JP2011203252A5 - - Google Patents
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- Publication number
- JP2011203252A5 JP2011203252A5 JP2011063978A JP2011063978A JP2011203252A5 JP 2011203252 A5 JP2011203252 A5 JP 2011203252A5 JP 2011063978 A JP2011063978 A JP 2011063978A JP 2011063978 A JP2011063978 A JP 2011063978A JP 2011203252 A5 JP2011203252 A5 JP 2011203252A5
- Authority
- JP
- Japan
- Prior art keywords
- test solution
- solution
- fluoride
- predetermined
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012085 test solution Substances 0.000 claims 40
- 239000000243 solution Substances 0.000 claims 27
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 20
- -1 fluoride ions Chemical class 0.000 claims 18
- 239000003153 chemical reaction reagent Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 10
- 229910052710 silicon Inorganic materials 0.000 claims 10
- 239000010703 silicon Substances 0.000 claims 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 7
- 238000011088 calibration curve Methods 0.000 claims 4
- 238000010790 dilution Methods 0.000 claims 4
- 239000012895 dilution Substances 0.000 claims 4
- 238000005070 sampling Methods 0.000 claims 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 239000012482 calibration solution Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 2
- 229910017855 NH 4 F Inorganic materials 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000003814 drug Substances 0.000 claims 1
- 229940079593 drug Drugs 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000002277 temperature effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/661,968 US8008087B1 (en) | 2010-03-25 | 2010-03-25 | Analysis of silicon concentration in phosphoric acid etchant solutions |
| US12/661,968 | 2010-03-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015165808A Division JP6189380B2 (ja) | 2010-03-25 | 2015-08-25 | エッチング剤溶液中のケイ素濃度の分析 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011203252A JP2011203252A (ja) | 2011-10-13 |
| JP2011203252A5 true JP2011203252A5 (enExample) | 2014-04-17 |
| JP5800539B2 JP5800539B2 (ja) | 2015-10-28 |
Family
ID=44486251
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011063978A Active JP5800539B2 (ja) | 2010-03-25 | 2011-03-23 | エッチング剤溶液中のケイ素濃度の分析 |
| JP2015165808A Active JP6189380B2 (ja) | 2010-03-25 | 2015-08-25 | エッチング剤溶液中のケイ素濃度の分析 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015165808A Active JP6189380B2 (ja) | 2010-03-25 | 2015-08-25 | エッチング剤溶液中のケイ素濃度の分析 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8008087B1 (enExample) |
| JP (2) | JP5800539B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5795983B2 (ja) * | 2012-03-27 | 2015-10-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| US9274079B2 (en) * | 2013-01-22 | 2016-03-01 | Eci Technology, Inc. | Etchant product analysis in alkaline etchant solutions |
| TWI630652B (zh) * | 2014-03-17 | 2018-07-21 | SCREEN Holdings Co., Ltd. | 基板處理裝置及使用基板處理裝置之基板處理方法 |
| US20160018358A1 (en) * | 2014-07-18 | 2016-01-21 | Eci Technology, Inc. | Analysis of silicon concentration in phosphoric acid etchant solutions |
| KR101671118B1 (ko) | 2014-07-29 | 2016-10-31 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
| KR20160050536A (ko) * | 2014-10-30 | 2016-05-11 | 램테크놀러지 주식회사 | 질화막 식각 조성물 및 이를 이용한 반도체 장치의 제조 방법 |
| JP6668257B2 (ja) * | 2014-12-26 | 2020-03-18 | 倉敷紡績株式会社 | 珪素濃度又はエッチング選択比の測定方法及び測定装置 |
| KR102511986B1 (ko) | 2015-09-02 | 2023-03-21 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| JP6909620B2 (ja) * | 2017-04-20 | 2021-07-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| EP3671197B1 (en) * | 2018-03-06 | 2024-10-16 | Hitachi High-Tech Corporation | Ion concentration measurement device |
| JP6767442B2 (ja) * | 2018-08-24 | 2020-10-14 | 株式会社東芝 | 測定器、エッチングシステム、シリコン濃度測定方法、及びシリコン濃度測定プログラム |
| US11555798B2 (en) * | 2018-10-08 | 2023-01-17 | Eci Technology, Inc. | Selective monitoring of multiple silicon compounds |
| KR102084044B1 (ko) * | 2018-12-24 | 2020-03-03 | 주식회사 세미부스터 | 인산용액 중의 실리콘 농도 분석방법 |
| CN114746744A (zh) | 2019-12-02 | 2022-07-12 | 株式会社堀场先进技术 | 荧光x射线分析装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6890758B2 (en) * | 2003-06-13 | 2005-05-10 | Eci Technology, Inc. | Measurement of complexing agent concentration in an electroless plating bath |
| JP4809122B2 (ja) * | 2005-05-17 | 2011-11-09 | アプリシアテクノロジー株式会社 | 燐酸溶液中の珪素濃度測定装置及び測定方法 |
| US20090229995A1 (en) * | 2008-03-14 | 2009-09-17 | Eci Technology, Inc. | Analysis of fluoride at low concentrations in acidic processing solutions |
-
2010
- 2010-03-25 US US12/661,968 patent/US8008087B1/en active Active
-
2011
- 2011-03-23 JP JP2011063978A patent/JP5800539B2/ja active Active
-
2015
- 2015-08-25 JP JP2015165808A patent/JP6189380B2/ja active Active
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