JP2011210829A - Method of manufacturing laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component suppressing generation of irregular spots in a thickness direction of a ceramic green sheet and suppressing occurrence of sheet attack, while suppressing generation of a level difference caused by the thickness of a conductor layer.SOLUTION: A carrier film CF with the conductor layer CL formed is prepared. A first ceramic slurry CS1 is applied onto the prepared carrier film CF1 to cover the conductor layer CL. The applied first ceramic slurry CS1 is dried so that a solvent contained in the first ceramic slurry CS1 is remained. A second ceramic slurry CS2 is applied onto the first ceramic slurry CS1. The applied first and second ceramic slurries CS1, CS2 are dried to obtain the ceramic green sheet CG with the conductor layer CL disposed. The plurality of ceramic green sheets CG are laminated to obtain a ceramic green sheet laminate.

Description

  The present invention relates to a method for manufacturing a multilayer electronic component such as a multilayer capacitor.

  When manufacturing multilayer electronic components such as multilayer capacitors, a step occurs due to the thickness of the conductor layer formed on the upper surface of each ceramic green sheet. There was a fear of generating internal structural defects. For this reason, in the manufacturing method described in Patent Document 1, a support body on which a plurality of conductor layers are formed is prepared, and a first ceramic slurry is applied on the support body so as to cover the plurality of conductor layers. The second ceramic slurry is applied onto the dried first ceramic slurry, the first and second ceramic slurries are dried, and a ceramic green sheet having a plurality of conductor layers is obtained, thereby generating a step. Is suppressed.

  In the manufacturing method described in Patent Document 2, after preparing a support body on which a plurality of conductor layers are formed, applying a first ceramic slurry on the support body so as to cover the plurality of conductor layers, and drying the support body The unevenness caused by the conductor layer is filled with ceramic ink, the second ceramic slurry is applied on the dried first ceramic slurry, the second ceramic slurry is dried, and a plurality of conductor layers are arranged. The generation of a step is suppressed by obtaining a ceramic green sheet.

JP 2006-66627 A JP-A-2-36509

  As a result of the research conducted by the present inventors, it has been newly found that when the second ceramic slurry is applied on the first ceramic slurry in an undried state, irregular spots occur in the thickness of the ceramic green sheet. When irregular spots occur in the thickness of the ceramic green sheet, the strength of the thin portion is reduced, and the ceramic green sheet may not be properly peeled from the support. In addition, if the ceramic green sheet is thinly distributed, the thickness of the dielectric layer after firing becomes difficult to manage to a desired value, and the electrical characteristics may deteriorate. .

  When the ceramic ink or the second ceramic slurry is applied on the first ceramic slurry in the dry state, the first ceramic slurry in the dry state is applied by the solvent contained in the ceramic ink or the second ceramic slurry paste. There is a possibility that a so-called sheet attack occurs in which the resin contained in the resin melts.

  The present invention relates to a multilayer electronic component capable of suppressing generation of irregular spots in the thickness of a ceramic green sheet and suppressing occurrence of sheet attack while suppressing generation of a step due to the thickness of a conductor layer. It aims at providing the manufacturing method of.

  The method for manufacturing a laminated electronic component according to the present invention includes a step of preparing a support body on which a plurality of conductor layers are formed, and a step of applying a first ceramic slurry on the support body so as to cover the plurality of conductor layers. And drying the applied first ceramic slurry so that the solvent contained in the first ceramic slurry remains, and applying the second ceramic slurry on the first ceramic slurry; A step of drying the first and second ceramic slurries to obtain a ceramic green sheet on which a plurality of conductor layers are disposed, a step of obtaining a ceramic green sheet laminate by laminating a plurality of ceramic green sheets, and a ceramic green Cutting the sheet laminate to obtain a plurality of laminate chips, and firing the plurality of laminate chips to obtain a plurality of capacitor bodies; And extent, characterized in that it comprises.

  In the method for manufacturing a laminated electronic component according to the present invention, the first ceramic slurry applied on the support is fed into a region between the conductor layers of the support (hereinafter referred to as a conductor layer non-formation region), and the first The 2nd ceramic slurry provided on 1 ceramic slurry is sent into the field corresponding to the conductor layer non-formation field on the 1st ceramic slurry. Thereby, the difference between the thickness of the ceramic green sheet between the conductor layers and the thickness of the ceramic green sheet on the conductor layer is reduced, and the occurrence of a step due to the thickness of the conductor layer can be suppressed.

