JP2011199140A - Driving device and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suitably move a body to be driven in a processing container which has a vacuum and high-temperature inner atmosphere.SOLUTION: A driving device 115 has a cylinder 120 penetrating the processing container 70. An outer housing 130 supporting a support portion 114 is provided on an outer peripheral surface of the cylinder 120. An outer magnet 131 is attached to an inner peripheral surface of the outer housing 130. An inner housing 140 is provided on an inner peripheral surface of the cylinder 120. An inner magnet 143 is attached to the outer peripheral surface of the inner housing 140. The outer magnet 131 and inner magnet 143 are arranged opposite each other and have the different polarities. A predetermined gap is formed between the outer magnet 131 and cylinder 120, and between the inner magnet 143 and cylinder 120. A driving portion 180 which moves the inner housing 140 is provided outside the processing container 70.

Description

  The present invention relates to a driving device that moves a driven body in a processing vessel whose internal atmosphere is vacuum and high temperature, and a bonding apparatus including the driving device.

  In recent years, semiconductor devices have been highly integrated. When a plurality of highly integrated semiconductor devices are arranged in a horizontal plane and these semiconductor devices are connected by wiring to produce a product, the wiring length increases, thereby increasing the wiring resistance and wiring delay. There is concern about becoming.

  Thus, it has been proposed to use a three-dimensional integration technique in which semiconductor devices are stacked three-dimensionally. In this three-dimensional integration technique, two semiconductor wafers (hereinafter referred to as “wafers”) are bonded using, for example, a bonding apparatus. The bonding apparatus includes, for example, a fixed table on which a wafer is placed on the upper surface, and a movable table that is arranged to face the fixed table and that can move up and down by sucking and holding the wafer on the lower surface. A heater is built in each of the fixed table and the movable table. In this bonding apparatus, after the two wafers are superposed in a vacuum atmosphere, the wafers are heated by a heater and the wafers are pressed by applying a load by a fixed table and a movable table. They are pasted together (Patent Document 1).

JP 2004-207436 A

  By the way, when two wafers are bonded, for example, metal bonding portions formed on the wafer surface may be bonded. In such a case, it is necessary to press the bonding portion while heating it at a predetermined temperature of, for example, 200 ° C. or higher. That is, first, a pre-heat treatment process for heating the wafer to a predetermined temperature, a bonding process for pressing the wafer while maintaining the wafer temperature at a predetermined temperature, and a post-heat treatment process for cooling the wafer are sequentially performed. There is a need.

  However, in this case, when the bonding apparatus of Patent Document 1 is used, it takes time for the heat treatment process of the wafer (that is, the pre-heat treatment process and the post-heat treatment process), and it takes a lot of time to join the two wafers.

  In view of this, the inventors studied to perform the heat treatment process and the bonding process in different processing vessels in a vacuum atmosphere in order to improve the throughput of the wafer bonding process. In such a case, a driving device for moving the wafer between the processing containers is required. That is, a driving device that moves the wafer in a vacuum and in a high temperature atmosphere is required.

  Here, as a driving device used in a vacuum atmosphere, a rotary arm actuator, a linear motion actuator, or the like having a rotary shaft hermetically sealed is conventionally used. In particular, a linear actuator is useful because it can withstand a high load and can reduce an operation space as compared with a rotary arm actuator. And this linear motion actuator is arrange | positioned and used in a processing container.

  However, since the motor and ball screw used in the linear motion actuator have high dust generation properties and dust is generated in the processing container, there is a possibility that the dust adheres to the wafer. Further, since these motors and ball screws have low heat resistance, it is difficult to use a linear actuator in a high temperature atmosphere.

  Further, since parts such as a motor for the direct acting actuator and a ball screw are provided in the processing container, it is necessary to open the processing container in order to perform maintenance of these parts, which requires a great deal of maintenance.

  This invention is made | formed in view of this point, and it aims at providing the drive device which moves a to-be-driven body appropriately within the processing container whose internal atmosphere is a vacuum and high temperature.

  In order to achieve the above object, the present invention provides a driving device for moving a driven body in a processing container whose internal atmosphere is vacuum and high temperature, and penetrates the wall of the processing container, and the inside of the processing container A cylinder extending in the moving direction of the driven body, an annular outer side of the cylinder along the outer peripheral surface of the cylinder, and supporting the driven body, facing the outer housing, and the cylinder An inner housing that is annularly provided along the inner surface of the cylinder, and a drive unit that is provided outside the processing vessel and moves the inner housing in the axial direction of the cylinder, An outer magnet is attached to the inner peripheral surface of the outer housing, an inner magnet is attached to the outer peripheral surface of the inner housing, and the outer magnet and the inner magnet are attached. The nets are arranged to face each other and have different polarities, and predetermined gaps are formed between the outer magnet and the cylinder and between the inner magnet and the cylinder, respectively. Yes. In addition, the high temperature here means a temperature of 200 ° C. or higher. The predetermined gap is, for example, the shortest distance between the inner peripheral surface of the outer magnet and the outer peripheral surface of the cylinder, and the shortest distance between the outer peripheral surface of the inner magnet and the inner peripheral surface of the cylinder, for example, 10 μm. It refers to a gap of ~ 200 μm.

  According to the present invention, since the outer magnet and the inner magnet are arranged opposite to each other and have different polarities, the outer magnet and the inner magnet attract each other by magnetic force, and the outer magnet moves following the movement of the inner magnet. . That is, for example, when the inner housing is moved by a drive unit having a motor, the outer housing is also moved accordingly. Further, at this time, since predetermined gaps are formed between the outer magnet and the cylinder and between the inner magnet and the cylinder, the outer housing and the inner housing can move smoothly and dust generation can be suppressed. Furthermore, since the drive part with high dust generation property is provided outside the processing container, dust generation in the processing container can be further suppressed. Therefore, the cleanliness of the atmosphere in the processing container can be improved, and the adhesion of dust to the driven body can be suppressed. Moreover, since the drive part with low heat resistance is provided outside the processing container, the drive device of the present invention can be used with a long life even in a high temperature atmosphere. In addition, maintenance of the drive unit can be performed without opening the processing container, and maintenance labor can be greatly reduced. As described above, according to the driving device of the present invention, the driven body can be appropriately moved in the processing container whose internal atmosphere is vacuum and high temperature.

