JP2011216539A - Method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can reduce unevenness of the thickness of an external electrode.SOLUTION: The method of manufacturing an electronic component includes a step of preparing an element body 18, a step of preparing a resin sheet 30, a step of coating the element body with conductive paste 34, a step of sticking the resin sheet to the conductive paste, a step of deforming a part of the resin sheet stuck to the conductive paste along the element body, and a step of removing the resin sheet.

Description

  The present invention relates to a method for manufacturing an electronic component having an external electrode.

  Electronic components such as chip capacitors, chip inductors, and chip varistors used for surface mounting generally have an external electrode formed at the end thereof. As a method for forming an external electrode in an electronic component, a method is known in which a paste containing a conductive material is applied to an end portion of an element body, and then the applied paste is dried and baked.

  However, the conventional method for forming an external electrode has a problem that it is difficult to apply the paste so that the paste uniformly covers the element body when the paste is applied to the element body. Therefore, the conventional method for manufacturing an electronic component has a problem that it is difficult to achieve both miniaturization and high capacity of the electronic component, and it is difficult to ensure reliability such as insulation resistance.

  As a method for solving such a problem, for example, the process of applying the paste is divided into two, and after the first application, the process of removing a part of the paste and the process of drying the other part Has been proposed (see Patent Document 1, etc.). However, the method of dividing the process of applying the paste into two times has a problem in productivity because the manufacturing method becomes complicated as the number of processes increases.

JP 2006-351727 A

  The present invention has been made in view of such a situation, and an object thereof is to provide an electronic component manufacturing method capable of reducing non-uniformity of the thickness of the external electrode.

In order to achieve the above object, a method for manufacturing an electronic component according to the present invention includes:
A body preparation process for preparing the element body;
A sheet preparation step of preparing a resin sheet;
An application step of applying a conductive paste to the element body;
An attaching step of attaching the resin sheet to the conductive paste;
A deformation process in which a part of the resin sheet attached to the conductive paste is deformed along the element body,
A drying step for drying the conductive paste;
A removing step of removing the resin sheet;
Have

  In the method for manufacturing an electronic component according to the present invention, since the conductive paste applied to the element body is held between the resin sheet and the element body, the element body is compared with the case where one is a free surface. An outer shape is formed along the surface shape. Further, the method for manufacturing an electronic component according to the present invention includes a deformation process in which the solvent contained in the conductive paste penetrates into the resin sheet, and a part of the resin sheet attached to the conductive paste is deformed along the element body. Including. Thus, when the resin sheet is appropriately deformed, the conductive paste can form an outer shape that more closely matches the surface shape of the element body. Therefore, the method for manufacturing an electronic component according to the present invention can reduce the unevenness of the thickness of the external electrode.

  In addition, the method for manufacturing an electronic component according to the present invention can reduce the non-uniformity of the thickness of the external electrode by simply attaching the resin sheet to the conductive paste and removing the resin sheet after the deformation process. Is excellent.

Further, for example, in the method for manufacturing an electronic component according to the present invention, the thickness of the resin sheet may be 5 to 20 μm,
The ratio of the sheet width that is the width of the resin sheet and the element body width that is the width of the element body corresponding to the sheet width may be 0.5 to 1.5.

  By setting the outer shape of the resin sheet in the above range, the external electrode can be formed with a more uniform thickness.

In addition, for example, the method for manufacturing an electronic component according to the present invention may further include a binder removal process for removing the binder from the conductive paste, and a baking process for baking the conductive paste.
The removing step may be performed simultaneously with at least one of the binder removal step and the baking step.

  By performing the removal step simultaneously with at least one of the binder removal step and the baking step, it is possible to reduce the labor and time required to remove the resin sheet. Can be produced.

FIG. 1 is a schematic cross-sectional view of a chip capacitor manufactured by a manufacturing method according to an embodiment of the present invention. FIG. 2 is a conceptual diagram illustrating a manufacturing method according to an embodiment of the present invention. FIG. 3 is a conceptual diagram illustrating the penetration into the resin sheet that occurs in the steps included in the manufacturing method shown in FIG. FIG. 4 is an enlarged cross-sectional view illustrating deformation of the resin sheet that occurs in the steps included in the manufacturing method shown in FIG. FIG. 5 is a flowchart illustrating a manufacturing method according to an embodiment of the present invention. FIG. 6 is a conceptual diagram illustrating dimensions measured in the embodiment of the present invention.

  FIG. 1 is a schematic cross-sectional view of a capacitor 10 manufactured by a manufacturing method according to an embodiment of the present invention. As shown in FIG. 1, a capacitor 10 as an example of an electronic component manufactured by the manufacturing method according to the embodiment includes an element body 18 and an external electrode 14. The external electrode 14 is formed at both ends of the element body 18.

  The element body 18 has a laminated structure in which the dielectric layers 12 and the internal electrode layers 13 are alternately laminated. In the element body 18, protective dielectric layers 16 are disposed at both ends in the stacking direction. The internal electrode layer 13 is connected to one of the two external electrodes 14 formed at both ends of the element body 18. The internal electrode layers 13 are alternately connected along the stacking direction to one of the one external electrode 14 and the other external electrode 14.

  The dielectric layer 12 and the protective dielectric layer 16 in the element body 18 are made of a dielectric ceramic material such as barium titanate, but are not particularly limited. The internal electrode layer 13 is made of a conductive material such as Ni or Ni alloy, but is not particularly limited.