  In the present invention, the second ceramic slurry is applied on the first ceramic slurry dried so that the solvent remains. For this reason, when the second ceramic slurry is applied on the first ceramic slurry in the sheet attack or the undried state that has been generated when the second ceramic slurry is applied on the first ceramic slurry in the dry state. It is possible to suppress the occurrence of irregular spots of the thickness of the generated ceramic green sheet.

  Preferably, in the step of drying the first ceramic slurry so that the solvent contained in the first ceramic slurry remains, the first ceramic slurry is dried by blowing air. In this case, by actively drying the first ceramic slurry, the time required for drying can be shortened and the remaining state of the solvent can be accurately controlled.

  Preferably, air at room temperature is blown through the first ceramic slurry. In this case, the remaining state of the solvent can be controlled with higher accuracy while preventing the first ceramic slurry from being excessively dried.

  Preferably, the first and second ceramic slurries have substantially the same solvent content relative to the ceramic powder. In this case, when the second ceramic slurry is applied onto the first ceramic slurry, the mixing condition of the first and second ceramic slurries is improved, and the occurrence of irregular irregularities in the thickness of the ceramic green sheet is further increased. Further suppression can be achieved.

  Preferably, in the step of applying the first ceramic slurry, the first ceramic slurry is applied by gravure printing using a gravure roll, and the peripheral speed of the gravure roll is faster than the feed speed of the support. In this case, the amount of the first ceramic slurry fed into the conductor layer non-formation region of the support increases, and the occurrence of a step due to the thickness of the conductor layer can be further suppressed.

  Preferably, in the step of applying the second ceramic slurry, the second ceramic slurry is applied by gravure printing using a gravure roll, and the peripheral speed of the gravure roll is faster than the feed speed of the support. In this case, the amount of the second ceramic slurry fed to the area corresponding to the conductor layer non-formation area on the first ceramic slurry increases, and the generation of a step due to the thickness of the conductor layer is further suppressed. be able to.

  According to the present invention, it is possible to suppress the occurrence of irregularities in the thickness of the ceramic green sheet while suppressing the occurrence of a step due to the thickness of the conductor layer, and to suppress the occurrence of a sheet attack. An electronic component manufacturing method can be provided.

1 is a perspective view of a multilayer capacitor according to an embodiment. It is a figure showing the section composition of the multilayer capacitor concerning this embodiment. It is a flowchart which shows the manufacturing method of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of a multilayer capacitor. It is a schematic diagram which shows a gravure printing apparatus. It is a schematic diagram which shows an air blower. It is a schematic diagram for demonstrating the manufacturing process of a multilayer capacitor. It is a figure which shows the cross-sectional structure of a laminated body chip | tip.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  A multilayer capacitor 1 which is an example of a multilayer electronic component manufactured using the method for manufacturing a multilayer electronic component according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the multilayer capacitor in accordance with the present embodiment. FIG. 2 is a diagram illustrating a cross-sectional configuration of the multilayer capacitor in accordance with the present embodiment. As shown in FIG. 1, the multilayer capacitor 1 includes a substantially rectangular parallelepiped element body 3 and a pair of first terminal electrodes 5 and second terminal electrodes 7 formed on the element body 3.

  The element body 3 includes a pair of end faces opposed to the longitudinal direction of the element body 3, a pair of side faces opposed to the stacking direction of the element body 3, and a pair of side faces opposed to the longitudinal direction and the direction perpendicular to the stacking direction. Have. The first terminal electrode 5 is formed so as to cover the entire surface of one end surface, and further, a part of the first terminal electrode 5 wraps around each side surface. The second terminal electrode 7 is formed so as to cover the entire surface of the other end surface, and further, a part of which wraps around each side surface. One side surface of the pair of side surfaces facing the stacking direction of the element body 3 is a surface facing the external substrate when the multilayer capacitor 1 is mounted on the external substrate.

