JP2011187727A - Assembling apparatus of solar cell module and method for assembling the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a brittle solar battery cell breaks in the conventional bonding apparatus, since a large pressurizing force is required in bonding by an adhesive resin containing conductive particles capable of low-temperature bonding. <P>SOLUTION: After pressing to stretch a solar battery cell flat beforehand, it is pressure-heated by a main crimping blade at a main crimping section. Thereby, an impact applied to the solar battery cell in main crimping is relieved. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a solar cell module assembling apparatus and assembling method for connecting a wiring member to the surface of a substrate (cell) of a crystalline solar cell, and particularly to connection using an adhesive resin film or an adhesive resin paste containing conductive particles. The present invention relates to a suitable assembling apparatus and assembling method.

  In the crystalline solar cell module assembly process, after a crystal cell substrate (hereinafter simply referred to as a cell) of a crystalline solar cell such as a single crystal solar cell or a polycrystalline solar cell is connected to a wiring member to form a series of solar cell circuits Seal with a protective sheet and attach external terminals. Conventionally, soldering has been widely used as a method for connecting a wiring member to a cell. Lead-containing solder is a good conductor and has a certain strength and environmental reliability, and therefore has a durability of about 20 years. However, from the viewpoint of environmental protection in recent years, when lead-free solder is used, a decrease in reliability becomes a problem.

  Tin-zinc bismuth alloy solder is known as low-temperature lead-free solder and is used in household appliances. This tin-zinc bismuth alloy solder has a melting point of 183 ° C., which is the same as that of the conventional tin-lead eutectic solder, but is uneasy about environmental resistance for connecting solar cells used for a long time outdoors. On the other hand, tin-silver-copper alloy solder is known as a highly reliable solder and is often used for electronic components such as LSI packages. This tin silver copper alloy solder has a melting point of 220 ° C. or higher. The damage (damage) due to the difference in thermal expansion between the cell, the solder and the wiring member is also a problem in the conventional eutectic solder, and various countermeasures have been studied (Patent Document 1). Therefore, warping or chipping of the cell due to an increase in melting point is a serious problem.

  In order to solve this problem, a method for adhering a cell and a wiring member with a resin film or resin paste (Patent Document 2 and Patent Document 3) containing conductive particles and having a thermosetting temperature lower than the melting temperature of lead-free solder has been proposed. ing. According to this method, since the process temperature can be lowered, the thermal stress of the cell can be reduced.

JP 2006-147902 A JP 2007-158302 A JP 2008-300403 A

  However, in joining with resin containing electroconductive particle, in order to obtain sufficient conduction performance which a solar cell requires, a high pressure is required compared with the conventional solder joining. Therefore, there has been a problem that the cell is damaged due to an impact or a biased load during pressurization.

  The object of the present invention is to solve the above-mentioned problems by providing a uniform and sufficient pressure for conduction by pressure contact of conductive particles, and applying unnecessary stress and non-uniform temperature to the cell, thereby adding unnecessary stress to the cell. It is to perform the joining without giving. And it is providing the assembly apparatus and assembly method of a stable and reliable solar cell module.

  In order to achieve the above-mentioned object, the entire cell is flattened by pressing a flexible extending member (flattening member) before pressing the wiring member temporarily bonded to the surface of the cell. Further, preheating is performed from above and below at a temperature lower than the curing temperature of the adhesive resin. Thereby, the impact force by the strong pressurization at the time of the main pressure bonding and the thermal shock due to rapidly reaching the heat curing temperature of the adhesive are alleviated. Similarly, when cooling the cell after the final press bonding, the cell is cooled while gradually cooling (slow cooling) while being heated with a heater to a temperature lower than the curing temperature of the adhesive resin and higher than the environmental temperature, and the heat at the time of cooling. The shock is also reduced.

  In order to achieve the above object, after the cell is placed on a flat hard stage, it is covered with a soft rubber film, and the main press blade is pressed through the soft rubber film. This avoids cell damage due to local concentration of applied pressure.

  In addition, in order to achieve the above-mentioned purpose, the cell and the wiring member are transported on a stage preheated at a temperature lower than the curing temperature of the adhesive resin before the wiring member temporarily bonded to the surface of the cell is finally bonded. To do. And after carrying out the main press-bonding of the wiring member temporarily crimped to the surface of the cell, the cell and the wiring member are transported on a stage preheated at a temperature lower than the curing temperature of the adhesive resin. As a result, the thermal shock is mitigated by slowing the temperature rise and cooling of the cell and the wiring member.