  A guide cylinder that extends in the axial direction of the cylinder and passes through the inside of the inner housing is provided in the cylinder, and a male screw portion is formed on the outer peripheral surface of the guide cylinder. A female threaded portion that is screwed into the male threaded portion is formed on the peripheral surface, and the driving unit drives the guide cylinder to rotate about the central axis of the guide cylinder so that the inner housing moves to the central axis. You may make it move to a direction.

  A coolant channel through which a cooling medium flows may be formed inside the guide cylinder.

  The inner side surface of the cylinder is formed with a stop groove extending in the axial direction of the cylinder, and both ends of the inner housing are provided with the stop groove and a slidable stop protrusion. Also good. The both end portions of the inner housing mean both end portions in the axial direction of the cylinder.

  The drive unit includes a pair of pulleys provided at both ends of the cylinder, and a drive belt that is inserted through the inner side of the inner housing and wound around the pair of pulleys is provided in the cylinder. The inner housing may be attached to the drive belt. In addition, the both ends of a cylinder mean the both ends of the axial direction of a cylinder.

  A guide cylinder that extends in the axial direction of the cylinder and passes through the inside of the inner housing is provided in the cylinder, and a bearing may be disposed between the inner housing and the guide cylinder. .

  A coolant channel through which a cooling medium flows may be formed inside the guide cylinder.

  A guide cylinder that extends in the axial direction of the cylinder and passes through the inside of the inner housing is provided in the cylinder, and the driving unit supplies gas from an end of the cylinder to move the inner housing. In addition, a sealing material for sealing between the cylinder and the guide cylinder may be provided at both ends of the inner housing. The both end portions of the inner housing mean both end portions in the axial direction of the cylinder.

  The gas supplied from the drive unit may be cooled to a predetermined temperature.

  A coolant channel through which a cooling medium flows may be formed inside the guide cylinder.

  A rail extending along the cylinder is provided in the processing container, and the outer housing is configured to be movable on the rail via a bearing, and on the outer side of the processing container, along the rail. A cooling plate that extends and cools the rail may be provided.

  According to another aspect of the present invention, there is provided a bonding apparatus that includes the driving device and joins substrates together, a heat treatment plate that heat-treats the substrates, and a pressurizing mechanism that presses the substrate on the heat treatment plate toward the heat treatment plate. A bonding unit including a pressure reducing mechanism for reducing the internal atmosphere to a predetermined degree of vacuum, a heat treatment plate for heat-treating the substrate, and a heat treatment unit including a pressure reducing mechanism for reducing the internal atmosphere to a predetermined degree of vacuum; The bonding unit and the heat treatment unit are hermetically connected, and the driving device moves a transfer unit that transfers a substrate between the bonding unit and the heat treatment unit.

  ADVANTAGE OF THE INVENTION According to this invention, a to-be-driven body can be appropriately moved within the processing container whose internal atmosphere is vacuum and high temperature.

It is a cross-sectional view which shows the outline of a structure of the joining apparatus concerning this Embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the joining apparatus concerning this Embodiment. It is explanatory drawing which shows a mode that the holding | maintenance part of a holding arm is accommodated in the 1st heat processing board, and a wafer is mounted in a 1st heat processing board. It is a longitudinal cross-sectional view which shows the outline of a structure of a drive device. It is a longitudinal cross-sectional view which shows the outline of a structure of a drive device. It is explanatory drawing which shows a mode that a wafer is adsorbed-held by the 2nd heat processing board. It is explanatory drawing which shows a mode that a wafer is delivered to the holding arm from the 1st conveyance arm. It is explanatory drawing which shows a mode that a wafer is mounted in the 1st heat processing board from a holding arm. It is explanatory drawing which shows a mode that the wafer on a 1st heat processing board is pressed and joined. It is explanatory drawing which shows a mode that a wafer is delivered to the 2nd conveyance arm from a holding arm. It is explanatory drawing which shows a mode that a wafer is mounted in the 3rd heat processing board from a 2nd conveyance arm. It is a longitudinal cross-sectional view which shows the outline of a structure of the drive device concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of the structure in the outer side housing of the drive device concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the drive device concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the drive device concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the drive device concerning other embodiment.

  Embodiments of the present invention will be described below. FIG. 1 is a cross-sectional view showing an outline of a configuration of a joining device 1 in which a driving device according to the present embodiment is arranged. FIG. 2 is a longitudinal sectional view showing an outline of the configuration of the bonding apparatus 1. In the bonding apparatus 1 of the present embodiment, a wafer (hereinafter simply referred to as “wafer”) as a substrate in which two wafers are superimposed is bonded. Moreover, the wafer conveyed to the joining apparatus 1 of this Embodiment is temporarily joined by the adhesive, for example, after surface cleaning processing is performed.

  As shown in FIGS. 1 and 2, the bonding apparatus 1 includes a bonding unit 10 and a heat treatment unit 11. The joining unit 10 and the heat treatment unit 11 are connected in an integrated and airtight manner in the horizontal Y direction (left and right direction in FIGS. 1 and 2) via the gate valve 12.

  The joining unit 10 has a processing container 20 capable of sealing the inside. The processing container 20 has a configuration in which a container body 21 and a top plate 22 are connected by a shield bellows 23. The shield bellows 23 is configured to be extendable in the vertical direction, and the top plate 22 is movable in the vertical direction by the shield bellows 23.

  A loading / unloading port 24 for the wafer W is formed on the side surface of the container body 21 on the heat treatment unit 11 side, and the above-described gate valve 12 is provided at the loading / unloading port 24.

  An intake port 25 is formed on the side surface of the container body 21. An intake pipe 27 that communicates with a vacuum pump 26 that reduces the atmosphere inside the processing container 20 to a predetermined degree of vacuum is connected to the intake port 25. In this embodiment, the suction port 25, the vacuum pump 26, and the suction pipe 27 constitute a pressure reducing mechanism.