  As shown in FIG. 2, the element body 3 includes a first internal electrode 11, a second internal electrode 13, and a dielectric layer 15. In the present embodiment, the element body 3 includes two first internal electrodes 11 and second internal electrodes 13. The first internal electrode 11 having a rectangular shape is directly connected to the first terminal electrode 5 with one side exposed to the end face of the element body 3 on which the first terminal electrode 5 is formed. Thereby, the 1st internal electrode 11 and the 1st terminal electrode 5 will be electrically connected. The second internal electrode 13 having a rectangular shape is directly connected to the second terminal electrode 7 with one side exposed to the end face of the element body 3 on which the second terminal electrode 7 is formed. Thereby, the 2nd internal electrode 13 and the 2nd terminal electrode 7 will be electrically connected. The first internal electrodes 11 and the second internal electrodes 13 are alternately stacked via the dielectric layers 15.

  Subsequently, a method for manufacturing the multilayer capacitor 1 according to the present embodiment will be described. FIG. 3 is a flowchart showing the method for manufacturing the multilayer capacitor in accordance with this embodiment. The manufacturing process of the multilayer capacitor 1 includes a conductor layer forming step S1, a first ceramic slurry applying step S2, a first drying step S3, a second ceramic slurry applying step S4, and a second drying step S5. The laminate forming step S6, the chip forming step S7, the firing step S8, and the terminal forming step S9 are included.

  Each step will be described with reference to FIGS. 4 and 7 are schematic views for explaining the manufacturing process of the multilayer capacitor. FIG. 5 is a schematic diagram showing a gravure printing apparatus used in the method for manufacturing a multilayer capacitor. FIG. 6 is a schematic diagram showing a blower used in a method for manufacturing a multilayer capacitor. FIG. 8 is a diagram illustrating a cross-sectional configuration of the multilayer chip.

  In the conductor layer forming step S1, as shown in FIG. 4A, a plurality of conductor layers CL are formed on the carrier film (support) CF. Thereby, carrier film CF in which a plurality of conductor layers CL are formed is prepared. The conductor layer CL is formed by applying an electrode paste and then drying it. The electrode paste is obtained by adding and mixing a resin and a solvent to the conductive material powder constituting the first and second internal electrodes 11 and 13 in the multilayer capacitor 1. Examples of the conductive material include metal powders such as Ni, Ag, and Pd. As a method for applying the electrode paste, for example, there is a screen printing method.

  In the subsequent first ceramic slurry application step S2, as shown in FIG. 4B, the first ceramic slurry CS1 is applied on the carrier film CF so as to cover the plurality of conductor layers CL. Here, the first ceramic slurry CS1 is applied in a sheet form by a gravure printing apparatus GP as shown in FIG. As a result, a layer made of the first ceramic slurry CS1 is formed on the carrier film CF. The first ceramic slurry CS1 applied on the carrier film CF is sent to a region between the conductor layers CL (referred to as a conductor layer non-formation region) in the carrier film CF.

  The gravure printing apparatus GP has a slurry tank ST that is open at the top and contains ceramic slurry, a gravure roll GR that is arranged so that a part of the slurry tank ST enters the slurry tank ST, and a gravure roll GR. Blade BL for removing the ceramic slurry adhering to the surface. In the gravure printing apparatus GP, the gravure roll GR is sent in a predetermined direction (in the drawing, by a driving mechanism (not shown) while the carrier film CF is fed in a predetermined direction (in the direction of arrow B in the drawing) by a transport mechanism (not shown). The ceramic slurry is applied to the carrier film CF by being driven to rotate in the direction of arrow A).

  In the present embodiment, the peripheral speed of the gravure roll GR is set faster than the feed speed of the carrier film CF. For example, the peripheral speed of the gravure roll GR is set to about 1.5 to 3.0 times the feed speed of the carrier film CF.

  The first ceramic slurry CS1 is obtained by adding a resin and a solvent to the ceramic material powder constituting the dielectric layer 15 in the multilayer capacitor 1 and dispersing the mixture. The first ceramic slurry CS1 may contain a plasticizer or the like as necessary. In 1st ceramic slurry CS1, content of the solvent with respect to ceramic powder is set to 40-70 wt%.