  In order to achieve the above object, a soft member having a flat cross-sectional shape is used as a wiring member, the front and back positions are equalized when temporarily crimped to the front and back surfaces of the cell, and unevenness is observed from the top and bottom when performing final crimping. To prevent excessive pressurization.

  Moreover, in order to achieve the said objective, adhesive resin is affixed on a flexible wiring member previously, and the pressurization heating by an affixing process is not given to a weak cell which is weak to an impact. This reduces the number of times stress is applied.

  According to the present invention, since the cell and the wiring member can be joined at a low temperature as compared with the case of using lead-free solder, the stress of the cell due to the difference in thermal expansion can be alleviated. In addition, even when a pressure is applied to the cell to apply pressure bonding to conductive particles, thermal shock due to local impact, rapid heating, and rapid cooling can be mitigated. Can do.

It is a floor view which shows the layout of the assembly apparatus of the solar cell module of 1st Example of this invention. It is the schematic which shows the first half part of the assembly apparatus of the solar cell module of 1st Example of this invention. It is the schematic which shows the second half part of the assembly apparatus of the solar cell module of 1st Example of this invention. It is a perspective view which shows the principal part of the main crimping part of the 1st Example of this invention. It is sectional drawing which shows the principal part of the main crimping part of the 1st Example of this invention. FIG. 6A is a plan view showing a CF sticking portion of the second embodiment of the present invention, and FIG. 6B is an elevation view. It is cell string explanatory drawing which connects the photovoltaic cell manufactured by the assembly apparatus of the photovoltaic module of the 1st Example of this invention.

  Hereinafter, a procedure for pasting and connecting a copper wire (wiring member) 2 to a cell (solar cell) 1 with a conductive particle-containing film (adhesive resin) 3 and a description of a mechanism for performing the pasting will be described with reference to FIGS. To do. Hereinafter, the conductive particle-containing film is referred to as CF.

  FIG. 1 is a floor view showing a layout of the wiring member joining line 100. 2 is a schematic view showing an outline of the first half of the wiring member joining line 100, and FIG. 3 is a schematic view showing an outline of the second half.

  As shown in FIG. 1, a wiring member joining line (solar cell module assembly apparatus) 100 includes a copper wire bobbin supply unit 101, a copper wire drawing distortion removing unit 102, a CF copper wire pasting unit 103, and a copper wire cut. A pull-in unit 104 is provided. Furthermore, a cell tray supply unit 105, a copper wire temporary crimping unit 106, a main crimping unit 107, a discharge conveyor 108, and a discharge transfer device 109 are provided. The procedure of attaching and connecting the cell 1 and the copper wire 2 (see FIG. 3) is processed according to the arrow in FIG.

  As shown in FIG. 2, first, a strip-shaped copper wire 2 having a thickness of 0.1 to 0.2 mm and a width of 2 to 3 mm is wound around a reel bobbin 2a and supplied to a copper wire bobbin supply unit 101 to send out a copper wire. It is sent out by the mechanism 111 while maintaining a constant tension. In this embodiment, a so-called two-bus structure cell is assumed, and the copper bobbin supply unit 101 is arranged in two upper and lower stages. In the subsequent process, two copper wires 2 are routed in parallel, but overlap in FIG.

  Next, the direction of the copper wire 2 drawn into the copper wire drawing distortion removing unit 102 is changed by the driven roller 121, and the tension is kept constant by the dancer roller 122. The copper wire delivery mechanism 111 of the copper wire bobbin supply unit 101 controls the delivery amount so as to keep the movement of the dancer roller 122 constant.

  Thereafter, the distortion of the copper wire 2 is removed by the distortion removing unit 123. The copper wire 2 sent out from the reel bobbin 2a has a bending rod according to the curvature of the reel bobbin 2a. For this reason, the copper wire 2 is sandwiched from above and below by a pinch roller 125 having a diameter smaller than that of the reel bobbin 2a, and distortion is removed by passing a plurality of units while sequentially reducing the amount of folding. The copper wire 2 is sandwiched between the capstan roller 124 and the pinch roller 125 and sent out. The feed amount of the copper wire 2 is controlled by the rotation amount of the capstan roller 124.