  The outer shape of the element body 18 is a substantially rectangular parallelepiped shape. As shown in FIG. 1, the substantially rectangular parallelepiped shape includes a shape in which rounds are formed at the ridge line portion and the corner portion of the rectangular parallelepiped. The outer shape of the element body 18 is not limited to a substantially rectangular parallelepiped, and may be, for example, a cylindrical shape or a polygonal column shape.

  There is no restriction | limiting in particular in the dimension of the element main body 18, According to a use, it can set suitably, Usually, length (0.2-5.6 mm) x width (0.1-5.0 mm) x height ( 0.1 to 1.9 mm).

  In the element body 18, a pair of external electrodes 14 is formed at both ends in a direction orthogonal to the stacking direction. The external electrode 14 is formed so as to cover the entire body end face 18 a of the element body 18 and a part of the body side surface 18 b which is the side surface of the element body 18. That is, in the capacitor 10, the external electrode 14 is formed in a cap shape at both ends of the element body 18.

  As shown in the partially enlarged view in FIG. 1, the external electrode 14 has a base layer 20 that is a paste baking film and an upper layer 22 that is a plating layer. The underlayer 20 is formed between the element body 18 and the upper layer 22. The underlayer 20 is mainly composed of Cu, Ag, Pd, Zn, Al, Ni, Au, Pt, Fe, Sn alone and an alloy containing these, but is not particularly limited.

  The upper layer 22 is formed on the base layer 20. The upper layer 22 is made of Sn, Ni or the like and an alloy containing these, but is not particularly limited. For example, the upper layer 22 has a two-layer structure of a lower layer made of Ni or Ni alloy film and an upper layer made of Sn or Sn alloy film.

  Next, a method for manufacturing the capacitor 10 shown in FIG. 1 will be described. FIG. 2 is a conceptual diagram illustrating a method for manufacturing the capacitor 10, and FIG. 5 is a flowchart illustrating a method for manufacturing the capacitor 10. In step S001 to step S003 shown in FIG. 5, an individual resin sheet 30 (see FIG. 2E) to be attached to the conductive paste 34 is prepared.

  In step S001, a resin sheet paste, which is a raw material of the individual resin sheet 30, is spread on a support such as a PET film using a coater or the like to form a sheet. The resin sheet paste is prepared, for example, by stirring a compound containing 1 to 99 parts by weight of a resin, 1 to 99 parts by weight of a solvent, and 0 to 10 parts by weight of a dispersant until the resin is dissolved in the solvent. Is done. The resin sheet paste can be obtained by stirring the compound under heating conditions using a roll mill or the like, but the method for producing the resin sheet paste is not particularly limited.

  As the resin used for the resin sheet paste, various resins such as cellulose resin, methacrylic resin, butyral resin, epoxy resin, phenol resin, and rosin resin can be used alone or in appropriate combination. The solvent used in the resin sheet paste is not particularly limited, but hydrocarbon-based, alcohol-based, ether-based, ester-based, ketone-based or glycol-based solvents such as toluene, benzene, terpineol, terpineol acetate, dihydroterpineol, Examples include dihydroterpineol acetate, octanol, decanol, isopropanol, carbitol, butyl carbitol, butyl carbitol acetate, ethyl acetate, acetone, cellosolve, butyl cellosolve, cellosolve acetate, ethylene glycol diacetate, and propylene glycol diacetate. The dispersant may be appropriately selected according to the resin and the solvent. For example, a carboxylate compound, a sulfonate compound, or the like can be used as the dispersant.

  In step S002, the formed sheet is dried to obtain a large resin sheet 28 as shown in FIG. Further, in step S003, the large resin sheet 28 is cut to obtain the individual resin sheet 30. The thickness of the individual resin sheet 30 is adjusted according to the outer shape of the capacitor 10 and the like, but is preferably 5 to 20 μm. By setting the thickness of the individual resin sheet 30 to 5 μm or more, the individual resin sheet 30 is hardly broken, and the handling property of the individual resin sheet 30 can be kept good. Further, by setting the thickness of the individual resin sheet 30 to 5 μm or more, the individual resin sheet 30 has a hardness sufficient to maintain a substantially planar shape. 2 (e)), the conductive paste 34 can be attached to the surface of the element body 18 with a more uniform thickness.

  Further, by setting the thickness of the individual resin sheet 30 to 20 μm or less, the solvent 36 in the conductive paste 34 can permeate the entire individual resin sheet 30 in a short time. Therefore, by setting the thickness of the individual resin sheet 30 to 20 μm or less, in step S007, the deformation of the individual resin sheet 30 occurs surely in a short time, and the conductive paste 34 is applied to the surface of the element body 18. It can be made to adhere with a more uniform thickness.

  Moreover, it is preferable that ratio of the sheet | seat width which is the width | variety of the piece resin sheet 30 and the element main body width which is the width | variety of the element main body 18 corresponding to this is 0.5-1.5. If the sheet width of the individual resin sheet 30 is less than 0.5 times the element body width of the element body 18 corresponding thereto, the conductive paste 34 is placed on the outer periphery of the individual resin sheet 30 in step S007. There is a case where a phenomenon of climbing occurs, and the thickness uniformity of the conductive paste 34 may be deteriorated. Further, when the sheet width of the individual resin sheet 30 is larger than 1.5 times the element body width of the element body 18 corresponding thereto, the solvent 36 in the conductive paste 34 is reduced to the entire individual resin sheet 30. It becomes difficult to penetrate in time. As a result, the outer peripheral portion of the individual resin sheet 30 cannot obtain the flexibility necessary for deformation, and the thickness uniformity of the conductive paste 34 may deteriorate.