  A pressure mechanism 30 that presses a wafer W on a first heat treatment plate 50 (described later) toward the first heat treatment plate 50 is provided in the top plate 22 inside the processing container 20. The pressurizing mechanism 30 connects the pressing member 31 that abuts against the wafer W and presses, the support member 32 that is annularly attached to the top plate 22, and the pressing member 31 and the support member 32, and is extendable in the vertical direction. And a pressure bellows 33. Inside the pressing member 31, for example, a heater (not shown) that generates heat by power feeding is incorporated. Then, for example, compressed air is supplied or sucked into the interior of the pressurizing mechanism 30, that is, the internal space surrounded by the pressing member 31, the pressurizing bellows 33, the support member 32, and the top plate 22. The pressing member 31 expands and contracts and is movable in the vertical direction. In addition, since compressed air is enclosed in the pressurizing mechanism 30, the rigidity of the pressurizing bellows 33 of the pressurizing mechanism 30 is that of the shield bellows 23 of the processing container 20 so as to withstand the internal pressure of the compressed air. It is getting bigger.

  In addition, the inside of the processing container 20 and the top plate 22 are held for delivering the wafer W between the first transfer arm 100 or the second transfer arm 101 described later and the first heat treatment plate 50. An arm 40 is provided. Therefore, the holding arm 40 is movable in the vertical direction as the top plate 22 moves. For example, four holding arms 40 are provided at equal intervals on the same circumference of the wafer W, and hold the outer peripheral portion of the wafer W at four locations. As shown in FIG. 3, the holding arm 40 extends vertically downward from the top plate 22, has a lower end bent and extended inward in the horizontal direction, is supported by the support 41, and holds the wafer W. And holding part 42 to hold. The holding portion 42 protrudes inward in the horizontal direction and holds a lower surface of the outer peripheral portion of the wafer W. The guide member 44 extends vertically upward from the protruding member 43 and guides the side surface of the outer peripheral portion of the wafer W. have. In addition, the inner surface of the upper end of the guide member 44 is enlarged in a tapered shape from the lower side to the upper side.

  As shown in FIG. 2, a first heat treatment plate 50 for placing and heat-treating the wafer W at a position facing the pressurization mechanism 30 is provided inside the processing container 20 and below the pressurization mechanism 30. Is provided. The first heat treatment plate 50 has a built-in heater (not shown) that generates heat by power supply, for example. The heating temperature of the 1st heat processing board 50 is controlled by the control part 200 mentioned later, for example. Further, the holding portion 42 of the holding arm 40 is accommodated in the outer peripheral portion of the first heat treatment plate 50 in a state where the wafer W is delivered from the holding arm 40 to the first heat treatment plate 50 as shown in FIG. A notch groove 51 is formed. As shown in FIG. 1, the notch grooves 51 are formed at, for example, four locations on the outer peripheral portion of the first heat treatment plate 50.

  As shown in FIG. 2, a cooling plate 60 for cooling the wafer W is provided on the lower surface side of the first heat treatment plate 50. The cooling plate 60 incorporates a cooling member (not shown) such as a Peltier element or a water cooling jacket. The cooling temperature of the cooling plate 60 is controlled by, for example, the control unit 200 described later.

  As shown in FIGS. 1 and 2, the heat treatment unit 11 has a processing container 70 that can be sealed inside. A loading / unloading port 71 for the wafer W is formed on the side surface of the processing container 70, and a gate valve 72 is provided at the loading / unloading port 71. Further, a loading / unloading port 73 for the wafer W is formed on the side surface of the processing container 70 on the side of the bonding unit 10, and the loading / unloading port 73 is provided with the gate valve 12 described above.

  An intake port 74 is formed on the bottom surface of the processing container 70. An intake pipe 76 that communicates with a vacuum pump 75 that depressurizes the atmosphere inside the processing container 70 to a predetermined degree of vacuum is connected to the intake port 74. In this embodiment, the suction port 74, the vacuum pump 75, and the suction pipe 76 constitute a pressure reducing mechanism.

  A second heat treatment plate 80 for heat treating the wafer W is provided inside the processing container 70 and on the ceiling surface. The second heat treatment plate 80 has a built-in heater (not shown) that generates heat by power supply, for example. The heating temperature of the second heat treatment plate 80 is controlled by, for example, the control unit 200 described later. In addition, a plurality of suction ports 81 for sucking and holding the wafer W by suction are formed on the lower surface of the second heat treatment plate 80.

  A third heat treatment plate 90 that heat-treats the wafer W is provided at a position facing the second heat treatment plate 80 inside the processing container 70 and on the bottom surface. The third heat treatment plate 90 incorporates a heater (not shown) that generates heat by, for example, power feeding. The heating temperature of the third heat treatment plate 90 is controlled by, for example, the control unit 200 described later. Further, the third heat treatment plate 90 accommodates the arm portion 113 of the second transfer arm 101 in a state where the wafer W is transferred from the second transfer arm 101 to be described later to the third heat treatment plate 90. A notch groove 91 is formed. The notch groove 91 extends in the Y direction (left and right direction in FIGS. 1 and 2), and is formed in, for example, two places.

  A cooling plate 92 that cools the wafer W is provided on the lower surface side of the third heat treatment plate 90. The cooling plate 92 includes a cooling member (not shown) such as a Peltier element or a water cooling jacket. The cooling temperature of the cooling plate 92 is controlled by, for example, the control unit 200 described later.

  Between the second heat treatment plate 80 and the third heat treatment plate 90, for example, two transfer arms 100 and 101 as a driven body and a transfer unit are arranged in the vertical direction. Hereinafter, the transfer arm disposed on the upper side may be referred to as “first transfer arm 100”, and the transfer arm disposed on the lower side may be referred to as “second transfer arm 101”. The number of transfer arms is not limited to two, and may be one, for example.

  The first transfer arm 100 includes two arm portions 110 and 110 that hold the back surface of the wafer W and extend in the Y direction, and a support portion 111 that supports the arm portions 110 and 110. The arm unit 110 is disposed on the back surface of the wafer W and holds the wafer W. The support part 111 is configured to be movable in the vertical direction. Further, the support unit 111 is provided with a driving device 112 that is movable along the Y direction. With this driving device 112, the first transfer arm 100 is movable in the horizontal direction between the heat treatment unit 11 and the joining unit 10. The arm unit 110 may have, for example, an electrostatic chuck that holds the back surface of the wafer W by suction, or a claw portion that can hold the outer periphery of the wafer W.

