JP2011211052A - Expand device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an expand device that cuts off a wafer and a ring frame apart from each other.SOLUTION: This invention relates to the expand device 10, wherein a workpiece W1 is a semiconductor wafer W including a plurality of chips C united through an adhesive sheet S on an inner peripheral side of the ring frame RF, and the expand device 10 includes a support means 12 of supporting the workpiece W1, a contact means 13 capable of abutting on a reverse surface side of the adhesive sheet S, a driving means 14 of elevating the support means 12, and a cutting means 16 capable of cutting off the adhesive sheet S after the tensile force is applied. The support means 12 is lowered to below an upper end of the contact member 13 to apply tensile force in a radiation direction of the adhesive sheet S to increase chip C intervals and in this state, the cutting means 16 cuts the adhesive sheet S, so that the chips C can be carried.

Description

  The present invention relates to an expanding apparatus, and more specifically, a plurality of chips integrated with a ring frame via an adhesive sheet, or a plate-like member that can be singulated into a plurality of chips formed with a brittle layer. The present invention relates to an expanding device that can be expanded as a processing object by extending and deforming an adhesive sheet in a radial direction.

A plate-like member such as a semiconductor wafer (hereinafter simply referred to as “wafer” as required) is subjected to various treatments in a state of being integrated inside the ring frame via an adhesive sheet. A circuit is formed on the surface of the wafer, and it is separated into chips by a cutting device, or separated into chips through a brittle layer forming process by laser irradiation, and each chip is extracted and electronic component Bonded to a lead frame or the like.
When extracting the tip, an expanding device is used for expanding the interval between the tip formed by cutting or the tip formed by providing a brittle layer. Examples of the expanding device include Patent Documents 1 and 2 The device disclosed in is known.

JP 2006-49591 A JP 2002-151439 A

The expanding apparatus disclosed in Patent Documents 1 and 2 includes a frame holding member that supports a ring frame, a plurality of clamp mechanisms provided on the outer peripheral side of the frame holding member, and an adhesive that integrates the ring frame and the wafer. A drum that abuts against the sheet and applies a radial tensile force to the adhesive sheet, and is configured to hold the ring frame with the clamp mechanism and the frame holding member when the tensile force is applied. Has been.
However, in Patent Documents 1 and 2, since there is no structure for separating the wafer and the ring frame, for example, the chip is picked up for bonding after widening the chip interval, so that the chip is transferred from the expanding device to another device. In this case, the ring frame must also be transported, which disadvantageously increases the mounting space at the transport destination.

[Object of invention]
An object of the present invention is to provide an expanding apparatus capable of separating a wafer and a ring frame.

In order to achieve the above object, the present invention provides a plurality of chips that are bonded to and integrated with one surface of an adhesive sheet provided on the inner peripheral side of a ring frame, or a brittle layer is formed. In the expanding apparatus that can widen the chip interval by applying a plate-like member that can be singulated to the object to be processed and applying a tensile force in the radial direction to the adhesive sheet,
Support means for supporting the object to be treated;
Abutment means which is provided so as to be movable relative to the support means, and which abuts against the other surface of the adhesive sheet to apply the tensile force;
It is configured to include a cutting means capable of cutting the adhesive sheet.

  According to the present invention, since the cutting means capable of cutting the adhesive sheet is provided, the wafer is separated from the ring frame, and the ring frame is recovered for reuse, or the expanded and bonded chip group is separated from the ring frame. Or can be transported to another place in an expanded state.

The schematic front view of the expanding apparatus which concerns on embodiment. FIG. 2 is a schematic plan view of the expanding device. The schematic perspective view which shows the state before making a receiving object support a process target object. The schematic exploded plan view of the expanding apparatus which abbreviate | omitted some structures, such as a support means. The AA cross section B arrow line figure of FIG. Explanatory drawing of the expanding apparatus in the state which supported the process target object. Explanatory drawing which shows the state which pulled the adhesive sheet outside and expanded the chip | tip space | interval. Explanatory drawing which shows the state which cut | disconnects an adhesive sheet with a cutting | disconnection means.

  Hereinafter, embodiments of the expanding device of the present invention will be described with reference to the drawings.

  As shown in FIG. 3, the expanding apparatus 10 according to the present embodiment is bonded to and integrated with one surface (adhesion surface) of the adhesive sheet S provided on the inner peripheral side of the ring frame RF. The wafer W composed of the chips C is set as the processing object W1, and a tensile force that extends outward in the plane direction from the center of the adhesive sheet S, that is, a tensile force in the radial direction is applied and deformed so that the distance between the chips C can be expanded. It is configured.