  The planar shape of the individual resin sheet 30 is preferably substantially similar to the cross-sectional shape of the element body 18 parallel to the individual resin sheet 30. In the present embodiment, both the planar shape of the individual resin sheet 30 and the cross-sectional shape of the element body 18 are substantially rectangular (substantially square).

  In step S004 of FIG. 5, the element body 18 is prepared as shown in FIG. The element body 18 is a laminate obtained by laminating three kinds of material layers to be the protective dielectric layer 16, the internal electrode layer 13 and the dielectric layer 12 as shown in FIG. It is obtained by firing. The material layer that becomes the dielectric layer 12 and the protective dielectric layer 16 after firing is provided in the form of a green sheet containing dielectric particles. The material layer that becomes the internal electrode layer 13 after firing is provided in the form of an electrode paste film formed by printing or the like on the green sheet.

  The laminated body is produced, for example, by laminating a large number of green sheets each having an electrode paste film formed between green sheets that become the protective dielectric layer 16 after firing. The laminated body includes a step of cutting the laminated body into a predetermined chip shape, a step of performing a binder removal process on the laminated body, a step of firing the laminated body subjected to the binder removal treatment, a step of heat treating the fired laminated body, etc. After that, the element body 18 shown in FIG.

  In step S005 shown in FIG. 5, the conductive paste 34 is applied to the end of the element body 18 as shown in FIG. The conductive paste 34 is a raw material of the base layer 20 shown in FIG. 1 and becomes the base layer 20 after baking. The conductive paste 34 is applied so as to cover the entire body end surface 18a of the element body 18 and a part of the body side surface 18b adjacent to the body end surface 18a. Application of the conductive paste 34 to the element body 18 can be performed using a dipping method, a printing method, or the like, but is not particularly limited.

  The conductive paste 34 contains 50 to 95 parts by weight of conductive powder, 0 to 20 parts by weight of glass frit, 1 to 20 parts by weight of binder, 0 to 10 parts by weight of dispersant, and 0 to 40 parts by weight of solvent 36. It is obtained by mixing the blend using a roll mill or the like.

  In step S006 shown in FIG. 5, as shown in FIG. 2E, the individual resin sheet 30 is attached to the conductive paste 34 applied to the element body 18.

  The individual resin sheet 30 is attached to the conductive paste 34. The individual resin sheet 30 is attached by, for example, transporting and installing the individual resin sheet 30 on the surface of the conductive paste 34 using an adsorption nozzle capable of controlling air suction and suction stop. The method of attaching the individual resin sheet 30 is not particularly limited.

  As shown in FIG. 2E, when the individual resin sheet 30 is attached to the conductive paste 34, the conductive paste 34 is held between the element body 18 and the individual resin sheet 30. Changes so as to cover the element body 19 more uniformly than before attachment. Also, the individual resin sheet 30 pushes the conductive paste 34 at the central portion of the main body end surface 18 a to the main body ridge line portion 18 c of the element main body 18, and changes the shape of the conductive paste 34 to be uniform.

  In step S007, the resin sheet deformation | transformation process in which the piece resin sheet 30 deform | transforms into the state shown in FIG.2 (f) from the state shown in FIG.2 (e) is implemented. FIG. 3 is an enlarged view of the area surrounded by the dotted line III in FIG. 2E, and is a conceptual diagram showing the initial state of step S007. As shown in FIG. 3, immediately after the individual resin sheet 30 is attached to the conductive paste 34, the individual resin sheet 30 is less bent and can maintain a shape close to a flat surface in the initial stage of step S007. it can. Therefore, the sheet outer peripheral portion 30 c that is the outer peripheral portion of the individual resin sheet 30 is positioned at substantially the same height as the sheet central portion 30 a that is the central portion of the individual resin sheet 30.

  In the state shown in FIG. 3, the paste ridge line portion 34 c that is the ridge line portion of the conductive paste 34 is supported by the individual resin sheet 30 in a state of being separated from the element body 18. In the initial stage of step S 007, as shown in FIG. 3, the solvent 36 permeates into the individual resin sheet 30 as the conductive paste 34 is dried.

  Immediately after the individual resin sheet 30 is attached to the conductive paste 34, in the initial stage of Step S007, the penetration of the solvent 36 into the individual resin sheet 30 proceeds, so that the flexibility of the individual resin sheet 30 is increased. Increase. Then, in the latter stage of step S007, as shown in FIG. 2F, a part of the individual resin sheet 30 is deformed along the element body 18.

  FIG. 4 is an enlarged cross-sectional view showing a state in the latter stage of step S007, in which the region surrounded by the dotted line IV in FIG. When the flexibility increases due to the permeation of the solvent 36, the sheet outer peripheral portion 30c of the individual resin sheet 30 becomes unable to support the paste ridge line portion 34c and deforms. That is, when the flexibility of the resin sheet 30 is increased by the penetration of the solvent 36, the paste ridge line portion 34c can be deformed to be rounded along the element body 18, and accordingly, the sheet outer peripheral portion 30c. As shown in FIG. 4, it is deformed along the element main body 18 (so that the sheet outer peripheral portion 30c approaches the main body ridge line portion 18c or the main body side surface 18b).