  Next, the tip of the copper wire 2 is sandwiched between the drawer clamps 136 and is stretched over the CF copper wire pasting unit 103 by the drawer driving unit 137. CF3 is attached to the front half of the copper wire 2 from below, and CF3 is attached to the rear half of the copper wire 2 from above. The copper wire 2 is sandwiched between the attaching bases 135A and 135B and the attaching heads 133A and 133B from above and below. When the sticking heads 133A and 133B move toward the sticking bases 135A and 135B, CF3 stretched between the copper wire 2 by the CF feed reel 131 and the CF take-up reel 132 is pressed against the copper wire 2.

  CF3 is applied to a release tape made of PET (Polyethylene terephthalate) film, and the adhesive resin containing conductive particles adheres to the other side and is transferred by pressure heating from the release tape side.

  The copper wire 2 to which CF3 is attached is moved at its tip end to the pull-in clamp 142 of the copper wire cut-in pulling portion 104, and is pulled into the copper wire temporary crimping portion 106 (see FIG. 3) by the pull-in driving portion 143. At this time, when the necessary length is drawn, the copper wire 2 is fixed in the vicinity of the cut portion by the pull-out clamp 136 and cut by the wire cutting portion 141.

  When a cell 1 in the middle of a series of cells connected in a chain (see cell string 4 and FIG. 7) is attached, the drawer clamp 136 is fixedly installed at the position shown in FIG. It doesn't matter. On the other hand, when the first cell 1 of the cell string 4 is to be pasted, it is necessary to cut the copper wire 2 short and CF3 only to the upper surface, so after cutting the electric wire 2 for creating the previous cell string 4 Then, in a state where the tip of the copper wire 2 to be used next is gripped by the drawer clamp 136, the drawer clamp 136 performs an operation of returning to the vicinity of the pasting head 133B for pasting CF3 on the upper surface while rewinding the copper wire 2. Then, it sticks only with the sticking head 133B which sticks CF3 of the upper surface side.

  As shown in FIG. 3, the front half of the copper wire 2 drawn into the copper wire temporary crimping portion 106 by the lead-in clamp 142 is placed on the cell 1 that has already been temporarily crimped with the copper wire 2 on the lower surface, It is placed on the conveyor 161. Thereafter, the cell 1 supplied from the cell tray supply unit 105 is placed on the latter half by the cell transfer machine 154.

  The new cell 1 is placed with a slight load on the CF 3 attached to the latter half of the copper wire 2 while being vacuum-sucked by the cell chuck 153. Thereafter, the cell 1 and the copper wire 2 are pressed by the two sets of front and rear temporary attachment heads (mounting members) 163. Here, the preheating base (heater) 162 provided inside the conveyor 161 is maintained at a temperature slightly lower than the CF attachment temperature (40 to 50 degrees in this embodiment), and the temporary attachment head 163 is CF attachment. It is kept at 90 ° C., which is the attaching temperature. Thereby, the cell 1 and the copper wire 2 are temporarily fixed by CF3 sandwiched therebetween.

  Next, the member in which the cell 1 and the copper wire 2 fed out by the conveyor 161 are slid on the main crimping stage 171 of the main crimping section 107 and fed under the main crimping head 175.

  FIG. 4 is a perspective view showing the main part of the main crimping part 107. In FIG. 4, the copper wire 2 is not shown because it is complicated, and only the surface CF3 is shown. FIG. 5 is a cross-sectional view showing the main part of the main crimping part 107.

  The main crimping stage 171 includes a slide base 171b that guides both sides of the cell 1 with a slide guide 171a, and a lower blade stage 171c that retreats downward so as not to disturb the slide. When the cell 1 arrives at the crimping position, the lower blade stage 171c moves to a specified height and supports the copper wire 2 from below. At this time, as shown in FIG. 5, a groove 171d into which the copper wire 2 is fitted is formed in the lower blade stage 171c, and the copper wire 2 is not shifted left and right. And since the flat copper wire 2 is facing the upper and lower sides of the cell 1, the vertical stress in the cell 1 is not generated.

