JP2011192683A - Package for semiconductor device and semiconductor device, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent cracking and chipping of a mold resin during manufacture of a semiconductor device through an easy process. <P>SOLUTION: The mold resin 3 is provided with a recess 9 in which one surface of a hanger lead 1 is completely exposed, thereby preventing cracking and chipping of the mold resin 3 from occurring when separated from the hanger lead 1 by moving the hanger lead 1 in a direction where the mold resin 3 is not present. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a package for a semiconductor device in which a lead frame is held by a mold resin, a semiconductor device using the package, and a manufacturing method thereof.

Conventionally, a hanger lead is used to support the mold resin, and the entire surface of the tip of the hanger lead is bitten into the mold resin to support the mold resin.
FIG. 6 is a diagram showing the configuration of a conventional semiconductor device, FIG. 6A is a plan view showing the configuration of a conventional lead frame, and FIG. 6B is a cross-sectional view showing the configuration of the conventional semiconductor device. .

  As shown in FIG. 6, the lead frame 2 is formed by punching or etching a single metal plate, and is formed as a multiple lead frame in which a plurality of lead frames 2 used in one semiconductor device are integrated. ing. Each lead frame 2 includes an inner lead 4, an outer lead 5, and a semiconductor element 6 mounting region provided on the inner lead 4. Further, as shown in FIG. 6B, the semiconductor device holds the semiconductor element 6 mounted in the mounting region of the lead frame 2, the inner lead, the metal thin wire 7 connecting the semiconductor element 6, and the lead frame 2, It is formed from a mold resin 3 that seals the semiconductor element 6 and the fine metal wire 7. Furthermore, the hanger lead 1 is provided on the lead frame 2 in order to support the mold resin 3 when the mold resin 3 is formed. The hanger lead 1 is formed with a pull-out type hanger lead 1 a protruding from the lead frame 2 toward the mold resin 3.

  The pull-out type hanger lead 1a is set to a length that reaches at least a portion where the tip is completely sealed with the mold resin 3, and the shape thereof can be easily pulled out in the suspension pin cutting step. Are formed parallel to the drawing direction (see, for example, Patent Document 1).

JP-A-3-105959

  However, in the above-described conventional configuration, as a process after the outer lead 5 is cut, the connecting portion with the lead frame 2 on the opposite side of the tip of the pull-out type hanger lead 1a is cut, so that the pull-out type hanger lead 1a is formed. There was a problem that it was necessary to create a gap for drawing. Therefore, a cutting process is required before the drawing process. In addition, there is a problem that metal debris is generated by cutting.

  In addition, when pulling out the pull-out type hanger lead, if the pull-out type hanger lead 1a is not pulled in parallel with high accuracy, the pull-out type hanger lead 1a will be caught by the mold resin 3, and the mold resin 3 will be scraped off, resulting in cracks and chips. Was.

  An object of the present invention is to solve the above-mentioned conventional problems, and to prevent cracking and chipping of a mold resin during the manufacture of a semiconductor device by an easy process.

  In order to achieve the above object, a package for a semiconductor device according to the present invention includes a lead frame having a semiconductor element mounting surface, a mold resin integrally formed with the lead frame, and a parting line on a side surface of the mold resin. It has the recessed part formed in a direction, It is characterized by the above-mentioned.

The concave portion may be provided on the semiconductor element mounting surface side from the parting line.
Further, it is preferable that one surface of the hanger lead provided to hold the mold resin from the concave portion is completely exposed when the mold resin is formed.

Moreover, it is preferable that the width | variety of the direction parallel to the said side surface of the said recessed part becomes large as it leaves | separates from the said parting line.
Furthermore, the semiconductor device of the present invention includes a lead frame having a semiconductor element mounting surface, a mold resin integrally formed with the lead frame, a semiconductor element placed on the semiconductor element mounting surface, the semiconductor element, A conductive material for electrically connecting the lead frame, a sealing resin for sealing the semiconductor element and the conductive material, and a recess formed in one direction from a parting line on a side surface of the mold resin. And

  Furthermore, the method for manufacturing a package for a semiconductor device according to the present invention includes a step of inserting a lead frame to which a hanger lead is connected into a mold to mold a mold resin, and an external process from the lead frame protruding from the mold resin. A step of forming a terminal and a step of separating the hanger lead, and forming a recess on a side surface of the mold resin so that the entire surface of the hanger lead is exposed during the molding resin molding. And

  Further, the method for manufacturing a semiconductor device of the present invention includes a step of inserting a lead frame connected with a hanger lead into a mold to mold a mold resin, and an external terminal from the lead frame protruding from the mold resin. Forming, separating the hanger leads, placing a semiconductor element on the lead frame, electrically connecting the semiconductor element and the lead frame with a conductive material, and the semiconductor element And a step of resin-sealing the conductive material, wherein a concave portion is formed on a side surface of the mold resin so that the entire surface of one surface of the hanger lead is exposed during the molding resin molding.