  In this way, a part of the individual resin sheet 30 is deformed, a part that contacts the body end surface 18a of the element body 18, a paste ridge line part 34c that contacts the body ridge line part 18c of the element body 18, and the element body 18 The thickness of each part of the electrically conductive paste 34 comprised by the part which contacts the main body side surface 18b becomes more uniform. Moreover, a round shape is formed in the corner of the conductive paste 34 and the paste ridge line part 34c by the process in which a part of the individual resin sheet 30 is deformed.

  In step S008, the drying process which dries the electrically conductive paste 34 with respect to the element main body 18 provided with the electrically conductive paste 34 with which the piece resin sheet 30 was affixed is implemented. In addition, the deformation | transformation process (step S007) in which the piece resin sheet 30 deform | transforms and the drying process (step S008) to dry the electrically conductive paste 34 may be performed simultaneously.

  In step S009 shown in FIG. 5, a binder removal process for removing the conductive paste 34 is performed. Moreover, in step S009, depending on the material of the individual resin sheet 30, the removal process of removing the individual resin sheet 30 is performed simultaneously with the binder removal process.

  Specifically, in step S009, the element main body 18 (FIG. 2 (f)) including the deformed individual resin sheet 30 and the conductive paste 34 is heated, and the binder removal process of the conductive paste 34 is performed. The heating temperature in the debinding process performed in step S009 is preferably in the range of 300 to 600 ° C. By setting the temperature to 300 ° C. or higher, insufficient binder removal can be prevented, and by setting the temperature to 600 ° C. or lower, oxidation of the conductive material can be prevented.

  Moreover, it is preferable to make the heating time in the binder removal process implemented in step S009 into the range of 0.2 to 1.5 hours. By setting the heating time to 0.2 hours or longer, insufficient binder removal is prevented, and by setting the heating time to 1.5 hours or less, the conductive paste 34 or the base layer 20 after firing the conductive paste 34 becomes the element body 18. Can be prevented from being easily peeled off.

  When the burnout temperature of the individual resin sheet 30 is lower than the heating temperature in the binder removal process, the removal process for removing the individual resin sheet 30 is performed simultaneously with the binder removal process in step S009. That is, when the burning temperature of the individual resin sheet 30 is lower than the heating temperature in the binder removal process, the individual resin sheet 30 is burned out and removed in step S009.

  In step S010 shown in FIG. 5, a baking process for baking the conductive paste 34 is performed. If the individual resin sheet 30 has not been removed in step S010, the removing process of removing the individual resin sheet 30 is performed simultaneously with the baking process in step S010.

  Specifically, in step S010, the element body 18 and the conductive paste 34 after the binder removal processing are heated, and the conductive paste 34 is baked. The heating temperature in the baking performed in step S010 is preferably 450 to 850 ° C. By setting the temperature to 450 ° C. or higher, insufficient sintering can be prevented, and by setting the temperature to 850 ° C. or lower, oversintering can be prevented.

  Moreover, it is preferable to make the heating time in the baking implemented in step S010 into the range of 0.2 to 1.5 hours. Insufficient sintering can be prevented by setting the heating time to 0.2 hours or longer, and oversintering can be prevented by setting the heating time to 1.5 hours or less.

  In addition, when the burning temperature of the individual resin sheet 30 is higher than the heating temperature in the binder removal process and lower than the heating temperature in baking, the removing process of removing the individual resin sheet 30 in step S010 is a baking process. Done at the same time. That is, when the burning temperature of the individual resin sheet 30 is higher than the heating temperature in the binder removal process and lower than the heating temperature in baking, the individual resin sheet 30 is burned out and removed in step S010. Through the baking process according to step S010, the conductive paste 34 shown in FIG. 2 (f) becomes the base layer 20 as shown in FIG. 2 (g), and the element body 18 on which the base layer 20 is formed is obtained.

  In step S011, the upper layer 22 (see FIG. 1) is formed on the underlayer 20. The upper layer 22 is produced by forming two layers of plating composed of a lower layer and an upper layer on the base layer 20. Specifically, a lower layer made of Ni or Ni alloy film is formed on the underlayer 20 by electroless plating or electroplating, and an upper layer made of Sn or Sn alloy film is formed on the lower layer. It is formed by electroless plating or electroplating.

  As described above, the capacitor 10 shown in FIG. 1 is obtained through a series of steps according to steps S001 to S011. Note that in steps S001 to S011, only the process of forming the external electrode 14 on one end of the element body 18 has been described as shown in FIG. 2, but the same applies to the other end of the element body 18 as well. The external electrode 14 is formed on the surface.

  In the above-described embodiment, the method of removing the individual resin sheet 30 has been described by taking, as an example, the method of burning off the individual resin sheet 30 simultaneously with the binder removal process or the baking process. The method for removing 30 is not limited to this. For example, as another method of removing the individual resin sheet 30, a method of removing the individual resin sheet 30 by peeling it from the element body 18 with an adsorption nozzle or the like, or a solvent that dissolves the individual resin sheet 30 is used. The method of removing by dissolving is mentioned.

  As described above, in the method for manufacturing the capacitor 10 according to the present embodiment, the conductive paste 34 applied to the element body 18 is held between the individual resin sheet 30 and the element body 18. Compared to the case of the free surface, the outer shape is formed along the surface shape of the element body 18. Further, in the method for manufacturing the capacitor 10 according to the present embodiment, the solvent 36 contained in the conductive paste 34 penetrates into the individual resin sheet 30 and a part of the individual resin sheet 30 attached to the conductive paste 34 is an element. A deformation process for deforming along the main body 18 is included. In this manner, when the individual resin sheet 30 is appropriately deformed, the conductive paste 34 can form an outer shape that more closely matches the surface shape of the element body 18. Therefore, the method for manufacturing the capacitor 10 according to the present embodiment suppresses unevenness due to the thickness portion of the base layer 20 formed by baking the conductive paste 34 and the external electrode 14 including the base layer 20. it can.