  The second transfer arm 101 also has the same configuration as the first transfer arm 100. That is, the second transfer arm 101 includes two arm portions 113 and 113 that hold the back surface of the wafer W and extend in the Y direction, and a support portion 114 that supports the arm portions 113 and 113. Yes. The arm unit 113 is disposed on the back surface of the wafer W and holds the wafer W. The support part 114 is configured to be movable in the vertical direction. In addition, the support unit 114 is provided with a driving device 115 that is movable along the Y direction. By this driving device 115, the second transfer arm 101 is movable in the horizontal direction between the heat treatment unit 11 and the joining unit 10. The arm portion 113 may also have, for example, an electrostatic chuck that holds the back surface of the wafer W by suction, or a claw portion that can hold the outer periphery of the wafer W.

  Next, the configuration of the driving devices 112 and 115 described above will be described.

  The drive device 115 has a cylindrical hollow cylinder 120 as shown in FIGS. 4 and 5. The cylinder 120 passes through the wall portion 70a of the processing container 70 and extends in the moving direction of the second transfer arm 101 (Y direction in FIG. 4) inside the processing container 70. A sealing material, for example, a resin O-ring 121 is provided between the outer peripheral surface of the cylinder 120 and the wall portion 70a at a portion where the cylinder 120 passes through the wall portion 70a. The O-ring 121 ensures airtightness in the processing container 70. On the inner side surface of the cylinder 120, a stop groove 122 into which a stop protrusion 141 of the inner housing 140 described later is inserted is formed. The rotation stop groove 122 extends in the axial direction of the cylinder 120 (Y direction in FIG. 4).

  Inside the processing container 70 and outside the cylinder 120, an annular outer housing 130 is provided along the outer peripheral surface of the cylinder 120. The outer housing 130 supports the support part 114 of the second transfer arm 101. An outer magnet 131 is attached to the inner circumferential surface of the outer housing 130 over the entire circumference.

  Inside the processing container 70 and inside the cylinder 120, an annular inner cylinder 140 is provided along the inner peripheral surface of the cylinder 120. The inner housing 140 is provided to face the outer housing 130. The inner housing 140 is provided with two anti-rotation protrusions 141 inserted into the anti-rotation groove 122 of the cylinder 120 at both ends of the cylinder 120 in the axial direction (Y direction in FIG. 4). The rotation protrusion 141 is configured to be slidable with the rotation groove 122 as the inner housing 140 moves. In addition, when the sliding protrusion 141 needs to be made of a low sliding material, a self-lubricating material such as molybdenum disulfide or graphite, or a mixed material thereof may be used, or a roller bearing structure may be used. You may do it. The rotation of the inner housing 140 is prevented by the rotation protrusion 141 and the rotation groove 122. On the inner peripheral surface of the inner housing 140, a female screw portion 142 that is screwed into a male screw portion 152 of a guide cylinder 150 described later is formed. The female screw portion 142 has a plurality of trapezoidal female screws in a side view, for example. An inner magnet 143 is attached to the outer peripheral surface of the inner housing 140 over the entire circumference.

The outer magnet 131 and the inner magnet 143 have different polarities. Therefore, the outer magnet 131 and the inner magnet 143 are arranged so as to attract each other and face each other by magnetic force. Further, a predetermined gap D ₁ is formed between the outer magnet 131 and the cylinder 120, and a predetermined gap D ₂ is formed between the inner magnet 143 and the cylinder 120. Gap _{D 1} is a small gap of the shortest distance is for example 10μm~200μm between the outer peripheral surface of the inner peripheral surface of the cylinder 120 of the outer magnet 131. Similarly the gap _{D 2} is also a small gap of the shortest distance is for example 10μm~200μm between the outer surface and the inner circumferential surface of the cylinder 120 of the inner magnet 143.

  A cylindrical hollow guide cylinder 150 is provided in the cylinder 120. The guide cylinder 150 extends in the axial direction of the cylinder 120 (the Y direction in FIG. 4) and passes through the inside of the cylinder 120 and the inside of the inner housing 140. The guide cylinder 150 is configured to be rotatable via a bearing 151 provided between the guide cylinder 150 and the cylinder 120. The bearing 151 is provided at both ends of the cylinder 120. A male threaded portion 152 is formed on the outer peripheral surface of the guide cylinder 150. The male screw portion 152 has a plurality of trapezoidal female screws in a side view, for example. The guide cylinder 150 having such a configuration is rotationally driven around the central axis of the guide cylinder 150 by a drive unit 180 described later. Then, the inner housing 140 and the inner magnet 143 move in the direction of the central axis of the guide cylinder 150 (Y direction in FIG. 4).

  Inside the guide cylinder 150, a coolant channel 153 through which a cooling medium flows is formed. A supply housing 160 for supplying a cooling medium and a discharge housing 161 for discharging the cooling medium are provided at both ends of the refrigerant flow path 153. That is, the supply housing 160 and the discharge housing 161 are provided at both ends of the guide cylinder 150 and outside the cylinder 120. A supply pipe 162 that supplies a cooling medium is connected to the supply housing 160. A discharge pipe 163 that discharges the cooling medium is connected to the discharge housing 161. Between the supply housing 160 and the outer peripheral surface of the guide cylinder 150 and between the discharge housing 161, a sealing material, for example, a resin O-ring 164 is provided. The O-ring 164 ensures the airtightness of the cooling medium in the guide cylinder 150, and the guide cylinder 150 is rotatable. For example, cooled air or cooling water is used as the cooling medium.

A rail 170 extending along the axial direction of the cylinder 120 (the Y direction in FIG. 4) is provided on the bottom surface 70 b in the processing container 70. A bearing 171 is disposed on the rail 170, and the bearing 171 is attached to the outer housing 130. By the rail 170 and the bearing 171, the outer housing 130 is configured to be movable along the rail 170, the outer housing 130 is prevented from rotating, and the gap D ₁ is kept constant. A cooling plate 172 extending along the rail 170 is provided outside the bottom surface 70 b of the processing container 70. The cooling plate 172 incorporates a cooling member (not shown) such as a Peltier element or a water cooling jacket, and can cool the rail 170.