  Thereafter, the cushion sheet 173 delivered from the cushion reel 172 is placed on the cell 1 and the copper wire 2. Further, the cell 1 is pressed evenly from above with the cell presser (planarizing member) 174 to the main press-bonding stage 171 to correct the warp of the cell 1 and eliminate the lifting. In this state, the cell 1 is pressed against the main press-bonding stage 171 via the copper wire 2 and is not lifted up. Therefore, even when the main pressure blade 176 pressed down by the pressurizing mechanism 177 is used for pressurization, the cell 1 will not be rattled, and pressurization can be performed with the impact reduced.

  Further, the main pressure bonding stage 171 is maintained at 90 ° C., which is the bonding temperature of CF 3, and the surface of the cell presser 174 that is not opposed to the cell is heated to 90 ° by the rubber heater 174 b. For this reason, even if the main crimping blade 176 heated to 250 to 270 degrees heats the cell 1 and the copper wire 2 through the cushion sheet 173 and the crimped portion reaches a thermosetting temperature of 190 degrees, the cell 1 and the copper wire 2 The temperature difference from the place other than the crimping part is kept at about 100 degrees. As a result, temperature unevenness due to rapid heating or partial heating can be suppressed, and excessive thermal stress does not occur.

  Furthermore, even if the copper wire 2 has a slight thickness unevenness, excessive stress is not locally applied by the elastic deformation of the cushion sheet 173, and even if the copper wire 2 is warped or twisted. , It can be pushed along the cell 1 while being flattened.

  The cushion sheet 173 receives a certain amount of damage because the back surface thereof is pressed by the high-temperature main pressure bonding blade 176. Therefore, the cushion sheet 173 pressurized several times is sent out by the thickness of the main crimping blade 176 in the direction of the arrow in FIG. 4 and always uses a good portion.

  The cells 1 and the copper wires 2 that have been subjected to the main pressure bonding are sequentially drawn out by the conveyor 181 as the cell strings 4 and arranged on the discharge conveyor 181. At this time, the first part of the conveyor 181 was heated with a heater at a temperature lower than the thermosetting temperature of GF3 (adhesive resin) and higher than the environmental temperature (40 to 50 degrees in this embodiment). An annealing base 182 is provided. Thereby, the cell 1 and the copper wire 2 are not rapidly cooled from the thermosetting temperature of about 190 ° C. to the environmental temperature, and the thermal shock is mitigated by being held at a midway temperature. As a result, excessive thermal stress is not applied to the cell 1 even during cooling. After completion of the pressure bonding in which the cell string 4 has reached the specified number of cells, the cell string 4 is transferred to the apparatus of the next step 110 by the discharge transfer apparatus 109.

  Each cell 1 is sucked and held by a suction chuck 191 supported by an independent suspension mechanism 192, lifted by a lifting mechanism 193 without giving an impact, and unloaded by a transport mechanism 194. Thereby, there is no worry that an impact is applied to the cell 1 during conveyance.

  In the above embodiment, the copper wire 2 is applied as the wiring member. However, the wiring member according to the present invention may be a soft good conductor such as a tin-plated wire or an aluminum wire, and the surface is subjected to rust-proof plating or the like. It is also preferable to use one. Further, in this embodiment, the description has been given by taking the cell of the two bus bar structure as an example. The number of bus bars is appropriately determined depending on the design of the solar cell, and may be one or three or more. However, there is no influence on the method of this embodiment, and it can be handled by changing some members. is there.

FIG. 6A is a plan view showing a CF sticking portion of the second embodiment of the present invention, and FIG. 6B is an elevation view.
In the second embodiment of the present invention, CF3 is pasted on the cell 1 instead of CF3 on the copper wire 2 in advance.

  In the second embodiment, since CF3 is simultaneously attached to both the front and back surfaces of the cell 1, the cell holder 174 sandwiches the cell 1 from above and below and holds it in the air, and simultaneously attaches CF from the up and down direction with the attaching head 133. In this embodiment, the CF sticking is confirmed by a pair of upper and lower CF confirmation cameras 200 at the next stage.

  According to the second embodiment, CF3 can be attached to the flat cell 1, so that a semicircular electric wire with one side raised on the wiring member, or an electric wire swelled to a middle thickness due to thick antirust plating There is an advantage that a deformed wire such as can be used.