  In the subsequent first drying step S3, the applied first ceramic slurry CS1 is dried so that the solvent contained in the first ceramic slurry CS1 remains. Here, as shown in FIG. 6, the carrier film CF to which the first ceramic slurry CS1 is applied is transported by a transport mechanism (not shown) using a blower unit BU provided with a nozzle NZ that ejects air AR. The first ceramic slurry CS1 is dried by blowing air while feeding in the direction (in the direction of arrow B in the figure). The amount (air volume) of the air AR ejected from the nozzle NZ is set to 80 to 120 l / min, for example. The temperature of the air AR ejected from the nozzle NZ is set to room temperature, for example. The drying time is set to 1 to 5 seconds, for example.

  The solvent present in the vicinity of the surface of the layer made of the first ceramic slurry CS1 is easily removed, but the solvent present in the layer made of the first ceramic slurry CS1 is difficult to remove. Accordingly, in the first drying step S3, in the layer made of the first ceramic slurry CS1, the amount of the solvent remaining in the vicinity of the surface is reduced, and a difference occurs in the remaining state of the solvent.

  In the subsequent second ceramic slurry application step S4, as shown in FIG. 4 (c), the second ceramic slurry CS2 is applied onto the first ceramic slurry CS1. Here, the 2nd ceramic slurry CS2 is apply | coated to the sheet form with the gravure printing apparatus GP as shown in FIG. As a result, a layer made of the second ceramic slurry CS2 is formed on the layer made of the first ceramic slurry CS1. The second ceramic slurry CS2 applied on the first ceramic slurry CS1 is fed into a region corresponding to the conductor layer non-forming region in the layer made of the first ceramic slurry CS1.

  By the way, since the first and second ceramic slurries CS1 and CS2 contain a solvent, they are mixed with each other and integrated so that the boundary between the first ceramic slurry CS1 and the second ceramic slurry CS2 cannot be recognized. To do. In FIG.4 (c), the boundary of 1st ceramic slurry CS1 and 2nd ceramic slurry CS2 is shown with the dashed-dotted line for description.

  In the present embodiment, even when the second ceramic slurry CS2 is applied, the peripheral speed of the gravure roll GR is set faster than the feed speed of the carrier film CF. For example, the peripheral speed of the gravure roll GR is set to about 1.5 to 3.0 times the feed speed of the carrier film CF.

  Similar to the first ceramic slurry CS1, the second ceramic slurry CS2 is obtained by adding and mixing a resin and a solvent to the ceramic material powder constituting the dielectric layer 15 in the multilayer capacitor 1. The second ceramic slurry CS2 may also contain a plasticizer or the like as necessary. In the second ceramic slurry CS2, the content of the solvent with respect to the ceramic powder is set to 40 to 70 wt%, and is set to be substantially the same as the content in the first ceramic slurry CS1.

The ceramic material used for the first and second ceramic slurries CS1 and CS2 can be applied without particular limitation as long as it is a dielectric material used for a ceramic capacitor. For example, known high dielectric constant ceramic materials such as barium titanate (BaTiO ₃ ) -based materials, lead composite perovskite compound-based materials, and strontium titanate-based (SrTiO ₃ ) -based materials can be applied. Examples of the resin used for the first and second ceramic slurries CS1 and CS2 include butyral resins, acrylic resins, and mixed resins thereof, but a butyral resin or an acrylic resin is preferable. As a solvent used for the first and second ceramic slurries CS1 and CS2, an alcohol solvent, a ketone solvent (for example, methyl ethyl ketone), an aromatic hydrocarbon solvent (for example, toluene, xylene), or the like can be applied. The resin and solvent used may be different between the first and second ceramic slurries CS1 and CS2.

  In the subsequent second drying step S5, the first and second ceramic slurries CS1 and CS2 are dried. Thereby, a ceramic green sheet CG in which a plurality of conductor layers CL are arranged is obtained. Here, under predetermined heating conditions, the first and second ceramic slurries CS1 and CS2 are dried, and substantially all of the solvent contained in the first and second ceramic slurries CS1 and CS2 is removed. A drying temperature is set to 40-100 degreeC, for example.

In the subsequent laminated body forming step S6, first, a plurality of ceramic green sheets CG _{0 on} which the plurality of ceramic green sheets CG and the conductor layer CL are not arranged are prepared. Then, as shown in FIG. 7, for laminating a plurality of ceramic green sheets CG which is prepared, the CG ₀ in a predetermined order. At this time, the plurality of ceramic green sheets CG are stacked such that the conductor layers CL adjacent in the stacking direction of the ceramic green sheets CG are shifted in a predetermined direction orthogonal to the stacking direction. Thereby, the ceramic green sheet laminated body GL will be obtained. Then, the ceramic green sheet laminate GL pressure treatment (e.g., isostatic pressing, etc.), and crimping the ceramic green sheets CG, the CG _0.