  A drive unit 180 that rotates the guide cylinder 150 is provided outside the processing container 70. The drive unit 180 includes a pair of pulleys 181 and 182, a belt 183 wound around the pair of pulleys 181 and 182, and a motor 184 that drives the drive pulley 181. The driven pulley 182 is attached to the outer peripheral surface of the guide cylinder 150. With this configuration, the driving unit 180 can drive the guide cylinder 150 to rotate about the central axis of the 150.

  Note that the configuration of the driving device 112 is the same as the configuration of the driving device 115 described above, and a description thereof will be omitted. However, the driving device 112 has a configuration in which the driving device 115 is inverted in the vertical direction, and is provided on the ceiling surface of the processing container 70.

  The above-described joining device 1 and the driving devices 112 and 115 are provided with a control unit 200 as shown in FIG. The control unit 200 is a computer, for example, and has a program storage unit (not shown). The program storage unit stores a program for controlling driving of the driving devices 112 and 115. In addition to this, the program storage unit stores a program for controlling the bonding process of the wafer W in the bonding apparatus 1. The program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), or a memory card. May have been installed in the control unit 200 from the storage medium H.

  Next, a method for bonding the wafer W performed using the bonding apparatus 1 configured as described above will be described together with a driving method for the driving devices 112 and 115.

  In the bonding apparatus 1, first, the gate valve 72 of the heat treatment unit 11 is opened, and the wafer W is loaded below the second heat treatment plate 80. Subsequently, as shown in FIG. 6, after the wafer W is transferred to the first transfer arm 100, the first transfer arm 100 is raised and the wafer W is brought into contact with the lower surface of the second heat treatment plate 80. . Then, the wafer W is sucked from the suction port 81 of the second heat treatment plate 80, and the wafer W is sucked and held on the lower surface of the second heat treatment plate 80. Thereafter, the gate valve 72 is closed, and the atmosphere inside the processing container 20 is reduced by the vacuum pump 75. Thereafter, the wafer W is heated to 350 ° C. by the second heat treatment plate 80, for example. When the inside of the processing container 70 is reduced to the pressure in the bonding unit 10, the suction of the wafer W from the suction port 81 is stopped. At this time, the wafer W is kept in contact with the lower surface of the second heat treatment plate 80 by the first transfer arm 100.

  When the wafer W is heated to the first temperature, the gate valve 12 is opened. Subsequently, after the first transfer arm 100 is lowered, the drive unit 112 moves the first transfer arm 100 to the bonding unit 10 as shown in FIG. 7, and the wafer W is positioned above the first heat treatment plate 50. To be transported. At this time, in the joining unit 10, the holding arm 40 stands by below the first transfer arm 100.

  The movement of the first transfer arm 100 described above is performed by driving the motor 184 of the driving unit 180 in the driving device 112. The drive of the motor 184 is transmitted to the guide cylinder 150 via the drive pulley 182, the belt 183, and the driven pulley 181. Thereby, the guide cylinder 150 rotates. When the guide cylinder 150 rotates, the male screw portion 152 of the guide cylinder 150 and the female screw portion 142 of the inner housing 140 are screwed together, so that the inner housing 140 moves in the direction of the center axis of the guide cylinder 150, that is, the joining unit 10. Move to the side. At this time, the anti-rotation protrusion 141 slides along the anti-rotation groove 122, and the inner housing 140 is prevented from rotating. As the inner magnet 143 of the inner housing 140 moves, the outer magnet 131 follows and moves. That is, the outer housing 130 moves to the joining unit 10 side. At this time, the outer housing 130 moves on the rail 170, and the rotation of the outer housing 130 is prevented. Thus, the first transfer arm 100 is moved to the bonding unit 10 by the driving device 112.

  Note that the position control of the first transfer arm 100 is controlled by the control unit 200. Specifically, an encoder signal from an encoder (not shown) attached to the female screw portion 142 of the inner housing 140 and an origin position from an origin sensor (not shown) arranged at the origin position of the inner housing 140 are obtained. The control signal is output to the control unit 200, and the position of the first transfer arm 100 is controlled by the control unit 200. In such a case, for example, position control with an accuracy of about 100 μm can be performed. Alternatively, for example, when position control of the first transfer arm 100 is performed with an accuracy of 10 μm or less, a mechanical stopper (not shown) may be disposed at the stroke end position of the outer housing 130. Here, since the driving device 112 according to the present embodiment has a structure in which the first transfer arm 100 is driven by the magnetic force attracted by the outer magnet 131 and the inner magnet 143, the outer magnet 131 is slightly overrun toward the joining unit 10 side. May occur. Even in such a case, if the position control of the first transfer arm 100 is performed as described above, it is possible to suppress the impact on the driving device 112 and an excessive load.

  Further, when the first transfer arm 100 is moved in this way, the driving device 112 causes the cooling medium to flow through the refrigerant flow path 153 in the guide cylinder 150. Thereby, even if the inside of the processing container 70 of the heat treatment unit 11 reaches a high temperature of 350 ° C., for example, the guide cylinder 150, the inner housing 140, the inner magnet 143, the outer housing 130, the outer magnet 131, and the cylinder 120 can be cooled. . Further, when the first transfer arm 100 is moved, the rail 170 and the bearing 171 are cooled by the cooling plate 172.

  Thereafter, as shown in FIG. 7, the holding arm 40 is raised, and the wafer W is transferred from the first transfer arm 100 to the holding unit 42 of the holding arm 40. At this time, since the inner side surface of the upper end of the guide member 44 of the holding portion 42 is tapered from the lower side to the upper side, for example, the wafer W on the first transfer arm 100 moves from the inner side surface of the guide member 44. Even if they are displaced, the wafer W is smoothly held by the guide member 44. Thereafter, the first transfer arm 100 is moved to the heat treatment unit 11 by the driving device 112 and the gate valve 12 is closed. The movement of the first transfer arm 100 to the heat treatment unit 11 by the driving device 112 is the same as the movement of the first transfer arm 100 to the joining unit 10 described above, but the guide housing 150 of the driving device 112 is reversed. Rotate in the direction. As a result, the inner housing 140 and the outer housing 130 move to the heat treatment unit 11 side. Note that the transfer of the wafer W from the first transfer arm 100 to the holding arm 40 may be performed by lowering the first transfer arm 100.

