first substrate 10 and the second substrate 12;
a spiral coil 14, wherein the spiral coil 14 is located in the first substrate 10 and the second substrate 12, is located at the periphery of the receiving hole 111, and has a distance from the receiving hole 111; the spiral coil 14 extends from one end of the accommodating hole 111 to the other end of the accommodating hole 111;
and a ferromagnetic core 15 inserted into the receiving hole 111.
As an example, the first substrate 10 may be a silicon wafer (a common silicon wafer or a high resistance silicon wafer), a glass wafer or a ceramic wafer, or the like; preferably, in this embodiment, the first substrate 10 is a silicon wafer.
As an example, the second substrate 12 may be a silicon wafer (a common silicon wafer or a high resistance silicon wafer), a glass wafer or a ceramic wafer, or the like; preferably, in this embodiment, the second substrate 12 is a silicon wafer.
For example, a groove 11 is formed in the first surface of the first substrate 10, the first surface of the second substrate 12 is a plane, and after the second substrate 12 and the first substrate 10 are bonded together, the groove 11 on the first surface of the first substrate 10 forms the accommodating hole 111.
As an example, the thickness of the second substrate 12 is smaller than that of the first substrate 10, so as to ensure that after the second substrate 12 is bonded to the first substrate 10, the distance from the accommodating hole 111 to the second surface of the first substrate 10 is the same as the distance from the accommodating hole 111 to the second surface of the second substrate 12, that is, the accommodating hole 111 is located at the middle of a bonded structure after the first substrate 10 and the second substrate 12 are bonded. In one example, the first substrate 10 may have a thickness of 425 micrometers and the second substrate 12 may have a thickness of 300 micrometers; but in practical examples it is not limited thereto.
As an example, the spiral inductor with the ferromagnetic core further includes an oxide layer 22, and the oxide layer 22 is located on the second surface of the first substrate 10 and the second surface of the second substrate 12. The oxide layer 22 may be, but is not limited to, a silicon oxide layer.
As an example, the spiral inductor with the ferromagnetic core further includes an isolation oxide layer 23, and the isolation oxide layer 23 is located between the spiral coil 14 and the first and second substrates 10 and 12. The isolation oxide layer 23 may be, but is not limited to, a silicon oxide layer.
As an example, the spiral inductor with the ferromagnetic core further comprises: a first electrode 171, wherein the first electrode 171 is located on a second surface of the second substrate 12; a second electrode 181, wherein the second electrode 181 is located on a second surface of the second substrate 12; a third electrode 191, wherein the third electrode 191 is located on the second surface of the first substrate 10 and connected to the first electrode 171; a fourth electrode 201, wherein the fourth electrode 201 is located on the second surface of the first substrate 10 and connected to the second electrode 181; a first electrode wire 21, wherein the first electrode wire 21 is located on the second surface of the second substrate 12, one end of the first electrode wire 21 is connected to the first electrode 171, and the other end of the first electrode wire 21 is connected to one end of the spiral coil 14; and a second electrode wire (not shown) located on the second surface of the first substrate 10, one end of which is connected to the fourth electrode 201, and the other end of which is connected to the other end of the spiral coil 14.
EXAMPLE III
Referring to fig. 23 to fig. 26 in conjunction with fig. 1 to fig. 22, the present embodiment further provides a method for manufacturing a spiral inductor with a ferromagnetic core, the method for manufacturing the spiral inductor with a ferromagnetic core in the present embodiment is substantially the same as the method for manufacturing the spiral inductor with a ferromagnetic core in the first embodiment, and the difference between the methods is that: in the first embodiment, the oxide layer 22 is formed on the second surface of the first substrate 10 and the second surface of the second substrate 12 after the second substrate 12 is bonded to the first substrate 10, and in the present embodiment, the oxide layer 22 is formed on the second surface of the first substrate 10 and the second surface of the second substrate 12 before the second substrate 12 is bonded to the first substrate 10.