  As described above, it is possible to prevent the mold resin from being cracked or chipped at the time of manufacturing the semiconductor device by an easy process.

  As described above, according to the present invention, when the mold resin is provided with a recess in which one surface of the hanger lead is completely exposed, the hanger lead is moved in a direction where there is no mold resin to separate the mold resin from the hanger lead. It is possible to prevent cracks and chips from occurring in the mold resin.

The figure which shows the structure of the package for semiconductor devices of this invention The figure which shows the structure of the semiconductor device of this invention 8A and 8B illustrate a semiconductor device package and a semiconductor device manufacturing method according to the second embodiment. 8A and 8B illustrate a semiconductor device package and a semiconductor device manufacturing method according to the second embodiment. The figure explaining the process of taking out the package for semiconductor devices from a metal mold | die The figure which shows the structure of the conventional semiconductor device

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
A semiconductor device package of the present invention will be described with reference to FIGS.

  1A and 1B are diagrams showing a configuration of a package for a semiconductor device according to the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line A-A 'of FIG. 2A and 2B are diagrams showing the configuration of the semiconductor device of the present invention, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along the line A-A 'in FIG.

  As shown in FIG. 1, the package for a semiconductor device of the present invention includes a lead frame 2 and a mold resin 3 that holds the lead frame 2 while opening a cavity region. The lead frame 2 includes a plurality of leads in which an inner lead 4 and an outer lead 5 serving as an external terminal are integrally formed, and each lead is electrically independent from each other. Further, at least one of the inner leads 4 is provided with a mounting region for mounting the semiconductor element 6, and the inner leads 4 may not be connected to the outer leads 5. The remaining inner lead 4 is provided with a connection region with a conductive material such as a thin metal wire 7, and the outer lead 5 electrically connected to the inner lead 4 functions as an external terminal. Further, the semiconductor device package is provided with a hanger lead 1 that supports the mold resin 3 during the manufacture of the semiconductor device package. With the mounting surface of the semiconductor element 6 of the lead frame 2 as the upper surface, a recess 9 is provided in the upper surface portion from the hanger lead 1 of the mold resin 3 so that the hanger lead 1 is completely exposed in the upper surface direction. Then, after forming the mold resin 3, the hanger lead 1 is separated to form a package for a semiconductor device.

  As shown in FIG. 2, after mounting the semiconductor element 6 on the mounting portion of such a package for a semiconductor device and electrically connecting the connection portion of the semiconductor element 6 and the inner lead 4 with the thin metal wire 7. The semiconductor device is formed by sealing the semiconductor element 6 and the inner lead 4 with the sealing resin 8 in the cavity.

Hereinafter, the recess 9 will be described in detail.
As shown in FIG. 1 and FIG. 2, the upper mold 13 (see FIG. 3) and the lower mold 12 (see FIG. 3) are formed on the side surface of the mold resin 3 integrally molded with the lead frame 2 during injection molding. A parting line 14 that is a seam of the reference part), and a recess 9 is provided on the upper surface of the semiconductor element mounting surface side from the parting line 14. The depth of the recess 9 is 0.03 mm to 0.2 mm from the side surface of the mold resin 3. As a result, the hanger lead 1 is in close contact with the recess 9 and does not easily fall off from the recess 9. The end of the hanger lead 1 is placed on the bottom surface of the recess 9. Further, the concave portion 9 is formed so as to expand from the parting line 14 to the upper surface of the mold resin 3 toward the upper surface side, and the hanger lead 1 is completely exposed by the concave portion 9.

  According to this configuration, when the mold resin 3 integrally molded with the lead frame 2 is released from the mold, the hanger lead 1 can be easily separated from the mold without hindering the separation, and the mold resin 3, the hanger lead 1 can be easily separated by separating the hanger lead 1 along the recess 9. Therefore, it is possible to suppress the hanger lead 1 from coming into contact with the mold resin 3 at the time of separation of the hanger lead 1, and it is possible to prevent generation of metal debris without causing cracks or chipping of the mold resin 3.

