JP2011192943A5 - - Google Patents

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Publication number
JP2011192943A5
JP2011192943A5 JP2010060165A JP2010060165A JP2011192943A5 JP 2011192943 A5 JP2011192943 A5 JP 2011192943A5 JP 2010060165 A JP2010060165 A JP 2010060165A JP 2010060165 A JP2010060165 A JP 2010060165A JP 2011192943 A5 JP2011192943 A5 JP 2011192943A5
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JP
Japan
Prior art keywords
chip
holding member
circuit board
semiconductor
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010060165A
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English (en)
Japanese (ja)
Other versions
JP5558874B2 (ja
JP2011192943A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010060165A priority Critical patent/JP5558874B2/ja
Priority claimed from JP2010060165A external-priority patent/JP5558874B2/ja
Publication of JP2011192943A publication Critical patent/JP2011192943A/ja
Publication of JP2011192943A5 publication Critical patent/JP2011192943A5/ja
Application granted granted Critical
Publication of JP5558874B2 publication Critical patent/JP5558874B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010060165A 2010-03-17 2010-03-17 チップ搬送装置 Active JP5558874B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010060165A JP5558874B2 (ja) 2010-03-17 2010-03-17 チップ搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010060165A JP5558874B2 (ja) 2010-03-17 2010-03-17 チップ搬送装置

Publications (3)

Publication Number Publication Date
JP2011192943A JP2011192943A (ja) 2011-09-29
JP2011192943A5 true JP2011192943A5 (zh) 2013-04-18
JP5558874B2 JP5558874B2 (ja) 2014-07-23

Family

ID=44797529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010060165A Active JP5558874B2 (ja) 2010-03-17 2010-03-17 チップ搬送装置

Country Status (1)

Country Link
JP (1) JP5558874B2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5973753B2 (ja) * 2012-03-08 2016-08-23 東レエンジニアリング株式会社 チップ受け渡し治具およびチップ受け渡し方法
KR101900477B1 (ko) * 2012-04-20 2018-09-19 (주)큐엠씨 전자 소자 분류장치
JP2014053517A (ja) * 2012-09-10 2014-03-20 Hitachi High-Tech Instruments Co Ltd 受渡用ステージ及びダイピックアップ装置並びにダイボンディング装置
JP6266275B2 (ja) * 2013-09-09 2018-01-24 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
CN108511329B (zh) * 2018-06-15 2024-03-15 德阳帛汉电子有限公司 一种芯片清洗装置

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