  In addition, the method of manufacturing the capacitor 10 according to the present embodiment can be achieved by simply attaching the individual resin sheet 30 to the conductive paste 34 and removing the individual resin sheet 30 after the deformation process. Since the uniformity can be reduced, the productivity is excellent.

  Further, in the method for manufacturing the capacitor 10 according to the present embodiment, it is possible to reduce the labor and time required for removing the individual resin sheet 30 by performing the removal process simultaneously with at least one of the binder removal process and the baking process. Thus, the capacitor 10 can be efficiently produced by such a manufacturing method. In the above embodiment, the capacitor 10 as an example of the electronic component has been described as an example. However, the electronic component manufactured by the manufacturing method of the present invention is not limited to the capacitor. The present invention can also be applied to a method of manufacturing an electronic component including an inductor, a varistor, a resistor, or a combination thereof.

EXAMPLES Hereinafter, the present invention will be described based on more detailed examples, but the present invention is not limited to these examples.

Sample 01 to Sample 05
Sample 01
As the sample 01, the capacitor 10 as shown in FIG. 1 is manufactured using the manufacturing method including the manufacturing process according to steps S001 to S011 shown in FIG. 5, and the suitability of the manufacturing method, the dimensions of the underlayer 20, the capacitor The reliability of 10 and the appearance of the external electrode 14 were evaluated.

  The individual resin sheet 30 used for the manufacture of Sample 01 was prepared using a resin sheet paste containing 30 parts by weight of acrylic resin as a resin and 70 parts by weight of terpineol as a solvent. The thickness of the individual resin sheet 30 was 1 μm, and the ratio of the area of the resin sheet 30 to the cross-sectional area of the element body 18 by a cross section parallel to the individual resin sheet 30 was 1 (steps S001 to S003).

  In the manufacture of the sample 01, an element body 18 for the capacitor 10 having a shape of 1005 (length 1.0 mm × width 0.5 mm) and a thickness of 0.5 mm was prepared as the element body 18 (step S004). The conductive paste 34 applied to the element body 18 is 70 parts by weight of Cu powder as the conductive powder, 5.6 parts by weight of acrylic resin as the binder, 0.7 parts by weight of carboxylate compound as the dispersant, and as the solvent 36. A blend of 26 parts by weight of terpineol was used. Application of the conductive paste 34 to the element body 18 was performed by a dipping method (step S005).

  The individual resin sheet 30 was attached to the conductive paste 34 using a suction nozzle (step S006). The process of deforming a part of the individual resin sheet 30 is performed by leaving the element body 18 and the like naturally until the individual resin sheet 30 is deformed and the individual resin sheet 30 and the conductive paste 34 are integrated. (Step S007). After a part of the piece resin sheet 30 was deformed, a step of drying the conductive paste 34 was performed (step S008).

  The element body 18 provided with the deformed individual resin sheet 30 and the conductive paste 34 was heated and the conditions for the binder removal treatment were 450 ° C. and 0.9 hours (step S009). The conditions for baking the conductive paste 34 were 650 ° C. and 0.9 hours (step S010). The piece resin sheet 30 was removed by burning at the same time as the binder removal step.

  By performing Ni plating and Sn plating on the underlayer 20, the upper layer 22 was formed (step S011), and the capacitor 10 including the external electrode 14 as shown in FIG. 1 was produced. Ni plating and Sn plating were performed by a barrel plating method.

The following evaluation was performed on the manufacturing method of Sample 01 and the prepared Sample 01.
(1) Evaluation Item: Resin Sheet Handling Evaluation Criteria: It was visually determined whether or not the individual resin sheet 30 was transported and adhered to the conductive paste 34 by the suction nozzle. When the individual resin sheet 30 is wrinkled during transportation or pasting, or when the individual resin sheet 30 is not correctly installed, there is no defect (x) and no wrinkle, and the individual resin sheet 30 is accurate. The one installed in was considered good (◯).
(2) Evaluation item: Integration Evaluation criteria: After attaching the individual resin sheet 30 to the conductive paste 34, it is visually confirmed that the four corners of the individual resin sheet 30 are deformed along the element body 18. Judgment was made by measuring the time required until the time. Those in which the deformation was confirmed within 5 minutes after the individual resin sheet 30 was attached to the conductive paste 34 were judged as good (◯), and those in which the deformation could not be confirmed within 5 minutes were judged as bad (x).

(3) Evaluation item: T dimension after baking Evaluation standard: After the conductive paste 34 was baked to form the underlayer 20, the electronic component was filled and polished, and the dimensions of the underlayer 20 were measured under a microscope. Here, as shown in FIG. 6, the T dimension was the maximum thickness of the foundation layer 20 (the maximum value of the distance from the main body end face 18a to the outer surface of the foundation layer 20).
(4) Evaluation item: F dimension after baking Evaluation standard: After the conductive paste 34 was baked to form the base layer 20, the capacitor 10 was filled and polished with a resin, and the dimensions of the base layer 20 were measured under a microscope. Here, as shown in FIG. 6, the F dimension is the thickness of the base layer 20 on the extension of the outermost internal electrode layer 13.
(5) Evaluation item: T dimension / F dimension <3
Evaluation criteria: The ratio of T dimension to F dimension (T dimension / F dimension) was calculated.