In subsequent chip forming step S7, the ceramic green sheet laminate GL is cut into laminate chips of a predetermined size by a cutting device. At this time, as shown in FIG. 8, the ceramic green sheet laminate GL is cut so that the conductor layer CL is exposed as a cross section on the end face of the laminate chip LC. In laminate chip LC shown in FIG. 8, the ceramic green sheets CG, it is not illustrated boundaries of CG _0.

In the subsequent firing step S8, the multilayer chip LC is fired. Specifically, after removing the resin contained in the multilayer chip LC (debinding), the multilayer chip LC is baked. By this firing, the element body 3 in which the dielectric layer 15 is formed from the ceramic green sheet CG or the like and the first and second internal electrodes 11 and 13 are formed from the conductor layer CL is obtained. The binder removal can be performed by heating the multilayer chip LC for a predetermined time at a temperature of 200 to 600 ° C. in a reducing atmosphere such as air or a mixed gas of N ₂ and H _2. . Firing can be performed by heating the laminated chip LC after the binder removal at a temperature of 1100 to 1300 ° C. for a predetermined time in a reducing atmosphere, for example.

  In the subsequent terminal formation step S9, first and second terminal electrodes 5 and 7 are formed in a predetermined region on the surface of the element body 3. Here, the conductive paste is applied to the predetermined region on the surface of the element body 3, that is, the entire end surfaces and the portions near the end surfaces of the side surfaces. The application of the conductive paste can be performed by a dipping method, a printing method, a transfer method, or the like. In the conductive paste, as described above, a conductive metal powder (for example, a metal powder mainly composed of Cu powder) is mixed with glass powder (for example, glass frit) and an organic vehicle as described above. Use things. Then, a desired heat treatment is performed on the element body 3 to which the conductive paste is applied, and the conductive paste is baked on the element body 3. As a result, the first and second terminal electrodes 5 and 7 are formed on the element body 3. The baking of the conductive paste is performed by heating at a temperature of 600 to 800 ° C. for a predetermined time, for example. The first and second terminal electrodes 5 and 7 may have plating layers formed on the surfaces thereof.

  The multilayer capacitor 1 is obtained through the above-described steps.

  As described above, in the present embodiment, the first ceramic slurry CS1 applied onto the carrier film CF is fed into the conductor layer non-formation region of the carrier film CF, and is applied onto the first ceramic slurry CS1. The second ceramic slurry CS2 is fed into an area corresponding to the conductor layer non-formation area on the first ceramic slurry CS1. Thereby, the difference between the thickness of the ceramic green sheet CG between the conductor layers CL and the thickness of the ceramic green sheet CG on the conductor layer CL is reduced, and the occurrence of a step due to the thickness of the conductor layer CL is suppressed. be able to.

  In the present embodiment, the second ceramic slurry CS2 is applied onto the first ceramic slurry CS1 dried so that the solvent remains. For this reason, the second ceramic slurry CS2 is formed on the first ceramic slurry CS1 or the sheet attack generated when the second ceramic slurry CS2 is applied on the first ceramic slurry CS1 in the dry state. The generation of irregular spots on the surface of the ceramic green sheet that has occurred during the application can be suppressed.

  In the present embodiment, the first ceramic slurry CS1 is dried by blowing air in the first drying step S3. Thus, by actively drying the first ceramic slurry CS1, it is possible to reduce the time required for drying and to accurately control the remaining state of the solvent.

  In the first drying step S3, air at room temperature is blown to the first ceramic slurry CS1. Thereby, the remaining state of the solvent can be controlled with higher accuracy while preventing the first ceramic slurry CS1 from being overdried.

  In the present embodiment, the first and second ceramic slurries CS1 and CS2 are set to have substantially the same solvent content with respect to the ceramic powder. Accordingly, when the second ceramic slurry CS2 is applied on the first ceramic slurry CS1, the mixing condition of the first and second ceramic slurries CS1 and CS2 becomes good, and the thickness of the ceramic green sheet CG is irregular. Generation of irregular spots can be further suppressed.