Other steps of the method for manufacturing a spiral inductor with a ferromagnetic core in this embodiment are the same as those of the method for manufacturing a spiral inductor with a ferromagnetic core in the first embodiment, and refer to the first embodiment specifically, and will not be described again here.
Example four
Referring to fig. 27 to 28 in conjunction with fig. 1 to 22, the present embodiment further provides a method for manufacturing a spiral inductor with a ferromagnetic core, the method for manufacturing the spiral inductor with a ferromagnetic core in the present embodiment is substantially the same as the method for manufacturing the spiral inductor with a ferromagnetic core in the first embodiment, and the difference between the method for manufacturing the spiral inductor with a ferromagnetic core in the first embodiment is: in a first embodiment, a first surface of the second substrate 12 is a plane, after the second substrate 12 is bonded to the first substrate 10, the accommodating hole 111 is formed in the groove 11 on the first surface of the first substrate 10, and a thickness of the second substrate 12 is smaller than a thickness of the first substrate 10; in the present application, the groove 11 is formed on both the first surface of the first substrate 10 and the first surface of the second substrate 12, after the second substrate 12 is bonded to the first substrate 10, the groove 11 on the first surface of the first substrate 10 and the groove 11 on the first surface of the second substrate 12 jointly form the accommodating hole 111, and the thickness of the second substrate 12 is the same as that of the first substrate 10.
Other steps of the method for manufacturing a spiral inductor with a ferromagnetic core in this embodiment are the same as those of the method for manufacturing a spiral inductor with a ferromagnetic core in the first embodiment, and refer to the first embodiment, which will not be described herein again.
EXAMPLE five
Referring to fig. 27 to 28 in conjunction with fig. 2 to 22, the present embodiment further provides a spiral inductor with a ferromagnetic core, and the spiral inductor with a ferromagnetic core in the present embodiment is substantially the same as the spiral inductor with a ferromagnetic core in the second embodiment, and the difference between the two embodiments is: in the second embodiment, the first surface of the second substrate 12 is a plane, after the second substrate 12 is bonded to the first substrate 10, the accommodating hole 111 is formed in the groove 11 on the first surface of the first substrate 10, and the thickness of the second substrate 12 is smaller than that of the first substrate 10; in this application, the grooves 11 are formed on both the first surface of the first substrate 10 and the first surface of the second substrate 12, after the second substrate 12 is bonded to the first substrate 10, the grooves 11 on the first surface of the first substrate 10 and the grooves 11 on the first surface of the second substrate 12 together form the receiving hole 111, and the thickness of the second substrate 12 is the same as that of the first substrate 10.
Other structures of the spiral inductor with the ferromagnetic core in this embodiment are the same as those of the spiral inductor with the ferromagnetic core in the second embodiment, and please refer to the second embodiment specifically, and not repeated here.
EXAMPLE six
Referring to fig. 29 to 30 in conjunction with fig. 1 to 22 and 27 to 28, the present embodiment further provides a method for manufacturing a spiral inductor with a ferromagnetic core, the method for manufacturing the spiral inductor with a ferromagnetic core in the present embodiment is substantially the same as the method for manufacturing the spiral inductor with a ferromagnetic core in the fourth embodiment, and the difference between the methods is that: in the fourth embodiment, after the second substrate 12 is bonded to the first substrate 10, the oxide layer 22 is formed on the second surface of the first substrate 10 and the second surface of the second substrate 12; in this embodiment, the oxide layer 22 is formed on the second surface of the first substrate 10 and the second surface of the second substrate 12 before the second substrate 12 is bonded to the first substrate 10.
Other steps of the method for manufacturing a spiral inductor with a ferromagnetic core in this embodiment are the same as those of the method for manufacturing a spiral inductor with a ferromagnetic core in the fourth embodiment, and refer to the fourth embodiment specifically, and will not be described herein again.