(6) Evaluation item: Reliability Evaluation criteria: The insulation resistance value was measured while applying a bias to the capacitor 10 completed by forming the external electrode 14 for 1000 hours. When the leakage current was 0.1 mA or less, it was judged as good (◯), and when it exceeded 0.1 mA, it was judged as defective (×).
(7) Evaluation item: Appearance of electrode shape Evaluation criteria: The shape of the external electrode 14 of the capacitor 10 was visually confirmed. When the shape of the ridgeline or corner of the external electrode 14 is not rounded or sharp, or when the undulation or swelling due to the attachment of the individual resin sheet 30 is seen on the external electrode 14, it is considered as defective (×). The external electrode 14 is formed along the shape of the element body 18 and the surface of the external electrode 14 is smooth.
The production conditions and evaluation results of Sample 01 are shown in Table 1.

Sample 02
In the manufacturing method according to the sample 02, the capacitor 10 was formed using the individual resin sheet 30 having a thickness of 5 μm. The manufacturing method of the sample 02 is the same as the manufacturing method of the sample 01 except that the thickness of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 02, the same evaluation as for sample 01 was performed. The production conditions and evaluation results of Sample 02 are shown in Table 1.

Sample 03
In the manufacturing method according to the sample 03, the capacitor 10 was formed using the individual resin sheet 30 having a thickness of 10 μm. The manufacturing method of Sample 03 is the same as the manufacturing method of Sample 01 except that the thickness of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 03, the same evaluation as for sample 01 was performed. The production conditions and evaluation results of Sample 03 are shown in Table 1.

Sample 04
In the manufacturing method according to the sample 04, the capacitor 10 was formed using the individual resin sheet 30 having a thickness of 20 μm. The manufacturing method of the sample 04 is the same as the manufacturing method of the sample 01 except that the thickness of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 04, the same evaluation as for sample 01 was performed. The production conditions and evaluation results for Sample 04 are shown in Table 1.

Sample 05
In the manufacturing method according to the sample 05, the capacitor 10 was formed using the individual resin sheet 30 having a thickness of 25 μm. The manufacturing method of Sample 05 is the same as the manufacturing method of Sample 01 except that the thickness of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 05, the same evaluation as for sample 01 was performed. The production conditions and evaluation results of Sample 05 are shown in Table 1.

Sample 06
In the manufacturing method according to the sample 06, the capacitor 10 was produced without using the individual resin sheet 30. That is, in the sample 06, the capacitor 10 is manufactured without performing the step of preparing the individual resin sheet 30 (steps S001 to S003 in FIG. 5) and the step of attaching to the conductive paste 34 (step S006 in FIG. 5). Went. Therefore, the manufacturing method of the sample 06 does not include a step of deforming a part of the piece resin sheet 30 and a step of removing the piece resin sheet 30. However, the manufacturing method of the sample 06 is the same as the manufacturing method of the sample 01 except that the individual resin sheet 30 is not used.

  For sample 06, the same evaluation as for sample 01 was performed. However, since the sample 06 was manufactured without using the individual resin sheet 30, the handling and integration of the resin sheet were excluded from the evaluation items. The production conditions and evaluation results of Sample 06 are shown in Table 1.

Sample 07
In the manufacturing method according to the sample 07, the capacitor 10 was produced without using the individual resin sheet 30 as in the case of the sample 06. In the method for manufacturing Sample 07, the step of applying and drying the conductive paste 34 was repeated three times, and then the binder and baking of the conductive paste 34 were performed. Similar to the manufacturing method of the sample 06, the manufacturing method of the sample 07 includes a step of preparing the individual resin sheet 30, a step of attaching the individual resin sheet 30, a step of deforming a part of the individual resin sheet 30, and The step of removing the individual resin sheet 30 is not included. The manufacturing method of Sample 07 is the same as the manufacturing method of Sample 06 except that the process of applying and drying conductive paste 34 is repeated three times.

  Sample 07 was evaluated in the same manner as Sample 01. However, since the sample 07 was manufactured without using the individual resin sheet 30, the handling and integration of the resin sheet were excluded from the evaluation items. The production conditions and evaluation results of Sample 07 are shown in Table 1.

Evaluation Results of Sample 01 to Sample 07 As shown in Table 1, in Sample 01 to Sample 05 manufactured using a resin sheet, the F dimension is larger than that of Sample 06 manufactured without using a resin sheet. Thus, it can be seen that non-uniformity due to the thickness of the underlayer 20 is suppressed by the manufacturing method using the resin sheet. Note that the sample 07 to which the conductive paste 34 was applied three times had a larger F dimension than the sample 06 and improved reliability, but the T dimension was too large, and the external electrode 14 also had an external appearance on the dome. Therefore, it is difficult to achieve both miniaturization and high capacity.

  When Sample 01 to Sample 05 were compared, Sample 02 to Sample 04 were good (◯) in all evaluation items. On the other hand, in the sample 01, since the thickness of the individual resin sheet 30 is as thin as 1 μm, wrinkles may enter the individual resin sheet 30 and there is a problem in the handling property of the resin sheet. Moreover, since the thickness of the individual resin sheet 30 is too thin at 1 μm in the sample 01, the individual resin sheet 30 is weak, and the individual resin sheet 30 has little effect of suppressing the T dimension and increasing the F dimension. I understood that. In addition, it was found that the sample 01 has a larger non-uniformity due to the thickness of the base layer 20 than the samples 02 to 04, and is inferior in reliability.