  DESCRIPTION OF SYMBOLS 1 ... Cell (solar cell), 2 ... Copper wire (wiring member), 2a ... Reel bobbin, 3 ... Conductive particle containing film (adhesive resin), 4 ... Cell string, 100 ... Wiring member joining line, 101 ... Copper wire bobbin supply unit, 102 ... Copper wire drawing distortion removing unit, 103 ... CF copper wire pasting unit, 104 ... Copper wire cut drawing unit, 105 ... Cell tray supply unit, 106 ... Copper wire temporary crimping unit, 107 ... Main crimping unit , 108 ... discharge conveyor, 109 ... discharge transfer device, 111 ... copper wire feeding mechanism, 121 ... driven roller, 122 ... dancer roller, 123 ... distortion removing unit, 124 ... capstan roller, 125 ... pinch roller, 131 ... CF Feed reel, 132 ... CF take-up reel, 133A, 133B ... Pasting head, 135A, 135B ... Pasting stand, DESCRIPTION OF SYMBOLS 136 ... Drawer clamp, 137 ... Drawer drive part, 141 ... Electric wire cutting part, 142 ... Lead-in clamp, 143 ... Pull-in drive part, 153 ... Cell chuck, 154 ... Cell transfer machine, 161 ... Conveyor, 162 ... Preheating base, 163 ... Temporary pasting head (mounting member), 171 ... Main pressure bonding stage, 171a ... Slide guide, 171b ... Slide base, 171c ... Lower blade stage, 171d ... Groove, 172 ... Cushion reel, 173 ... Cushion sheet, 174 ... Cell presser (Flattening member), 174b ... rubber heater, 175 ... main pressure bonding head, 176 ... main pressure bonding blade, 177 ... pressure mechanism, 181 ... conveyor, 182 ... slow cooling base, 191 ... suction chuck, 192 ... suspension mechanism, 193 ... Elevating mechanism, 194 ... Conveying mechanism 200 ... CF confirmation camera

Claims (7)

In a solar cell module assembly apparatus for mounting and assembling by connecting a wiring member to a solar cell,
Temporary pressure bonding part for temporarily pressure bonding the solar cell and the wiring member by low-temperature bonding using an adhesive resin containing conductive particles;
A flattening member that flatly stretches the solar cell after the temporary bonding with the wiring member;
A main press-bonding portion that presses a main press-bonding blade against the solar cells stretched by the flattening member and performs main press-bonding;
An assembly apparatus for a solar cell module, comprising: The solar cell module assembly apparatus according to claim 1,
The solar cell module assembling apparatus, wherein the flattening member and the mounting member for mounting the solar battery cell on the main crimping portion are heated to a temperature lower than the thermosetting temperature of the adhesive resin. . The solar cell module assembly apparatus according to claim 2,
An assembly apparatus for a solar cell module, comprising a cushion sheet interposed between the main crimping blade and the wiring member. The solar cell module assembly apparatus according to claim 1,
A heater for heating the solar cell and the wiring member is provided in a pre-process of the main press-bonding step, and a slow cooling heater for cooling the solar cell and the wiring member is provided in a post-process of the main press-bonding step. A solar cell module assembly apparatus. The solar cell module assembly apparatus according to claim 1,
The said adhesive resin is affixed on the said wiring member, Then, the said wiring member is temporarily crimped | bonded to the said photovoltaic cell, The assembly apparatus of the solar cell module characterized by the above-mentioned. The solar cell module assembly apparatus according to claim 1,
The said adhesive resin is affixed on the said photovoltaic cell, and the said photovoltaic cell is temporarily crimped | bonded to the said wiring member after that, The assembly apparatus of the photovoltaic module characterized by the above-mentioned. In a method of assembling a solar cell module for connecting and mounting a wiring member to a solar cell,
A temporary pressure bonding step of temporarily pressing the solar battery cell and the wiring member by low temperature bonding with a temporary pressure bonding portion using an adhesive resin containing conductive particles;
A flattening step of flattening and extending the solar cells that have been temporarily crimped with the wiring member by a flattening member;
A main pressure bonding step of pressing the main pressure bonding blade of the main pressure bonding portion against the solar battery cells stretched and stretched by the planarizing member,
A method of assembling a solar cell module, comprising:

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