To sum up, the spiral inductor with a ferromagnetic core and the manufacturing method thereof of the present invention include the following steps: 1) Providing a first substrate, wherein the first substrate comprises a first surface and a second surface which are opposite; 2) Forming a groove on the first surface of the first substrate; 3) Providing a second substrate, wherein the second substrate comprises a first surface and a second surface which are opposite; bonding the second substrate and the first substrate together so that a groove between the first substrate and the second substrate forms an accommodating hole; the first surface of the second substrate and the first surface of the first substrate are bonding surfaces; 4) Forming spiral groove holes in the first substrate and the second substrate, wherein the spiral groove holes are positioned on the periphery of the accommodating hole and have a distance with the accommodating hole, and the spiral groove holes extend from one end of the accommodating hole to the other end of the accommodating hole; 5) Filling the spiral groove hole to form a spiral coil; 6) Providing a ferromagnetic core, and inserting the ferromagnetic core into the accommodating hole. The inductance value of the spiral inductor with the ferromagnetic core prepared by the invention has better consistency, and the preparation method of the spiral inductor with the ferromagnetic core is simpler and is suitable for batch production.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (15)
1. A method for preparing a spiral inductor with a ferromagnetic core is characterized by comprising the following steps:
1) Providing a first substrate, wherein the first substrate comprises a first surface and a second surface which are opposite;
2) Forming a groove on the first surface of the first substrate;
3) Providing a second substrate, wherein the second substrate comprises a first surface and a second surface which are opposite; bonding the second substrate and the first substrate together such that a recess between the first substrate and the second substrate forms an accommodation hole; the first surface of the second substrate and the first surface of the first substrate are bonding surfaces;
4) Forming spiral groove holes in the first substrate and the second substrate, wherein the spiral groove holes are positioned on the periphery of the accommodating hole and have a distance with the accommodating hole, and the spiral groove holes extend from one end of the accommodating hole to the other end of the accommodating hole;
5) Filling the spiral groove hole to form a spiral coil;
6) Providing a ferromagnetic core, and inserting the ferromagnetic core into the accommodating hole.
2. The method as claimed in claim 1, wherein in step 2), a plurality of positioning holes are formed on the first surface of the first substrate at the same time of forming the grooves on the first surface of the first substrate, and the plurality of positioning holes define the length and width of the spiral slot formed in step 4).
3. The method as claimed in claim 1, wherein the distance from the receiving hole to the second surface of the first substrate is the same as the distance from the receiving hole to the second surface of the second substrate after the second substrate is bonded to the first substrate in step 3).
4. The method of claim 1, wherein the first surface of the second substrate provided in step 3) is formed with a recess.
5. A method for manufacturing a spiral inductor with a ferromagnetic core as claimed in claim 1, wherein step 4) comprises the steps of:
4-1) forming a plurality of first slotted holes which are arranged in the second substrate at intervals in parallel along the length direction of the accommodating hole, wherein the first slotted holes comprise first grooves and first through holes communicated with the first grooves; the first groove is positioned on the second surface of the second substrate and crosses the accommodating hole along the width direction of the accommodating hole; the first through hole is positioned at two sides of the accommodating hole, is communicated with two ends of the first groove and extends to the first surface of the second substrate from the first groove;
4-2) forming a plurality of second slotted holes which are arranged in parallel at intervals along the length direction of the accommodating hole in the first substrate, wherein the second slotted holes comprise second grooves and second through holes communicated with the second grooves; the second groove is positioned on the second surface of the first substrate and crosses the accommodating hole along the width direction of the accommodating hole; the second through holes are positioned on two sides of the accommodating hole, are communicated with two ends of the second groove and extend to the first surface of the first substrate from the second groove;
the second through holes are communicated with the first through holes in a one-to-one correspondence mode, and the spiral slotted holes are formed by the first slotted holes and the second slotted holes.