  In Sample 05, since the thickness of the individual resin sheet 30 was too large, 25 μm, the individual resin sheet 30 was not deformed within 5 minutes after the individual resin sheet 30 was attached to the conductive paste 34 (integral) Poor chemical conversion (×)). In addition, since the shape of the ridge line portion and the corner portion of the external electrode 14 is not rounded and sharp, the capacitor 10 according to the sample 05 has a problem that chipping or cracking is likely to occur before mounting (electrode) Shape appearance defect (×)).

  From Table 1, it can be seen that by producing the capacitor 10 using the individual resin sheet 30, non-uniformity due to the thickness of the foundation layer 20 is suppressed. Moreover, it turns out that it is preferable that the thickness of the piece resin sheet 30 used for manufacture shall be 5-20 micrometers.

Sample 08
In the manufacturing method according to the sample 08, the capacitor 10 was formed using the individual resin sheet 30 having a thickness of 10 μm. Further, in the manufacturing method according to the sample 08, the individual resin in which the ratio of the sheet width that is the width of the individual resin sheet 30 and the element main body width that is the width of the corresponding element main body 18 is 0.3. The capacitor 10 was created using the sheet 30. The manufacturing method of the sample 08 is the same as the manufacturing method of the sample 03 except that the width (size) of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 08, the same evaluation as for sample 03 was performed. The production conditions and evaluation results of Sample 08 are shown in Table 2.

Sample 09
In the manufacturing method according to the sample 09, the individual resin sheet 30 in which the ratio of the sheet width that is the width of the individual resin sheet 30 and the element main body width that is the width of the corresponding element main body 18 is 0.5. Using this, a capacitor 10 was produced. The manufacturing method of the sample 09 is the same as the manufacturing method of the sample 03 except that the width (size) of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 09, the same evaluation as for sample 03 was performed. Table 2 shows the manufacturing conditions and evaluation results of Sample 09.

Sample 10
In the manufacturing method according to the sample 10, the individual resin sheet 30 in which the ratio of the sheet width that is the width of the individual resin sheet 30 to the element main body width that is the width of the corresponding element main body 18 is 1.5. Using this, a capacitor 10 was produced. The manufacturing method of the sample 10 is the same as the manufacturing method of the sample 03 except that the width (size) of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 10, the same evaluation as for sample 03 was performed. Table 2 shows the manufacturing conditions and evaluation results of Sample 10.

Sample 11
In the manufacturing method according to the sample 11, the individual resin sheet 30 in which the ratio of the sheet width that is the width of the individual resin sheet 30 and the element main body width that is the width of the corresponding element main body 18 is 2 is used. Thus, a capacitor 10 was produced. The manufacturing method of the sample 11 is the same as the manufacturing method of the sample 03 except that the width (size) of the individual resin sheet 30 attached to the conductive paste 34 is different. For sample 11, the same evaluation as for sample 03 was performed. Table 2 shows the manufacturing conditions and evaluation results of Sample 11.

Evaluation results of sample 08 to sample 11 and sample 03 When sample 08 to sample 11 and sample 03 were compared, sample 09, sample 10 and sample 03 were good (◯) in all evaluation items. On the other hand, the sample 08 has a sheet width, which is the width of the individual resin sheet 30, which is too small, 0.3 times the element body width, which is the width of the corresponding element main body 18. When the sheet 30 was affixed to the conductive paste 34, a phenomenon that a part of the conductive paste 34 ran over the outer peripheral portion of the individual resin sheet 30 occurred. As a result, in sample 08, the surface of the base layer 20 formed by firing the conductive paste 34 was undulated, and the surface of the external electrode 14 including the base layer 20 was also undulated (electrode shape appearance defect (× )). Further, in the manufacturing method according to Sample 08, since the individual resin sheet 30 is too small, it is difficult to accurately carry and install the individual resin sheet 30 by the suction nozzle, and there is a problem in handling of the resin sheet.

  Since the sample 11 has a sheet width that is the width of the individual resin sheet 30 that is twice as large as the element main body width that is the width of the corresponding element main body 18, the individual resin sheet 30 is replaced with the conductive paste 34. No deformation of the individual resin sheet 30 occurred within 5 minutes after being attached to the sheet (poor integration (x)). In addition, since the shape of the ridge line portion and the corner portion of the external electrode 14 is not rounded and sharp, the capacitor 10 according to the sample 05 has a problem that chipping or cracking is likely to occur before mounting (electrode) Shape appearance defect (×)).

  From Table 2, it is preferable that the ratio of the sheet width that is the width of the individual resin sheet 30 and the element body width that is the width of the element body 18 corresponding thereto is 0.5 to 1.5. I understand. In addition, both the shape of the piece resin sheet 30 used in each Example and the shape of the cross section parallel to the piece resin sheet 30 in the element body 18 are both substantially square. Therefore, the ratio of the first length, which is the length of the side of the individual resin sheet 30, to the second length, which is the length of the side of the element body 18 parallel to the side of the individual resin sheet 30, is 0. It turns out that it is preferable to set it as 5-1.5.