  As shown in FIGS. 1 and 2, the expanding device 10 is disposed on the base 11 and the support means 12 that supports the processing object W <b> 1 above the base 11, and the other side of the adhesive sheet S. An abutting means 13 provided so as to be able to abut on a surface (an opposite surface of the adhesive surface), a driving means 14 for relatively moving the support means 12 and the abutting means 13 in the vertical direction in FIG. 1, and an adhesive sheet S And a severable cutting means 16.

The support means 12 is arranged above the base 11 via a feed screw shaft 43 constituting a part of the drive means 14, and the support means 12 is a receiving member 20 and a pressing member 21 that support the object to be processed W1. Including. The receiving member 20 is located between the pressing member 21 and the abutting means 13 and is configured by a plate-like body having a circular hole 23 at the center. The pressing member 21 is concentric with the hole 23 of the receiving member 20 in a state where the upper surface 20A of the receiving member 20 is in a closed position (a position indicated by a two-dot chain line in FIG. 1) in contact with the lower surface 21A of the pressing member 21. It is constituted by a plate-like body provided with holes 26. Further, the receiving member 20 and the pressing member 21 are connected to each other on the right side in FIG. 1 via a bearing mechanism 30, and the receiving member 20 is rotatably provided with the left end in FIG. 1 as a free end.
Thereby, when the receiving member 20 is kept in the closed position, the ring frame RF can be sandwiched together with the pressing member 21, while the upper surface 20 </ b> A of the receiving member 20 is spaced downward from the lower surface 21 </ b> A of the pressing member 21 ( When rotated to the position indicated by the solid line in FIG. 1, the ring frame RF is released and the processing object W1 can be taken in and out. A magnet 60 is embedded or attached to the upper surface on the free end side of the receiving member 20, and the upper surface 20 </ b> A of the receiving member 20 is attached to the lower surface 21 </ b> A of the pressing member 21 via the magnet 60.

  As shown in FIG. 3, the receiving member 20 is provided with positioning means 32 on the outer peripheral side of the hole 23. The positioning means 32 is formed at a receiving surface 32A that supports the ring frame RF, an upstanding surface 32B that is located on the outer peripheral side of the receiving surface 32A and abuts on the outer periphery of the ring frame RF, and two outer peripheral portions of the ring frame RF. The pin 32C is engageable with the V-shaped notch 61 formed.

  The contact means 13 includes a cylindrical tubular member 35 that is detachably provided on the base 11 via a connection means 64. The diameter of the cylindrical member 35 is smaller than the inner diameters of the holes 23 and 26 formed in the receiving member 20 and the holding member 21, respectively, and is larger than the diameter of the wafer W in the stage before expanding the chip C interval. Largely provided.

  As shown in FIG. 4, the connecting means 64 is provided at three locations at intervals of 120 ° in the circumferential direction on the lower end side of the cylindrical member 35, and a piece 70 that protrudes outward from the lower end, The upper surface of the base 11 is formed in a shape corresponding to each piece 70, and is provided with a recess 71 that can receive the piece 70, and as shown in FIG. And a lateral groove 72 formed so that the piece 70 can be sandwiched from above and below. The connection means 64 holds the cylindrical member 35 and receives the respective strips 70 in the respective recesses 71, and then rotates the cylindrical member 35 in the direction of arrow A1 in FIG. The relative movement of the cylindrical member 35 with respect to the base 11 is restricted by inserting the cylindrical body 70. A ball plunger 72A in which a ball-like member is urged by a spring (not shown) is embedded in each lateral groove 72, and each piece 70 is provided with a hole 70A that engages with each ball plunger 72A. It has been.

  In the extension base 11A located on the right end side of the base 11 in FIG. 2, the drive means 14 penetrates the base 11 in the vertical direction and the motor M arranged so that the output shaft 40 protrudes from the lower surface side thereof. , And four feed screw shafts 43 that are rotationally driven by the rotation of the output shaft 40 of the motor M via the power transmission means 41. The power transmission means 41 includes a pulley 45 fixed to the output shaft 40, a pulley 46 fixed to the lower end portion of each feed screw shaft 43, a belt 47 wound around these pulleys 45, 46, and the belt 47 And a plurality of guide rollers 48 for restricting the rotation position of the. The feed screw shaft 43 extends upward through the pressing member 21 in a state of being screw-engaged with the pressing member 21, and an upper end thereof is rotatably supported by the top plate 51 via a bearing 50. The lower end side of the feed screw shaft 43 is rotatably supported by the base 11 via a bearing 53, and the lower end protrudes downward from the lower surface of the base 11, and the pulley 46 is fixed to the protruding shaft portion. Yes. The top plate 51 is provided in a shape having a hole 52 concentric with the hole 26 provided in the pressing member 21 at the center, and is fixed to the base 11 by four guide rods 55. Each guide rod 55 penetrates the pressing member 21 via the bush, and ensures straightness when the pressing member 21 moves up and down.