6. The method according to claim 5, wherein in step 4-1), while forming the first slot in the second substrate, a first electrode hole, a second electrode hole and a first electrode connecting line trench are formed in the second surface of the second substrate, and the first electrode hole is connected to one end of the spiral slot through the first electrode connecting line trench; in the step 4-2), while forming the second slot hole in the first substrate, forming a third electrode hole, a fourth electrode hole and a second electrode connecting line groove on the second surface of the first substrate, wherein the fourth electrode hole is communicated with the other end of the spiral slot hole through the second electrode connecting line groove; the third electrode hole is communicated with the first electrode hole, and the fourth electrode hole is communicated with the second electrode hole; in step 5), forming the spiral coil, forming a first electrode in the first electrode hole, forming a second electrode in the second electrode hole, forming a third electrode in the third electrode hole, forming a fourth electrode in the fourth electrode hole, forming a first electrode connecting line in the first electrode connecting line groove, and forming a second electrode connecting line in the second electrode connecting line groove.
7. The method of claim 1, further comprising a step of forming an oxide layer on the second surface of the first substrate and the second surface of the second substrate between step 3) and step 4).
8. The method of claim 1, further comprising a step of forming an oxide layer on the second surface of the first substrate between step 1) and step 2); a step of forming an oxide layer on the second surface of the second substrate is further included between the step 3) and the step 4).
9. The method of claim 1, further comprising a step of forming an isolation oxide layer on the sidewall of said spiral slot hole between step 4) and step 5).
10. A method for making a spiral inductor with a ferromagnetic core as recited in any of claims 1-9, wherein in step 5), a spiral coil is formed by filling the spiral groove hole with a micro-casting process.
11. A method for manufacturing a spiral inductor with a ferromagnetic core as recited in claim 10, wherein step 5) comprises the steps of:
5-1) providing a first cover plate and a second cover plate, and respectively attaching the first cover plate and the second cover plate to the second surface of the first substrate and the second surface of the second substrate; a filling through hole communicated with the spiral groove hole is formed in the first cover plate;
5-2) pressing the hot-melted alloy into the spiral groove hole through the filling through hole, wherein the spiral groove hole is filled with the hot-melted alloy;
5-3) solidifying the hot melted alloy to form the spiral coil;
5-4) removing the first cover plate and the second cover plate.
12. A spiral inductor with a ferromagnetic core, said spiral inductor with a ferromagnetic core comprising:
a first substrate comprising opposing first and second surfaces;
a second substrate comprising opposing first and second surfaces; the second substrate is bonded to the first surface of the first substrate, and the first surface of the second substrate and the first surface of the first substrate are bonding surfaces;
a receiving hole is formed between the first substrate and the second substrate;
the spiral coil is positioned in the first substrate and the second substrate, positioned at the periphery of the accommodating hole and spaced from the accommodating hole; the spiral coil extends from one end of the accommodating hole to the other end of the accommodating hole;
a ferromagnetic core inserted into the receiving hole.
13. The spiral inductor with a ferromagnetic core of claim 12, wherein a thickness of said second substrate is less than a thickness of said first substrate, and a distance from said receiving hole to a second surface of said first substrate is the same as a distance from said receiving hole to said second surface of said second substrate.
14. The spiral inductor with a ferromagnetic core of claim 12, further comprising an oxide layer on a second surface of said first substrate and a second surface of said second substrate and an isolation oxide layer between said spiral coil and said first substrate and said second substrate.
15. The spiral inductor with a ferromagnetic core of claim 12, further comprising:
the first electrode is positioned on the second surface of the second substrate;
the second electrode is positioned on the second surface of the second substrate;
the third electrode is positioned on the second surface of the first substrate and is connected with the first electrode;
the fourth electrode is positioned on the second surface of the first substrate and is connected with the second electrode;
a first electrode connecting wire located on the second surface of the second substrate, one end of the first electrode connecting wire is connected with the first electrode, and the other end of the first electrode connecting wire is connected with one end of the spiral coil;
and the second electrode connecting wire is positioned on the second surface of the first substrate, one end of the second electrode connecting wire is connected with the fourth electrode, and the other end of the second electrode connecting wire is connected with the other end of the spiral coil.
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