  Thereafter, as shown in FIG. 8, the holding arm 40 is lowered and the wafer W is placed on the first heat treatment plate 50. At this time, the holding portion 42 of the holding arm 40 is accommodated in the notch groove 51 of the first heat treatment plate 50.

  Thereafter, the wafer W is heated to, for example, 430 ° C. by the first heat treatment plate 50. The atmosphere inside the processing container 20 is maintained at a predetermined degree of vacuum, for example, 0.1 Pa.

  Thereafter, while maintaining the temperature of the wafer W at, for example, 430 ° C., compressed air is supplied to the pressurizing mechanism 30 as shown in FIG. Then, the pressing member 31 is brought into contact with the wafer W, and the wafer W is pressed toward the first heat treatment plate 50 with a predetermined load, for example, 50 kN. Then, the wafer W is pressed for a predetermined time, for example, 10 minutes, and the wafer W is bonded. Note that the temperature of the wafer W may be maintained using, for example, a heater or a cooling plate 60 in the pressing member 31.

  Thereafter, the wafer W is cooled to, for example, 350 ° C. by the first heat treatment plate 50. For cooling the wafer W, for example, a heater in the pressing member 31 or a cooling plate 60 may be used.

  When the wafer W is cooled to 350 ° C., for example, the holding arm 40 is raised, and the wafer W is transferred from the first heat treatment plate 50 to the holding arm 40. Subsequently, the gate valve 74 is opened. Then, as shown in FIG. 10, the second transfer arm 101 is moved below the holding arm 40 and above the first heat treatment plate 50 by the driving device 115. Since the driving of the second transfer arm 101 at this time is the same as the driving of the first transfer arm 100 by the driving device 112 described above, the description thereof is omitted.

  Thereafter, as shown in FIG. 10, the holding arm 40 is lowered, and the wafer W is transferred from the holding arm 40 to the second transfer arm 101. Thereafter, the second transfer arm 101 is moved to the heat treatment unit 11 and the gate valve 12 is closed. Since the driving of the second transfer arm 101 at this time is the same as the driving of the first transfer arm 100 by the transfer arm 112 described above, the description thereof is omitted. Note that the transfer of the wafer W from the holding arm 40 to the second transfer arm 101 may be performed by raising the second transfer arm 101.

  Thereafter, as shown in FIG. 11, the second transfer arm 101 is lowered and the wafer W is placed on the third heat treatment plate 90. At this time, the arm portion 113 of the second transfer arm 101 is accommodated in the notch groove 91 of the third heat treatment plate 90. Then, the wafer W is cooled to, for example, 200 ° C. by the third heat treatment plate 90. At this time, the wafer W may be cooled by the cooling plate 92.

  Thereafter, the second transfer arm 101 is raised, and the wafer W is transferred from the third heat treatment plate 90 to the second transfer arm 101. Further, after releasing the pressure in the heat treatment unit 11 to atmospheric pressure, the gate valve 72 is subsequently opened, and the wafer W is unloaded from the bonding apparatus 1. In this way, a series of wafer W joining processes are completed.

According to the above embodiment, since the outer magnet 131 and the inner magnet 143 are arranged to face each other and have different polarities, the outer magnet 131 moves following the movement of the inner magnet 143. That is, when the inner housing 140 is moved by the drive unit 180 having the motor 184, the outer housing 130 is also moved accordingly. At this time, a predetermined clearance D ₁ is formed between the outer magnet 131 and the cylinder 120, since between the inner magnet 143 and the cylinder 120 a predetermined gap D ₂ is formed, the outer housing 130 and inner The housing 140 can move smoothly and dust generation can be suppressed. Especially between the outer magnet 131 and the cylinder 121 by a gap D _1, it is not necessary to provide a grease for smooth movement of the outer magnet 131, it can be suppressed dusting. Furthermore, since the highly dust-generating motor 184 is provided outside the processing container 70, dust generation in the processing container 70 can be further suppressed. Therefore, the cleanliness of the atmosphere in the processing container 70 can be improved, and the adhesion of dust to the wafer W and the transfer arms 100 and 101 can be suppressed.

  In addition, since the motor 184 of the driving unit 180 having low heat resistance is provided outside the processing container 70, the driving unit 180 can be used with a long life even if the inside of the processing container 70 becomes high temperature. Further, since the cooling medium is circulated through the refrigerant flow path 153 in the guide cylinder 150, the guide cylinder 150, the inner housing 140, the inner magnet 143, the outer housing 130, the outer magnet 131, and the cylinder 120 can be cooled. Can be used with a long service life. Furthermore, the rail 170 and the bearing 171 can be cooled by the cooling plate 170, and these can be used with a long life. As described above, the driving devices 112 and 115 of the present invention can be used with a long life even in a high temperature atmosphere of, for example, 200 ° C. or higher.

  Further, only the cylinder 120 and the outer housing 130 exist as the driving devices 112 and 115 in the processing container 70. For this reason, since the volume in the processing container 70 can be reduced as compared with the case where a drive unit such as a motor is disposed in the processing container as in the prior art, the processing container 70 is evacuated to a predetermined degree of vacuum. Time can be shortened. Thereby, the throughput of the bonding process of the wafer W process is improved.

  Moreover, since the cooling medium flows in the guide cylinder 150 that is not exposed in the processing container 70, the degree of vacuum of the atmosphere in the processing container 70 due to leakage of the cooling medium does not decrease.

  Further, since the driving unit 180 is provided outside the processing container 70, maintenance of the pulleys 181 and 182, the belt 183, and the motor 184 of the driving unit 180 can be performed without opening the processing container 70. Therefore, maintenance labor can be greatly reduced.

  In the bonding apparatus 1, while the bonding process is performed on one wafer W in the bonding unit 10, heat treatment by the second heat treatment plate 80 or the third heat treatment plate 90 is performed on another wafer W in the heat treatment unit 11. Post heat treatment is performed. Thus, in one bonding apparatus 1, processing for two wafers W is performed in parallel. As described above, according to the present embodiment, since the two wafers W can be processed efficiently at the same time, the throughput of the wafer bonding process can be improved.