  Furthermore, in recent years, there is a tendency that the area required for releasing the injection molded mold resin 3 with the ejector pin cannot be secured in the package portion for the semiconductor device in connection with the miniaturization and thinning which are also market demands. According to the present invention, since the stress in the lower surface direction and the direction in which the ejector pin is pushed up are the same, it is possible to easily release the hanger lead 1 from the mold by making the hanger lead 1 push up with the ejector pin. .

In addition, although the recessed part 9 is provided in the semiconductor element mounting surface side from the parting line 14, you may provide in the reverse side from the parting line 14. FIG.
The depth of the recess 9 may be 0.2 mm or more from the side surface of the mold resin 3.

Even if the width of the recess 9 is smaller than the width of the mold resin 3, it is sufficient that the hanger lead 1 can be completely exposed.
(Embodiment 2)
Next, the semiconductor device package and the method for manufacturing the semiconductor device of the present invention will be described with reference to FIGS.

  FIGS. 3 and 4 are diagrams for explaining a semiconductor device package and a method for manufacturing the semiconductor device according to the second embodiment. FIG. 3A is a diagram showing a molding resin forming process of the semiconductor device package. FIG. 3B is a cross-sectional view showing the mounting process of the semiconductor elements, FIG. 3C is a plan view showing the mounting process of the semiconductor elements, and FIG. 4A is a diagram for explaining the outer lead cutting process. ) Is a cross-sectional view showing a hanger lead separation step, and FIG. 4C is a view showing a side structure of a recess.

  First, when manufacturing a package for a semiconductor device, a molding resin 3 is formed on the lead frame 2 using an injection molding apparatus including an upper mold 13 and a lower mold 14. Specifically, as shown in FIG. 3A, the upper mold 13 and the lower mold 12 are inserted so that the lead frame 2 is inserted into a space formed when the upper mold 13 and the lower mold 12 are in close contact with each other. And the injected resin is poured into the space through the sprue 10 to mold the mold resin 3.

  At this time, the lower mold 12 where the hanger lead 1 is inserted has a partially protruding structure toward the inside, and this protrusion forms a part of the outer periphery of the mold resin 3 to form a recess 9. . This protrusion is formed with a length of 0.03 mm to 0.2 mm. By this recess 9, the tip of the hanger lead 1 inserted in the mold resin 3 is surrounded by the mold resin 3 on the side opposite to the side of the hanger lead 1 and the element mounting side. The structure is exposed without contacting the resin 3.

  Next, as shown in FIG. 3B, the semiconductor element 6 is mounted on the inner lead 4, and the connecting portion of the inner lead 4 and the semiconductor element 6 are electrically connected by the metal thin wire 7. Further, the sealing resin 8 is injected into the element mounting side of the mold resin 3 to protect the semiconductor element 6.

  In this state, as shown in FIG. 3C, the mold resin 3 is supported by the outer leads 5 continuous from the lead frame 2 toward the mold resin 3 and the hanger leads 1 inserted into the recesses 9 of the mold resin 3. Has been.

  Next, as shown in FIG. 4A, the outer leads 5 are cut to form external terminals. In this state, the mold resin 3 is connected to the lead frame 2 only by the hanger lead 1.

  Finally, the mold resin 3 is separated from the hanger lead 1. As shown in FIG. 4B, by applying stress to the mold resin 3 or against the hanger lead 1, the hanger lead 1 is moved along the recess 9. The semiconductor device is completed by being moved and separated from the mold resin 3.

  At this time, the hanger lead 1 is moved along the concave portion 9 by applying a stress such that the hanger lead 1 moves from the semiconductor device toward the upper surface, which is the mounting surface. It can be separated without receiving resistance and without cutting the mold resin 3.

  In the semiconductor device manufactured as described above, since the element mounting side of the hanger lead 1 is not surrounded by the mold resin 3 due to the recess 9, the mold resin 3 is dropped from the hanger lead 1 when the element mounting side is turned up. However, since the mold resin 3 is made by injection molding, the resin melted at the time of injection molding surrounds the three surfaces of the hanger lead 1 in the mold, so the mold resin 3 and the hanger lead are Close contact. Further, as a feature of the injection molded product, a product cooled immediately after molding has a property of causing resin shrinkage and shrinking more than immediately after molding. Therefore, the concave portion 9 of the mold resin 3 that is in contact with the side surface of the hanger lead 1 comes into contact with the hanger lead 1 so that the mold resin 3 does not easily fall off.