  The cutting means 16 includes a rotary motor 74 that can be moved in the vertical direction in FIG. 1 by a drive means (not shown), a first linear motor 75 that is attached to the output shaft of the rotary motor 74 and is provided rotatably. A second linear motor 76 attached to the slider 75A of the linear motor 75 and movably provided in the left-right direction in FIG. 1 and an output shaft 76A of the second linear motor 46 are movable up and down in the figure. The cutter blade 79 is provided.

  Next, the operation of expanding the chip C interval by the expanding device 10 will be described with reference to FIGS.

  First, the receiving member 20 is set to the open position, and after the processing object W1 is transferred onto the receiving surface 32A of the receiving member 20, the receiving member 20 is set to the closed position. At this time, the processing object W1 is positioned at a predetermined position by the positioning means 32.

  Next, when each of the feed screw shafts 43 is rotated via the power transmission mechanism 41 by driving the motor M, the pressing member 21 is screw-engaged with each of the feed screw shafts 43. Descend along. Then, as shown in FIG. 7, when the ring frame RF moves downward from the upper end position of the cylindrical member 35, a radial tensile force acts on the adhesive sheet S. This tensile force acts to widen the distance between the chips C of the wafer W bonded to the adhesive sheet S, thereby forming a certain gap between the chips C.

  As shown in FIG. 8, the inner diameter of the chip C can be increased or decreased by rotating the knob, for example, from above the cylindrical member 35 with the mutual distance between the chips C expanded as described above. Cover the holding means H such as a clamp. Thereafter, the rotary motor 74 is lowered by a driving means (not shown) so that the cutter blade 79 penetrates the adhesive sheet S, and then the rotary motor 74 is operated to move the cutter blade 79 along a trajectory surrounding the wafer W, The adhesive sheet S after the force is applied is cut. By this cutting, the cylindrical member 35 including each chip C and the adhesive sheet S region to which these chips C are bonded is separated from the ring frame RF and removed from the expanding device 10. Then, the separated adhesive sheet S region and the chip C are transported to a pickup device (not shown) that extracts the chip C with a predetermined position as a reference position, and each chip C is extracted through the pickup device. Become.

  Therefore, according to such an embodiment, since the cutting means 16 capable of cutting the adhesive sheet S is provided, the ring frame RF is collected for reuse or expanded, and the chip C group in the middle of bonding is ringed. It can be separated from the frame RF and transported to another place in the expanded state.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the cutting means 13 can be variously modified as long as it can cut the adhesive sheet S to which a tensile force is applied. A cutter blade serving as a linear blade edge can be used, or the base 11 can be driven by appropriate driving means. The cutter blade 75 and the adhesive sheet S may be moved relative to each other around the wafer W by this movement to perform cutting.

  In the above embodiment, the wafer W composed of a plurality of chips C bonded and integrated on one surface of the adhesive sheet S provided on the inner peripheral side of the ring frame RF is used as the processing object W1. As a processing object, it is bonded and integrated with one surface of an adhesive sheet S provided on the inner peripheral side of the ring frame RF, and a brittle layer is formed by stealth dicing or the like. It is good also considering the wafer which can be made into a process target object.

  Further, the structure in which the support means 12 descends with respect to the cylindrical member 35 constituting the abutting means 13 has been illustrated and described. However, the cylindrical member 35 is provided so as to be movable up and down via appropriate driving means such as a motor. In addition to the configuration, both the supporting means 12 and the cylindrical member 35 can be provided so as to be movable up and down.

  Further, the support means 12 is not limited to driving the motor M, and can be configured to be manually movable up and down along the guide rod 55. In addition, the support means 12 is provided along the guide rod 55 by a weight. It is good also as a structure provided so that it could descend | fall.

  In addition, the cylindrical member 35 may be a solid member instead of a cylindrical member, and the cylindrical member 35 can be replaced with a member whose upper surface is closed. The number of screw shafts 43 may be more or less than four.

  Examples of the plate member include a silicon semiconductor wafer and a compound semiconductor wafer. However, the plate member is not limited to this, and may be a metal or ceramic.

DESCRIPTION OF SYMBOLS 10 Expand apparatus 12 Support means 13 Contact means 16 Cutting means C chip RF ring frame S Adhesive sheet W Semiconductor wafer (plate-shaped member)
W1 processing object

Claims (1)

A plurality of chips integrated by bonding to one surface of an adhesive sheet provided on the inner peripheral side of the ring frame or a plate-like member that is formed into a brittle layer and can be separated into a plurality of chips is processed. In an expanding apparatus that can widen the chip interval by applying a tensile force in the radial direction to the adhesive sheet as an object,
Support means for supporting the object to be treated;
Abutment means which is provided so as to be movable relative to the support means, and which abuts against the other surface of the adhesive sheet to apply the tensile force;
An expanding apparatus comprising: cutting means capable of cutting the adhesive sheet after the tensile force is applied.

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