Sample 12 to Sample 15
In the manufacturing method according to Sample 12 to Sample 15, the heating temperature when baking the conductive paste 34 was set to 350 ° C., 450 ° C., 850 ° C., and 950 ° C., respectively, and the capacitor 10 was created. The manufacturing method of Sample 12 to Sample 15 is the same as the manufacturing method of Sample 03 except that the heating temperature when baking the conductive paste 34 in Step S009 (FIG. 5) is different. In addition, Sample 12 to Sample 15 were evaluated in the same manner as Sample 03. Table 3 shows the production conditions and evaluation results of Sample 12 to Sample 15.

Evaluation Results of Sample 12 to Sample 15 and Sample 03 When comparing Sample 12 to Sample 15 and Sample 03, Sample 13, Sample 14, and Sample 03 were good (◯) in all evaluation items. On the other hand, the sample 12 was insufficiently sintered because the heating temperature when the conductive paste 34 was baked was too low, and was poor (×) in reliability evaluation. Further, the sample 15 was oversintered because the heating temperature when baking the conductive paste 34 was too high, and was poor (×) in the reliability evaluation. From Table 3, it is understood that the heating temperature when baking the conductive paste 34 is preferably 450 to 850 ° C.

Sample 16 to Sample 19
In the manufacturing method according to Samples 16 to 19, the heating temperature when baking the conductive paste 34 was 650 ° C. Further, in the manufacturing method according to Samples 16 to 19, the capacitor 10 is produced by setting the heating time when baking the conductive paste 34 to 0.1 hours, 0.2 hours, 1.5 hours, and 2.0 hours, respectively. did. The manufacturing method of Sample 16 to Sample 19 is the same as the manufacturing method of Sample 03 except that the heating time for baking the conductive paste 34 in Step S009 (FIG. 5) is different. In addition, Sample 16 to Sample 19 were evaluated in the same manner as Sample 03. Table 4 shows the manufacturing conditions and evaluation results of Sample 16 to Sample 19.

Evaluation results of sample 16 to sample 19 and sample 03 When sample 16 to sample 19 and sample 03 were compared, sample 17, sample 18 and sample 03 were good (◯) in all evaluation items. On the other hand, the sample 16 was insufficiently sintered because the heating time when the conductive paste 34 was baked was too short, and was poor (×) in reliability evaluation. Moreover, since the heating time at the time of baking the electrically conductive paste 34 was too long, the sample 19 was unsatisfactory (x) in reliability evaluation. From Table 3, it can be seen that the heating time for baking the conductive paste 34 is preferably 0.2 hours to 1.5 hours.

Sample 20 to Sample 24
In the manufacturing method according to Samples 20 to 24, cellulose resin, butyral resin, epoxy resin, phenol resin, and rosin resin were used as the resins contained in the resin sheet paste as the raw material of the individual resin sheet 30, respectively. The manufacturing method of Sample 16 to Sample 19 is the same as the manufacturing method of Sample 03 except that the type of resin contained in the resin sheet paste that is the raw material of the individual resin sheet 30 is changed. In addition, Sample 20 to Sample 24 were evaluated in the same manner as Sample 03. Table 5 shows the manufacturing conditions and evaluation results of Sample 20 to Sample 24.

Sample 25 to Sample 29
In the manufacturing method according to Sample 25 to Sample 29, an acrylic resin was used as the resin blended in the resin sheet paste as the raw material of the individual resin sheet 30. Moreover, in the manufacturing method which concerns on the samples 25-29, isopropanol, butyl carbitol, ethyl acetate, acetone, and cellosolve were used as a solvent mix | blended with the paste for resin sheets used as the raw material of the piece resin sheet 30, respectively. The manufacturing method of Sample 25 to Sample 29 is the same as the manufacturing method of Sample 03 except that the type of the solvent blended in the resin sheet paste that is the raw material of the individual resin sheet 30 is changed. In addition, Sample 25 to Sample 29 were evaluated in the same manner as Sample 03. Table 5 shows the manufacturing conditions and evaluation results of Sample 25 to Sample 29.

Evaluation Results of Sample 20 to Sample 29 As shown in Table 5, Sample 20 to Sample 29 were good (◯) in all evaluation items. Thus, it was found that the manufacturing method according to Sample 20 to Sample 29 in which the resin and the solvent were changed can achieve the same effect as the manufacturing method according to Sample 03 using acrylic resin and terpineol.

DESCRIPTION OF SYMBOLS 10 ... Capacitor 12 ... Dielectric layer 13 ... Internal electrode layer 14 ... External electrode 16 ... Protective dielectric layer 18 ... Element main body 18a ... Main body end surface 18b ... Main body side surface 18c ... Main body ridgeline part 20 ... Underlayer 22 ... Upper layer 28 ... large-sized resin sheet 30 ... individual resin sheet 30a ... sheet center part 30c ... sheet outer peripheral part 34 ... conductive paste 34c ... paste ridge line part 36 ... solvent

Claims (3)

A body preparation process for preparing the element body;
A sheet preparation step of preparing a resin sheet;
An application step of applying a conductive paste to the element body;
An attaching step of attaching the resin sheet to the conductive paste;
A deformation process in which a part of the resin sheet attached to the conductive paste is deformed along the element body,
And a removing step of removing the resin sheet. The resin sheet has a thickness of 5 to 20 μm,
The ratio of the sheet width, which is the width of the resin sheet, to the element body width, which is the width of the element body corresponding to the sheet width, is 0.5 to 1.5. The manufacturing method of the electronic component of description. A binder removal process for removing the binder from the conductive paste;
A baking step of baking the conductive paste, and
The method of manufacturing an electronic component according to claim 1, wherein the removing step is performed simultaneously with at least one of the binder removal step and the baking step.

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