  In the above embodiment, the female screw portion 142 of the inner housing 140 and the male screw portion 152 of the guide cylinder 150 have trapezoidal screws in a side view, but the shape of the screws is not limited to this and is various. The shape can be taken. For example, when high accuracy is required for the movement of the transfer arms 100 and 101, for example, a ball screw can be used.

  In the above embodiment, the rail 170 and the bearing 171 are cooled by the cooling plate 172. However, instead of the cooling plate 172, a heat shield plate (not shown) that separates the rail 170 and the bearing 171 may be provided. Good.

  In the above embodiment, the driving device 112 supports one end of the first transfer arm 100. However, two similar driving devices 112 are provided in the processing container 70, and these driving devices 112, 112 are the first ones. You may make it support the both ends of one conveyance arm 100. FIG. Similarly, two drive devices 115 may be provided in the processing container 70 so that the drive devices 115 and 115 support both ends of the second transfer arm 101. In such a case, even when the mass of the driven body is large, the driven body can be appropriately conveyed.

  Although the driving device 112 according to the above embodiment moves the first transfer arm 100 in the horizontal direction, the first transfer arm 100 may be moved in the vertical direction. That is, the driving device 112 can be applied to the support portion 111 that is movable in the vertical direction. Similarly, the driving device 115 can be applied to the support portion 114 of the second transfer arm 101.

  In the bonding apparatus 1 of the above embodiment, the second heat treatment plate 80 and the third heat treatment plate 90 are provided in the same heat treatment unit 11, but these second heat treatment plate 80 and third heat treatment plate are provided. 90 may be provided in different heat treatment units. In such a case, the two heat treatment units are hermetically connected to the joining unit 10 respectively. In addition, the driving device 115 is provided in each of the two heat treatment units. The second heat treatment plate 80 and the third heat treatment plate 90 themselves can be moved between the heat treatment unit and the joining unit 10 by the driving device 115. Even in such a case, the same effects as those of the above-described embodiment can be enjoyed.

  The drive unit 180 of the drive devices 112 and 115 of the above embodiment is not limited to the configuration of the above embodiment, and can have various configurations. Hereinafter, other embodiments of the driving device 115 will be described. However, the configuration of the driving device 112 may be the same as that of the driving device 115 described below.

  For example, as shown in FIGS. 12 and 13, the drive unit 300 of the drive device 115 may have a pair of pulleys 301 and 302 provided at both ends of the cylinder 120. The pair of pulleys 301 and 302 constitutes a driving pulley 301 and a driven pulley 302 provided with a motor (not shown), for example. A drive belt 303 is wound around the pair of pulleys 301 and 302. The drive belt 303 extends inside the cylinder 120 in the axial direction of the cylinder 120 (Y direction in FIG. 12), and passes through the inside of the inner housing 140. The driving belt 303 is provided with a fixing member 304 for attaching the inner housing 140 to the driving belt 303. The fixing member 304 fixes the drive belt 303 and the inner housing 140 so that the upper surface of the drive belt 303 and the inner peripheral surface of the inner housing 140 are in contact with each other. For this reason, the internal thread part 142 of the inner side housing 140 of the said embodiment can be abbreviate | omitted.

  In the cylinder 120, as shown in FIGS. 13 and 14, for example, two hollow cylindrical guide cylinders 310 are provided. The guide cylinder 310 extends in the axial direction of the cylinder 120 and passes through the inside of the cylinder 120 and the inside of the inner housing 140. A bearing 311 is provided between the guide cylinder 310 and the inner housing 140.

  Inside the guide cylinder 310, a coolant channel 312 through which a cooling medium flows is formed. Housings (not shown) having the same configuration as the supply housing 161 and the discharge housing 162 of the above embodiment are provided at both ends of the refrigerant flow path 312. The guide cylinder 310 cools the guide cylinder 150, the inner housing 140, the inner magnet 143, the outer housing 130, the outer magnet 131, and the cylinder 120, and also functions to prevent the inner housing 140 from rotating. Therefore, the anti-rotation groove 122 of the cylinder 120 and the anti-rotation protrusion 141 of the inner housing 140 according to the above embodiment can be omitted.

  Note that the other configuration of the driving device 115 is the same as that of the above embodiment, and thus the description thereof is omitted. Even in such a case, the same effects as those of the above-described embodiment can be enjoyed.

  For example, as shown in FIGS. 15 and 16, the driving unit 400 of the driving device 115 may supply gas from the end of the cylinder 120 to move the inner housing 140. The drive part 400 has a sealing part 401 provided between the cylinder 120 and the guide ring 150 in order to seal both ends of the cylinder 120. Between the outer peripheral surface of the sealing portion 401 and the inner peripheral surface of the cylinder 120, a sealing material, for example, a resin O-ring 402 is provided. Further, a sealing material, for example, an O-ring 403 is provided between the inner peripheral surface of the sealing portion 401 and the outer peripheral surface of the guide ring 150. These O-rings 402 and 403 ensure airtightness in the cylinder 120.

  The sealing portion 401 is formed with a gas inflow / outflow port 404 for supplying or discharging a gas, for example, an inert gas, into the cylinder 120. That is, the gas inlet / outlet 404 is formed at both ends of the cylinder 120. The gas inlet / outlet 120 is connected to a gas supply source (not shown) for supplying gas to the gas inlet / outlet. Then, for example, when gas is supplied from the gas inlet / outlet 404 at one end of the cylinder 120 (Y direction negative direction side in FIG. 15), the inner housing 140 moves to the Y direction positive direction side, The gas is discharged from the gas inflow / outlet 404 at the end (the Y direction positive direction side in FIG. 15). On the other hand, when gas is supplied from the gas inlet / outlet 404 at the other end of the cylinder 120 (Y direction positive direction side in FIG. 15), the inner housing 140 moves to the Y direction negative direction side, Gas is discharged from the gas inlet / outlet 404 at the end (the Y direction negative direction side in FIG. 15). Thus, since the drive part 400 moves the inner housing 140 with gas, the internal thread part 142 of the internal housing 140 of the said embodiment and the external thread part 152 of the guide cylinder 150 can be abbreviate | omitted.