  On the contrary, when stress is applied to the hanger lead 1 in order to remove the hanger lead 1, it is expected that the hanger lead 1 will not easily come off due to resin shrinkage, and the mold resin 3 will be scraped. The lower mold 12 that forms the recess 9 is made to expand from the hanger lead 1 side toward the upper surface side of the mold resin 3. Therefore, as shown in FIG. 4C, the recess 9 has a width L on the upper surface side of the recess 9 larger than a width l on the padding line 14 side, and the hanger lead 1 is separated while scraping the mold resin 3. There is nothing.

Next, the process of taking out the semiconductor device package from the mold will be described with reference to FIG.
FIG. 5 is a view for explaining a process of taking out the package for the semiconductor device from the mold.

  As shown in FIG. 5, when the mold resin 3 formed by the lower mold 12 and the upper mold 13 is released from the lower mold 12, the hanger lead 1 inserted into the mold resin is pushed up by the ejector pins 11. At this time, when the ejector pin 11 is pushed up, the stress applied to the hanger lead 1 works in the lower surface direction, and the hanger lead 1 is held on the bottom surface of the recess 9, so that there is an advantage that the hanger lead 1 is difficult to come off. Even when the size and thickness are reduced and a region where the mold resin 3 is pushed up cannot be secured, the mold resin 3 can be released from the mold 12 by pushing up the hanger lead 1.

  When the hanger lead 1 is separated, the hanger lead 1 moves along the concave portion 9 by applying a stress in the upper surface direction contrary to the previous case, so that resistance to the mold resin 3 can be easily achieved. It can isolate | separate without giving and it can prevent that a mold resin 3 produces a crack and a chip.

  The present invention is an easy process that can prevent cracking and chipping of a mold resin during manufacture of a semiconductor device, and a semiconductor device package in which a lead frame is held by the mold resin, a semiconductor device using the same, It is useful for the manufacturing method thereof.

DESCRIPTION OF SYMBOLS 1 Hanger lead 1a Pull-out type hanger lead 2 Lead frame 3 Mold resin 4 Inner lead 5 Outer lead 6 Semiconductor element 7 Metal fine wire 8 Sealing resin 9 Recess 10 Sprue 11 Ejector pin 12 Lower die 13 Upper die 14 Parting line

Claims (10)

A lead frame having a semiconductor element mounting surface;
Mold resin integrally molded with the lead frame;
A package for a semiconductor device, comprising a recess formed in one direction from a parting line on a side surface of the mold resin.   2. The package for a semiconductor device according to claim 1, wherein the recess is provided on the semiconductor element mounting surface side from the parting line.   The said recessed part is a shape which one surface of the hanger lead provided in order to hold | maintain the said mold resin in the case of formation of the said mold resin is completely exposed from the said recessed part. A package for a semiconductor device according to any one of the above.   4. The package for a semiconductor device according to claim 1, wherein a width of the concave portion in a direction parallel to the side surface increases as the distance from the parting line increases. 5. A lead frame having a semiconductor element mounting surface;
Mold resin integrally molded with the lead frame;
A semiconductor element mounted on the semiconductor element mounting surface;
A conductive material for electrically connecting the semiconductor element and the lead frame;
A sealing resin for sealing the semiconductor element and the conductive material;
A semiconductor device having a recess formed in one direction from a parting line on a side surface of the mold resin.   6. The semiconductor device according to claim 5, wherein the concave portion is provided on a semiconductor element mounting surface side from the parting line.   The said recessed part is a shape where one surface of the hanger lead provided in order to hold | maintain the said mold resin in the case of formation of the said mold resin is completely exposed from the said recessed part. The semiconductor device according to any one of the above.   8. The semiconductor device according to claim 5, wherein a width of the recess in a direction parallel to the side surface increases as the distance from the parting line increases. 9. Inserting a lead frame to which a hanger lead is connected into a mold and molding a mold resin; and
Forming an external terminal from the lead frame protruding from the mold resin;
A step of separating the hanger lead, and forming a recess on a side surface of the mold resin so that an entire surface of the hanger lead is exposed during the molding resin molding. Production method. Inserting a lead frame to which a hanger lead is connected into a mold and molding a mold resin; and
Forming an external terminal from the lead frame protruding from the mold resin;
Separating the hanger leads;
Placing a semiconductor element on the lead frame;
Electrically connecting the semiconductor element and the lead frame with a conductive material;
A step of resin-sealing the semiconductor element and the conductive material, and forming a recess on a side surface of the mold resin so that the entire surface of one surface of the hanger lead is exposed during the molding resin molding. A method for manufacturing a semiconductor device.

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