  In the present embodiment, in the first ceramic slurry application step S2, the first ceramic slurry CS1 is applied by the gravure printing device GP, and the peripheral speed of the gravure roll GR is higher than the feed speed of the carrier film CF. It is set fast. As a result, the amount of the first ceramic slurry CS1 fed into the conductor layer non-formation region of the carrier film CF is increased, and generation of a step due to the thickness of the conductor layer CL can be further suppressed.

  In the present embodiment, the second ceramic slurry CS2 is applied by the gravure printing apparatus GP in the second ceramic slurry applying step S4, and the peripheral speed of the gravure roll GR is higher than the feed speed of the carrier film CF. Is set faster. As a result, the amount of the second ceramic slurry CS2 fed into the region corresponding to the conductor layer non-formation region on the first ceramic slurry CS1 increases, and the occurrence of a step due to the thickness of the conductor layer CL is further increased. Further suppression can be achieved.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  In 1st drying process S3, although 1st ceramic slurry CS1 is dried by ventilation, the method of drying 1st ceramic slurry CS1 is not restricted to ventilation. For example, the first ceramic slurry CS1 may be naturally dried by managing the time from applying the first ceramic slurry CS1 to applying the second ceramic slurry CS2. Even when the first ceramic slurry CS1 is naturally dried, the first ceramic slurry CS1 is dried so that the solvent remains.

  The present invention is not limited to multilayer capacitors, and can also be applied to multilayer electronic components such as multilayer varistors, multilayer piezoelectric actuators, multilayer composite components of capacitors and inductors, or multilayer composite components of capacitors and beads.

  DESCRIPTION OF SYMBOLS 1 ... Multilayer capacitor, 3 ... Element body, 11 ... 1st internal electrode, 13 ... 2nd internal electrode, 15 ... Dielectric layer, AR ... Air, BU ... Air blower, CF ... Carrier film, CG ... Ceramic green sheet, CL: conductor layer, CS1: first ceramic slurry, CS2: second ceramic slurry, GL: ceramic green sheet laminate, GP: gravure printing device, GR: gravure roll, LC: laminate chip, S1: conductor layer Forming step, S2 ... first ceramic slurry applying step, S3 ... first drying step, S4 ... second ceramic slurry applying step, S5 ... second drying step, S6 ... laminated body forming step, S7 ... chip formation Step, S8: Firing step, S9: Terminal forming step.

Claims (6)

Preparing a support on which a plurality of conductor layers are formed;
Applying a first ceramic slurry on the support so as to cover the plurality of conductor layers;
Drying the applied first ceramic slurry so that the solvent contained in the first ceramic slurry remains;
Applying a second ceramic slurry on the first ceramic slurry;
Drying the first and second ceramic slurries to obtain a ceramic green sheet in which the plurality of conductor layers are disposed;
Laminating a plurality of the ceramic green sheets to obtain a ceramic green sheet laminate;
Cutting the ceramic green sheet laminate to obtain a plurality of laminate chips;
Firing the plurality of multilayer chips to obtain a plurality of capacitor bodies, and a method for producing a multilayer electronic component.   The first ceramic slurry is dried by blowing air in the step of drying the first ceramic slurry so that the solvent contained in the first ceramic slurry remains. The manufacturing method of the laminated electronic component of description.   The method for manufacturing a multilayer electronic component according to claim 2, wherein air at room temperature is blown to the first ceramic slurry.   The method for manufacturing a multilayer electronic component according to any one of claims 1 to 3, wherein the first and second ceramic slurries have substantially the same solvent content relative to the ceramic powder.   In the step of applying the first ceramic slurry, the first ceramic slurry is applied by gravure printing using a gravure roll, and the peripheral speed of the gravure roll is faster than the feed speed of the support. The manufacturing method of the multilayer electronic component as described in any one of Claims 1-4 characterized by the above-mentioned.   In the step of applying the second ceramic slurry, the second ceramic slurry is applied by gravure printing using a gravure roll, and the peripheral speed of the gravure roll is faster than the feed speed of the support. The manufacturing method of the multilayer electronic component as described in any one of Claims 1-5 characterized by the above-mentioned.

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