  The inner housing 140 is provided with a sealing material 410 at both ends of the cylinder 120 in the axial direction (Y direction in FIG. 15). The sealing material 410 is provided so as to seal between the cylinder 120 and the guide cylinder 150. The seal material 410 prevents the gas supplied from the gas inflow / outlet 404 from flowing out to the downstream side of the inner housing 140, and allows the inner housing 140 to move appropriately. The sealing material 410 also functions to prevent the inner housing 140 from rotating. Therefore, the anti-rotation groove 122 of the cylinder 120 and the anti-rotation protrusion 141 of the inner housing 140 in the above embodiment can be omitted.

  Note that the gas supplied from the gas inlet / outlet 404 may be cooled to a predetermined temperature. In such a case, the cylinder 120, the guide cylinder 150, the inner housing 140, the inner magnet 143, the outer housing 130, and the outer magnet 131 can be cooled. In addition, since the cooling medium also flows through the coolant channel 153 in the guide cylinder 150, the guide cylinder 150, the inner housing 140, the inner magnet 143, the outer housing 130, and the outer magnet 131 can be efficiently cooled. Therefore, the driving device 115 can be used with a long life.

  Note that the other configuration of the driving device 115 is the same as that of the above embodiment, and thus the description thereof is omitted. Even in such a case, the same effects as those of the above-described embodiment can be enjoyed.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.
The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask. The drive device of the present invention can also be applied to a processing container that requires high cleanliness, such as a medical device. Furthermore, the driving device of the present invention can be applied not only to the transfer arm and the heat treatment plate but also to other various driven bodies such as an ultraviolet irradiation lamp and a treatment liquid coating nozzle.

DESCRIPTION OF SYMBOLS 1 Joining apparatus 10 Joining unit 11 Heat processing unit 20 Processing container 25 Intake port 26 Vacuum pump 27 Intake pipe 30 Pressurizing mechanism 50 First heat treatment plate 70 Processing container 74 Inlet port 75 Vacuum pump 76 Intake pipe 80 Second heat treatment plate 90 Third heat treatment plate 100 First transfer arm 101 Second transfer arm 112, 115 Drive device 120 Cylinder 122 Stop groove 130 Outer housing 131 Outer magnet 140 Inner housing 141 Stop projection part 142 Female screw part 143 Inner magnet 150 Guide cylinder 152 Male thread part 153 Refrigerant flow path 170 Rail 171 Bearing 172 Cooling plate 180 Drive part 300 Drive part 301 Drive pulley 302 Driven pulley 303 Drive belt 310 Guide cylinder 311 Bearing 312 Refrigerant flow path 400 drive unit 404 gas inflow outlet 410 sealant D _{1, D 2} gap W wafer

Claims (12)

A driving device for moving a driven body in a processing container whose internal atmosphere is vacuum and high temperature,
A cylinder that penetrates the wall of the processing vessel and extends in the direction of movement of the driven body inside the processing vessel;
An outer housing that is provided annularly along the outer peripheral surface of the cylinder on the outside of the cylinder and supports the driven body;
An inner housing that faces the outer housing and is annularly provided inside the cylinder along the inner surface of the cylinder;
A drive unit provided outside the processing container and moving the inner housing in the axial direction of the cylinder;
An outer magnet is attached to the inner peripheral surface of the outer housing,
An inner magnet is attached to the outer peripheral surface of the inner housing,
The outer magnet and the inner magnet are arranged opposite to each other and have different polarities;
A driving device, wherein predetermined gaps are formed between the outer magnet and the cylinder and between the inner magnet and the cylinder, respectively. In the cylinder, a guide cylinder extending in the axial direction of the cylinder and passing through the inside of the inner housing is provided,
A male screw portion is formed on the outer peripheral surface of the guide cylinder,
On the inner peripheral surface of the inner housing, a female screw part that is screwed into the male screw part is formed,
2. The driving apparatus according to claim 1, wherein the driving unit rotates the guide cylinder about a central axis of the guide cylinder to move the inner housing in the central axis direction. The drive device according to claim 2, wherein a coolant channel through which a cooling medium flows is formed inside the guide cylinder. On the inner surface of the cylinder, a stop groove extending in the axial direction of the cylinder is formed,
4. The driving device according to claim 2, wherein both the end portions of the inner housing are provided with rotation stop projections that are slidable with the rotation stop groove. 5. The drive unit has a pair of pulleys provided at both ends of the cylinder,
In the cylinder, a drive belt is provided which is inserted through the inside of the inner housing and wound around the pair of pulleys.
The drive device according to claim 1, wherein the inner housing is attached to the drive belt. In the cylinder, a guide cylinder extending in the axial direction of the cylinder and passing through the inside of the inner housing is provided,
The drive device according to claim 5, wherein a bearing is disposed between the inner housing and the guide cylinder. The drive device according to claim 6, wherein a coolant channel through which a cooling medium flows is formed inside the guide cylinder. In the cylinder, a guide cylinder extending in the axial direction of the cylinder and passing through the inside of the inner housing is provided,
The drive unit supplies gas from an end of the cylinder, moves the inner housing,
The drive device according to claim 1, wherein seal members for sealing between the cylinder and the guide cylinder are provided at both ends of the inner housing. The driving apparatus according to claim 8, wherein the gas supplied from the driving unit is cooled to a predetermined temperature. The drive device according to claim 8 or 9, wherein a coolant channel through which a cooling medium flows is formed inside the guide cylinder. A rail extending along the cylinder is provided in the processing container,
The outer housing is configured to be movable on the rail via a bearing, and a cooling plate that extends along the rail and cools the rail is provided outside the processing container. The drive device according to any one of claims 1 to 10. A drive device comprising the drive device according to claim 1, and a bonding device for bonding substrates,
A bonding unit including a heat treatment plate for heat treating the substrate, a pressure mechanism for pressing the substrate on the heat treatment plate toward the heat treatment plate, and a pressure reduction mechanism for reducing the internal atmosphere to a predetermined degree of vacuum;
A heat treatment plate provided with a heat treatment plate for heat treating the substrate and a decompression mechanism for depressurizing the internal atmosphere to a predetermined degree of vacuum,
The joining unit and the heat treatment unit are hermetically connected,
The said drive device moves the conveyance part which conveys a board | substrate between the said joining unit and the said heat processing unit, The joining apparatus characterized by the above-mentioned.

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